JP2000094232A - Height adjusting mechanism and chip mounting equipment using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a height adjusting mechanism having comparatively simple structures and capable of stably mounting in high accuracy a chip, for example, on a substrate and using general members for adjusting the height at lower costs, and the chip mounting equipment using the same. SOLUTION: This chip mounting equipment recognizes the position of a bare chip and that of the electrode-forming surface on a substrate by means of a camera 20 position-adjusted through a height adjusting mechanism 3. Position alignment is applied to the bare chip and the electrode-forming surface. The electrode of the bare chip is then connected to the substrate. Where, the height adjusting mechanism 3 is formed of: a plate 32 used for holding the camera 20, and upwardly, downwardly, slidably installed on a base member 19; a cam follower 33 provided on the plate 32; a motor 34 provided on and held by the base member 19 side; a cam plate 36 mounted on an output shaft 35 rotated by the motor 34 and for upwardly, downwardly moving the plate 32 associated with a cam face 36a with the cam follower 33 mounted on the cam surface 36a; a sensor 38 for detecting the angle of the rotation of the cam plate 36; and a control circuit means for controlling the angle of the rotation of the cam plate 36 is accordance with an output from the sensor 38.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a height adjusting mechanism among various adjusting mechanisms and a chip mounting apparatus using the same.

[0002]

2. Description of the Related Art Conventionally, a bare chip of an integrated circuit is connected to a printed circuit board, a glass substrate, etc.
Generally, these are generally mounted on a “substrate”). However, in recent years, in order to reduce the mounting space of the integrated circuit on the substrate and reduce the size of the device, a method of directly mounting the bare chip on the substrate by soldering has been increasing.

[0003] This bare chip (IC before package,
Hereinafter, a general operation of a conventional chip mounting apparatus used for mounting a chip (hereinafter simply referred to as a chip) on a substrate, that is, a bonding apparatus will be described. First, chips are picked out one by one from a tray in which a large number of chips are stored by a chip transfer arm, and the chips are conveyed laterally and delivered to a tool. Subsequently, positioning of the chip and the electrode formation surface on the substrate is performed, and thereafter, the chip is pressed against the electrode formation surface on the substrate by a tool to perform bonding. A camera is used for positioning the chip and the electrode forming surface on the substrate. The camera is movable in the X-Y direction and also in the Z direction (height direction), and is adjusted to a predetermined height position corresponding to the thickness of the substrate.

FIGS. 9 and 10 show an example of a height adjusting mechanism for a camera used in a conventional bonding apparatus (flip chip bonder). FIG. 9 is a side view thereof, and FIG. 10 is a front view thereof. FIG. 9 and 10, a camera 101 includes a camera XY stage 102, a rib 103, a Z slider 104, and a camera linear guide 1.
05, provided on a base 107 of a frame (not shown) of a flip chip bonder via a frame 106.

More specifically, the camera linear guide 1
A servo motor 108 and a ball screw 110 that is rotatably connected to the servo motor 108 via a coupling 109 are provided on 05. The Z slider 104 is screwed to the ball screw 110. And the ball screw 110 is the servo motor 1
08, the Z slider 104 moves the rib 103 and the camera XY stage 1 in accordance with the rotation direction.
02, the screw is fed upward or downward together with the camera 101, and the height of the camera 101 is adjusted by this screw feed.

At the upper and lower portions of the servo motor 108, a rotary encoder 111 for detecting the amount of rotation of the servo motor 108, and when the servo motor 108 is stopped, the ball screw 110 rotates by a load on the camera 101 side. An electromagnetic brake 112 for preventing the camera 101 from sliding down is incorporated.

[0007] Along the camera linear guide 105, a sensor 113 for detecting the upper end, a sensor 114 for detecting the origin, and a sensor 11 for detecting the lower end are provided on the frame 106.
5 are provided in order. Each sensor 113, 11
4 and 115 are dogs 11 fixed to the rib 103 side.
When 6 comes to the corresponding position, it is detected respectively.

