JPS6255947A - Equipment for transferring and mounting chip - Google Patents

Abstract

PURPOSE:To accurately transfer a chip by arbitrarily setting the moving distance and pressing a load of a suction tool by a linear motor on upper and lower linearly moving shafts, and controlling the moving position of a transfer motor to apply a proper lateral force to the chip arbitrary times. CONSTITUTION:A tool 6 is set to a height P0 by a linear motor L, and transferred to a position A by a motor 19. When a chip 2a is completely positioned at T0, the L is operated to lower to a height P1 (at T1), is finely moved to lower to a height P2. The chip is attracted at T4, and raised to the P0 at T5. The motor 19 transfers the tool to a position B at T6, and starts setting next chip 2b. When the tool 6 is lowered to P3 at T7, a signal S separates a position loop from a speed loop at T8, the motor L is controlled at the speed from the P3 according to a load deviation signal alpha, is switched to a current control at P4 to monitor a current feedback signal, a predetermined load is applied to the chip 2a, and the motor 19 applies a lateral vibration thereto. The tool is returned to the P0 at T10, and the motor 19 is returned to the position A to the next cycle.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention is applicable to electronic components, particularly semiconductor chip components (integrated circuits).
The present invention relates to a chip component transfer and mounting device for mounting chip components such as those on a circuit board. 'Conventional technology In recent years, the development of electronic component mounting technology has been remarkable, and there is a demand for flexible transfer and mounting equipment that can handle high-mix, low-volume production in production equipment.

FIG. 2 is a configuration diagram of a transfer and mounting section of a conventional die bonding apparatus, which transfers semiconductor chip components (hereinafter referred to as chips) 2a and 2b on a wafer 1 onto a circuit board 3a and performs a mounting operation. .

The operation will be explained below with reference to FIG.

A portion A for positioning the wafer 1 is a first positioning portion, and a portion B for positioning the circuit board 3& is a second positioning portion. In the second positioning part B, the circuit board sa, 3
Apply adhesive 4a to b in advance.

4b is positioned by a positioning mechanism (not shown). The chip 2a is placed in the first positioning part A.
When the positioning is completed, the positioning motor 5 is driven to move the suction tool 6 to the first positioning part A. The vertical drive cam γ drives the shaft 8 vertically as the cam 7 rotates, and is connected to a cam switch 9 for receiving a timing signal. Next, when the vertical drive cam 7 is rotated, the suction tool 6 is lowered. A cam switch 9 connected to the vertical drive cam 7 causes a chip suction pulp (not shown) to suction the chip 2a using the ONL suction tool 6.

Further rotation of the vertical drive cam 7 causes the suction tool 6 to rise. After the suction tool 6 is raised, the positioning motor 5 is rotated to move the suction tool 6 to the second positioning part B. At this time, the first positioning section A starts positioning the next chip 2b. The vertical drive cam 7 is rotated to lower the suction tool 6. Chip 2a is mounted on adhesive 4a on circuit board 3a under the pressure of spring 10. At the same time, the rotation of the vertical drive cam 7 is stopped by a signal from the cam switch 9. The positioning motor 6 is rotated in forward and reverse directions at a minute angle to apply a lateral force with a minute amplitude to the suction tool 6, giving the chip 2a a so-called scrubbing action.

The chip adsorption pulp (not shown) is stopped from adsorbing 0FFL chips. When the vertical drive cam 7 is rotated to raise the suction tool 6, the suction tool 6 and the chip 2a are separated, and the chip 2a is separated.
The installation of a is completed. On the other hand, the second positioning section B positions the tip 2b at the mounting position with the adhesive 4b applied onto the circuit board 3a on which the tip 2b is to be mounted next. The positioning motor 5 is driven to move the suction tool 6 to the first positioning part A, and the next cycle begins.

