JPH0350438B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a component mounting device, specifically a mounting head that is repeatedly moved between a component receiving position and a component mounting position, to suction and hold a component at a component receiving position. This device is used to mount electronic components such as chip resistors and chip multilayer capacitors onto electronic circuit boards.

Conventional technology For example, in the conventional case, a mounting head that is held around an intermittent rotating support body and circulatedly moves the electronic component by suctioning and holding it during the movement, and then presses and mounts it onto an electronic circuit board. Referring to FIG. 1, the mounting head 2 held on the intermittent rotation support 1 has a buffer spring 9 between the suction nozzle 2a side at the lower end and the passive part 2b side at the upper end. The head pushing rod 16 for component mounting always moves the mounting head 2 downward to a certain position with a constant stroke, and the spring eliminates variations in the thickness of the electronic component 8 to be pressed against the electronic circuit board 6. 9
The component 8 is elastically pressed against the board 6 while being absorbed by the material.

Problems to be Solved by the Invention Even though the springs 9 absorb variations in the height dimensions of the electronic components 8, there are many types of electronic components 8 that are handled at the same time by one component mounting device today. The difference in thickness between the maximum and minimum dimensions is also quite large. Therefore, the elastic pressing force of the spring 9 will be large on the electronic component 8 having a large thickness, and if the electronic circuit board 6 is made of a fragile ceramic board or a thin board with low strength. , causing them to crack or chip. Furthermore, the electronic component 8 itself may also be damaged.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a mounting head that is repeatedly moved between a component receiving position and a component mounting position to suction and hold the components at the component receiving position. In a component mounting device that transports a component to a mounting position and mounts the component by elastically pressing it onto the object to be mounted,
The present invention is characterized by comprising a pressing elastic force correcting means for correcting the component pressing elastic force of the mounting head in accordance with the thickness dimension of the mounted component.

The component pressing elastic force is generated by an elastic transmission part (for example, the spring 9) provided in a part of the component pressing operation system including the mounting head, and the pressing elastic force correction means is generated by the elastic transmission part of the component pressing operation system. By changing the pushing stroke of the operating member (for example, the head pushing rod 16) located closer to the source of the component pushing operation in accordance with the thickness of the mounted component, the component pushing elastic force can be easily corrected. can do.

More specifically, for example, the component pressing operation system includes two links as transmission members between the mounting head having the elastic transmission section, a component pressing motion source that provides a component pressing stroke to the mounting head, and the mounting head. It is preferable to configure it so that it has a connecting part. Further, it is preferable that the pressing elastic force correction means is constructed by connecting the connecting shaft between the respective links and the tip of a stroke adjustment lever connected to the control motor via a worm reducer with a swing fulcrum regulating link. . The use of this worm speed reducer not only enables fine adjustment, but also has the advantage of maintaining the fine adjustment state due to its non-reverse transmission mechanism.

If a cam mechanism is used as the source of the component pressing operation, when the mounting head brings the component close to the object to be mounted and presses it, the approaching speed of the component will be slowed down near the object to be mounted. Control to reduce the impact on the object to be mounted can be easily and reliably achieved.

However, the point is that the component pressing elastic force of the mounting head can be finely adjusted according to the thickness dimension of the component to be mounted. Other pressure control means can be employed. For example, a microcomputer installed in the component mounting device may be used to control various operations of the cam and the like.

Furthermore, in the case of a model in which a large number of mounting heads are circulated and parts are mounted on the way, the pressing elastic force correction means is designed to act sequentially on the mounting heads that have reached the component mounting position. It only needs to be installed in one location.

Function: When the mounting head presses and mounts the component that it suctions and holds onto the object to be mounted, the component pressing elasticity is adjusted by the pressing elastic force correction means to correspond to the thickness dimension of the component to be mounted. A force is generated, and regardless of the thickness of the part, the part is mounted with a substantially constant elastic pressing force.

Embodiment As seen in FIG. 4, a plurality of mounting heads 2 are provided around the intermittent rotation support 1, corresponding to the intermittent rotation pitches. Each mounting head 2
is cyclically moved by the intermittent rotation of the support 1 in a state in which it sequentially advances through stop positions common to each mounting head 2, and is moved on the X-direction moving table 3 provided corresponding to the rear stop position S1. The electronic components 8 selectively supplied from the respective component supply cassettes 4 are sucked and held, and the electronic components 8 are provided corresponding to the stop position S5.
It is transferred to the electronic circuit board 6 on the XY direction moving table 5 and is elastically pressed and mounted thereon.

