JPS6238265A - Apparatus for applying adhesive - Google Patents

Abstract

PURPOSE:To easily control a coating length, a coating width and a coating thickness, by supporting a coating head having a laterally widened coating hole by a head support part relatively movable at least to one direction so as to arrange the same in a state rotatable with respect to a flat coating surface. CONSTITUTION:When large chip parts are adhered and fixed, the longitudinal direction of the emitting hole 11 of a coating head 1 is made vertical to a moving direction so as to form an adhesive layer having a width corresponding to the entire width W of said head 1. When relatively small chip parts are adhered and fixed, the coating head 1 is rotated by a predetermined angle by a rotary means 5 and the emitting hole 11 is set to a posture inclined at an angle theta to the moving direction to form an adhesive layer having a width of Wcostheta. Further, the thickness of the adhesive layer is regulated by regulating the moving speed of the coating head 1 in such a state that the supply amount from a supply pipe 2 is made constant. The length of the adhesive layer is determined by the moving quantity of a head support part 4.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an adhesive coating vc device, and particularly to a vc device for applying adhesive before soldering leadless type electronic components (hereinafter referred to as chip components) onto a wiring board. This invention relates to a device that applies adhesive to a substrate in order to temporarily fix chip components to the substrate.

Conventional technology When soldering chip components to a wiring board, in order to temporarily fix the chip components with adhesive in advance, adhesive is supplied to the tip of the adhesive application head, and the adhesive is applied onto the board. JP-A-55-110097 discloses a method of transferring and then mounting a chip component on this adhesive. The adhesive applicator has the structure shown in FIG. 6: The applicator head 21 is provided with a pair of applicator nozzles 22 made of small diameter pipes, and the adhesive 23 is discharged from the tip of the applicator nozzle 22. By pressing this onto the substrate 24 and transferring it onto the substrate 24, a mound of adhesive 23 is formed as shown in FIG.
4a, and a part of the back and side surfaces of the chip component 25 is adhered to the substrate 24 with an adhesive 23, and before soldering, the adhesive 23 is irradiated with ultraviolet rays or the like to harden and fix. I'm here.

Problems to be Solved by the Invention However, with the above configuration, it is possible to adjust the thickness by changing the amount of adhesive applied, but in order to do so, it is necessary to change the adhesive supply pressure and supply time. In addition, since the shape of the adhesive is mound-like, the precision of the shape deteriorates when a large amount is applied, causing problems such as misalignment and adhesion of the adhesive to the electrodes. Ta. In addition, since the spacing between the application nozzles cannot be changed, when the chip components are small, the adhesive may come off too much, resulting in poor adhesion, and when the chip components are large, the adhesive is hidden, making it difficult for ultraviolet rays to be irradiated, resulting in poor curing. There was a problem that the adhesive fixation was insufficient.

The present invention aims to solve the above problems.

Means for Solving the Problems In order to achieve the above-mentioned object, the present invention provides a coating head in which a wide adhesive discharge hole is formed in a head support portion that is relatively movable in at least one direction, and is rotatable along a coating plane. It is characterized by being placed in.

Function Since the present invention has the above-described configuration, an adhesive layer of a desired length can be formed by moving the coating head while discharging the adhesive from the dispensing hole in the coating direction, and the coating head can be moved to the desired length. By rotating the adhesive layer at an appropriate angle relative to the moving direction, the coating width of the adhesive layer can be arbitrarily selected, and by adjusting the moving speed of the coating head, the adhesive can be coated at a constant adhesive supply speed. The thickness of the layer can be set arbitrarily.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 5.

In FIG. 1, reference numeral 1 denotes a coating head for coating a substrate 3 with adhesive supplied from an adhesive supply pipe 2, and is mounted on a head support portion 4 so as to be rotatable back and forth at a predetermined angle by a rotation means 5. Further, the coating head 1 is configured to be movable up and down by appropriate means not shown. The head support section 4 is fixed to the XY moving device 6 and is configured to be movable in the X direction and the vY direction at an arbitrary speed. This X-Y moving wave ra6
The X-direction moving body 8 is installed on the base 7 so as to be movable in the X direction and is driven by an The head supporting section 4 is fixed to one end of the Y-direction moving body 9.

Reference numeral 10 denotes a control unit incorporating a microprocessor and a storage device, and is configured to control the X-axis motor 8a, the SY-pongee motor 9a and the rotating means 5, and control the supply and stop of adhesive.

