JPH01143393A - Method for soldering flat package type element to wiring board - Google Patents

Method for soldering flat package type element to wiring board

Info

Publication number
JPH01143393A
JPH01143393A JP30250487A JP30250487A JPH01143393A JP H01143393 A JPH01143393 A JP H01143393A JP 30250487 A JP30250487 A JP 30250487A JP 30250487 A JP30250487 A JP 30250487A JP H01143393 A JPH01143393 A JP H01143393A
Authority
JP
Japan
Prior art keywords
wiring board
solder
cream solder
terminal
cream
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30250487A
Other languages
Japanese (ja)
Inventor
Katsuhiko Kaneda
兼田 克彦
Koichi Chiba
宏一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP30250487A priority Critical patent/JPH01143393A/en
Publication of JPH01143393A publication Critical patent/JPH01143393A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To optimize cream solder amount by removing the excess solder supplied and applied to the terminal pattern group of a wiring board by a cream solder sucking mechanism. CONSTITUTION:A copy material 4 movable in an axial direction Z is provided on a wiring board 3 held on an XY table 1 and provided with a flat package element (FP element) 2 on a predetermined surface region. The material 4 has a cylinder 6 for supplying solder cream 5. Further, a cream solder cutter 7 movable elevationally and an excess cream solder sucking mechanism of the excess cream solder cut by the cutter 7 are provided in front of the material 4 and the cylinder 6 with respect to the advancing direction for crossing the material 4 and the cylinder 6 over the terminal pattern 3a corresponding to the terminal leads 2 of the FP element 2. When the supplying amount of the solder is excessive, the excessive solder is removed, the solder is then melted by irradiating it with a laser beam to be soldered as required.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は、フラットパッケージ型素子(以下FP素子と
略称)を配線基板に実装し高密度実装回路を構成する場
合などに適する配線基板に対するFP素子の半田付は方
法に関する。
[Detailed description of the invention] [Objective of the invention] (Industrial application field) The present invention is applicable to cases where a flat package type element (hereinafter abbreviated as FP element) is mounted on a wiring board to configure a high-density packaging circuit. Soldering of FP elements to a suitable wiring board relates to a method.

(従来の技術) 電子機器の小形化に伴ないFP素子を例えばセラミック
ス配線板へ装着する高密度実装回路板が開発されている
(Prior Art) With the miniaturization of electronic devices, high-density mounting circuit boards in which FP elements are mounted on, for example, ceramic wiring boards have been developed.

ところで、この種の配線基板の端子パターンとFP素子
端子ピンとの半田付けにおいて端子パターン群を横切る
ように付着するクリーム半田が余り多く被着していると
半田付けにより端子ピン間あるいは端子ピン間の電気的
短絡を招来したり、半田ボールを発生ずると言う不都合
がある。この不都合さを除去するため例えば端子ピン間
に隔壁を設は端子ピンに直交する方向への半田流れを防
止したりあるいは余分な半田を半田付(プ部から配線基
板上の仙の領域に流動吸収させることなどが試みられて
いる。
By the way, when soldering the terminal patterns of this type of wiring board and the FP element terminal pins, if too much cream solder adheres across the terminal pattern group, the soldering may cause damage between the terminal pins or between the terminal pins. This has the disadvantage of causing electrical short circuits and generating solder balls. To eliminate this inconvenience, for example, a partition wall may be installed between the terminal pins to prevent the solder from flowing in a direction perpendicular to the terminal pins, or to remove excess solder (flowing from the soldering part to the side area on the wiring board). Attempts are being made to absorb it.

(従′来技術の問題点) しかしこれら余分に被着したクリーム半田への対応策は
電気的短絡防止の目的を達成し得てもクリーム半田の浪
費と言う点については実用上なは問題がある。従って本
発明は煩雑な操作や装置を要せずに適量のクリーム半田
を用いてFP素子を配線基板上に容易かつ確実に半田付
【プしうる方法を提供するものである。
(Problems with conventional technology) However, although these measures to deal with excess cream solder may achieve the purpose of preventing electrical short circuits, there is a practical problem in that cream solder is wasted. be. Therefore, the present invention provides a method for easily and reliably soldering an FP element onto a wiring board using an appropriate amount of cream solder without requiring complicated operations or equipment.

