JP4984210B2 - Device for collecting defective electronic components - Google Patents

Description

  The present invention relates to an improvement of a defective electronic component recovery apparatus in which, when an electronic component sucked by a suction nozzle connected to a vacuum means is a defective product, the electronic component is recovered by a recovery unit.

  In an apparatus that forms IC chips (electronic components) by dicing the wafer, picks up the IC chips one by one, delivers them to the relay stage, sucks them with a bonding tool, moves them to the bonding position, and bonds them to the substrate. The IC chip placed on the chip placement table is photographed by photographing means provided above it for visual inspection.

  As a result of the inspection, if the IC chip 2 is defective, the IC chip 2 is picked up by the bonding tool 21 and discharged and collected in a collection box 31 installed beside the chip mounting table 17 of the relay stage 7. Yes. The discharge and collection into the collection box 31 is performed not only in the bonding apparatus but also in the electronic component taping apparatus as shown in the cited document 1. At the time of recovery, compressed air is jetted from a suction nozzle of a chip suction nozzle or a bonding tool that is set to a negative pressure during suction, or the negative pressure is released.

  At this time, as shown in FIG. 6, there is a problem that the IC chip 2 is not separated from the bonding tool 21 due to adhesive dust attached to the lower surface of the bonding tool 21 or the upper surface of the IC chip 2. This is because when the IC chip 2 is picked up from the adhesive sheet, the adhesive adheres to the lower surface of the IC chip 2, evaporates by heating during bonding, adheres to the lower surface of the bonding tool 21, and the adhesive force increases during the processing. This seems to be caused by a taping device that does not heat up, resulting in defective products.

  In any case, if the suction surface of the bonding tool or the tool contact surface of the chip is dirty, one end of the chip may adhere to the bonding tool even if the vacuum break is performed, and it may not be discharged and collected. When the next chip is picked up in this state, not only the normal chip is damaged but also the chip is defectively mounted on the substrate.

Japanese Patent Laid-Open No. 2004-238209

  The present invention is provided with a passage opening formed slightly larger than the electronic component in the collection unit and a vacuum means for making the inside negative pressure, and when collecting the defective electronic component, the defective electronic component is brought close to the passage port. The inside of the collecting part is set to a negative pressure and is sucked and collected from the passage port, and the object is to achieve reliable collection of defective electronic components and prevent defective mounting of electronic components.

In order to solve the above-mentioned problem, the first invention is a method for recovering a defective electronic component in which the electronic component is collected by the collecting unit when the electronic component sucked by the suction nozzle connected to the vacuum means is defective. The following means is adopted for the recovery device.
1stly, the collection | recovery part is provided with the passage opening formed slightly larger than the electronic component, the detachable lid | cover with which this passage opening was formed , and the vacuum means which makes an inside negative pressure.
Secondly, when collecting defective electronic components, at least one of the suction nozzle and the collecting unit is moved to bring the defective electronic components closer to the passing port, and the inside of the collecting unit is suctioned and collected from the passing port with a negative pressure. To do.
Thirdly, a plurality of lids having different passage openings are prepared so that defective electronic components having different sizes can be collected .

  According to a second invention, in the first invention, a pressurizing means for applying a positive pressure is provided in the suction nozzle, and when the defective electronic component approaches the passage port during the recovery of the defective electronic component, This is a device for collecting defective electronic components to which means for switching from negative pressure to positive pressure and ejecting pressurized gas is added.

3rd invention is the collection | recovery apparatus of the defective electronic component which added the means that the storage container was provided in the collection | recovery part detachably to the 1st or 2nd invention.

  In the present invention, when collecting defective electronic components, at least one of the suction nozzle and the collecting unit is moved to bring the defective electronic components closer to the passing port, and the inside of the collecting unit is suctioned and collected from the passing port with a negative pressure. Since it is a recovery device for defective electronic components, even when it is difficult to separate the electronic component from the suction nozzle, it can be reliably peeled off and recovered.

In addition, the collection unit is provided with a detachable lid, and by forming a passage opening in the lid, by preparing a plurality of lids with different sizes of the passage opening, defective electronic parts of different sizes can be obtained. It became a device for collecting defective electronic components that can be collected.

