JP5065969B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus for holding a component from a component supply unit such as a wafer by a head and mounting the component on a member to be mounted.

This type of component mounting apparatus is disclosed in, for example, Patent Document 1, but includes a mounting head having a bonding nozzle that sucks and holds a component such as a bare chip, and moves in the X-axis direction, the Y-axis direction, and θ rotation. A bonding nozzle of the mounting head picks up a component from the wafer on the mounting table, and mounts the component on a mounting substrate or a lead frame that is a mounted member that has been transported by the transport chute at the work station.
JP 2004-363607 A

  In such a conventional component mounting apparatus, at the work station, the mounting head is lowered by a preset lowering amount (stroke), and the component is mounted on the mounted member.

  However, in such a component mounting apparatus, the height of the mounting surface of the mounted member at the work station is increased during operation due to a change in ambient temperature with the passage of time after the component mounting apparatus starts operation. As a result, the height of the component mounting surface changes slightly. As a result, there arises a problem that the component is not surely mounted on the mounted member.

  In addition, when the operator performs the correction work for the descending amount, the operator needs to stop the temporary component mounting apparatus to perform the correction, and the correction work by the operator becomes complicated. There is a problem that the operator may forget.

  Therefore, the present invention can improve the correction workability by the operator, and when the height of the mounting surface of the mounted member at the work station is slightly changed, or the height of the component mounting surface is also small. It is an object of the present invention to provide a component mounting apparatus capable of mounting a component on a member to be mounted as much as possible even when it changes.

For this reason, the first invention includes a work stage for mounting a component on the conveyed mounted member, a work head that includes a holder for holding the component, and moves up and down on the work stage. A detector that detects contact of the holder with the work stage or a mounted member;
In the work stage, the work head is lowered in a state where the holder does not hold a part, and the amount of the work head lowered is measured based on the detection result of the detector. A control device that controls a descent amount correction operation that corrects a descent amount of the work head at the work stage, and a correction setting that sets how many times the component mounting operation is performed on the work stage. And an apparatus.

  In addition, the second invention presses the component supply stage, the first work stage on which the component is placed, and the holder holding the component downward so as to be movable up and down, and descends at the component supply stage. The first work head that holds the component, moves to the first work stage, descends, and places the component on the placement surface, and the first that mounts the component on the mounted member that has been transported And a second work head that moves between the first work stage and the second work stage, and is provided on the second work head. A detector for detecting contact of the holder with the second work stage, and the first work stage, the first work head is lowered while the holder is not holding a component. The first based on the detection result of the detector A control device that controls a descent amount correction operation for measuring a descent amount of the work head and corrects a descent amount of the first work head on the first work stage based on the measurement result, and the descent amount correction operation And a correction setting device for setting how many times component placement work is to be performed on the first work stage.

  According to a third aspect of the present invention, in the component mounting apparatus according to the first or second aspect, the correction setting device performs the lowering amount correction operation as a component mounting operation at the operation stage or the second operation stage, or the first operation. It is characterized by comprising correction setting means for setting how many times component placement work on the work stage is repeated.

  According to a fourth aspect of the present invention, in the component mounting apparatus according to the first or second aspect, the correction setting device performs the descent amount correction operation as a component mounting operation in the work stage or the second work stage, or the first It is characterized by comprising a plurality of correction setting means for setting how many times component placement work on the work stage is to be repeated.

  According to a fifth aspect of the present invention, in the component mounting apparatus according to the first or second aspect, the work stage, the first work stage, or the second work stage is provided with a heating device.

  The present invention can improve the correction workability by the operator, and when the height of the mounting surface of the mounted member at the work station is slightly changed, or the height of the component mounting surface is also slightly It is possible to provide a component mounting apparatus capable of mounting a component on a member to be mounted as much as possible even when it has changed.

  Hereinafter, an embodiment of a component mounting apparatus according to the present invention will be described with reference to the accompanying drawings. This component mounting apparatus mounts various electronic components on a mounted member such as a printed board or a lead frame.