Further, the mounting head 2 is arranged vertically relative to the support 1 as shown in FIG. It is held movably and is biased upward by a spring 7, so that it is temporarily moved downward by a predetermined amount toward the component supply cassette 4 at the stop position S1 and toward the board 6 at the stop position S5. A buffer spring 9 is operated between the suction nozzle 2a side at the lower end and the passive part 2b side at the upper end when the mounting head 2 presses and mounts the component 8 onto the board 6.

A detection means 10 for detecting the position and orientation of the component 8 held by the suction nozzle 2a with respect to the nozzle 2a is provided at the upper part of the mounting head 2 corresponding to another stop position S3, and a detection means 10 is located at the upper part of the mounting head 2 corresponding to the other stop position S4.
Nozzle rotating means 11 is provided for changing or correcting the orientation of the component 8 adsorbed to the nozzle 2a by temporarily applying frictional transmission to the passive component 2b.

Further, above the front stop position S5 of the mounting head 2, there is a component pressing operation mechanism 12 that sequentially moves the mounting head 2 that has reached the stop position S5 downward and presses and mounts the transferred component 8 onto the board 6. (Fig. 1, Fig. 3, Fig. 4).

This component pressing operation mechanism 12 includes a cam 13 as a component pressing drive source, and a swinging lever 15 having a cam follower 14 for this cam 13 in the middle.
The head pushing rod 16 is provided above the stop position S5 so as to be movable up and down facing the passive part 2b of the mounting head 2, and the tip of the swinging lever 15 and the upper end of the head pushing rod 16 are connected to each other. Two links to be connected 1
7 and 18, the swinging fulcrum P of the connecting shaft 19 of these links 17 and 18 is regulated by the component pressing stroke adjustment mechanism 20, and the mounting head 2 is moved with a stroke according to the set position of the swinging fulcrum P. Move down.

As clearly shown in FIG. 3, the component pressing stroke adjustment mechanism 20 includes a stroke adjustment lever connected to a correction drive shaft 23 connected to a control motor 21 such as a servo motor or a pulse motor via a worm reduction mechanism 22. 24, and this lever 2
4 and the connecting shaft 19 are connected by a swing fulcrum regulating link 25.

Since the worm reduction mechanism 22 cannot transmit reverse transmission from the driven side to the driving side, the rotational position of the stroke adjustment lever 24 set by the transmission from the motor 21 can be reversed by the operation of the component pressing mechanism 12. Stable without being driven, swinging fulcrum regulation link 2
The connecting shaft 26 with 5 is fixed at the set position. As a result, the swinging fulcrum regulating link 25 can only swing about the connecting shaft 26, and the swinging fulcrum P of the connecting shaft 19 between the links 17 and 18 is restricted to be on the connecting shaft 26, and the stroke As the adjustment lever 24 is rotated by the drive from the worm deceleration mechanism 22 side, the swing fulcrum P is moved on a circular arc trajectory centered on the correction drive shaft 23, as shown by points P1 and P2 in FIG. Continuously displaced.

The swinging stroke given to the swinging lever 15 by the cam 13 is between point Q and point Q1 in the first diagram. At this time, the pivot point of the connecting shaft 19 is at the point P.
If there is a swing fulcrum at point P1, it swings between point R0 and point R1. Also, with respect to the swing fulcrum P2, the swing is from point R0 to point R2, and the swing start point is commonly point R0, while the swing end points are points R, R1,
It changes to R2.

The difference in the end points of the swinging of the connecting shaft 19 is
A difference as shown by points T, T1, and T2 is given to the end point of the downward movement given to the head pushing rod 16 via the head. Due to this difference in the end point of the downward movement, the head pushing rod 16
The downward stroke is adjusted to change the amount of pushing of the mounting head 2 relative to the passive portion 2b. Mounting head 2
is the change in the amount of pushing force applied to the part 8 to be installed.
By adjusting the thickness according to the thickness of the parts, the elastic pressing action by the same amount of deflection of the rocking spring 9 can be applied to the parts of any thickness, so that they can be reliably mounted on the board 6. Even if the substrate 6 is made of fragile ceramic or thin with low strength, it will not be cracked or chipped, and damage to the parts 8 can be prevented.

