JP2007088181A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To permit to inspect the mounting condition of a component without equipping a sensor separately on a mounting head even immediately after mounting the component. <P>SOLUTION: The component mounting device is equipped with the mounting head movable into the direction of plane by an X-axis driving means and a Y-axis driving means while being provided with an attraction nozzle for attracting and retaining the component, a Z-axis driving means for advancing and retreating the attraction nozzle into the horizontal direction, and a load detecting means for detecting the contact load of the attraction nozzle lowered by the Z-axis driving means. In such a component mounting device, contact with the surface of component of the nozzle is detected by the load detecting means (L1) when the attraction nozzle is lowered from a height Z1 by the Z-axis driving means, and control is performed for detecting the height of surface of the contacted component from the position of Z-axis (Z10) by the Z-axis driving means upon the contacting. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is applied to a component mounting apparatus, in particular, an electronic component that is automatically mounted on a substrate such as a printed circuit board or a liquid crystal display panel substrate while applying pressure and inspecting the mounting state of the mounted component. The present invention relates to a suitable component mounting apparatus.

  When an electronic component is mounted (mounted) on a printed circuit board or the like, it is important to inspect the mounting state, but the inspection technique is disclosed in Patent Document 1, for example.

  In this patent document 1, the mounting state is inspected as follows using an inspection apparatus whose outline is shown in FIG.

  On the substrate 104 after mounting the electronic component 105 with bumps, the height measuring means 100 measures the height of a plurality of points on the upper surface of the substrate 104 and the height of a plurality of points on the upper surface of the electronic component 105 with bumps. The height difference between the upper surface of the substrate and the upper surface of the electronic component at a plurality of positions is obtained from the measurement result. Whether the obtained height difference is within a preset allowable range or not is determined as to whether the mounting state such as bump floating or electronic component 105 inclination is good.

  In the determination, the scanning mirrors 111 and 112 are rotated by the galvano 113 to move the laser light from the laser generator 110 to the upper surface of the substrate 104 or the electronic component 105 via the lens 114 and the half mirror 115. Each is performed by irradiating a plurality of measurement points. Reflected light from each measurement point is received by a plurality of PSDs (position detection elements) 117 arranged around the measurement point, and the determination unit responds to the height of the measurement point and each measurement position based on the received light signal. The difference in height is measured.

JP-A-10-253323

  However, the inspection technique disclosed in Patent Document 1 has the following problems.

  In order to continuously detect the mounting state of each component after mounting the electronic component on the substrate, it is necessary to provide a height measurement sensor separately from the mounting device. In particular, when a sensor for height measurement is provided on a mounting head for mounting components separately from other sensors such as a pressure sensor and a flow rate sensor, the cost of the apparatus increases and the size of the head increases. In addition to an increase in size, there is a problem in that the head weight increases, resulting in a decrease in operating speed and a decrease in productivity.

  In addition, since various parts have been made in recent years, as in Patent Document 1, in the inspection method using light reflection on the surface, there is a problem that a measurement error increases depending on the surface state of the part. Also occurs.

  The present invention has been made in order to solve the above-described conventional problems, and it is possible to inspect the mounting state of the component immediately after mounting the component without providing a special sensor in the mounting head. It is an object to provide an apparatus.

  The present invention provides a mounting head that can be moved in a plane direction by an X-axis driving unit and a Y-axis driving unit, a suction nozzle that sucks and holds a component, a Z-axis driving unit that moves the suction nozzle back and forth in a vertical direction, In a component mounting apparatus comprising a load detection means for detecting a contact load of the suction nozzle lowered by the Z-axis drive means, when the suction nozzle is lowered by the Z-axis drive means, the load detection means The above-mentioned problem has been solved by providing control means for detecting contact with the surface of the component and detecting the height of the contacted component surface from the Z-axis position by the Z-axis drive means at the time of contact. Is.

  In the present invention, as the operation mode of the mounting head, it is possible to switch between a component suction mounting mode for sucking a component and mounting it on a substrate, and a height measurement mode for measuring the height of the mounted component. In addition, based on the height detected for one or more surface positions of the mounted component, whether the component is mounted correctly or not may be determined.