  FIG. 1 is a schematic side view of a component mounting apparatus. A component mounting apparatus main body 1 includes a component supply stage 2, a first work stage 3, a second work stage 4 as a bonding position, and a nozzle as a component holder. Two later-described work heads, each having 5 and 55, are provided.

  The component supply stage 2 places and supports a diced semiconductor wafer (hereinafter referred to as a wafer, and a component such as a bare chip taken out from the wafer is referred to as a component) 7 which is a group of components in which a large number of components 6 are assembled. A mounting table 8 which is a wafer table is provided.

  The first work stage 3 includes a component placement table 10 and a first heating device 11 provided below the placement table 10. The second work stage 4 has a work table 13 on which a printed circuit board 12 as a mounted member is placed to cover the periphery of the printed circuit board 12 and an opening 130 is formed on the upper surface. And a second heating device 14 provided. The printed circuit board 12 is transported from the upstream on the work table 13 by a transport mechanism (not shown), and is transported downstream after the component 15 mounting operation is completed.

  Hereinafter, a work head for transferring parts will be described. The work head for transferring parts from the part supply stage 2 to the first work stage 3 and the work head for transferring parts from the first work stage 3 to the second work stage 4 have the same mechanism. There will be described a work head for transferring parts from the component supply stage 2 to the first work stage 3 with reference to FIG. 2, and the parts are transferred from the component supply stage 2 to the first work stage 3. Description of the working head is omitted.

  Reference numeral 16 denotes a head support portion of the work head 20, and the head support portion 16 is formed with a sensor support portion 17 extending outward from the upper portion thereof. Moreover, it raises / lowers along the guide 18 arrange | positioned at an up-down direction. The guide 18 includes a rail 21 and a slide member 22 that is slidably supported by the rail 21. Further, the guide 18 is provided with an elevating drive unit (stator and mover) 23 such as a linear motor of the work head 20.

  Further, a ball bush 24 is provided substantially vertically at the lower portion of the head support portion 16, and the nozzle 5 is supported by the ball bush 24 so as to be vertically movable. Further, a contact piece 25 is attached horizontally at a substantially intermediate position of the nozzle 5. A compression spring 26 is provided between the upper surface of the contact piece 25 and the lower surface of the sensor support portion 17, and the nozzle 5 is biased downward by the compression spring 26 via the contact piece 25.

  Reference numeral 27 denotes a touch sensor as a detector attached through the sensor support portion 17, and a contact end 28 is provided at the lower end of the touch sensor 27. In a state where the lower end of the nozzle 5 is not in contact with other members and is not raised, a slight gap is formed between the lower end of the contact end 28 and the upper surface of the contact piece 25.

  Next, a control device for raising and lowering the work head 20 will be described with reference to FIG.

  Reference numeral 30 denotes a control device that controls the raising / lowering of the raising / lowering drive unit 23. The control device 30 includes a raising / lowering drive unit 23, a touch sensor 27, and a touch panel as a display device via an interface (not shown). A monitor 31 is connected.

  The control device 30 is provided with a CPU (Central Processing Unit) 32, a RAM (Random Access Memory) 33, and a ROM (Read Only Memory) 34. The CPU 32 inputs a signal from the touch sensor 27 and stores it in the RAM 33 in advance. The lift drive unit 23 is controlled based on the lift stroke data and the control program stored in the ROM 34, and energization to the first heating device 11 and the second heating device 14 is controlled.

  Further, the RAM 33 stores an interval and the number of lower stroke corrections (calibration) of a nozzle 5 or 55 described later, which are set in advance by, for example, an operation of the monitor 31 by the operator, that is, an interval for correcting the lower stroke and the number of corrections. Is stored.

  Hereinafter, an operation when the operator corrects the stroke will be described.

  First, before starting the component mounting apparatus, the operator operates the monitor 31 (correction setting apparatus) to display the correction method setting screen shown in FIG.