In the camera height adjusting mechanism having this structure, the output from the rotary encoder 111 rotating in synchronization with the servomotor 108 on the basis of the output when the sensor 114 for detecting the origin detects the dog 116 is used as a reference. By counting the pulse output, the height position of the camera 101 can be known and controlled. Further, when some abnormality occurs in the servomotor 108 and the motor runs out of control, and the sensor 113 for detecting the upper end or the sensor 1115 for detecting the lower end detects the servomotor 108, the power of the servomotor 108 is cut off and forcedly stopped.

[0009]

However, in the above-described camera height adjusting mechanism of the conventional bonding apparatus (chip mounting apparatus), the ball screw 110 and the servomotor 108 are used, and the rotary encoder 111 drives the camera based on the rotation information. Since the height position of the camera 101 is determined, there are the following problems. First, as for the components, expensive components such as the servomotor 108, the ball screw 110, and the electromagnetic brake 112 are frequently used.
The cost is high and the volume is large, making it difficult to reduce the size of the device. Second, in terms of control, feedback control of the output to the servomotor 108 in response to the input of the rotary encoder 111 complicates the control. Also, since the guide is guided by the screw connection between the ball screw 110 and the Z slider 104, the ball screw 110 may fall unless a brake mechanism (fall prevention mechanism) such as an electromagnetic brake 112 is provided.
Three detection sensors 115 and an origin sensor 114 are required, and the number of position detection sensors increases. Thirdly, since the servomotor 108 for driving the ball screw 110 must be arranged on the axis of the ball screw 110, the degree of freedom in design is small.

The present invention has been made in view of the above problems. Its purpose is to eliminate the above problems and achieve a relatively simple structure, for example, allowing a chip to be mounted on a substrate stably with high precision, and at a lower cost using only general-purpose members. It is an object of the present invention to provide a height adjusting mechanism that can be realized and a chip mounting device using the same. Still other objects will be sequentially clarified in the contents described below.

[0011]

The present invention is characterized in that the following technical means are provided to achieve the above object. That is, in the height adjustment mechanism for adjusting the vertical position of the equipment with respect to the base member arranged in the upright state,
A plate mounted on the base member slidably up and down to hold the devices, a cam follower provided on the plate, a motor held on the base member side, and an output rotated by the motor A cam plate mounted on a shaft and moving the plate up and down according to the cam surface while the cam follower is mounted on the cam surface;
The sensor comprises a sensor for detecting the rotation angle of the cam plate, and control circuit means for controlling the rotation angle of the cam plate according to the output of the sensor.

Another embodiment of the present invention is an example of an apparatus to which the above-described height adjusting mechanism is applied. That is, the position of the bare chip and the electrode forming surface on the substrate is recognized using a camera whose upper and lower positions are adjusted via a height adjusting mechanism, and after the positions of the bare chip are aligned with each other, the electrodes of the bare chip are attached to the substrate. In the chip mounting apparatus connected above, the height adjustment mechanism is provided on the plate holding the camera, which is assembled slidably up and down with respect to a base member arranged in an upright state, and provided on the plate. A cam follower, a motor provided in a state held on the base member side, and an output shaft rotated by the motor, the plate being mounted on the cam surface with the cam follower mounted on its cam surface. A cam plate that moves up and down according to the cam surface, a sensor that detects the rotation angle of the cam plate, and controls the rotation angle of the cam plate according to the output of the sensor In which and a that the control circuit means.

In the structure of the present invention described above, when the cam plate is rotated by the motor, devices such as a camera are moved up and down by the action of the cam curve of the cam surface in proportion to the rotation angle of the cam plate. It is to adjust the length. And
The structure in which the cam plate is rotated to move the camera up and down in this manner has a brake mechanism (fall prevention mechanism) compared to the conventional structure.
Is unnecessary, and only one sensor that can detect the portion serving as the origin of the cam plate during one rotation of the cam plate is required, and the simplification is realized.

[0014]

Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The embodiments described below are preferred specific examples and have various technically preferred limitations, but do not limit the technical scope of the present invention.

