JP4644481B2 - Electronic component crimping equipment - Google Patents

Description

  The present invention relates to an electronic component crimping / mounting apparatus, and more particularly, to an electronic component crimping / mounting apparatus that can quickly perform the crimping / mounting operation while suppressing an impact load when the electronic component is crimped / mounted on a substrate.

  In Patent Document 1, the vehicle descends to the position immediately before the substrate at the set maximum speed, and further descends at the set minimum speed. Then, after the substrate contact is detected by the load cell, the follow-up control is performed until the target pressure is reached. In this way, the tact time of the suction work and the mounting work is made as short as possible while suppressing the impact on the electronic components and the like.

  Next, in Patent Document 2, the position is controlled by a linear motor, firstly, it descends to a position immediately before the substrate at a high speed, and further descends at a speed further decelerated until contact with the substrate is detected. In this patent document 2, in the control part that feedback-controls the position and speed, the above-described change from the torque command output by the speed control unit 212, the speed signal output from the position / speed detection unit 115 of the linear motor attachment, and the like are described above. Board contact is detected. After the detection, the position control is switched to the torque control. In this way, the impact force on the component at the time of component adsorption and mounting is reduced, and the component can be mounted by pressing force.

JP 2001-210995 A Japanese Patent Laid-Open No. 11-145683

  However, in Patent Document 1, it is considered that the above-mentioned minimum set speed during installation control is extremely low (FIG. 10). Further, immediately after the contact is detected, the machining speed is once increased rapidly and then decelerated as it descends, and the decelerated decrease continues until the target pressure is reached. Therefore, in order to make the objectives of operation tact and pressing accuracy contradictory, these objectives cannot be fully achieved, or complicated downward acceleration / deceleration operations are required.

  Next, in Patent Document 2, a time lag occurs after switching from position control to substrate contact detection to switch to torque control (pressurization control), and an impact load occurs when contacting. Also, since the impact load is in the position control stage, the control becomes unstable, for example, the amount of impact load cannot be detected. For example, at the time of the switching, a time lag occurs until the torque control is stabilized, and the control becomes unstable.

  The present invention has been made to solve the above-mentioned conventional problems, and can suppress the impact load when electronic components are pressure-mounted on a substrate, and can quickly perform the operation of the electronic components. It is an object to provide an apparatus.

  In the present invention, the mounting of the electronic component on the substrate is not particularly limited as long as it is performed by pressing the electronic component against the substrate. The adhesive may be mounted by pressing with an adhesive previously applied to a substrate or an electronic component, or with some kind of adhesive or adhesive material. Alternatively, the electronic component lead pin may be inserted into the hole of the substrate by pressing, or may be mounted by pressure bonding by some physical bonding.

The present invention relates to an electronic component crimping mounting apparatus in which the mounting head (1) sucks an electronic component and moves it to a predetermined position above the substrate, and then lowers the mounting head to crimp and mount the electronic component on the substrate. A suction nozzle (18, 19) that is mounted on the mounting head and sucks the electronic component, and a contact detection means that detects that the electronic component sucked by the suction nozzle is in contact with the substrate during the lowering. 16, 17), a support member (15, 17) that supports the suction nozzle so as to be movable in the vertical direction, and is fixed to the mounting head, and the suction nozzle is moved up and down via the support member. A Z-axis motor (9) and a main body (24a) are fixed to the support member, a moving part (24b) is connected to the suction nozzle side, and a drive motor (14) that moves the suction nozzle up and down by driving. 24), a voice coil motor or an air slider, which is used while the suction nozzle is lowered by the Z-axis motor, and the contact detecting means detects contact between the electronic component and the substrate. Until the suction nozzle and the contact detection means are driven upward to compensate for their own weight, the control means (control circuit unit) for controlling the drive motor, the contact detection means, an elastic member (28, springs, gas springs etc.), the movably supports the suction nozzle, and the If you detect contact of the electronic component and the substrate by detecting a pressing force applied to the suction nozzle both the support member, the suction nozzle asked to support via the contact detection means is obtained by solving the above problems.