  The setting screen has a cycle setting unit 36 for setting a correction interval, that is, how many times component mounting is performed, and a number setting unit 37 for setting how many times correction is performed. In the embodiment, three first setting units 41, second setting units 42, and third setting units 43 are provided. Further, a number increase / decrease unit 44 and a number determination unit 45 are provided below each setting unit, and a setting end unit 46 is provided on the right side of the screen.

  When the operator touches the cycle setting unit 36 of the first setting unit 41, the cycle can be set. By touching the increase / decrease unit 44 in this state, the number of times displayed on the cycle setting unit 36 increases or decreases. For example, when “5” is displayed on the cycle setting unit 36, the determination unit 45 and the setting end unit 46 are touched. In the RAM 33, “a control program for correcting the stroke every time the mounting operation is performed five times” and “a control program for continuing this correction until the automatic operation of component mounting in the component mounting apparatus is stopped”. (See Example 1 in FIG. 5) is stored.

  In addition, “−” is displayed in the number setting unit 37 of the first setting unit 41, the cycle setting unit 36 and the number of times setting unit 37 of the second setting unit 42 and the third setting unit 43.

  The display of “−” in each cycle setting unit 36 indicates that the number of times of executing correction is not set. In the first, second and third setting sections 41, 42 and 43, the cycle is set and displayed in the cycle setting section 36, but the number of times is not set in the number setting section 37 and “-” is displayed. When it is, it means that the correction in the cycle set in the cycle setting unit is continued until the automatic operation of the component mounting apparatus is stopped.

  Further, as described above, when the operator sets “5” in the cycle setting unit 36 of the first setting unit 41 and touches the number setting unit 37, the number of times can be set. By touching the increase / decrease unit 44 in this state, the number of times displayed on the number setting unit 37 increases or decreases. For example, when “10” is displayed on the number setting unit 37, the determination unit 45 and the setting end unit 46 are touched. In the RAM 33, “a control program for correcting the stroke every time the mounting operation is performed five times” and “after repeating this correction ten times, the automatic operation in the component mounting apparatus is continued without correction. "Control program to be executed" (see Example 2 in FIG. 5) is stored. In the second and third setting units 42 and 43, since the cycle and the number of times are not set, each cycle setting unit 36 and the number of times setting unit 37 display “−”.

  Further, as described above, when the operator sets the correction cycle and the number of times in the first setting unit 41 and then touches the cycle setting unit 36 of the second setting unit 42 without ending the setting operation, the cycle is set. Setting is possible. By touching the increase / decrease unit 44 in this state, the number of times displayed on the cycle setting unit 36 increases or decreases. For example, when “20” is displayed on the cycle setting unit 36, the determination unit 45 and the setting end unit 46 are touched. In the RAM 33, “the correction of the stroke every time the mounting operation is performed five times is repeated 10 times, and then the correction of the stroke every time the mounting operation is performed 20 times is performed automatically in the component mounting in the component mounting apparatus. Is stored until it is stopped ”(see Example 3 in FIG. 5).

  Further, “−” is displayed in the number setting unit 37 of the second setting unit 41, the cycle setting unit 36 and the number of times setting unit 37 of the third setting unit 43.

  Furthermore, as described above, after the operator sets the correction cycle and the number of times in the first setting unit 41, the cycle is set in the cycle setting unit 36 of the second setting unit 42 without ending the setting operation. When the number is set and the number setting unit 37 of the second setting unit 42 is touched, the number can be set. By touching the increase / decrease unit 44 in this state, the number of times displayed on the number setting unit 37 increases or decreases. For example, when “5” is displayed on the number setting unit 37, the determination unit 45 and the setting end unit 46 are touched. In the RAM 33, “the stroke correction is repeated 10 times every time the mounting operation is performed 5 times, and then the stroke correction is repeated 5 times every time the mounting operation is performed 20 times, and then the correction is performed. The control program for continuing the automatic operation in the component mounting apparatus ”(see Example 4 in FIG. 5) is stored. In the third setting unit 43, since the cycle and the number of times are not set, the cycle setting unit 36 and the number of times setting unit 37 display “−”.