The coating head 1 includes one #I as shown in FIG.
A long and wide discharge hole 11 is formed, the width W of which is set to correspond to the width of the adhesive layer that is optimal for bonding the largest chip component to which it is applied.

In the configuration described below, when a thick chip component P1 is to be fixed with adhesive as shown in FIG. Allow adhesive layer 12 to be formed. In addition, as shown in FIG. 4, when a relatively small chip component P2 is to be adhesively fixed, the coating head 1 is rotated by a predetermined angle by the rotating means 5, and the discharge hole 11 is placed in a posture inclined by an angle θ with respect to the moving direction. so that the adhesive layer 12 having a width of W cos θ is formed. In this manner, by rotating the coating head 1 by a predetermined angle depending on the size of the chip component, the width of the adhesive layer 12 can be set to the optimum width for the electronic component.

Further, the thickness of the adhesive layer 12 can be adjusted by adjusting the moving speed of the adhesive layer 1 during coating while keeping the supply amount from the adhesive supply pipe 2 constant.

Furthermore, when adjusting the width of the adhesive layer 12 in accordance with the size of the chip component as described above, it is possible to keep the thickness of the adhesive N12 constant while keeping the supply amount of the adhesive constant. This is also possible by adjusting the moving speed of the coating head 1.

That is, in FIG. 5, the amount of adhesive supplied per unit time is Q, and the length of the predetermined adhesive layer 12 or the amount of movement of the rad 1 for application is L=v・t (V is the moving speed, t is Travel time)
, the thickness of the adhesive layer 12 is 1+, and the rotation angle of the coating blade 1 is θ, the amount S of adhesive in this adhesive layer 12 is as follows: 5=Q−L=v−L−h−WCO5θ , V is given by v=Q/h−WCO5θ.

Therefore, in order to keep the thickness I+ constant even if the width of the adhesive layer 12 is varied while keeping the supply amount Q of adhesive per unit time constant, the movement determined by the above equation according to the rotation angle θ is necessary. The coating head 1 may be moved at a speed V. For this purpose, input the rotation angle θ of the coating head 1 into the control unit 10,
According to the above formula, the X-axis motor 8a and the Y-pongee motor 9
What is necessary is to set it so that a is controlled.

The present invention can be implemented in various modes other than those shown in the above embodiments. For example, instead of moving the coating head 1 in two directions using the X-Y moving device 6, the substrate 3 may be moved in the opposite direction. Alternatively, it may be sufficient to simply move the coating head 1 or the substrate 3 in one direction, or the coating head and the substrate may each be moved in one direction orthogonal to each other. Further, the specific configurations of the moving device and the rotating means may be arbitrarily designed.

Effects of the Invention According to the adhesive applicator of the present invention, as described above, the applicator head in which the wide applicator hole is formed is arranged rotatably along the applicator plane on the head support portion that is relatively movable in at least one direction. This makes it possible to control the moving speed of the coating head to reduce the thickness of the adhesive layer to 1!4W1 while keeping the amount of adhesive supplied to the coating head, which is difficult to control, constant. The thickness of the agent layer can be made uniform.

Moreover, by rotating the application head, the width of the adhesive layer can be set arbitrarily, and the adhesive layer can be formed with a width that is suitable for the size of the electronic component. Therefore, according to the present invention, misalignment of electronic components, defective adhesion, etc. can be completely eliminated.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of an embodiment of the present invention, Fig. 2 is a perspective view of the tip of the coating head, Figs. 3 and 4 are plan views of electronic components bonded, and Fig. 5 is an adhesive An explanatory diagram of the relationship between layer thickness and coating head moving speed, @Figure 6 is a front view of the conventional example,
FIG. 7 is a perspective view of the bonding process of the electronic component. 1... Coating head 4... Head support section 5... Rotating means 6... X-Y moving device 10... Control section 11... Coating hole 12... Adhesive layer. Agent: Patent attorney Toshio Nakao (1 person) Figure 3 Figure 4
Figure 5 (=vt) 12... Insertion 1 Ward 1D ■〇-

Claims (3)

[Claims] (1) An adhesive coating device characterized in that a coating head having a wide adhesive discharge hole is disposed on a head support portion that is relatively movable in at least one direction so as to be rotatable along a coating plane. (2) The adhesive application device according to claim 1, further comprising a control section that controls the moving speed of the head support section. (3) The control section is configured to control the moving speed of the head support section in accordance with the rotation angle of the coating head with reference to the direction in which the discharge hole extends in a direction perpendicular to the head movement direction. An adhesive coating device according to claim 2, characterized in that: