JP2008103549A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately press mount a component on a substrate and to simplify a mounting head structure for downsizing and weight reduction. <P>SOLUTION: The mounting head of a component mounting device movable in a planar direction comprises an absorption nozzle 19 for absorption holding the component; a press driving means 8 for moving the press driving unit 8a forward and backward in a Z-axis direction and moving the absorption nozzle supported by the press driving unit in the same direction; a supporting frame 15 for fixing and supporting the press driving means; a Z-axis driving means 11 for moving the supporting frame forward and back in the Z-axis direction and moving the absorption nozzle integrally with the press driving means in the same direction; and a substrate mounting table 30 for supporting the substrate 34 for press mounting the component 40 held by the absorption nozzle by the press mounting means. In this instance, a load detecting means 31 for detecting the load applied to the supporting substrate 34 is attached to the substrate mounting table 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus suitable for application when mounting electronic components on a substrate such as a printed circuit board or a liquid crystal display panel substrate while controlling the pressure.

  As a component mounting apparatus that automatically mounts (mounts) an electronic component on a printed circuit board under pressure control, a bare chip mounter shown in FIG.

  This bare chip mounter has an XY table 104 mounted with a printed wiring board 103 on the upper surface and moved in a direction perpendicular to the horizontal plane, an adsorption nozzle portion 102 that is located above the XY table and sucks the upper surface of the bare chip 101, A vacuum generator 105 that is connected to the suction nozzle unit and performs vacuum suction of the bare chip, a first uniaxial table 106 that holds the suction nozzle unit and guides its vertical movement, and the first uniaxial table A bracket 107 that holds the suction nozzle portion downward, a rod 109 that contacts the upper end of the compression spring on the lower surface, and a load cell 110 that is held by the bracket and contacts the upper surface of the rod. , The movable part of the first uniaxial table is lifted and the direction opposite to the load direction of the compression spring is A tension spring 111 that generates a load greater than the dead weight of the movable part of the shaft table, a pressure detection unit 112 that is connected to the load cell and outputs the detected pressure of the load cell, and moves up and down by a motor that holds the bracket And a table controller 114 which is connected to the pressure detection unit and controls the operation of the second uniaxial table.

  Further, in Patent Document 2, as a bonding load control device including a head 126 mounted on a component mounting apparatus, a collet 122 for fixing a chip 121 as shown in FIG. Including a head 126, a cylinder 128 that pressurizes the protruding portion 125 with a constant pressure, a load cell 129 that converts a load received by the protruding portion 125 into a voltage, a housing 130, and a ball screw 132 fixed to the housing 130. A motor 133 that rotates a ball screw 132, a CPU 134, and a stage 136 that fixes a substrate 135 is disclosed.

JP 2004-158743 A JP 2001-127081 A

  However, the component mounting apparatus disclosed in Patent Documents 1 and 2 that pressurizes and mounts components on a substrate has the following problems.

  Since the load cell for detecting the load is on the head, when the head is moved in the XY direction or the like for picking up and mounting the parts, the load cell and its accompanying parts are swung with the moving operation. The reliability is inferior because there is a risk of failure of the load cell or disconnection of the cable.

  Similarly, since the load cell is arranged on the head, a detection system mechanism such as a compression spring and a rod related to the load cell is required, and the structure of the head becomes complicated. Therefore, the head becomes large and increases in weight.

  The present invention has been made to solve the above-mentioned conventional problems. In addition to being able to pressure-mount components on a substrate with high precision, the structure of the mounting head can be simplified, and the size and weight can be reduced. It is an object of the present invention to provide a component mounting apparatus that can be used.

  In the present invention, the mounting head movable in the plane direction by the X-axis driving means and the Y-axis driving means moves the suction nozzle for sucking and holding the component and the pressure drive unit forward and backward in the Z-axis direction, and the pressure drive A pressure driving means for moving the suction nozzle supported by the unit in the same direction; a support frame for fixing and supporting the pressure driving means; and the pressure driving by moving the support frame forward and backward in the Z-axis direction. A component comprising: a Z-axis drive unit that moves the suction nozzle in the same direction integrally with the unit; and a substrate mounting table that supports a substrate on which the component sucked and held by the suction nozzle is mounted by the pressure drive unit In the mounting apparatus, the problem is solved by providing a load detection means for detecting a load applied to the support substrate on the substrate mounting table.

  In the present invention, the load detection means may be a plurality of load cells installed under the substrate mounting table, and a stopper for preventing excessive deflection may be provided below each load cell. Good.

  In the present invention, at the time of pressure mounting, the load detecting means detects the load applied to the substrate and controls the pressure by the pressure driving means so that the load matches the load command value. Control means are provided. In this case, at the time of component suction, the control means moves the tip of the suction nozzle by the Z-axis drive means in a state where the pressure drive unit is in contact with the lower stopper portion of the support frame at a target pressure amount. You may make it contact the components of a predetermined position.

  According to the present invention, the load detecting means is attached to the board mounting table, and the load applied when the components are pressure-mounted on the board supported on the board mounting table can be detected by the load detecting means. As a result, it is possible to pressure-mount components while controlling the load with high accuracy, and to eliminate the load detection means and its associated components and related mechanisms from the mounting head, thus simplifying the structure of the mounting head. In addition to being able to reduce the size and weight.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

  In FIG. 1, the mounting head 1 includes a pressurizing device that sucks and holds parts and pressurizes, and a recognition device (not shown) that corrects the position of the mounting head 1.

  The mounting head 1 is attached to an X-axis gantry (X-axis driving means) 2 that moves the electronic component mounting (mounting) device in the X-axis direction. The mounting head 1 and the X axis gantry 2 are attached to a Y axis gantry (Y axis driving means) 3 for moving in the Y axis direction of the electronic component mounting apparatus.

  Further, in this electronic component mounting apparatus, a recognition device 4 using a CMOS camera or a CCD camera for recognizing the posture of the sucked electronic component is fixed within the movable range of the mounting head 1. An electronic component supply device 5 for supplying an electronic component to be mounted on a substrate is installed on the front surface of the electronic component mounting device.

  Next, the mounting head 1 will be described with reference to FIG.

  The mounting head 1 has a head base 6 for connecting and fixing to the X-axis gantry 2. The head base 6 is connected to the linear guide 7, and the vertical Z-axis drive unit (support frame) 15 is configured to be movable in the vertical Z-axis direction.

  Above the head base 6 is a θ motor 9 for rotating parts, a vertical rotation drive bearing 20 composed of a spline bearing and a bearing, and a vertical rotation drive shaft 21. A belt 10 for transmitting to the vertical rotation drive shaft 21 and a Z-axis motor (Z-axis drive means) 11 for vertically moving the vertical Z drive unit 15 vertically are attached. Further, a threaded portion 14 of a ball screw is connected to the Z-axis motor 11 via a coupling 12.

  A voice coil motor for pressurization (pressure drive means, hereinafter referred to as VCM) 8 is attached to the vertical Z drive unit 15. The VCM 8 includes a magnet-side operating element 8a and a coil-side stator 8b, and the VCM 8 and the θ motor 9 are connected via a vertical rotation drive shaft 21, and the VCM 8 is movable. Since the side armature 8a and the like are independently supported by the vertical rotation drive shaft 21 with respect to the vertical Z drive unit 15, the vertical operation unit 8a can rotate and move up and down. (Advancing and retreating in the Z-axis direction) is possible.

  Further, an upper stopper 21a is mounted on the upper side of the VCM 8, and when the VCM 8 is driven upward, the upper stroke of the VCM 8 is restricted by contacting the upper stopper portion 6a of the head base 6. ing.

  Similarly, a lower stopper 21b is attached to the lower side of the VCM 8, and when the lower stopper 21b of the VCM 8 comes into contact with the lower stopper portion 15a of the vertical Z drive unit 15, the downward movement stroke of the VCM 8 is increased. It is regulated.

  A ball screw nut portion 13 is fixed to the vertical Z drive portion 15, and a ball screw screw portion 14 connected to the nut portion 13 via the coupling 12 is fitted into the nut portion 13. The Z-axis motor 11 is rotated and the vertical Z drive unit 15 can be moved up and down by the nut portion 13 of the ball screw.

  Further, a ball bush 16 is attached to the lower part of the VCM 8 fixed to the vertical Z drive unit 15, and a nozzle shaft 17 is held via the ball bush 16, and the nozzle shaft 17 is connected to the vertical Z drive unit. 15 has a structure capable of rotating and vertically moving up and down.

  A suction nozzle 19 is held at the tip of the lower portion of the nozzle shaft 17 by a nozzle chuck mechanism 18 and is replaceable. The nozzle 19 sucks and holds the component 40 and can mount the component 40 on the substrate 34 mounted and supported on the substrate mounting table 30.