  In addition, when the correction is performed for a predetermined cycle and a predetermined number of times after the correction of the cycle and the number of times set in the second setting unit is completed, as in the setting in the first and second setting units 41 and 42, The cycle and the number of times may be set by operating the cycle setting unit 36, the number of times setting unit 37, and the increase / decrease unit 44 of the third setting unit 43.

  When the operator operates a start switch (not shown) of the component mounting apparatus in the state set as described above, automatic operation of the component mounting apparatus starts.

  First, the control device 30 starts energization of the first heating device 11 and the second heating device 14. When a predetermined time elapses, the control device 30 operates to output a drive signal to an XY direction moving mechanism (not shown) of the work head 20, and as a result, the work head 20 moves above the component supply stage 2. Then, it descends based on the drive signal from the control device 30, sucks and holds components from the semiconductor wafer 7, and rises.

  Thereafter, the control device 30 operates to output a drive signal to an XY direction moving mechanism (not shown) of the work head 20, and as a result, the work head 20 moves from above the component supply stage 2 to above the first work stage 3. Moving. Then, the stroke set in advance based on the drive signal from the control device 30 and stored in the RAM 33 is lowered, the component held by suction is placed on the component placement table 10, and then raised.

  Thereafter, the control device 30 operates, and the work head 20 moves from above the first work stage 3 to above the component supply stage 2, descends, and ascends and holds the parts from the semiconductor wafer 7 again.

  Thereafter, similarly, the work head 20 moves between the component supply stage 2 and the first work stage 3 to place the component on the component placement table 10.

  In addition, a work head (not shown) provided with a nozzle 55 and configured in the same manner as the work head 20 moves between the first work stage 3 and the second work stage 4 based on a drive signal from the control device 30. To do. In the first work stage 3, the nozzle 55 moves down together with the work head, sucks and holds the components placed on the component mounting table 10, moves up, and moves to the second work stage 4. In the second work stage 4, the nozzle 55 is lowered together with the work head, the held components are mounted on the printed circuit board 12, and are moved up and moved to the first work stage 3.

  Thereafter, similarly, the work head provided with the nozzle 55 moves between the first work stage 3 and the second work stage 4 to mount the components on the printed circuit board 12. That is, the automatic operation for mounting components on the printed circuit board 12 continues.

  When the component mounting operation on the printed circuit board 12 is completed in a cycle set in advance by the first setting unit 41, that is, five times, the lowering amounts of the nozzle 5 and the nozzle 55 are corrected.

  First, based on a drive signal from the control device 30, the first work stage in which the nozzle 5 of the work head 20 does not pick up the component and the component is already sucked and held by the nozzle 55. 3 moves upward and descends.

  When the nozzle 5 is lowered by an interval Z between the lower end of the nozzle 5 before starting to descend shown in FIG. 2 and the upper surface 61 of the first work stage 3, as shown in FIG. 6, the lower end of the nozzle 5 becomes the component mounting table. 10 is in contact with the upper surface 61 of the substrate. At this time, a slight gap is formed between the contact end 28 of the touch sensor 27 and the upper surface of the contact piece 25.

  When the nozzle 5 further descends, the nozzle 5 moves upward relative to the head support portion 16 against the urging force of the compression spring 26 as it descends. For this reason, when the nozzle 5 moves by a distance L similar to a slight gap between the contact end 28 stored in advance in the RAM 33 and the upper surface of the contact piece 25, as shown in FIG. The touch sensor 27 outputs a signal to the control device 30 in contact with the upper surface of the contact piece 25.

  The control device 30 that has input the signal calculates a value obtained by subtracting the distance L from the descending amount of the work head 20 until the signal is input. The calculated value is an actual lowering amount L1 when the nozzle 5 is lowered to the upper surface 61 of the first work stage 3, and is stored in the RAM 33. Further, the controller 30 sets the nozzle 5 when the component is placed on the first work stage 3 based on the lowering amount L1 of the nozzle 5 stored in the RAN 33 and the thickness of the component stored in the RAM. A descending amount (stroke) L2 is calculated, the previous descending amount is corrected by the calculated descending amount L2, and the corrected descending amount is stored in the RAM 33 as the descending amount of the nozzle 5. That is, the lowering amount L2 of the nozzle 5 is taught.