Further, in the same electronic component crimping and mounting apparatus, the suction nozzle is connected to a vacuum suction source, and the contact detection means includes a flow rate measurement means (22) for measuring a change in the air flow rate in the suction nozzle. And a distance detecting means (54) for detecting the distance between the suction nozzle and the substrate, detecting the approach of the suction nozzle to the substrate by a decrease in the flow rate of the suction air detected by the flow measuring means, and lowering the suction nozzle. The approach distance of the suction nozzle to the substrate is detected based on the Z-axis position when stopped and the flow rate of the suction air, and the height of the place where the electronic component is mounted is detected based on the approach distance. and detection known contact of the electronic component and the substrate based on the height, is obtained by solving the above problems.

  In the above description of the means for solving the problems, the numbers in parentheses are constituent elements corresponding to the embodiments described later as an example. Alternatively, it is another configuration requirement as an example.

  The operation of the present invention will be briefly described below.

  In the present invention, means for adsorbing an electronic component to be transferred to a substrate and pressure detecting means for detecting the pressure of the pressure applied from the component adsorbing means are supported by a predetermined support means so as to be vertically movable. Moreover, the pressure of the pressing is adjusted by driving the vertical movement by the pressing means.

  Then, the driving is controlled so that the driving force is applied upward so as to compensate at least the weights of the component adsorbing means and the pressure detecting means. For example, when the electronic component is vertically mounted on the substrate when the electronic component is crimped, the self-weight compensation is controlled until the electronic component contacts the substrate, and after the contact, the control of the pressing means is performed. Then, the upward driving force is set downward, and the pressure applied to the electronic component against the substrate is controlled to gradually increase to the set value.

  The magnitude of the upward driving force for the self-weight compensation is not particularly limited, and is the same as or larger than the self-weight. The driving force may be a constant value, or may be variable depending on a vertically lowered state of the electronic component on the substrate or a position where the electronic component is being lowered. You may make it increase / decrease only by the stress which arises by the acceleration / deceleration of this vertical descent.

  According to such self-weight compensation, it is possible to suppress the impact load when the electronic component is mounted on the substrate by pressure bonding. In addition, when the electronic component is pressure-mounted on the substrate by the pressure detection means, the pressure applied from the component suction means can be improved in accuracy and stability. In addition, since the impact load can be suppressed, it is possible to improve the descending speed and efficiently control the speed switching when the electronic component is mounted on the substrate by pressure bonding. Accordingly, the operation of crimping mounting can be performed quickly.

  As described above, according to the present invention, it is possible to provide an electronic component crimping mounting apparatus that can quickly perform the operation of crimping and mounting while suppressing an impact load when the electronic component is crimped and mounted on a substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a configuration of an electronic component crimping mounting apparatus according to an embodiment to which the present invention is applied.

  In the figure, arrows X, Y, and Z indicate the movement directions of the X, Y, and Z axes, respectively. The mounting head 1 includes a pressurizing device, which will be described in detail later, and a recognition device (not shown) that corrects the position of the mounting head 1. The substrate 21 is disposed below the mounting head 1.

  As shown in the drawing, the mounting head 1 is attached to the X-axis gantry 2, and the X-axis gantry 2 is attached to the X-axis direction, and the mounting head 1 and the X-axis gantry 2 are attached to the Y-axis gantry 3. The gantry 3 moves and positions in the Y-axis direction. Further, as will be described in detail later, the electronic component attracted to the lower portion of the mounting head 1 is moved and positioned in the Z-axis direction by the vertical movement of the vertical Z-axis drive unit 15 attached to the mounting head 1. Made.

  Moreover, the electronic component supply apparatus 5 supplies an electronic component from the corresponding tape among a plurality of tapes arranged in the X-axis direction. Each type of electronic component is affixed to each tape, and when the electronic component is sucked into the mounting head 1, a deep of the electronic component is fed out, and the next electronic component is fed out accordingly.

  The recognition device 4 uses a CMOS (Complementary Metal Oxide Semiconductor) camera or a CCD (Charge Coupled Device) camera, and the electronic component sucked to the lower part of the mounting head 1 positioned above is recognized from below. A photograph is taken, and electronic parts are recognized and confirmed by image recognition of the photograph.

  FIG. 2 is a side view of the mounting head 1 of the electronic component crimping mounting apparatus used in the present embodiment.