Problems to be Solved by the Invention However, with the above structure, when trying to mount various types of tips, the stroke is fixed because the cam 7 is used for vertical drive, and when changing the type of tip, the stroke is fixed. If the height of the vertical drive cam 7 changes, it is necessary to replace the vertical drive cam 7. Moreover, if the product type changes, the load pressure for pressing must also be changed, and the vertical drive cam 7 must be replaced, as well as the spring 1o and the spring 1o must be replaced and finely adjusted, making handling extremely difficult.

Further, due to the structure of the rack and the pinion, there are problems such as backlash, and the positioning accuracy after scrubbing is not good.

In view of the above-mentioned drawbacks, the present invention has been developed in such a way that the problems of the conventional mechanism, the change in the height of the chip when changing types during continuous production of many types, the pressing load pressure and the amplitude during scrubbing can be freely changed. The present invention provides a chip component transfer/mounting device that improves positioning accuracy and can support high-mix, low-volume production.

Means for Solving the Problems The present invention provides a first positioning section for positioning a chip component, a second positioning section for positioning a circuit board, and a second positioning section for positioning a circuit board.
a suction tool that suctions the chip component of the positioning section and attaches it to the circuit board of the second positioning section; a near motor that drives the suction tool in the vertical direction; and a near motor that drives the suction tool in the first positioning section. It is equipped with a transfer motor that is driven to move between the second positioning section and a control device that controls the vertical movement position, speed, and axial pressure of the linear motor, and also controls the movement position of the transfer motor. It is characterized by:

Operation According to the above configuration, the suction tool can be driven vertically by the linear motor, and the vertical movement position, speed, and axial load pressure of the suction tool can be arbitrarily controlled, and the suction tool can be driven horizontally by the transfer motor. Since the moving position of the suction tool can be arbitrarily controlled by driving the suction tool, the impact received by the chip component during mounting can be kept constant, and the load, amplitude, and number of times of pressing, which is the scrubbing condition during mounting, can be arbitrarily set.

Embodiment An embodiment of the present invention will be explained based on the drawings. Fig. 1 is a configuration diagram of the transfer and mounting section of the die-ponding device, Fig. 3 is a timing chart of the linear motor, Fig. 4 is a schematic flowchart of the operation, and Fig. 6 is a block diagram of the linear motor control device. Identical parts of the embodiments are designated by the same reference numerals.

The operation will be explained according to the schematic flowchart of FIG. 4. As in the conventional example, the chip 2a is positioned in the first positioning section A. In the second positioning part B, the circuit board 3
A is positioned with adhesive 4a applied in advance. As shown in FIG. 1, the linear motor L used in the embodiment has a magnetic circuit composed of a main body yoke 11, a side yoke 12, and a permanent magnet 13. A voice coil 14 that moves vertically is provided in the space between the main body yoke 11 and the permanent magnet 13, and the voice coil 14 is held by a coil guide 16. A suction tool 6 is attached to the tip of the coil guide 15. Also, a guide shaft 16 that fixes the coil guide 15 so that it does not swing in the left-right direction.
Furthermore, the movable parts of the speed sensor 17 and the position sensor 18 are fixed to the voice coil 14. The linear motor L is directly connected to a rotating transfer motor 19,
A speed sensor 2o and a position sensor 21 are attached to the transfer motor 19 at Pl.

The linear motor L and the transfer motor 19 are controlled by a control device 50.
is controlled as follows.

Now, in the initial state, as shown in Figure 3, the linear motor LK
The directly connected suction tool 6 is at a height of P. Position it at the position.

The transfer motor 19 is driven to rotate the suction tool 6 to the first positioning section A. Time T when positioning of the chip 2a in the first positioning part A is completed. The linear motor L is driven once to position the suction tool 6 from the height Po to the height Pl. A timer is operated from timing T1 when positioning is completed, and at timing T2 after time-up, the linear motor L is lowered by small positioning control, and the suction tool 6 is moved to the position of height T2.