  Further, the correction of the lowering amount of the nozzle 55 on the first work stage 3 is also performed when the nozzle 55 is in a state where the nozzle 55 does not hold the component and the component is not placed on the component placement table 10. The same is done. That is, the lowering amount (stroke) of the nozzle 55 when the part is held on the first work stage 3 is calculated, and the previous lowering amount is corrected by the calculated lowering amount. The amount of decrease is stored in the RAM 33. That is, the lowering amount of the nozzle 55 on the first work stage 3 is taught.

  Further, the amount of lowering of the nozzle 55 on the second work stage 4 is corrected in the state where the nozzle 55 does not hold the component and the component 15 and the printed circuit board 12 are not placed on the work table 13. This is performed in the same manner as in the correction on the work stage 3.

  That is, the nozzle 55 is configured in the same manner as the work head 20 and is provided in the work head including the compression spring and the touch sensor. The second work in which the printed circuit board and the parts are not placed without sucking the parts. It moves above the stage 4 and descends.

  When the nozzle 55 is lowered, the lower end of the nozzle 55 comes into contact with the upper surface 61 of the work table 13. When the nozzle 55 further descends, the nozzle 55 moves relatively upward against the urging force of the compression spring as it descends. For this reason, the touch sensor comes into contact with the upper surface of the contact piece provided on the work head, and the touch sensor 27 outputs a signal to the control device 30.

  The control device 30 receiving the signal calculates a value obtained by subtracting the above-described distance L stored in the RAM 33 in advance from the descending amount of the working head until the signal is input. The calculated value is an actual lowering amount L3 when the nozzle 55 is lowered to the upper surface 62 of the second work stage 4 and is stored in the RAM 33. Further, the control device 30 causes the component to be placed on the second work stage 4 based on the lowering amount L3 of the nozzle 55 stored in the RAM 33 and the thickness of the component 15 and the thickness of the printed circuit board 12 stored in the RAM. The lowering amount (stroke) L4 of the nozzle 55 when mounted on the printed circuit board 12 is calculated, the previous lowering amount is corrected by the calculated lowering amount L4, and the corrected lowering amount is stored in the RAM 33 as the lowering amount of the nozzle 55. Stored. That is, the lowering amount of the nozzle 55 on the first work stage 3 is taught.

  Thereafter, the correction of the lowering amount of the nozzle 5 at the first work stage 3 and the correction of the lowering amount of the nozzle 55 at the first work stage 3 and the second work stage 4 are the operation start of the component mounting apparatus. For example, when the cycle is set to only “5” as in Example 1 shown in FIG. 5, mounting is performed from the start of operation of the component mounting apparatus. Every time the operation is performed five times, the correction of the strokes of the nozzle 5 and the nozzle 55 is continued until the automatic operation of component mounting in the component mounting apparatus is stopped.

  Further, as shown in Examples 2, 3, and 4, when the correction cycle and number of times are set, the control device 30 operates based on the setting, and the correction is performed according to the cycle and the number of times from the start of operation of the component mounting apparatus. Is done.

  As described above, since the correction of the stroke when the nozzle 5 and the nozzle 55 are lowered is set by the worker for both the cycle and the number of times, the correction is automatically performed. Can be greatly reduced.

  In addition, when setting the correction cycle and the number of corrections, it is possible to set the correction cycle longer or the number of corrections as small as possible. The decrease can be minimized.

  Furthermore, a plurality of setting units for setting the correction cycle and the number of times, that is, the first, second and third setting units 41, 42 and 43, can set correction timings of different cycles and times, for example, the first At the start of operation of a component mounting apparatus in which the temperature change due to heating of the heating device 11 or the second heating device 14 is large and the level change of the upper surface 61 of the component mounting table 10 or the upper surface 62 of the work table 13 may be large. It is possible to shorten the correction cycle and set the correction cycle gradually longer after the time has passed, or to gradually reduce the number of times. The reduction can be reduced, and the setting according to the operator's request is possible.