  According to the present invention, the load detection means detects that the suction nozzle has contacted the component surface, and the height of the component surface at the time of contact can be detected from the Z-axis position of the nozzle by the Z-axis drive means at that time. Therefore, the mounting head can reliably detect the surface height of the mounted component without installing a special sensor.

  Conventionally, a suction nozzle is used for component mounting and a laser sensor is used for height measurement. However, in the present invention, mounting and measurement are performed by the nozzle, so that the cost can be reduced.

  In addition, since it is a contact type of the suction nozzle, measurement independent of the component surface state (color, surface state, light reflectance) becomes possible.

  In addition, in an assembly process of a SiP component or a camera module for mounting a component in the component, the component is often mounted on the mounted component while applying pressure control. Such a pressure mounting head has a pressure detector on the head, so it can be used not only to detect the amount of pressure during pressurization but also as a contact-type sensor to measure the height. can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic configuration diagram of an electronic component mounting apparatus according to an embodiment of the present invention.

  In FIG. 1, the mounting head 1 includes a pressurizing device that sucks and holds parts and pressurizes, and a recognition device (not shown) that corrects the position of the mounting head 1.

  The mounting head 1 is attached to an X-axis gantry (X-axis drive means) 2 that moves the electronic component mounting apparatus in the X-axis direction. The mounting head 1 and the X axis gantry 2 are attached to a Y axis gantry (Y axis driving means) 3 for moving in the Y axis direction of the electronic component mounting apparatus.

  Further, in this electronic component mounting apparatus, a recognition device 4 using a CMOS camera or a CCD camera for recognizing the posture of the sucked electronic component is fixed within the movable range of the mounting head 1. An electronic component supply device 5 for supplying an electronic component to be mounted on a substrate is installed on the front surface of the electronic component mounting device.

  Next, the mounting head 1 will be described with reference to FIGS.

  The mounting head 1 has a head base 6 for connecting and fixing to the X-axis gantry 2. The head base 6 is connected to the linear guide 7, and the vertical Z-axis drive unit 15 is configured to be movable in the vertical Z-axis direction.

  Above the head base 6 is a vertical rotation drive bearing 21 and a vertical rotation drive shaft 22 composed of a θ motor 9 for rotating parts, a spline bearing and a bearing, and the power of the θ motor is rotated vertically. A Z-axis motor (Z-axis drive means) 11 for vertically moving the belt 10 and the vertical Z drive unit 15 transmitted to the drive shaft 22 is attached. Further, a threaded portion 14 of a ball screw is connected to the Z-axis motor 11 via a coupling 12.

  A voice coil motor for pressurization (pressurization drive means, hereinafter referred to as VCM) 8 is attached to the upper part of the vertical Z drive unit 15. The VCM 8 is connected to the θ motor 9 via a vertical rotation drive shaft 22, and the drive side 8 b of the VCM 8 is supported independently of the vertical Z drive unit 15 by the vertical rotation drive shaft 22. Therefore, the vertical Z driving unit 15 can be rotated and moved up and down.

  A ball screw nut portion 13 is fixed to the vertical Z drive portion 15, and a ball screw screw portion 14 connected to the nut portion 13 via the coupling 12 is fitted into the nut portion 13. The Z-axis motor 11 is rotated and the vertical Z drive unit 15 can be moved up and down by the nut portion 13 of the ball screw.

  Further, a cylindrical pressure detection unit 16 is built in the vertical Z drive unit 15, and the pressure detection unit 16 is a ball between the outer periphery and the inner periphery of the vertical Z drive unit 15. Via the guide bearing 17, the vertical Z driving unit 15 can be rotated and vertically moved up and down.

  A nozzle shaft 18 extends downward at the lower portion of the pressure detection unit 16, and a suction nozzle 20 is held by a nozzle chuck mechanism 19 at the lower end of the nozzle shaft 18 and has a replaceable structure. It has become. The nozzle 20 can suck and hold a component (not shown) and mount the component on a substrate (not shown).

  Next, the pressure detection unit 16 and the like will be described with reference to FIG.

  The VCM 8 is attached to the upper portion of the pressure detection unit 16, and a coil (not shown) is wound around the fixed side 8 a with the vertical Z drive unit 15 that is an outer cylinder of the VCM 8. Further, a magnet is attached to the drive side 8b of the VCM 8, and the VCM 8 can be linearly driven in the vertical direction by energizing the coil on the fixed side 8a of the VCM 8. The shaft 22 is extended at the center of the drive side 8 b of the VCM 8 and is coupled to the upper portion of the pressure detection unit 16.