As an effect of the second invention, a pressurizing means for applying a positive pressure is provided in the suction nozzle, and when the defective electronic component is recovered, the inside of the suction nozzle is switched from a negative pressure to a positive pressure to eject a pressurized gas. By adding the means, it becomes possible to more reliably peel and collect electronic components that are difficult to separate.

Although it is the effect of 3rd invention, since the collection | recovery part was provided in the collection | recovery part so that removal was possible, extraction of the defective electronic components after collection | recovery can also be performed by replacement | exchange of a storage container, and it is a very practical defect It became a collection device for electronic parts.

  Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. FIG. 1 is a schematic plan view showing the entire bonding apparatus 1. The bonding apparatus 1 in this embodiment is an apparatus for bonding chips 2 formed by dividing a wafer attached to a wafer sheet 11 to a wafer substrate 4 as a substrate in sequence. The wafer substrate 4 in the embodiment is an 8-inch wafer substrate. The chip 2 may be a chip arranged in a tray instead of the dicing wafer as described above.

  As shown in FIGS. 1 and 2, the bonding apparatus 1 includes a wafer ring supply unit 5, a chip supply unit 6, a relay stage 7, a bonding unit 8, and a substrate-side wafer supply unit (not shown). The wafer ring supply unit 5 has a magazine 13 in which a large number of wafer rings 3 each having a plurality of divided thin IC chips attached to the upper surface of an adhesive wafer sheet 11 attached to the inner side of the ring frame are stored. The wafer ring 3 is taken out from the magazine 13 by the wafer transfer device 9, and the wafer ring 3 is transferred to the wafer stage 10 of the chip supply unit 6.

  The chip supply unit 6 supplies a wafer stage 10 for positioning and fixing the wafer ring 3, a wafer stage moving mechanism for positioning the wafer stage 10 in the X-axis direction and the Y-axis direction, and a chip 2 one by one. Therefore, a push-up device 15 having a push-up member 25 that pushes up the chip 2 on the wafer stage 10, a pickup nozzle 12 that can suck and hold the chip 2, and the pickup nozzle 12 between the pickup position of the chip supply unit 6 and the relay stage 7. And a first camera 16 for detecting the position of the chip 2 to be picked up by the pickup nozzle 12.

  Note that the wafer stage moving mechanism for positioning the wafer stage 10 in the embodiment is only in the X-axis direction (the same direction as the transfer direction of the chip 2) and the Y-axis direction (the direction orthogonal to the X-axis). It may be provided with a positioning movement mechanism (rotation mechanism) in the θ-axis direction (rotation direction). The pickup nozzle moving device 14 has a Z-axis moving mechanism (elevating mechanism) and an X-axis moving mechanism (conveying direction of the chip 2).

  The relay stage 7 is formed with a chip mounting table 17 on which chips 2 can be mounted and a defective chip recovery device 30. The relay stage 7 is moved in the Y-axis direction (vertical direction in FIG. 1). A stage moving device 18 and a second camera 19 are provided. The chip placement table 17 of the relay stage 7 has a θ-axis drive mechanism for alignment, and a chip suction portion connected to a suction device (not shown) is formed. The lower surface of the chip 2 is sucked and held.

  The position of the chip placement table 17 of the relay stage 7 is set to be different between the placement position A where the chip 2 is placed by the pickup nozzle 12 and the pick-up position B where the chip 2 is picked up by the bonding tool 21. Has been. Specifically, as shown in FIG. 2, a travel line (movement) of the pickup nozzle 12 and the bonding tool 21 in a direction (Y axis direction) orthogonal to the movement direction (X axis direction) of the pickup nozzle 12 and bonding tool 21. The placement position A and the pick-up position B are set at positions separated so as not to interfere with each other. By setting in this way, there is no collision even if the pickup nozzle 12 is moved to the placement position A and the bonding tool 21 is simultaneously positioned to the pick-up position B. In FIG. 2, A is the mounting position, and B is the picking position.

  The relay stage 7 can be reciprocated by a relay stage moving device 18. The range is a range in which the position of the chip mounting table 17 reciprocates between the mounting position A and the pick-up position B. This movement of the relay stage 7 in the embodiment is based on the movement in the Y-axis direction, but may be performed by rotation.

  A second camera 19 is fixedly installed above the relay stage 7. In the embodiment, the second camera 19 is installed above the pick-up position B in the moving range of the chip mounting table 17 of the relay stage 7. That is, it may be between the placement position A where the chip 2 is placed by the pickup nozzle 12 and the pick-up position B where the chip 2 is picked up by the bonding tool 21.