  The head base 6 of the mounting head 1 is attached to the X-axis gantry 2 and can move and position the X-axis by the X-axis gantry 2 and the Y-axis by the Y-axis gantry 3. In the mounting head 1, a linear guide 7 is attached to the head base 6 in which a vertical Z-axis drive unit 15 is assembled so as to be linearly movable in the Z-axis direction. The movement in the Z-axis direction is driven by a Z-axis motor 9.

  On the upper part of the head base 6, driving (θ axis movement) is performed for rotating and positioning the electronic component sucked by the nozzle 19 held by the nozzle chuck mechanism 20 as indicated by an arrow θ in the figure. A θ motor 8 and a Z-axis motor 9 for driving the movement in the Z-axis direction are attached. The Z-axis motor 9 is provided with a pulse generator 70 (not shown) that outputs a signal according to the rotation of the rotor of the Z-axis motor 9 in order to detect the amount of movement in the Z-axis direction. .

  A voice coil motor (hereinafter referred to as VCM) 14 for impact avoidance driving is attached to the upper part of the vertical Z-axis drive unit 15. The VCM 14 is connected to the θ motor 8 through the coupling 10. The drive side of the VCM 14 is supported by a vertical Z-axis drive unit 15 by a spline bearing and a rotary bearing (not shown), and the vertical Z-axis drive unit 15 is moved in the Z-axis direction or by the VCM 14 described later. Regardless of the vertical movement, the above-described θ-axis movement is possible.

  A ball screw nut portion 12 is fixed to the upper portion of the vertical Z-axis drive portion 15. A threaded portion 13 of the ball screw, which is rotationally driven by a Z-axis motor 9 through a coupling 11, is attached to the nut portion 12. Accordingly, the nut portion 12 is linearly moved in the axial direction of the Z axis in accordance with the rotational drive of the Z axis motor 9, and accordingly, the vertical Z axis driving portion 15 is also moved along the linear guide 7 along the Z axis axis. It is moved linearly in the direction.

  Next, in the vertical Z-axis drive unit 15, a pressure detection unit 16 is incorporated below the VCM 14. In the cylindrical inner periphery 17c of the vertical Z-axis drive unit 15, the cylindrical outer periphery of the pressure detection unit 16 is supported by six ball guide bearings 17b drawn in a circle shape in the drawing. Thus, the pressure detection unit 16 has a structure capable of rotating and moving up and down with respect to the vertical Z-axis drive unit 15.

  A nozzle shaft 18 extends downward at a lower portion of the pressure detection unit 16, and a nozzle chuck mechanism 20 is provided at the lower end of the nozzle shaft 18. The nozzle chuck mechanism 20 is configured to hold or replace the nozzle 19.

  The suction air is sucked from the suction port at the lower end of the nozzle 19 and sucked to the vacuum suction source via the nozzle shaft 18 and the shaft of the θ motor 8 and further via the vacuum hose 23 and the flow meter 22. It has become. With the suction air, an electronic component (not shown) can be sucked and held on the nozzle 19 and mounted on the substrate 21. Further, the flow rate of the suction air is measured by the flow meter 22 described above.

  FIG. 3 is a view seen from the side of the VCM 14 and the pressure detection unit 16 of the mounting head 1 used in the present embodiment.

  First, the VCM 14 has a structure in which another cylindrical member 24b (VCM drive side) is mounted inside the cylindrical member 24a so as to be movable up and down (moving in the Z-axis direction). A magnet is attached to the inner side of the cylindrical member 24a, and an electromagnetic coil (voice coil) is wound on the outer side of the cylindrical member 24b. Electromagnetic force is generated in. Further, the direction of the electromagnetic force is the above-described vertical movement direction, and the pressure detection unit 16 is moved up and down by the shaft 25 fixed to the center of the cylindrical member 24b of the VCM 14 by the electromagnetic force.

  Next, the pressure detection unit 16 has a cylindrical shape, and a load cell 26 for detecting a pressure applied from a support plate 27 described below downward on the upper inner surface of the pressure detection unit 16 from the nozzle 19 side. Is provided. Below the load cell 26, there are provided disk-shaped support plates 27 and 29, springs 28 supported by the support plates 27 and 29, and a spline bearing 31. The nozzle shaft 18 has a structure capable of moving up and down by a spline bearing 31.