  An upper stopper 23a and a lower stopper 23b using thrust bearings are attached to the upper and lower sides of the shaft fixed to the drive side 8b of the VCM 8. The upper stopper 23 a comes into contact with the lower part 6 a of the head base 6, and the lower stopper 23 b comes into contact with the upper part 15 a of the vertical Z drive unit 15.

  That is, the vertical movement amount of the VCM 8 is regulated by the upper stopper 23a and the lower stopper 23b. However, even if the movement amount of the VCM 8 is restricted by contacting the upper stopper 23a or the lower stopper 23b, the thrust bearing is used, so that the drive side 8b can be rotated.

  The internal structure of the pressure detection unit 16 will be described. The load cell 24 is fixed downward on the upper portion thereof. An upper support plate 25a for receiving a spring is attached below the load cell 24. A pressurizing spring 26 is provided below the upper support plate 25a, and a lower support plate 25b for receiving a lower portion of the pressurizing spring 26 is attached below the pressurizing spring 26.

  The nozzle shaft 18 is fixed to the lower side of the lower support plate 25b, and the nozzle shaft 18 has a structure capable of moving up and down by a spline bearing 28.

  A step portion 16a is provided below the lower support plate 25b in the pressure detection unit 16, and is smaller than the outer shape of the lower support plate 25b so that the lower support plate 25b abuts.

  A self-weight canceling spring 27 is attached below the lower support plate 25b between the spline bearing 28 and pushes up the lower support plate 25b. The spring force of the self-weight canceling spring 27 supports the spring force of the pressurizing spring 26, the weight of the lower support plate 25b, and the combined weight of the nozzle shaft 18, the nozzle chuck mechanism 19 and the nozzle 20. .

  In addition, the spring force of the self-weight canceling spring 27 is set slightly lower than the force supporting these, and the lower support plate 25b is configured to abut against the stepped portion 16a in the no-load state. Accordingly, the lower support plate 25b is normally pressed against the step portion 16a with a weak force, and when a load greater than the weak force is applied to the nozzle 20, the load cell 24 detects it.

  In the present embodiment, the operation mode of the mounting head 1 includes a “component suction mounting mode” and a “height measurement mode”, which can be switched by a control device (not shown).

  Each mode will be described in detail below. The “component suction mounting mode” is an operation mode when a component is mounted while performing pressure control at the time of component suction or component mounting.

  The “height measurement mode” is a mode in which the height of the mounted position of the component is measured using the load cell 24 provided on the head.

  The above two operation modes can be automatically switched and operated by an operation program of the control device, or can be switched and operated by a manual operation by an operator.

  In the above configuration, the electronic component suction operation and the pressure mounting operation performed by selecting the “component suction mounting mode” will be described with reference to FIGS. 4, 5, and 6.

  The mounting head 1 shown in FIG. 1 is moved above the electronic component supply device 5 by driving the X-axis gantry 2 and the Y-axis gantry 3, and the electronic components are sucked by the suction nozzle 20.

  The mounting head 1 that has attracted the electronic component is moved above the recognition device 4, and the recognition device 4 recognizes the component.

  After completing the recognition of the components, the mounting head 1 is moved to a mounting portion of an electronic component on a substrate (not shown), and the electronic component sucked by the suction nozzle 20 of the mounting head 1 is mounted on the mounting position on the substrate. To do.

  Hereinafter, these operations will be described in detail. In the component suction operation, the mounting head 1 is driven at the component suction position on the component suction device 5 by driving the Z-axis motor 11 and lowering the suction nozzle 20 together with the vertical Z drive unit 15.

  At that time, a voltage is applied to the VCM 8 to generate a downward force, and the lower stopper 23b is abutted against the upper portion 15a of the vertical Z drive unit 15 as shown in FIG. 4 to regulate the downward movement of the VCM 8. deep.

  The suction nozzle 20 is lowered by the Z-axis motor 11, and the suction nozzle 20 is rapidly stopped at a height immediately before the suction surface of the part to be sucked. At this time, although the inertial force works downward due to the weight of the pressure detection unit 16 and the acceleration during deceleration, the position is regulated by the lower stopper 23b of the VCM8, so that it exceeds the force generated by the VCM8. Even if the inertial force due to the acceleration at the time of deceleration works downward, no change is observed in the position of the nozzle tip.