  The second camera 19 recognizes an image of the chip 2 before delivering the chip 2 to the bonding tool 21, and performs an appearance inspection of the chip 2 and a position correction at the time of delivery based on the image recognition. For correction of the position at the time of delivery, the chip 2 may be moved relative to the bonding tool 21 in the X-axis direction, the Y-axis direction, and the θ-axis direction. , Movement in the Y-axis direction, movement in the θ-axis direction by the θ-axis drive mechanism of the chip mounting table, and movement in the X-axis direction by the bonding tool moving device 22.

  The relay stage 7 is provided with a defective chip recovery device 30 adjacent to the chip mounting table 17. The collection device 30 is provided with a detachable pre-filter 32 inside the collection box 31 so that the collected chips can be taken out together with the pre-filter 32. A lid 33 is also detachably mounted on the upper surface of the collection box 31. The lid 33 is formed with a suction port 34 that serves as a passage port for defective electronic components. A large number of air circulation holes are provided in the side portion of the prefilter 32, and a gap is formed between the outer surface of the prefilter 32 and the inner wall surface of the collection box 31, and this gap communicates with the vacuum suction mechanism 35. The vacuum suction mechanism 35 can make the inside of the prefilter 32 have a negative pressure.

  The suction port 34 is a suction port 34 that is slightly larger than the chip size or the bonding tool size in order to increase the flow velocity of the sucked air. In the embodiment, since both the chip 2 and the bonding tool 21 are rectangular, the suction port 34 is also rectangular. As shown in FIG. 3, a vacuum suction mechanism 35 for applying a negative pressure to the collection box 31 is continuously provided. As shown in FIG. 3, the vacuum suction mechanism 35 also plays a role of applying a negative pressure for the bonding tool 21 to suck the chip 2.

  The bonding unit 8 includes a bonding stage 20 on which the wafer substrate 4 is placed, a bonding tool 21 that holds the chip 2 by suction and is bonded to the wafer substrate 4 by thermocompression bonding, and the bonding tool 21 is connected to the relay stage 7 and the bonding stage 20. A bonding tool moving device 22 that moves between them and a third camera 23 are provided. The bonding tool 21 is a suction nozzle in the present invention.

  The bonding stage 20 includes an X-axis drive table 26, a Y-axis drive table 27, and a θ-axis drive table 28 for alignment. The bonding tool moving device 22 has an X-axis drive mechanism for moving between the relay stage 7 and the bonding stage 20, a chip pick-up operation, a chip recovery operation, and a Z-axis drive mechanism (elevating mechanism) for the bonding operation. is doing.

  The bonding tool 21 has a rectangular lower end surface and can hold the chip 2 by suction. When the chip 2 is picked up from the chip mounting table 17 of the relay stage 7, the bonding tool 21 does not hide the alignment mark attached to the upper surface of the chip 2. To take up. The third camera 23 has a Z-axis drive mechanism that is different from the Z-axis drive mechanism of the bonding tool 21. The third camera 23 moves up and down to adjust the height of chip recognition and the height of substrate recognition. The recognition after bonding the chip 2 to the wafer substrate 4 is that, when the chip 2 is thin, by observing the marks on the chip 2 and the wafer substrate 4 at a height increased by a half of the thickness of the chip 2. Do. When the chip 2 is thick, the marks are observed separately. The moving path of the bonding tool 21 by the bonding tool moving device 22 is provided in parallel to the back side from the moving path of the pickup nozzle 12 by the pickup nozzle moving device 14 described above. 3 denotes a positive pressure application mechanism for applying a positive pressure to the bonding tool 21.

  The operation of the bonding apparatus 1 according to the embodiment will be described below with reference to FIG. First, the wafer transfer device 9 takes out the wafer ring 3 from the wafer ring supply unit 5, transfers it, and places it on the wafer stage 10 of the chip supply unit 6. Then, the chip 2 to be taken out from the wafer ring 3 is moved below the first camera 16 by the wafer stage moving mechanism. On the other hand, the wafer substrate 4 taken out from the substrate-side wafer supply unit is placed on the bonding stage 20 so that the bonding stage 20 is positioned below the third camera 23 at the position where the chip 2 to be taken out is bonded. Has moved.