At the completed timing T3, a chip suction valve (not shown) is turned on and the suction tool 6 suctions the chip 2a. At timing T4 when suction is completed as controlled by a timer, the linear motor L is driven to raise the suction tool 6 to the height P. position. At timing T6 when positioning is completed, the transfer motor 19 is rotated to move the suction tool 6 to the second positioning part B.
Move to. At the same time, the first positioning section A starts positioning the next chip 2b. At timing T6 when the positioning of the transfer motor 19 is completed, the linear motor L is driven to move the suction tools to the height P. Position it to a position at a height T3 from the position. The timer is operated from timing T7 when positioning is completed, and at timing T8 after time-up, the changeover switch 22 in FIG. 5 is switched from a to b by the changeover signal S to separate the position loop and the speed loop. Next, the control unit 23 outputs a load command signal β. Since the linear motor L applies the load command signal β and the speed feedback signal f' to the next stage as the load deviation signal α obtained by comparing the load comparison section 24, the speed of the suction tool 6 is controlled from the position of the height T3. When the suction tool 6 reaches the height T4, the suction tool 6 comes into contact with the circuit board 3a, so the value of the speed feedback signal vf' becomes zero, and the load command signal β becomes a current command signal.

Therefore, the suction tool 6 switches from the conventional speed control to current control, and applies a load as a pressing force to the chip 2a.

At this time, the load value is confirmed by monitoring the current feedback signal f, and the desired load is applied. When the desired load value is reached, the transfer motor 19 is positioned at a minute angle to give the chip 2a a certain amplitude movement in the lateral direction. Finish the scrubbing by performing several lateral positionings. Height P at timing T1o after scrubbing. Position to the position. The transfer motor 19 moves to the first positioning section A and enters the next cycle.

As described above, according to this embodiment, by using the linear motor L on the axis that requires load for pressing, the movement amount of the suction tool and the load for pressing can be arbitrarily set, and the speed can be controlled. This makes it possible to keep the impact that the chip receives constant. Furthermore, by directly connecting the linear motor L to the transfer motor 19, we can solve the problem of bank lash such as rank and pinion, improve the positioning accuracy, and improve the amplitude and
The force can be set arbitrarily. In this embodiment, only one suction tool is used to attach the beam near motor LK, but two suction tools are arranged at a certain angle as shown in Fig. 6, and the first positioning part A and the first positioning part A station for regulating the position of the chip is provided between the two positioning parts B, and by regulating the position of the chip, it is possible to improve the mounting accuracy of the chip. Furthermore, by using a linear motor as the transfer motor 19 as shown in FIG. 7, positioning can be performed not in the rotational direction but in the linear direction.

Effects of the Invention As described above, the present invention uses a linear motor for the vertical linear movement axis, so that the amount of movement of the suction tool and the load for pressing can be set arbitrarily.In addition to controlling the IJ near motor, the transfer motor By controlling the movement position of the chip, it is possible to apply a force in the lateral direction of the load to suit the chip component.
The number of times of this can also be set arbitrarily, and the effect is that the chip parts can be mounted with high precision in a well-familiar state.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a die-ponding device according to a first embodiment of the present invention, FIG. 2 is a perspective view of a conventional example, and FIG. 6 is a perspective view of a die-ponding device according to a second embodiment. 7 are perspective views of the transfer and mounting section of the die-ponding device of the third embodiment. 2d...Chip, 3a...Circuit board, 6
...Suction tool, 19...Transfer motor, 5
0... Control device, A... First positioning section, B... Second positioning section, L...
・Linear motor. Name of agent: Patent attorney Toshio Nakao and 1 other person2°
°-oak 7°if': a Fig. 2 Fig. 4 Fig. 6

Claims (1)

[Claims] A first positioning section for positioning the chip component, a second positioning section for positioning the circuit board, and a suction system for picking up the chip component in the first positioning section and attaching it to the circuit board in the second positioning section. a linear motor that drives the suction tool in the vertical direction; a transfer motor that drives the suction tool to move the suction tool between a first positioning part and a second positioning part; and a linear motor that drives the suction tool in the vertical direction. moving position,
A chip component transfer and mounting device comprising: a control device that controls speed and axial load pressure and also controls the movement position of a transfer motor.