FIGS. 1 to 3 schematically show an example of a chip mounting apparatus (bonding apparatus) to which the present invention is applied.
1 is a plan view of the entire apparatus, FIG. 2 is a front view thereof, and FIG.
Is a side view thereof. 1 to 3, the bonding apparatus 10 positions a chip 2 on a substrate 1 and electrically connects electrodes of the chip 2, and provides an upright frame 13 on a base 12 of a gantry 11. Tool Z stage 14 provided for upright frame 13
And a substrate XY stage 15 disposed on the base 12 in correspondence with the tool Z stage 14, a tray Y stage 16, and an inverted X stage 17. The tool 1 of the tool Z stage 14 is placed on the horizontal base 12.
A camera base 19 is provided correspondingly to the camera base 8, and the position of a camera 20 as a device is adjusted with respect to the camera base 19 via the height adjustment mechanism 3 to which the present invention is applied.

Note that the chip 2 in the figure is a bare chip before the package, and affixes a, b, and c to the end of the code at each transported position, and the chip 2a disposed on the tray Y stage 16 The chip 2b transferred to the chip inversion X stage 17 and the tool 18 of the tool Z stage 14
Are conveniently separated as chips 2c passed to
These are all the same. The substrate 1 is a printed circuit board and has electrodes (not shown).

The tool Z stage 14 holds the tool 18 downward, and drives a tool Z motor 21 attached on the upper side to move the tool Z to the upright frame 13.
It moves in the vertical direction (Z direction) along the linear guide 22 and the like. The tool 18 has a rotation function and a parallelism adjustment function with respect to the vertical axis, and performs a chip pressing operation by driving the tool Z motor 21 while holding the chip 2c by suction. The substrate XY stage 15 is located in front of the upright frame 13, and drives the attached X motor 23 and Y motor 24 to move the substrate 1 detachably set on the upper surface of the stage in the XY direction. Positioning is performed.

The tray Y stage 16 is an initial stage for positioning the tray 4 to be loaded by an automatic machine or the like, and sending the chips 2a in the tray 4 from the inverted X stage 17 to the tool Z stage 14, and has a tray on the upper surface of the stage. 4 is set detachably. A large number of chips 2a to be bonded to the substrate 1 are arranged on the tray 4. Tray 4 (chip 2a in tray 4) is placed in tray Y
By driving a Y motor 25 attached to the stage 16, positioning in the Y direction is performed.

On the chip reversing X stage 17, a linear guide 26, a chip reversing cylinder 27 which is guided by the linear guide 26 and moves in the X direction, and is reciprocated 180 degrees by the chip reversing cylinder 27 so as to turn up and down. A chip reversing arm 28 to be reversed and a chip reversing X motor 29 are provided. At the tip of the chip reversing arm 28, a chip suction nozzle (not shown) that suctions and holds the chip 2a is provided. Then, by driving the chip inversion X motor 29, the chip inversion cylinder 27
Is moved toward the tray Y stage 16 along the linear guide 24, and the chip 2 a in the tray 4 is sucked by the chip reversing arm 28. By driving the chip reversing cylinder 27, the chip reversing arm 28 is turned 180 degrees in the same plane, and the chip 2b is turned over. Then, the chip inversion arm 28 is moved to the lower side of the tool 18 by the driving of the chip inversion X motor 29, and transfers the inverted chip 2b to the tool 18 side.

On the other hand, the height adjusting mechanism 3 adjusts the height position of the camera 20 with respect to the camera base 19 as shown in an enlarged detail in FIG. A camera upper / lower plate 32 holding the camera 20 via the camera 31; a cam follower 33 provided on the camera upper / lower plate 32;
A motor 34, a cam plate 36 and a spur gear 37 mounted on an output shaft 35 rotated by the camera Z motor 34.
A sensor 38 for detecting a rotation angle of the cam plate 36,
Control circuit means (a control unit 51 described later) for controlling the rotation angle of the cam plate 36 in accordance with the output of the sensor 38 is provided. The camera 20 has a structure in which the chip 2c and the substrate 1 can be simultaneously recognized between the chip 2c of the tool 18 and the substrate 1 on the substrate XY stage 15 in a vertical coaxial field of view.