  After the image of the chip 2 to be taken out is inspected by the first camera 16, the pickup nozzle 12 is moved above the target chip 2 by the pickup nozzle moving device 14 and descends to suck the chip 2. With the pickup nozzle 12 adsorbing the chip 2, the push-up device 15 pushes the chip 2 upward, and the pickup nozzle 12 rises according to the push-up height. Then, after the sticking force by the wafer sheet 11 is weakened by the thrusting device 15, the pickup nozzle 12 is raised so that the chip 2 is completely separated from the wafer sheet 11. Thereafter, the pickup nozzle 12 moves above the chip placement table 17 of the relay stage 7 and descends to place the chip 2 on the chip placement table 17.

  The relay stage 7 moves the chip mounting table 17 from the mounting position A of the chip 2 by the pickup nozzle 12 to a different position in the Y-axis direction (this position is referred to as the upper position B) by the relay stage moving device 18. The image inspection of the chip 2 on the chip mounting table 17 is performed by the second camera 19 at the pick-up position B. Therefore, the pick-up position B is also a photographing position. At the photographing position, the chip 2 is photographed by the second camera, the appearance is inspected, and the position is recognized. Thereafter, the relative position of the chip 2 is corrected, and it is determined whether or not the chip 2 is a non-defective product.

  On the other hand, the bonding tool 21 is moved above the pick-up position B by the bonding tool moving device 22 and lowered to suck and hold the chip 2 placed at the pick-up position B, and is lifted. If it is a non-defective product, the collection box 31 moves in the Y-axis direction and is discharged immediately below the chip 2 sucked and held by the bonding tool 21 by the relay stage moving device 18.

  Specifically, the vacuum suction mechanism 35 is activated and the inside of the collection box 31 is set to a negative pressure. Subsequently, the defective chip 2 is brought close to the suction port 34 formed in the lid 33 of the collection box 31. By approaching, the gap between the tip 2 and the suction port 34 becomes small, and a large suction force is generated. This ensures that the chip 2 is discharged and collected from the suction port 34 into the prefilter 32. At this time, the bonding tool 21 side also applies a positive pressure from the positive pressure applying mechanism 36 inside, releases the negative pressure in the bonding tool 21, and jets pressurized gas from the suction hole of the bonding tool 21. Thus, the discharge recovery can be made more reliable.

  If the chip 2 is a non-defective product, the chip 2 is moved to the bonding position, that is, above the bonding stage 20 while the chip is sucked and held by the bonding tool 21. At this time, the pickup nozzle 12 moves to the wafer stage 10 side and enters the next chip 2 pickup operation.

  Thereafter, the bonding tool 21 moves to the bonding position on the wafer substrate 4 and descends to a predetermined set height, and the third camera 23 sequentially recognizes the mark on the upper surface of the chip 2 and the mark on the upper surface of the wafer substrate 4. After the chip 2 and the wafer substrate 4 are aligned by the bonding stage 20, the chip 2 is bonded to the wafer substrate 4 by thermocompression bonding. At this time, the relay stage 7 has moved in the Y-axis direction, and the chip mounting table 17 has moved to the mounting position A. After the bonding of one chip 2 is completed, the bonding tool 21 moves up and returns to the relay stage 7 for the next bonding. By repeating this operation, when mounting of the predetermined chip 2 on the wafer substrate 4 is completed, the wafer substrate 4 is transferred to the next step.

  In the above embodiment, as shown in the first example of FIG. 5A, the chip 2 is picked up by the pickup nozzle 12 from the adhesive sheet of the wafer, and the chip 2 is mounted on the chip mounting table 17 of the relay stage 7. After the image is observed from above with the second camera 19, the chip 2 is sucked and held by the bonding tool 21 and collected in the collection box 31 when it is a defective chip. Means can also be employed.

  The second example is an example of an apparatus for observing an image with a second camera 19 in which the lower surface of the chip 2 sucked and held by the pickup nozzle 12 is provided below. As shown in FIG. The procedure is the same as in the first example until it is placed on the chip placement table 17 of No. 7, but the chip 2 is sucked and held by the bonding tool 21 from the chip placement table 17, moved to the photographing position, and then the second camera. 19, the image of the chip 2 is observed from below. If it is a defective chip, it is collected in the collection box 31. If it is a non-defective product, it passes over the collection box 31 and goes to the bonding stage 20. This is a procedure for bonding a chip to a substrate.