  Further, since the lower support plate 25b of the pressurizing spring 26 abuts against the step 16a inside the pressurization detection unit 16 and is positioned, the nozzle shaft 18 is connected to the nozzle shaft 18 by the inertial force due to acceleration during deceleration. The lower support plate 25b is prevented from being pushed down.

  After the suction nozzle 20 is rapidly stopped, the Z-axis motor 11 is operated slowly to suppress the collision load, and the pressurizing operation for applying the specified load pressure to the component is performed by the pressurizing VCM 8 while the component is sucked and held. The pressurizing operation at the time of component adsorption is basically the same as that at the time of component mounting, which will be described later, except for the applied load pressure, and the description thereof is omitted.

  After attracting and holding the component, the Z-axis motor 11 is driven to raise the component, and the mounting head 1 is moved to move onto the recognition device 4.

  A recognition operation for component position correction is performed, and then the component is moved to the mounting position (above the board), and the following component mounting operation is performed.

  The descending / pressurizing operation when mounting the components will be described with reference to the time chart shown in FIG. The descending operation at the time of component mounting is basically the same as that at the time of component adsorption described above except that the component is adsorbed by the nozzle 20.

  When the Z-axis motor 11 is driven, the lower stopper 23b is in the state shown in FIG. The first position Z1 is lowered at a high speed (time T1). Next, the speed is switched, and the movement is started at a low speed to the second position Z2 set below the height (= 0) of the upper surface of the substrate (time T2). The Z-axis height such as Z1 is determined by the encoder output built in the Z-axis motor 11.

  When a control device (not shown) receives a signal from the encoder that the movement to the first position Z1 at which the component does not contact the upper surface of the board by the Z-axis motor 11 is received from the encoder, the VCM 8 is energized, and the drive side 8b of the VCM 8 Then, the pressure detection unit 16 that moves up and down connected thereto, the nozzle shaft 18, the nozzle chuck 19, the suction nozzle 20, the stoppers 23a and 23b, and the like generates a pressing force of the weight + α of the movable unit to move upward. Part self weight cancellation + α force V1 is generated. As a result, the lower stopper 23b changes from the state of FIG. 4 to the unregulated state of FIG.

  The suction nozzle 20 is lowered as it is, and at time T0, the suction nozzle 20 reaches the height 0 of the upper surface of the substrate, and the nozzle 20 (component) contacts the substrate.

  During the time T2, the relationship between the lowering speed Vz of the nozzle 20 by the Z-axis motor 11 until contact (before contact) and the upward moving speed Vv due to the self-weight cancellation of the movable part + α by the VCM 8 is | Vz | The speed is set so that> | Vv |.

  Thus, by lowering the moving speed Vv upward by the VCM 8 from the descending speed Vz by the Z-axis motor 11 of the nozzle 20 (decreasing the absolute value in the reverse direction), the position of the nozzle 20 by the encoder output is the second. Before reaching the position Z2, it is possible to prevent the VCM 8 from being uncontrollable by operating up to the stroke end of the VCM 8 as shown in FIG. 5 and the upper stopper 23a colliding with the lower portion 6a of the head base.

  Further, when the upper stopper 23a collides with the lower portion 6a of the head base in this way, the nozzle 20 is not in contact with the substrate even after the position of the nozzle 20 by the encoder output reaches the second position Z2. Although it is possible that parts cannot be mounted, it is possible to prevent such a situation from occurring.

  At time T2, even if the nozzle 20 contacts the substrate at time T0, the Z-axis motor 11 does not stop driving until the encoder output becomes Z2. This Z2 is set to a height at which the nozzle 20 (component) is sufficiently in contact even when the VCM 8 raises the movable portion with the output of V1 and the state shown in FIG.

  On the other hand, when the VCM 8 receives the contact signal of the nozzle 20 from the load cell 24, the VCM 8 switches to a downward force and gradually pressurizes the pressurization amount to the target pressurization amount of the set output value V2. When the target pressurization amount is reached, pressurization is stopped, the target pressurization amount is held for a preset pressurization time T3, the pressurization operation is terminated, and the Z-axis motor 11 After raising the nozzle 20, that is, the vertical Z drive unit 15, the XY movement of the mounting head 1 is performed.

  Further, at the time T2, after the contact with the substrate at time T0 (after contact), the relationship between the lowering speed Vz of the nozzle 20 by the Z-axis motor 11 and the downward moving speed Vv due to the applied pressure of the VCM 8 is Vz <Vv. Set the speed so that

  Thus, by making the moving speed Vv downward by the VCM 8 higher than the lowering speed Vz by the Z-axis motor 11 of the nozzle 20 (increase the absolute value in the same direction), pressurization giving priority to the lowering action by the VCM 8. Control becomes possible, and it is possible to perform control in which the operation of the Z-axis is considered (considered) as a disturbance, so that highly accurate control can be performed.

  After the above component suction operation and component mounting operation are completed, the operation mode of the mounting head 1 is switched to the “height measurement mode”, and the height of the mounted component is measured according to the timing chart of FIG.

  The Z-axis positions of Z3 and Z0 are measured in advance from the encoder output when the Z-axis motor 11 is driven, and stored in a predetermined memory. Next, in the component measurement mode, a V2 voltage is applied to the VCM 8 to generate a downward force, and the lower stopper 23b is abutted against the upper portion 15a of the vertical drive unit 15 as shown in FIG. The nozzle is lowered with respect to the upper surface of the nozzle, and the nozzle 20 is temporarily stopped at the Z-axis position Z1 immediately before the upper surface of the component. Generate power.

  At this time, the downward force of the pressurizing VCM 8 does not have to be separated from the abutment of the upper portion 15a when the lower stopper 23b is lowered, and may be, for example, about 20% when it is lowered from Z3 to Z1.

  Thereafter, the nozzle is lowered while the Z-axis motor 11 is operated slowly to suppress the collision load. When the tip of the nozzle contacts the upper surface of the component, the output value of the load cell 24 changes from L0, and the output value L1 at the time of contact is output. The Z-axis position Z10 at this time is stored in the memory.

  When continuously inspecting the height, the measurement is returned to the Z1 position without returning to the Z3 position. In FIG. 7, (1) is the timing when shifting to component adsorption, and (2) is the Z-axis timing when representing multipoint measurement. That is, at the time of multipoint measurement, the voltage applied to the VCM 8 is set to V1 in the state (3). This component height measurement is performed on three points selected from arbitrary positions on the upper surface of the component.

  With the above measurement, the heights of the three locations can be determined from the position of the upper surface of the component. Therefore, when measuring a plurality of points, the plane equation of the upper surface of the component can be calculated to obtain the height of the component and the inclination of the component. From the calculation result, when the height and inclination of the component after mounting are equal to or greater than preset allowable values, it is determined that the mounting is defective and the operator is notified of the abnormality. The component height evaluation method may be absolute position measurement at the Z10 position or relative position measurement.

  If there is no abnormality, the mounting head 1 is raised to the height of Z3 and moved to the suction position of the next component.

  According to the embodiment described above, the following effects can be obtained.

  (1) Since the load cell 24 for pressurization control incorporated in the mounting head 1 is used to measure the height of the mounted component, it is not necessary to separately provide a sensor for measuring the height. It is possible to prevent problems such as an increase in the cost of the apparatus, an increase in the size of the apparatus, and a decrease in productivity due to the installation of the sensor.

  (2) Since the height measurement method is a method in which the nozzle is brought into contact with each other, it is possible to measure the component height and the like after the component is mounted without being affected by the surface state or material of the measurement surface.

  (3) Since the height can be measured each time a component is mounted, the component height at the time of mounting can be managed. Therefore, the average value of the component mounting height is obtained and is significantly higher than the average value. If the lengths are different, it is possible to notify the operator of an abnormality and to manage the process.

  FIG. 8 shows an outline of a mounting head provided in the component mounting apparatus according to the second embodiment of the present invention, and FIG. 9 shows a main configuration of the control system.

  The mounting head 1 of the present embodiment has a hardware configuration in which the pressure detection unit 16 is removed from the mounting head 1 of the first embodiment, and as shown in FIG. This is realized by the control unit.