The camera base 19 is on the base 12 and is erected on the side of the frame 13. On the front side of the camera base 19, camera linear guides 39 are provided in pairs in the vertical direction (Z direction). The camera upper / lower plate 32 has sliders 40 provided on the back side in correspondence with the camera linear guides 39, and the camera linear guides 3 corresponding to the respective sliders 40 are provided.
The camera base 19 is slidably mounted in the camera base 19 in the up and down direction in a fitted state. A pair of ribs 41 is provided on the front side of the camera upper and lower plate 32, and the camera XY stage 31 is attached to a lower portion of both the ribs 41. Although the camera XY stage 31 is not shown, the camera 20 held at the lower part can be adjusted in the X and Y directions independently of the height adjustment mechanism 3.

The camera upper / lower plate 32 is disposed in contact with the outer peripheral cam surface 36a of the cam plate 36 via the cam follower 33, and is held by the cam plate 36 from below. The cam plate 36 is mounted together with the spur gear 37 around the output shaft 35, and is rotated integrally with the output shaft 35. The output shaft 35 is rotatably supported by a motor holder 42 fixed to the camera base 19 and protruding forward. In other words, the motor holder 42 has a substantially L shape with the protruding end side bent upward,
A horizontal portion 42a is fixed to the camera base 19, and the camera Z motor 34 is connected to the vertical portion 42b of the L
3 is attached and held in a state where it intervenes. The output shaft 35 is connected to the camera Z motor 34 via the speed reducer 43.
, And rotated by the drive of the camera Z motor 34.

The cam plate 36 has an outer peripheral cam surface 36a formed as a cam curve whose radius from the center of rotation changes in proportion to the rotation angle. The camera upper / lower plate 32 is driven by the camera Z motor 34 to
Is rotated together with the output shaft 35, the cam follower 33 disposed on the outer peripheral cam surface 36a moves in the vertical direction in proportion to the rotation angle of the cam plate 36, and as a result, slides in the vertical direction. Here, in this embodiment, as schematically shown in FIG. 5, the cam plate 36 changes in radius from r1 to r2 at 0 to 270 degrees (S1 to S2), and changes from 270 degrees to 300 degrees (S2 to S2).
The radius changes from r2 to r1 in S3), but the radius does not change between 300 degrees and 360 degrees (S3 to S4). Therefore, the cam follower 33, the cam plate 3
Radius r during one rotation of S6 (S1 to S2 to S3 to S4)
The reciprocating operation is performed between 1 and r2, and the camera vertical plate 32 is vertically moved correspondingly.

In addition, the spur gear 37 has teeth H (indicated by symbols H1, H2, H3,... In FIG.
And is located on the output shaft 35 between the cam plate 36 and the vertical portion 42 b of the motor holder 42. Here, in this embodiment, as schematically shown in FIG.
A part of the teeth H of the spur gear 37 is cut out (H5 portion in the figure), and is set as a reference position (origin) of the spur gear 37. A sensor 38 is provided corresponding to the spur gear 37.
This sensor 38 is connected to the horizontal portion 4 of the motor holder 42.
It is attached to the side of 2a via a sensor plate 44. The direction of the sensor 38 is the pitch circle of the tooth H of the spur gear 37 (the sensor detection position indicated by reference numeral 45 in FIG. 6).
It corresponds to.

In the structure of this embodiment, as shown in FIG. 6, when the output when the sensor 38 detects the tooth H1 of the spur gear 37 is A1, the sensor detection position is located on the pitch circumference of the spur gear 37. 45, so teeth H1, H2, H3
, The detection waveforms A1, A2, A3 of the teeth that are output in a state where the ON (ON) and OFF (OFF) periods are approximately at equal intervals, and erroneous detection can be prevented. In addition, the tooth H5 is cut out to create a state in which the output A5 of the sensor 38 is not output, and the reference position (origin) of the spur gear 37 is set to the position of S4 (= S1) of the cam plate 36. When the position of H5) is reached, the gradient start position of the cam plate 36 is detected. Then, by counting the number of ON and OFF from the output A6 of the sensor 38, the rotation angle of the cam plate 36 from the reference position S1 can be determined.