Mounting of the various parts 8 is carried out according to a preset program. At this time, a component designation signal for supplying a predetermined component 8 to each mounting head 2 according to the program is sent to the control motor 21 as a recognition signal for the component 8 held by suction on the mounting head 2.
It is used for delayed control. As a result, the control motor 21 moves each mounting head 2 to the stop position S5.
Before the component mounting operation is performed at the stop position S5, the correction drive shaft 23, The connecting shaft 19 of the links 17 and 18 is connected via the stroke adjustment lever 24.
The swing fulcrum P of is changed according to the component 8. As a result, the mounting head 2 that has reached the stop position S5 is given a pushing amount by the component pressing mechanism 12 that corresponds to the component 8 that is being held by suction, thereby achieving mounting by elastic pressing of the various components 8 in just the right amount. do.

In addition, the head push rod 16 is moved to each swing fulcrum P, P.
The relationship between the push-down stroke given by the cam 13 and the push-down speed at P1 and P2 is set as shown by lines L, L1, and L2 in FIG. As it gets closer, the downward movement speed slows down and finally reaches zero, thereby eliminating the impact when the mounting head 2 presses the component 8 against the board 6.

On the other hand, if the swing fulcrum of the connecting shaft 19 of the links 17 and 18 is set on the connecting shaft 27 between the link 18 and the push rod 16, which is indicated by point P3 in FIG. Link 17 swings on the axis
As a result, both links 18 and 25 no longer exert tension between the link 17 and the pushing rod 16, and both are integrally R around the connecting shaft 26.
It only swings between 0 and R3, and the push rod 16 cannot be moved downward. Therefore, the downward stroke of the pushing rod 16 becomes zero, as indicated by L3 in FIG. By setting the pivot point of the connecting shaft 19 at the point P3, it is possible to prevent the pushing rod 16 from being pushed down against the mounting head 2 and avoid mounting the component 8 due to the downward movement of the mounting head 2. If it is desired to stop mounting the component 8 for some reason, there is an advantage that it can be done quickly and easily.

As the buffer spring 9 of the mounting head 2, in addition to a coil spring, the elasticity of the pressing transmission member itself, a fluid cushion, etc. can be used, and the location and manner in which it is provided can be changed freely.

Effects of the Invention According to the present invention, when a component is mounted by elastically pressing the component onto an object to which the component is mounted, the component pressing elastic force can be adjusted according to the thickness dimension of the component to be mounted. , no matter what kind of thickness dimensions are mixed and used when handling and mounting, the pressing elastic force against the component can be applied almost constantly without too much or too little, and the mounting of the component can be achieved reliably. Even if the substrate is a ceramic substrate or a thin substrate with low strength, it will not crack or chip, and damage to parts can be prevented.

[Brief explanation of drawings]

FIG. 1 is a partially sectional side view showing the essential parts of an embodiment of the present invention, FIG. 2 is a diagram of the operation of the part, FIG. 3 is a perspective view thereof, and FIG. 4 is an apparatus. It is a schematic perspective view of the whole. 2...Mounting head, 6...Electronic circuit board (component mounted object), 8...Electronic component, 9...Buffer spring,
12... Parts pressing operation mechanism, {17, 18...
Link, 19...Connection shaft, 21...Control motor},
20...Component pressing stroke adjustment mechanism.

Claims (1)

[Claims] 1. A mounting head that is repeatedly moved between a component receiving position and a component mounting position attracts and holds the component at the component receiving position, transfers it to the component mounting position, and applies elastic force to the object to be mounted. A component mounting device for mounting a component by pressing it against the mounting head is characterized by comprising a pressing elastic force correction means that can change the stroke of the mounting head so as to correct the component pressing elastic force of the mounting head in accordance with the thickness dimension of the mounting component. Parts mounting device. 2. The component pressing elastic force of the mounting head is generated by an elastic transmission part provided in a part of the pressing operation system including the mounting head, and the pressing elastic force correction means is generated by the elastic transmission part of the component pressing operation system. 2. The component mounting device according to claim 1, wherein the pressing operation stroke of the transmission member closer to the source of the component pressing operation is changed in accordance with the thickness dimension of the mounted component.