  Specifically, it is realized by feeding back the back electromotive voltage (load corresponding signal) of the pressurizing VCM 8 and performing pressurization control.

  FIG. 9B is a block diagram showing the main part of the pressure control unit. In this embodiment, a pressurizing VCM (pressurizing drive means) 8 is connected to an input port and an output port of a CPU via a pressure control unit as shown in FIG.

  As shown in FIG. 2B, the pressure control unit is composed of an AMP (deviation amplifier) and PWM (Pulse Width Modulation) drive circuit, a D / A converter (not shown), and the like. This PWM drive circuit is a circuit that changes the duty of a pulse for driving the motor.

  Next, the component height measurement operation by the mounting head of this embodiment will be described.

  When the mounting head 1 is lowered and the pressure operation is performed by the VCM 8 when the nozzle 20 comes into contact with the substrate, an upward load is generated in the VCM 8, and the load (pressurization load) according to the load (pressure load) at that time is generated. Counter electromotive voltage is generated.

  This counter electromotive voltage is the same phenomenon as a so-called generator, and is a phenomenon in which a voltage proportional to the external force is generated when an external force is applied to the motor, and the voltage generated from the motor at that time is called a counter electromotive voltage. The counter electromotive voltage is fed back to the VCM 8, the counter electromotive voltage is input to the AMP, the pressurizing VCM 8 is driven by the PWM drive circuit, and control is performed so that the specified pressurizing amount is obtained.

  The amount of pressurization can be detected by inputting the back electromotive voltage to the CPU and calculating the amount of pressurization according to the back electromotive voltage.

  The only difference from the first embodiment is that, instead of the signal of the load cell 24, the signal of the back electromotive voltage of the VCM 8 of the pressure driving source is inputted to the CPU, and the subsequent processing is the first embodiment. The form is the same.

  Although the present invention has been specifically described above, the present invention is not limited to that shown in the embodiment.

  For example, the pressure driving means may not be a VCM but an air cylinder or the like, and is not particularly limited as long as the structure can operate in the vertical direction.

  Further, although one load cell is used as the load detector, other load cells may be used, and two or more load cells may be used, depending on the detected pressurization amount.

  Further, although the spring is used for pressurizing the load cell and canceling the self-weight of the pressurization detecting unit, it may be other than the spring as long as it is an elastic body.

1 is a schematic perspective view schematically showing a component mounting apparatus according to a first embodiment of the present invention. Side view including a cross section showing a mounting head provided in the component mounting apparatus of the present embodiment Partial sectional view centering on the movable part by VCM of the mounting head. Partial sectional view showing the movable part in the descending restricted state Partial sectional view showing the movable part in the ascending regulation state Time chart showing the outline of pressurizing operation when mounting components according to this embodiment Time chart showing the outline of the component height measurement operation according to this embodiment The side view including the cross section which shows the mounting head with which the component mounting apparatus of 2nd Embodiment which concerns on this invention is provided. The block diagram which shows the outline | summary of the control system of 2nd Embodiment Main part perspective view showing an outline of a conventional component height measuring device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mount head 2 ... X-axis gantry 3 ... Y-axis gantry 8 ... Voice coil motor (VCM)
DESCRIPTION OF SYMBOLS 11 ... Z-axis motor 15 ... Vertical Z drive part 16 ... Pressure detection part 20 ... Adsorption nozzle 24 ... Load cell

Claims (3)

A mounting head that is movable in the plane direction by the X-axis driving means and the Y-axis driving means has a suction nozzle that sucks and holds components, a Z-axis driving means that moves the suction nozzle back and forth in the vertical direction, and the Z-axis driving means In the component mounting apparatus provided with a load detection means for detecting the contact load of the suction nozzle lowered by
When the suction nozzle is lowered by the Z-axis driving means, the load detecting means detects contact of the nozzle with the component surface,
A component mounting apparatus comprising control means for performing control for detecting the height of the contacted component surface from the Z-axis position by the Z-axis drive means at the time of contact.   The operation mode of the mounting head can be switched between a component suction mounting mode for sucking a component and mounting it on a substrate, and a height measurement mode for measuring the height of the mounted component. The component mounting apparatus described.   2. The component mounting apparatus according to claim 1, wherein whether or not the component is mounted is determined based on a height detected for one or more surface positions of the mounted component.

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