A tension spring 47 is incorporated between the camera base 19 and the camera upper and lower plate 32. The extension spring 47 is disposed between the spring plate 46 provided at the upper end of the camera base 19 and the upper end of the camera upper and lower plate 32 corresponding to this plate.
This spring force applies a lifting force to the camera upper and lower plates 32 to prevent the entire weight of the camera upper and lower plates 32 from being applied to the cam plate 36 side. Therefore, the tension spring 47 has a spring multiplier whose maximum pulling force is equal to or less than the total weight of the components provided on the camera upper and lower plate 32 side. When such a spring configuration is employed, the workload of the camera Z motor 34 can be reduced, and a general-purpose small motor can be used as the camera Z motor 34.

In the height adjusting mechanism 3 configured as described above, the cam plate 36 is rotated via the speed reducer 43 and the output shaft 35 by driving the camera Z motor 34. Then, the camera upper / lower plate 32 is moved in the vertical direction under the control of the cam curve of the cam plate 36. At this time, after passing through the origin,
By counting the number of on and off from the output A6 of 8,
The rotation angle of the cam plate 36 from the reference position S1 is known, and the height of the camera 20 can be controlled. The height of this camera 20 is
The thickness is adjusted according to the thickness of the substrate 1 and is adjusted each time the thickness of the substrate 1 handled by the mounting machine changes. After being adjusted once, it is held until the thickness of the substrate 1 to be handled changes again.

FIG. 7 is a control block diagram of the chip mounting apparatus (bonding apparatus) 10 described above. This control block diagram includes a control unit 5 corresponding to the control circuit means 50.
1, the operation panel 52 and the monitor 53 are shown in relation to the F / C bonder main body 54 and the camera 20 of the device 10 described above.

The control unit 51 includes a power supply, a control device, a motor driver, a temperature adjusting device, an image processing device, and the like. The operation panel 52 is a panel related to an input device, a display device, and the like. The operation panel 52 manually or automatically specifies an operation mode, specifies crimping conditions such as temperature, pressure, time, and the like. Instruct the model data of the mounting position. Conversely, the control unit 51 outputs data such as temperature, pressure, power supply, abnormality and the like, and status display. The monitor 53 includes a display panel and the like for displaying the image processing results and the like after being controlled by the control unit 51.

The F / C bonder main body 54 includes the tool Z stage 14, the substrate XY stage 15, the tray Y
Stage 16, chip inversion X stage 17, camera X-
The main components are related to motors used for the Y stage 31, the height adjusting mechanism 3, and the like, as well as tools related to a pressure detection sensor, a heater, and the like. And the F / C bonder body 5
4, signals such as an operation command and a heating power command are input from the control unit 51, and conversely, from the F / C bonder main body 54, positional information such as sensor signals and data such as temperature and pressure are sent to the control unit 51. Is output.

FIG. 8 is a flowchart showing an operation example of the F / C bonder main body 54. The operation of the apparatus will now be described with reference to FIG. First, before bonding the chip 2 to the substrate 1, the height position of the camera 20, which is the most characteristic of the present invention, is changed. In this adjustment, substrate 1
The input of the component data such as the thickness and the processing conditions are input from the operation panel 52 by the operator (step S1). When the input is completed, the camera Z motor 34 is driven, and the spur gear 37 and the cam plate 36 are integrally rotated by the output shaft 35. Then, when the sensor 38 detects the cutout portion (origin) H5, the output signal from the sensor 38 is counted. When the number corresponding to the input of the component data is counted, the camera Z motor 34 is stopped. On the other hand, when the camera Z motor 34 is driven, the rotation angle of the cam plate 36 from the reference position S1 also changes in proportion to the rotation of the output shaft 35. Then, under the control of the cam curve, the camera upper / lower plate 32 is moved upward or downward via the cam follower 33, and is arranged at a desired position. That is, the camera 20 is arranged at a predetermined height position (Step S2). As a result, the advance preparation is completed, and the height position of the camera 20 after the adjustment is maintained until the input condition is changed.

Subsequently, work preparation is started. Here, substrate X
-The substrate 1 is set on the Y stage 15, and the tray 4 containing the chips 2a is set on the tray Y stage 16 (steps S3 and S4). This completes the work preparation.

Next, a bonding operation (automatic operation) is started. In this bonding operation, the chip reversing arm 28
Is moved in the X direction (on the tray 4 of the tray Y stage 16) along the linear guide 26, and then the chip 2a in the tray 4 is sucked by the tip suction nozzle at the tip (step S5). Subsequently, the tip reversing arm 28 is turned by 180 degrees by the tip reversing cylinder 27 and is reversed, so that the lower surface of the tip 2b faces upward, and is moved along the linear guide 26 in the X direction (toward the tool 18) to move the tip 2b. Is arranged below the tool 18 (step S
6). Then, the tool 18 is lowered by the driving of the tool Z motor 21, and after receiving the chip 2b, moves up to a predetermined position. At the same time, the chip reversing arm 28 that has received the chips 2b retreats and again receives the chips 2a in the tray 4 (step S7).

Next, the camera XY stage 31 is driven, and the camera 20 is mounted on the chip 2 held by the tool 18.
c and the substrate XY stage 15, and the position of the chip 2c is recognized by the camera 20 (step S8). After the recognition, the camera 20 is retracted together with the camera XY stage 31 (step S9). . Subsequently, the substrate XY stage 15 is moved to the mounting position based on the information from the camera 20, and the substrate 1 and the chip 2c are aligned (Step S10). The positioning here is to match the electrode forming surface on the substrate 1 with the electrode of the chip 2c. After the alignment, the tool Z motor 21 is driven to move down the seal Z stage 14, mount the chip 2c on the substrate 1, and bond the chip 2c by thermocompression with the tool 18 to complete the bonding (step S11). , S
12). This completes one cycle of the bonding operation. Then, returning to step S5, the same operation is repeated, and when predetermined bonding to the substrate 1 is completed, returning to step 3, the same operation is repeated.

Therefore, in the chip mounting device 10 shown as this embodiment, when the height position of the camera 20 is adjusted by the height adjustment mechanism 3, when the cam plate 36 is rotated, the rotation angle is proportional to the rotation angle. By the action of the cam curve forming the outer peripheral cam surface 36a of the cam plate 36, the camera 20 is moved through the cam follower 33, the camera upper / lower plate 32 and the like.
Can be moved in the vertical direction, and the height can be adjusted easily and accurately. That is, in the present invention, the camera 2
The structure in which 0 is moved up and down by the rotation of the cam plate 36 requires three sensors as in the conventional structure, whereas only one sensor 38 is required, and the conventional brake mechanism is unnecessary. Becomes

In this structure, the position of the cam plate 36 is detected by a combination of a spur gear 37 and a sensor 38, which is simpler than a conventional method using a rotary encoder, a servo pack, or the like. It can be composed of only general-purpose parts and is simple, and can improve the device reliability. At the same time, by selecting the number of teeth of the spur gear 37 for the vertical movement amount (stroke), the stop position resolution becomes fine in proportion to the number of teeth, and high-precision positioning becomes possible. Further, since a tension spring 47 is provided between the spring plate 46 and the camera upper and lower plate 32 to reduce the load applied to the cam plate 36 by the spring force, a small and general-purpose motor is used as the camera Z motor 34. In this respect, the cost can be reduced. In addition, using a general-purpose product with a member configuration like this,
Since the structure is simple, flexibility and simplification of the device design can be achieved.

In the above-described embodiment, as means for detecting the position of the plate cam 36, a spur gear 37 and a sensor 38 are used.
The structure disclosed in combination with the above is disclosed, but instead of the spur gear 37, a device that periodically outputs an optical signal, for example, an optical disk, a perforated disk, or the like may be used. Further, a mechanical switch or a proximity switch may be used instead of the optical sensor. Further, as a means for reducing the workload of the camera Z motor 34, a structure using a tension spring 47 is disclosed.
It is also possible to provide a compression spring for constantly applying a force for pushing up 2 from below.

[0038]

As described above, in the height adjusting mechanism of the present invention and the chip mounting apparatus using the same, when adjusting the height of a camera (equipment and the like), the motor is driven to move the cam plate. When rotated, the height of the camera ((equipment, etc.) can be easily and accurately adjusted by moving the camera ((equipment, etc.) in the vertical direction by the action of the cam curve of the cam plate proportional to the rotation angle. Because the cam plate is rotated to move the camera (equipment, etc.) up and down, the number of sensors required in the conventional structure can be reduced, and no brake mechanism (fall prevention mechanism) is required. In addition, the size and cost of the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a schematic plan view of an entire chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic front view of the entire apparatus of FIG.