  In the substrate mounting table 30, as shown in FIG. 2, the substrate 34 mounted on the upper surface thereof is supported and fixed by a clamp 33.

  A load cell (load detection means) 31 is attached to the lower part of the substrate mounting table 30, and the lower side of the load cell 31 is supported by a load cell mounting base 32 fixed to the apparatus main body. A load cell stopper 32a protrudes upward from the load cell mounting base 32 in order to prevent the load cell 31 from being excessively bent due to an overload.

  The load cells 31 are arranged and fixed at the lower four corners of the substrate mounting table 30 as schematically shown in FIG. 3 as seen through the substrate mounting table 30, and each load cell 31 is a load cell amplifier. 35.

  FIG. 4 shows an outline of a control system provided in the component mounting apparatus of the present embodiment.

  This control system is constituted by a CPU 40 and the like. In the CPU 40, a Z-axis motor 11 constituting a Z-axis drive system and a Z-axis encoder 41 incorporated therein are connected via a Z-axis driver 42, and θ The θ-axis motor 9 constituting the shaft drive system and its encoder 43 are connected via the θ-axis driver 44, and further the VCM motor 8 constituting the pressure drive system is connected via the VCM driver 45. Sending and receiving is possible.

  The VCM driver 45 is connected to the load cell 31 on the apparatus main body via a load cell amplifier 35, and performs control to match the load command value from the CPU 40 while detecting the output value of the load cell amplifier 35. It constitutes a control means. However, this control function may be realized by the CPU 40.

  The operation from the pressure mounting operation of the electronic component to the suction operation of the next component executed in the electronic component supply apparatus having the above configuration will be described with reference to FIGS.

  The mounting head 1 of FIG. 1 is moved above the electronic component supply device 5 by driving the X-axis gantry 2 and the Y-axis gantry 3, and the electronic components are sucked by the suction nozzle 19.

  The mounting head 1 that has attracted the electronic component is moved above the recognition device 4, and the recognition device 4 recognizes the component.

  After completing the recognition of the components, the mounting head 1 is moved to a mounting portion of an electronic component on a substrate (not shown), and the electronic component 40 sucked by the suction nozzle 19 of the mounting head 1 is placed on the substrate 34. To be installed.

  Hereinafter, these operations will be described in detail, but the component mounting operation will be described first for convenience.

  After performing the above-described recognition operation for component position correction, the component 40 is moved to the mounting position (above the board) to perform the component mounting operation. The lowering / pressing operation at that time is shown in FIG. While referring to the time chart, it will be described in detail according to the flowchart of FIG.

  The component mounting operation is performed by moving the mounting head 1 to a component mounting position on the substrate 34, driving the Z-axis motor 11, and lowering the suction nozzle 19 together with the vertical Z driving unit 15.

  At that time, a voltage is applied to the VCM 8 to generate a downward force, and the lower stopper 21b is abutted against the lower stopper portion 15a of the vertical Z drive unit 15 as shown in FIG. 5 to move the VCM 8 downward. Be regulated.

  In this state, the suction nozzle 19 is lowered integrally with the vertical Z drive unit 15 by the Z-axis motor 11, and the suction nozzle 19 is rapidly stopped when the sucked component 40 reaches the height just before the substrate surface.

  At this time, the inertial force works downward due to the weight of the operating element 8a of the VCM 8 and the nozzle shaft 17 and the acceleration at the time of deceleration, but the position of the lower stopper 21b of the VCM 8 is regulated by the lower stopper portion 15a. Even if an inertial force greater than the force generated by the VCM 8 acts downward, no change is observed in the position of the tip of the nozzle 19.

  In this way, when the Z-axis motor 11 is driven, the vertical Z drive unit 15 in which the output value of the VCM 8 is V2 and the lower stopper 21b is in the restricted state of FIG. At a height that does not contact the upper surface, it is lowered at a high speed to a first height Z1 that is a slight displacement above the upper surface (steps 1 and 2). Next, the speed is switched, and at time T2, the movement is started at a low speed to the second height Z2 set below the height (= 0) of the upper surface of the substrate (step 3). Note that the Z-axis heights such as Z3, Z1, and Z2 are determined by the output of the encoder 41 built in the Z-axis motor 11.

  At that time, when the CPU 40 receives a signal from the encoder 41 that the Z-axis motor 11 has completed the movement to the first height Z1 at which the suction component does not contact the upper surface of the board, the VCM 8 is energized with the output value V1. , Generating an upward force of the weight + α of the movable part consisting of the moving element 8a of the VCM 8 and the nozzle shaft 17, the nozzle chuck 18, the suction nozzle 19 and the stoppers 21a, 21b, etc. A self-weight cancellation of the movable part + α force V1 is generated (step 4). As a result, the lower stopper 21b changes from the state of FIG. 5 to the unregulated state of FIG.

  The Z-axis motor 11 is driven while maintaining the upward V1 in the VCM 8, and the suction nozzle 19 is lowered together with the vertical Z drive unit 15. When the suction nozzle 19 reaches the height 0 of the upper surface of the substrate 34, the component sucked by the nozzle 19 comes into contact with the substrate at time T 0, and pressure is generated in the substrate mounting table 30 and the pressure is transmitted to the load cell 31. The contact timing T0 of the component 40 is detected by the load cell 24.

  At time T2, even if the suction component of the nozzle 19 contacts the substrate 34 at time T0, the output of the load cell 31 becomes the predetermined load L1 (step 5), and the Z-axis motor 11 is driven and the encoder output becomes Z2. Do not stop until. This Z2 is set to a height of 0.2 mm below the substrate surface height, for example, when the VCM 8 raises the movable part with the output of V1 and the state shown in FIG. .

  On the other hand, when the VCM 8 receives a contact signal from the nozzle 19 (component 40) from the load cell 31, the VCM 8 switches to a downward force and gradually increases the pressurization amount (load) to the set output value V2, thereby increasing the load cell 31. Is pressurized until the output value reaches a predetermined target pressurization amount L1 (step 5). When the target pressure amount L1 is reached and the second height Z2 is reached (step 6), the height is stopped and maintained (step 7), and the VCM 8 is stopped and the load is maintained (step 8). ) After maintaining the target pressurization amount for a preset pressurization time T3 (step 9), the pressurization mounting operation is terminated.

  As described above, when the pressure mounting operation of the component 40 is completed, the vertical Z drive unit 15 of the mounting head 1 is raised upward by the Z-axis motor 11 (step 10), and is rapidly raised to the third height Z3. Thus, one part mounting operation by pressurization control is completed, and the next suction operation is started.

  In the component suction operation, as shown in FIG. 8, the mounting head 1 is driven at the component suction position on the component supply device 5 to drive the Z-axis motor 11 and lower the suction nozzle 19 together with the vertical Z drive unit 15.

  At that time, the basic operation is the same as that of the pressure mounting, a voltage is applied to the VCM 8 to generate a downward force, and the lower stopper 21b is moved to the lower stopper of the vertical Z drive unit 15 as in FIG. The movement of the VCM 8 in the downward direction is restricted against the portion 15a.

  The suction nozzle 19 is lowered integrally with the vertical Z drive unit 15 by the Z-axis motor 11, and the suction nozzle 19 is rapidly stopped at a height immediately before the suction surface of the part to be sucked.

  At this time, the inertial force works downward due to the weight of the operating element 8a of the VCM8 and the nozzle shaft 17 and the acceleration at the time of deceleration, but VCM8 is generated because the position is regulated by the lower stopper 21b of the VCM8. Even if an inertial force greater than the applied force acts downward, no change is observed in the position of the tip of the nozzle 19.

  After the suction nozzle 19 is stopped rapidly as described above, an upward force is generated in the VCM 8 so as to reduce the collision load at the time of contact. While maintaining the upward force on the VCM 8, the Z-axis motor 11 is operated slowly to lower the vertical Z-axis drive unit 15. At this time, the pressurizing VCM 8 generates a pressure that does not destroy the parts by open loop control and abuts the lower stopper 21b against the lower stopper portion 15a, whereby the position of the nozzle 19 in the Z-axis direction is known. Like that.

  The suction nozzle 19 is lowered to the target suction height, and the Z-axis operation is stopped. Thereafter, an electromagnetic valve of an ejector (not shown) is turned on, and vacuum air for sucking parts is generated in the suction hole of the nozzle 19 to suck the part 40.

  After attracting and holding the component 40, the Z-axis motor 11 is driven to raise the component, and the mounting head 1 is moved to move onto the recognition device 4.

  As described above, according to the present embodiment, the following effects can be obtained.

(1) Since the load cell 31 is arranged on the substrate mounting table 30 which is a fixed portion at the lower part of the substrate, it is not necessary to install a load cell on the mounting head, the head structure can be simplified, and the enlargement and weight of the head are prevented. I can do it.

(2) Since there is no need to place a load cell as a load detector on the mounting head, there is a problem of vibration of the head due to the installation on the head and a problem of reliability reduction caused by swinging accessories such as cables. Disappear.

(3) Since the load cell is excluded from the head, restrictions on the shape and size of the load cell are reduced, and the range of selection is widened. Therefore, a load cell with higher accuracy and a lower cost can be used.

(4) Therefore, the pressure drive means (VCM) on the head can cope with the manufacture (mounting) of parts with complicated load control profiles at the time of processing and mounting. A pressurizing operation can be performed, and a suction operation without breaking the parts can be performed by performing the pressurizing operation with open loop control even during the suction.

  Although the present invention has been specifically described above, the present invention is not limited to that shown in the embodiment.

  For example, in the mounting head shown in FIG. 2 and the like, the ball bushing 16 may be an air bearing that can freely rotate and move.

  In the mounting head, the VCM 8 may be a moving coil system in which the magnet is disposed on the fixed side and the coil is disposed on the movable side instead of the illustrated moving magnet system. Similarly, the VCM 8 may be another linear motor such as a linear synchronous motor as long as the movable portion can be turned.

  In the mounting head, the means for converting the power of the vertical Z-axis motor 11 into vertical movement may be another motion conversion means such as a combination of a timing belt and a pulley. Similarly, if it is necessary to reduce the speed when transmitting the power of the rotary θ-axis motor 9, it may be connected to a rotating body including a suction nozzle via a speed reduction mechanism such as a gear or a harmonic drive.

1 is a schematic perspective view schematically showing a component mounting apparatus according to an embodiment of the present invention. Sectional drawing which shows the outline | summary of the mounting head and board | substrate mounting table with which the component mounting apparatus of this embodiment is provided. The principal part perspective view which shows the characteristic of the said board | substrate mounting table Block diagram showing the outline of the control system of the component mounting equipment Sectional drawing equivalent to the said FIG. 2 in which a pressurization drive part is in a fall control state Time chart showing the outline of pressurizing operation and ascending operation when mounting components according to this embodiment Flowchart showing the component pressure mounting operation according to the present embodiment Sectional drawing which shows the outline | summary of the mounting head of this embodiment at the time of adsorption | suction operation | movement Sectional drawing which shows the outline | summary of the conventional component mounting apparatus Sectional view showing the outline of a conventional mounting head

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mount head 2 ... X-axis gantry 3 ... Y-axis gantry 8 ... Voice coil motor (VCM)
DESCRIPTION OF SYMBOLS 11 ... Z-axis motor 15 ... Vertical Z drive part 15a ... Lower side stopper part 19 ... Adsorption nozzle 21a ... Upper side stopper 21b ... Lower side stopper 30 ... Substrate mounting table 31 ... Load cell 40 ... CPU
45 ... VCM driver (control means)

Claims (4)

A mounting head that can be moved in the plane direction by the X-axis drive means and the Y-axis drive means moves the suction nozzle that sucks and holds the components and the pressure drive unit in the Z-axis direction and is supported by the pressure drive unit. A pressure driving means for moving the suction nozzle in the same direction; a support frame for fixing and supporting the pressure driving means; and moving the support frame forward and backward in the Z-axis direction so as to be integrated with the pressure driving means. In a component mounting apparatus comprising: a Z-axis driving unit that moves the suction nozzle in the same direction; and a substrate mounting table that supports a substrate on which the component sucked and held by the suction nozzle is pressure-mounted by the pressure driving unit.
A component mounting apparatus, wherein load detecting means for detecting a load applied to a support substrate is attached to the substrate mounting table.   The component mounting apparatus, wherein the load detecting means is a plurality of load cells installed under the board mounting table, and a stopper for preventing excessive deflection is disposed below each load cell.   At the time of pressure mounting, there is provided control means for controlling the pressure on the component by the pressure driving means while detecting the load applied to the substrate by the load detecting means so that the load coincides with the load command value. The component mounting apparatus according to claim 1.   When the component is picked up, the control means moves the tip of the suction nozzle to a predetermined position by the Z-axis drive means in a state where the pressure driving unit is in contact with the lower stopper portion of the support frame at a target pressure amount. The component mounting apparatus according to claim 3, wherein the component mounting device is brought into contact with the component.

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