  Unlike the first and second examples, the third example does not have the relay stage 7 as shown in FIG. 5C, and after picking up with the pickup nozzle 12 having a reversing mechanism and reversing, It is sucked and held by the bonding tool 21, moved to the photographing position, and the image of the chip 2 is observed from below by the second camera 19, and if it is a defective chip, it is collected in the collection box 31. This is a procedure of passing the collection box 31 and heading to the bonding stage 20 to bond the chip to the substrate.

  In the fourth example, as shown in FIG. 5 (D), the chip 2 is placed on the chip placement table 17 of the relay stage 7 as in the first example, and the second camera 19 observes the image from above, In the case of a defective chip, the chip 2 is sucked and held by the pickup nozzle 12 instead of the bonding tool 21 and is collected in the collection box 31 installed on the front side of the relay stage 7.

  In the fifth example, the same procedure as in the first example is performed as shown in FIG. 5E, but the second camera 19 does not recognize it as a defective product, and the mark of the chip 2 when positioning with the wafer substrate 4 is performed. This is a procedure in which the bonding tool 21 that has sucked and held the chip 2 returns to the collection box 31 and collects it.

  Although the bonding apparatus has been described as an example, the defective electronic component recovery apparatus according to the present invention can also be used in a taping apparatus.

The schematic plan view which shows the whole bonding apparatus concerning a present Example Explanatory drawing showing the movement path of the chip Air circuit diagram of the recovery unit Flow chart of bonding operation FIG. 4 is an explanatory diagram showing an example of the procedure of the recovery operation, where A is the procedure of the present embodiment, B is the procedure of the second example, C is the procedure of the third example, D is the procedure of the fourth example, and E is the procedure of the fifth example. Show the procedure. Explanatory drawing showing a failure of a conventional defective electronic component recovery device

Explanation of symbols

1. . . . . . Bonding device . . . . . Chip 3. . . . . . Wafer ring 4. . . . . . 4. Wafer substrate . . . . . Wafer ring supply unit 6. . . . . . 6. Chip supply unit . . . . . Relay stage 8. . . . . . Bonding part 9. . . . . . Wafer transfer device 10. . . . . Wafer stage 11. . . . . Wafer sheet 12. . . . . Pickup nozzle 13. . . . . Magazine 14. . . . . Pickup nozzle moving device 15. . . . . Pushing device 16. . . . . First camera 17. . . . . . Chip mounting table 18. . . . . Relay stage moving device 19. . . . . Second camera 20. . . . . Bonding stage 21. . . . . . Bonding tool 22. . . . . Bonding tool moving device 23. . . . . . Third camera 25. . . . . Push-up member 26. . . . . X-axis drive table 27. . . . . Y-axis drive table 28. . . . . θ axis drive table 30. . . . . Collection device 31. . . . . Collection box 32. . . . . Pre-filter 33. . . . . Lid 34. . . . . Suction port 35. . . . . Vacuum suction mechanism 36. . . . . Positive pressure applying mechanism A. . . . . . Placement position B. . . . . . Lifting position

Claims (3)

When the electronic component sucked by the suction nozzle connected to the vacuum means is a defective product, the defective electronic component recovery device is configured to recover the electronic component to the recovery unit.
The collection unit is provided with a passage port formed slightly larger than the electronic component, a detachable lid on which the passage port is formed , and a vacuum means for making the inside negative pressure,
When collecting defective electronic components, move at least one of the suction nozzle and the collection unit to bring the defective electronic components closer to the passage port, and make the inside of the collection unit have a negative pressure to be sucked and collected from the passage port ,
Further , a defective electronic component recovery apparatus , wherein a plurality of lids having different passage openings are prepared so that defective electronic components of different sizes can be recovered. A pressurizing means for applying positive pressure is provided in the suction nozzle, and when the defective electronic component is recovered, when the defective electronic component approaches the passage port, the suction nozzle is switched from negative pressure to positive pressure to supply pressurized gas. The defective electronic component collecting apparatus according to claim 1, wherein the defective electronic component is collected. 3. The defective electronic component recovery apparatus according to claim 1 , wherein a storage container is detachably provided in the recovery unit.

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