FIG. 3 is a schematic side view of the entire apparatus of FIG. 1;

FIG. 4 is an enlarged perspective view of a camera height adjustment mechanism in the apparatus of FIG.

FIG. 5 is a cam curve diagram of a cam plate of the height adjusting mechanism of FIG. 4;

FIG. 6 is a schematic diagram illustrating a principle of detecting a rotation angle of the height adjustment mechanism in FIG. 4;

FIG. 7 is a control block diagram of the chip mounting apparatus.

FIG. 8 is an operation flowchart of the chip mounting apparatus.

FIG. 9 is a schematic side view of a camera height adjustment mechanism in a conventional device.

FIG. 10 is a schematic front view of the camera height adjustment mechanism of FIG. 9;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 (2a, 2b, 2c) ... Chip, 3 ... Height adjustment mechanism, 10 ... Chip mounting apparatus, 19 ... Camera base (base member), 20 ... Camera (equipment), 32 ... Camera upper and lower plate (Plate), 33 ... Cam follower, 3
4: Camera Z motor (motor), 35: Output shaft, 3
6 cam plate, 36a outer cam surface, 37 spur gear, H
... teeth, 38 ... sensors, 47 ... tension springs, 51 ... control unit (control circuit means), 52 ... operation panel.

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H05K 13/08 H05K 13/08 Q (72) Inventor Manabu Yamauchi 6-7-35 Kita Shinagawa, Shinagawa-ku, Tokyo Sonii Incorporated (72) Inventor Kazumasa Dasiwa 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo F-term within Sony Corporation (reference) 3C030 AA00 AA21 DA00 DA02 5E313 AA03 DD03 FF40 5H303 AA06 BB03 BB09 DD01 DD21 DD26 DD27

Claims (5)

[Claims] 1. A height adjusting mechanism for adjusting the vertical position of equipment with respect to a base member arranged in an upright state, wherein the height adjustment mechanism is vertically slidably assembled to the base member and holds the equipment. Plate, a cam follower provided on the plate, a motor held on the base member side, and mounted on an output shaft rotated by the motor, with the cam follower mounted on its cam surface. A cam plate that moves the plate up and down according to a cam surface,
A height adjusting mechanism comprising: a sensor for detecting a rotation angle of the cam plate; and control circuit means for controlling a rotation angle of the cam plate according to an output of the sensor. 2. A spur gear mounted on the output shaft,
The height adjusting mechanism according to claim 1, wherein the sensor is arranged corresponding to a pitch circle of the teeth of the spur gear, and detects a rotation angle of the cam plate from a passing state of the teeth of the spur gear. 3. The height adjusting mechanism according to claim 2, wherein the spur gear is formed by cutting out a part of teeth of the spur gear and setting the cutout as a rotation reference position of the spur gear. 4. A tension spring for pulling up the plate or a compression spring for supporting the plate from below is provided between the base member and the plate, and the compression spring supporting the plate from below is provided to the cam plate from the cam follower side. 4. The height adjusting mechanism according to claim 1, wherein the applied load can be reduced. 5. The position of the bare chip and the electrode forming surface on the substrate is recognized by using a camera whose vertical position is adjusted via a height adjusting mechanism, and the positions of the bare chip and the electrode forming surface are adjusted. In the chip mounting apparatus for connecting the above on the substrate, the height adjustment mechanism is mounted vertically slidably on a base member arranged in an upright state, and a plate holding the camera, A cam follower provided on the plate, a motor provided in a state held on the base member side, and mounted on an output shaft rotated by the motor, with the cam follower mounted on its cam surface. A cam plate that moves the plate up and down according to a cam surface, a sensor that detects a rotation angle of the cam plate, and a rotation angle of the cam plate according to an output of the sensor. Chip mounting apparatus characterized by and a Gosuru control circuit means.