  These support plates 27 and 29 are movable up and down while sliding inside the cylindrical shape of the pressure detection unit 16 in a state where the disk shape is maintained horizontally. In addition, between the support plates 27 and 29, the spring 28 expands and contracts according to the force applied to itself. Further, the load cell 26 outputs a signal corresponding to the pressure applied by the spring 28, and a signal corresponding to the pressure applied between the upper end of the pressure detection unit 16 fixed to the shaft 25 and the upper surface of the support plate 27. Is output. The spring 28 is not particularly limited, and may be another form of elastic member.

  A ring-shaped stopper 30 is provided inside the cylindrical shape of the pressurization detection unit 16. The support plate 29, which can move up and down while sliding inside the cylindrical shape by the stopper 30, cannot move to the support plate 27 side from the stopper 30. Therefore, the compression of the spring 28 is limited, the pressure applied to the load cell 26 is limited, and the load cell 26 is not broken even when a large force is applied to the nozzle chuck mechanism 20 side. ing.

  Although the present invention is not limited to this, in the present embodiment, when the pressure from the nozzle shaft 18 side becomes 700 grams, the support plate 29 hits the stopper 30 and the compression of the spring 28 is limited as described above. . Therefore, a pressure of 700 grams or more is not applied to the load cell 26.

  FIG. 4 is a block diagram illustrating the configuration of the control device according to the present embodiment.

  In this figure, the control in the Z-axis direction of the crimping mounting of the electronic component to which the present invention is applied includes the crimping mounting control unit 52, the position control unit 60, the speed control unit 62, the torque control units 64 and 68, This is performed by the distance detection unit 54. In addition, the electronic component mounting overall control unit 50 performs other control, for example, in the X-axis direction and the Y-axis direction.

  The position control unit 60, the speed control unit 62, and the torque control unit 64 perform feedback control of the Z-axis motor 9. The position control unit 60 outputs a signal corresponding to the deviation between the given position command signal and the current position detected by the pulse generator 70 to the speed control unit 62. The speed control unit 62 outputs a signal corresponding to the deviation between the signal from the position control unit 60 and the speed command signal and the current shaft movement speed detected by the pulse generator 70 to the torque control unit 64. The torque control unit 64 controls the driving force of the Z-axis motor 9 according to the signal from the speed control unit 62 and the torque command signal.

  Next, the torque control unit 68 controls the pressure of the pressure generated by the VCM 14 according to the torque command signal. In the control, feedback control may be performed so that the detected pressure coincides with the torque command signal according to the detected pressure signal obtained from the load cell 26, but is not limited thereto.

  The distance detector 54 detects the approach distance of the nozzle 19 to the substrate 21 based on the flow rate of the suction air detected by the flow meter 22. As shown in FIG. 5, when the nozzle 19 is separated from the substrate 21, the suction air is sucked from the nozzle 19 without being affected by the substrate 21. On the other hand, as shown in FIG. 6, when the nozzle 19 approaches the substrate 21, the suction air is affected by the substrate 21, and thus the amount of suction is suppressed.

In the present embodiment, the vertical Z-axis drive unit 15 is lowered with respect to the substrate 21 while sucking suction air from the nozzle 19 in a state where the electronic component is not sucked by the nozzle 19. Then, at the timing when the decrease in the flow rate of the suction air is detected by the flow meter 22, the lowering is stopped, so that the lowering can be stopped just before the nozzle 19 contacts the substrate 21. Further, the approach distance of the nozzle 19 to the substrate 21 can be detected from the Z-axis position of the stop and the flow rate of the suction air detected by the flow meter 22 .

  Hereinafter, the operation of the present embodiment will be described.

  First, FIG. 7 is a schematic graph showing the height of the electronic component attracted by the nozzle 19 and the voltage applied to the electromagnetic coil of the VCM 14 in the crimping mounting control in the present embodiment.

  In FIG. 7 and in the following description, the heights indicated as the Z-axis axis positions, such as Z1 to Z3, are the Z-axis where the Z-axis motor 9 is used as the driving force and the vertical Z-axis drive unit 15 is moved up and down. This is the height of the electronic component indicated as a control command value, and is the height from the upper surface of the substrate 21. Therefore, there may be a difference between the Z-axis height of the command value and the actual height of the electronic component due to expansion and contraction of the spring 28 and the like.

  When the mounting head 1 moves in the X-axis direction or the Y-axis direction even when the electronic component is sucked, the height Z3 indicates that the mounting head 1 itself or the electronic component sucked by the nozzle 19 is It is a height which does not need to contact the electronic component on 21.

  The height Z1 is a target height when the electronic component that is being sucked is mounted on the substrate 21 by pressure bonding, after being positioned at a high speed from the height Z3 after positioning in the X-axis direction or the Y-axis direction. is there. The height Z1 is such that the lower end of the adsorbed electronic component is higher than the upper surface of the substrate 21 by a minute height ΔZ.

  If the height Z1 is too low, the vehicle cannot sufficiently decelerate when decelerating from the descending speed of the high-speed descent started in step 100 to be described later to the low-speed descent in step 104, and contact detection in step 110 and subsequent control are performed. Inconvenience may occur. Therefore, the height Z1 is the total height of the height that descends while decelerating from the high speed descent to the low speed descent and the height that falls during the time required for contact detection in step 110, or this. A higher height is preferred.

  The height Z2 is a target height when actually mounting the electronic component on the substrate 21 by pressure, and is a target height that descends at a reduced speed after the high-speed descent. The height Z2 is lower than the upper surface of the substrate 21 and the lower end of the adsorbed electronic component contacts the substrate 21 even when the voltage V1 is applied to the VCM 14 and the above-described integrated member is in a floating state. It is lower than the height.

  In FIG. 3, the cylindrical member 24 a of the VCM 14 is fixed to the vertical Z-axis drive unit 15. On the other hand, the cylindrical member 24b (VCM drive side) of the VCM 14 is structured so as to be vertically movable (movable in the Z-axis direction). For this reason, the pressure detection unit 16 and the shaft Integral members such as 25 and the nozzle shaft 18 can also be moved up and down.

  Here, the voltage applied to the electromagnetic coil of the VCM 14 is the voltage V <b> 1 in order to generate the lifting force F <b> 1 that balances the total weight (self-weight) of the integral member with the VCM 14. When the lifting force F1 is generated, the integrated member is in a neutral floating state that is neither raised nor lowered. In the present embodiment, the voltage V1 is a voltage that causes the pulling force F1 + α to be generated by the VCM 14. The upward force is slightly increased by this + α.

  Although the present invention is not limited to this, for example, in this embodiment, the weight of the integral member including the nozzle 19 and the electronic component having a standard weight adsorbed by the nozzle 19 is about It is 50 grams. The lifting force F1 + α is about 55 grams. Note that the pressure applied by the VCM 14 that presses the adsorbed electronic component against the substrate 21 is 100 grams at maximum.

  The electronic component, the substrate 21 and the mounting head 1 when the electronic component sucked by the vertical Z-axis driving unit 15 descending and contacting the substrate 21 are brought into the floating state or a state close thereto. The impact force applied to the can be suppressed. In addition, various detections by the load cell 26, for example, contact detection in step 110 to be described later, detection accuracy of detection of applied pressure at the time of pressure mounting, and detection stability can be improved.

  Next, the voltage V <b> 2 generates a specified pressure when pressurizing the electronic component onto the substrate 21 after the electronic component sucked by the vertical Z-axis drive unit 15 comes into contact with the substrate 21. belongs to.

  FIG. 8 is a flowchart showing the crimping mounting control in this embodiment.

  Hereinafter, in the present embodiment, an operation of a series of processes in which the electronic component in the electronic component supply device 5 is pressure-mounted on the specified position on the substrate 21 by the mounting head 1 will be described based on a flowchart.

  The control of this series of processes is performed mainly by the electronic component mounting overall control unit 50. The pressure mounting control unit 52 is also used for the movement and positioning of the Z axis and the control of the pressure mounting.

  First, in the present embodiment, the height ZΦ of the place where the electronic component is mounted on the substrate 21 carried into the electronic component crimping mounting apparatus of the present embodiment is measured according to the principle described above with reference to FIGS. .

That is, the mounting head 1 is appropriately moved by the X-axis gantry 2 and the Y-axis gantry 3 along the X-axis and Y-axis to position the mounting head 1 at the mounting position. Thereafter, the suction of the nozzle 19 is performed, and the flow rate of the suction air is detected by the flow meter 22, and the vertical Z-axis drive unit 15 is moved down by the Z-axis movement. Further , as described above with reference to FIG. 6, by stopping the descent at the timing when the flow rate decrease due to the approach of the substrate 21 is detected by the flow meter 22, the Z-axis position of the stop and the flow meter 22 detect the stop. The height ZΦ of the place where the electronic component is mounted can be detected by the flow rate of the suction air .

  Thereafter, the Z-axis is appropriately raised to avoid a collision, and the mounting head 1 is moved above the corresponding electronic component in the electronic component supply device 5 by the X-axis gantry 2 and the Y-axis gantry 3, and the vertical Z-axis drive unit 15 The component to be mounted on the substrate 21 is adsorbed while moving up and down appropriately.

  Further, the Z-axis is appropriately raised to avoid a collision, and the mounting head 1 that has attracted the electronic component is moved above the recognition device 4. Then, if necessary, the Z-axis is lowered, and the electronic device is recognized by the recognition device 4. After completing the recognition, the vertical Z-axis drive unit 15 once rises to the height Z3, and then appropriately moves and positions the X-axis and the Y-axis so as to mount the sucked electronic components. Move to the upper mounting position.

  After the movement, the crimping mounting operation process shown in the flowchart of FIG. 8 is performed to mount the sucked electronic component on the mounting position on the substrate 21. In the following description, the time t1 to t8 shown in FIG.

  In FIG. 8, first, at step 100, the electronic component of the vertical Z-axis drive unit 15 is usually at the height Z3. Alternatively, the height may be higher.

  In step 100 (time t1), the crimping mounting control unit 52 outputs a position command signal having a height Z1 to the position control unit 60, and outputs a speed command signal having a speed M1 to the speed control unit 62. Start moving. Thereby, the high-speed descent of the vertical Z-axis drive unit 15 to the height Z1 by the speed M1 is started.

  In step 102, the position control unit 60 detects that the height Z1 has been reached. The detection is transmitted to the crimping mounting control unit 52.

  When it is detected that it has arrived (time t2), in step 104 (time t3), the crimping mounting control unit 52 outputs a position command signal indicating the height Z1 to the position control unit 60 and sends it to the speed control unit 62. Then, a speed command signal of a speed M2 for commanding a lower speed than the above-described speed M1 is output to start the movement of the Z axis. This initiates a slow descent to height Z2.

  Simultaneously with step 104, in step 106 (time t3 to t4), the crimping mounting control unit 52 outputs a torque command signal for generating the lifting force F1 + α by the VCM 14 to the torque control unit 68. As a result, the torque control unit 68 applies the voltage V1 to the electromagnetic coil of the VCM 14.

  In step 110, the crimping mounting control unit 52 detects that the adsorbed electronic component has contacted the substrate 21 during the low-speed descent. The detection may be a change in the pressure applied to the pressure detection unit 16 due to the contact by a change in a signal output from the load cell 26. Alternatively, the detection may be performed by receiving, from the position control unit 60, a signal indicating that the Z-axis axis position has reached the contact height calculated from the detected height ZΦ as described above.

  When contact is detected in step 110 (time t5), in step 112 (time t5 to t7), the crimping mounting control unit 52 shifts the torque command signal output to the torque control unit 68, and the VCM 14 The transition of the voltage applied to the electromagnetic coil from voltage V1 to voltage V2 is started. Then, the above-mentioned integrated member that was in a floating state at the voltage V <b> 1 transitions to a lowered state. When the voltage V2 is applied, the electronic component that is in contact with the substrate 21 and is attracted to the nozzle 19 is pressed against the substrate 21 with a prescribed pressure corresponding to the voltage V2.

  Next, in step 114, the load cell 26 detects whether the pressure between the electronic component and the substrate 21 has reached a predetermined load by the lowering of the vertical Z-axis drive unit 15 and the VCM 14.

  Here, even when the above-described contact detection is performed and the Z-axis axis position becomes zero or less, the low-speed lowering of the vertical Z-axis drive unit 15 by the Z-axis motor 9 is continued. Thus, while the electronic component is in contact with the substrate 21, the vertical Z-axis drive unit 15 continues to descend at a low speed while the spring 28 is compressed. Then, in step 116, the position control unit 60 detects that the height of the electronic component has reached the height Z2, and when the detection is transmitted to the crimping mounting control unit 52 (time t7), the step continues. 120 and 122 are performed.