  In the above-described embodiment, the correction of the stroke when the nozzle 5 and the nozzle 55 are lowered is set for both the cycle and the number of times, but the amount of the lowering of the nozzle 5 in the first work stage 3 is set. The correction, the correction of the lowering amount of the nozzle 55 on the first work stage 3 and the correction of the lowering amount of the nozzle 55 on the second work stage 4 may be performed independently. For example, the correction method setting screen shown in FIG. 4 is used to set the correction of the descent amount of the nozzle 5 in the first work stage 3, the correction setting of the descent amount of the nozzle 55 in the first work stage 3, and the second By switching each time the setting of correction of the descent amount of the nozzle 55 in the work stage 4 is performed, and each setting can be performed, the correction of the descent amount of the nozzle 5 in the first work stage 3 and the first correction are performed. It is possible to set only the correction of the lowering amount of the nozzle 55 in the second work stage 4 without setting the correction of the lowering amount of the nozzle 55 in the work stage 3, and further according to the demand of the worker. Can be set.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a schematic side view of the component mounting apparatus of embodiment of this invention. It is a schematic side view of a working head. It is a block diagram of a control apparatus. It is a figure of a correction method setting screen. It is explanatory drawing of the setting of a several correction method. It is a schematic side view of the working head when the nozzle hits the upper surface of the component placement table. It is a schematic side view of a working head when a touch sensor contacts a contact piece.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus main body 2 Component supply stage 3 1st operation | work stage 4 2nd operation | work stage 5 Nozzle 6 Component 10 Component mounting table 11 1st heating apparatus 12 Printed circuit board (member to be mounted)
13 Work Table 14 Second Heating Device 15 Parts 20 Work Head 27 Touch Sensor (Detector)
30 Control device (correction setting device)
31 Monitor 36 Cycle Setting Unit 37 Number Setting Unit 41 First Setting Unit 42 Second Setting Unit 43 Third Setting Unit

Claims (5)

A work stage for mounting parts on the mounted member that has been transported;
A holding tool for holding parts, a working head that moves up and down on the work stage,
A detector that is provided in the working head and detects contact of the holder with the working stage or a mounted member;
In the work stage, the work head is lowered in a state where the holder does not hold a part, and the amount of the work head lowered is measured based on the detection result of the detector. A control device for controlling a descent amount correction operation for correcting a descent amount of the work head at the work stage;
A component mounting apparatus comprising: a correction setting device that sets how many times the component mounting operation on the work stage is performed. A component supply stage;
A first work stage for placing components;
A holding tool for holding a part is pressed downward to hold the part so as to be able to move up and down. The part is lowered at the part supply stage to hold the part. A first working head for mounting;
A second work stage for mounting components on the mounted member that has been transported;
A holding tool for holding a component, and a second working head that moves between the first working stage and the second working stage,
A detector provided on a second working head for detecting contact of the holder with the second working stage;
In the first work stage, the first work head is lowered in a state where the holder does not hold a component, and the amount of lowering of the first work head is measured based on the detection result of the detector. A control device for controlling a descent amount correction operation for correcting the descent amount of the first work head at the first work stage based on the measurement result;
A component mounting apparatus, comprising: a correction setting device that sets how many times the component placement work on the first work stage is performed. The correction setting device determines how many times the descending amount correction work is repeated every time the component mounting work at the work stage or the second work stage, or the component placement work at the first work stage. The component mounting apparatus according to claim 1, further comprising correction setting means for setting. The correction setting device determines how many times the descending amount correction work is repeated every time the component mounting work at the work stage or the second work stage, or the component placement work at the first work stage. The component mounting apparatus according to claim 1, further comprising a plurality of correction setting means for setting.   The component mounting apparatus according to claim 1, wherein a heating device is provided in the work stage, the first work stage, or the second work stage.