  In step 120, when the position control unit 60 detects that the height of the electronic component has reached the height Z2, the position control unit 60 stops the low-speed descent. At the same time, in step 122, the crimping mounting control unit 52 maintains the torque command signal output to the torque control unit 68, and the torque control unit 68 maintains the aforementioned voltage V2 according to the voltage V2 of the electronic component. The pressurization to the substrate 21 by the specified pressure is maintained.

  In step 124, the crimping mounting control unit 52 determines whether or not a predetermined time T has elapsed since it was determined in step 116 that the height of the electronic component has reached the height Z2. If it is determined in step 124 that time has passed (time t8), it is determined that the current crimping mounting has been completed. Next, in step 126, the crimping mounting control unit 52 performs predetermined position command signal and speed command signal. Are output to the position control unit 60 and the speed control unit 62, respectively, and the vertical Z-axis drive unit 15 is raised to the height Z3. Then, at time t9, the height Z3 is reached. The rise is to prevent the mounting head 1 from coming into contact with electronic components on the substrate 21 when the mounting operation 1 is completed and the mounting head 1 performs the next operation.

  When the adsorbed electronic component is pressed against the substrate 21 at a pressure greater than or equal to the maximum pressure applied by the VCM 14, pressurization is performed by the VCM 14 up to the maximum pressure applied by the VCM, and the Z-axis motor is applied at the maximum pressure value of the VCM. Switch to torque control by No. 9, and pressurize to the specified pressurization amount. When the pressing force is higher than the maximum pressing force as described above, the voltage V2 shown in FIG. 7 is a voltage for setting the maximum pressing force.

  In FIG. 7, a period T1 is a period during which the vehicle descends at a high speed. The period T2 is a period during which the vehicle is descending at a low speed. The period T3 is a period in which the electronic component is pressed against the substrate 21 with a specified pressure.

  As described above, according to this embodiment, the present invention can be effectively applied.

  In the present embodiment, since the weight of the movable part is corrected using the VCM 14, the impact load when the electronic component comes into contact with the substrate 21 can be eliminated or reduced.

  The VCM 14 can be replaced with an air slider and perform the same control as in this embodiment. However, the VCM 14 is less expensive than the air slider, and the cost can be reduced.

  In this embodiment, the contact is detected in step 110, and the Z-axis position control is switched to the pressurization control (torque control) when the Z-axis is lower than the substrate 21. Therefore, there is no time lag associated with the switching of the control, so that it is possible to shorten the time until the electronic component is lowered and brought into contact with the substrate 21. As a result, the operation of crimping mounting can be performed quickly.

  In the present embodiment, the load control of the electronic component to the substrate 21 at the time of pressure mounting is performed with the VCM 14 as the center, and when a large load is applied, the pressure control (torque control) by the Z-axis motor 9 is performed. Therefore, the VCM 14 can be reduced in size, and the mounting head 1 can be reduced in size. In addition, since pressure control is performed by the VCM 14 in this way, highly accurate control can be performed.

  Furthermore, in the case of a low load, the pressurization control is performed by the VCM 14 and the height (Z-axis) position control is performed by the Z-axis motor 9, so that a complicated cooperative operation is not necessary. Also, when pressurization control by the Z-axis motor 9 is performed when a large load is applied, the pressure control of the VCM 14 is switched from pressurization control of the VCM 14 to pressurization control by the Z-axis motor 9 after a certain amount of weight is added. Control is simpler than switching when the electronic component comes into contact with the substrate 21 and control is severe.

  In the present invention, since the height of the nozzle 19 from the substrate 21 is detected by the flow meter 22, it is not necessary to attach an expensive optical sensor, which is advantageous in terms of cost and securing installation space. It is.

  As described above, according to the present invention, it is possible to provide an electronic component crimping / mounting apparatus that can quickly perform the crimping / mounting operation while suppressing an impact load when the electronic component is crimped / mounted on a substrate. .

The perspective view which shows the structure of the electronic component crimping mounting apparatus of embodiment to which this invention was applied. The figure seen from the side of the mounting head 1 of the electronic component crimping mounting apparatus used for the said embodiment. Viewed from the side of the mounting head VCM and pressure detector The block diagram which shows the structure of the control apparatus in the said embodiment. Side view showing distance measurement (large distance) by suction air of the nozzle in the embodiment The side view which shows the distance measurement (distance is small) by the suction air of the nozzle in the said embodiment The typical graph which shows the voltage applied to the height of the electronic component attracted | sucked to the nozzle, and the electromagnetic coil of VCM in the crimping | bonding mounting control in the said embodiment. Flowchart showing crimping mounting control in the embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mounting head 2 ... X-axis gantry 3 ... Y-axis gantry 4 ... Recognition apparatus 5 ... Electronic component supply apparatus 6 ... Head base 7 ... Linear guide 8 ... θ motor 9 ... Z-axis motor 10, 11 ... Coupling 12 ... Nut Part 13 ... Screw part 14 ... VCM
DESCRIPTION OF SYMBOLS 15 ... Vertical Z-axis drive part 16 ... Pressure detection part 18 ... Nozzle shaft 19 ... Nozzle 20 ... Nozzle chuck mechanism 21 ... Substrate 22 ... Flow meter 23 ... Vacuum hose 25 ... Shaft 26 ... Load cell 27, 29 ... Support plate 28 ... Spring 30 ... Stopper 31 ... Spline bearing 50 ... Electronic component mounting overall control unit 52 ... Pressure mounting control unit 54 ... Distance detection unit 60 ... Position control unit 62 ... Speed control unit 64, 68 ... Torque control unit

Claims (2)

In the electronic component crimping and mounting device for mounting the electronic component on the substrate by lowering the mounting head after the mounting head sucks the electronic component and moves it to a predetermined position on the substrate,
A suction nozzle that is mounted on the mounting head and sucks the electronic component;
A contact detection means for detecting that the electronic component sucked by the suction nozzle has contacted the substrate during the lowering;
A support member that movably supports the suction nozzle along the vertical direction;
A Z-axis motor fixed to the mounting head and moving the suction nozzle up and down via the support member;
A voice coil motor or an air slider, wherein the main body is fixed to the support member, the moving part is connected to the suction nozzle side, and is used as a drive motor for moving the suction nozzle up and down by driving;
The suction nozzle and the contact detection unit are driven upward until the contact detection unit detects the contact between the electronic component and the substrate when the pressure mounting is performed while the suction nozzle is lowered by the Z-axis motor. And control means for controlling the drive motor so as to compensate for these dead weights,
The contact detection unit, an elastic member, wherein the movably supported suction nozzle, also, the when you detect contact of the electronic component and the substrate by detecting a pressing force applied to the suction nozzle both
Wherein the support member, the electronic component bonding mounting device comprising a Turkey to support the suction nozzle via the contact detection means. In the electronic component crimping and mounting device for mounting the electronic component on the substrate by lowering the mounting head after the mounting head sucks the electronic component and moves it to a predetermined position on the substrate,
A suction nozzle that is mounted on the mounting head and sucks the electronic component;
A contact detection means for detecting that the electronic component sucked by the suction nozzle has contacted the substrate during the lowering;
A support member that movably supports the suction nozzle along the vertical direction;
A Z-axis motor fixed to the mounting head and moving the suction nozzle up and down via the support member;
A voice coil motor or an air slider, wherein the main body is fixed to the support member, the moving part is connected to the suction nozzle side, and is used as a drive motor for moving the suction nozzle up and down by driving;
The suction nozzle and the contact detection unit are driven upward until the contact detection unit detects the contact between the electronic component and the substrate when the pressure mounting is performed while the suction nozzle is lowered by the Z-axis motor. And control means for controlling the drive motor so as to compensate for these dead weights,
The suction nozzle is connected to a vacuum suction source,
The contact detection means includes a flow rate measurement means for measuring a change in the air flow rate in the suction nozzle, and a distance detection means for detecting the distance between the suction nozzle and the substrate,
The approach of the suction nozzle to the substrate is detected by a decrease in the suction air flow detected by the flow rate measuring means, and the suction nozzle flow rate is determined by the Z-axis position when the suction nozzle is lowered and the suction air flow rate. detecting the approach distance to the substrate, based on該接short distance, detects the height of a portion for mounting the electronic component, wherein the benzalkonium to detect contact of the electronic component and the substrate based on the height- Electronic component crimping mounting device.

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