[発明の構成] (問題点を解決するための手段) 本発明は、XYテーブルに保持された配線基板上の表面
所定領域にFP素子を配置し、このFP素子のリード端
子を対応する前記配線基板上の端子パターンにクリーム
半田層を介して接続するに当り、前記配線基板に対して
Z軸方内に可動で前記配線基板に対するならい材に支持
されそのならい材によって配線基板に対し位置決めされ
たシリンダからクリーム半田を配線基板の端子パターン
群上に供給被着すること、前記供給被着したクリーム半
田の過剰分をクリーム半田吸着機構によって除去するこ
と、前記クリーム半田の過剰分を除きかつ被半田付は部
を位置合わせた状態で例えばレーザビームなど高エネル
ギを照射して被着残存しているクリーム半田を溶がし半
田付けを行なうことを骨子としている。
[Structure of the Invention] (Means for Solving the Problems) The present invention provides for arranging an FP element in a predetermined area on the surface of a wiring board held on an XY table, and connecting lead terminals of the FP element to the corresponding wirings. When connecting to the terminal pattern on the circuit board via the cream solder layer, it is movable in the Z-axis direction with respect to the wiring board, is supported by a tracing material for the wiring board, and is positioned with respect to the wiring board by the tracing material. supplying and depositing cream solder from a cylinder onto a group of terminal patterns of a wiring board; removing an excess amount of the supplied and deposited cream solder by a cream solder suction mechanism; removing the excess amount of cream solder and applying the solder The main point of attachment is to align the parts and irradiate them with high energy, such as a laser beam, to melt the remaining cream solder and solder the parts.

(作 用) 本発明によれば、位置決めのためにXYh向に移動可能
なXYテーブルに保持された配線基板の所定領域にFP
素子を配置し、このFP素子の例えば端子ピンをこの端
子ピンに対応して設けられた配線基板上の端子パターン
とを半田付けするに当り、次のようにクリーム半田が被
着される。
(Function) According to the present invention, an FP is placed in a predetermined area of a wiring board held on an XY table movable in XYh directions for positioning.
When arranging the elements and soldering, for example, terminal pins of the FP element to terminal patterns on the wiring board provided corresponding to the terminal pins, cream solder is applied as follows.

すなわち配線基板に対しZ軸方向(基板面に対し垂直方
向)に可動するならい材によって位置方向法めされたシ
リンダを介してクリーム半田は配線基板上の所定の被半
田付は領域(半田付はパターンないし端子パターン)に
正確に供給される。またこのクリーム半田の供給是が過
剰のときはクリーム半田の過剰分は前記シリンダを支持
しているならい材自体によっであるいはならい材に併設
した例えば真空吸着材構によって除外され、被半田領域
には適■のクリーム半田が被着残存していることになる
。従ってその後の例えばレーザビームの照射によってク
リーム半田を溶かし所要の半田付けを行なった場合にも
端子ピン間あるいは端子パターン間の半田による導通な
いし短絡化や半田ボールの発生を招来することなく所要
の半田付けが達成される。
In other words, the cream solder is applied to a predetermined area on the wiring board to be soldered (the soldering area is pattern or terminal pattern). In addition, when the cream solder is supplied in excess, the excess cream solder is removed by the tracing material itself supporting the cylinder or by, for example, a vacuum adsorption material structure attached to the tracing material, and is removed from the area to be soldered. This means that appropriate cream solder remains adhered. Therefore, even when the cream solder is melted by laser beam irradiation and the required soldering is performed, the required soldering can be performed without causing conduction or shorting or generation of solder balls due to solder between terminal pins or terminal patterns. attachment is achieved.

(実施例) 以下図面を参照して本発明の詳細な説明する。(Example) The present invention will be described in detail below with reference to the drawings.

第1図ないし第2図は本発明の実施態様を示したもので
、これらの図においてXYテーブル1に保持されかつ表
面所定領域にFP素子2を配置する配線基板3に対しZ
軸方向に可動なならい材4を備えた装置を用意する。し
かして前記ならい材4は前記配線基板3に対して所定の
位置につまり配線基板3に配置されたFP素子2の端子
リード2aに対応する半田付はパターンないし端子パタ
ーン3aに位置するようにXYテーブル1を駆動して位
置決めされており、このならい材4は半田クリーム5を
供給するシリンダ6を付設しである。
1 and 2 show embodiments of the present invention, and in these figures, Z
A device is provided with an axially movable profiler 4. Therefore, the tracing material 4 is placed at a predetermined position with respect to the wiring board 3, that is, the soldering material corresponding to the terminal lead 2a of the FP element 2 arranged on the wiring board 3 is placed in the XY direction so that the soldering material is located in the pattern or the terminal pattern 3a. It is positioned by driving a table 1, and this profiling material 4 is attached with a cylinder 6 for supplying solder cream 5.

さらに上記ならい材4およびクリーム半田シリンダ6が
FP素子2の端子リード2aに対応する端子パターン3
a上を横切る進行方向に対してならい材4の前方には適
宜上下動しうるクリーム半田カッタ7およびこのクリー
ム半田カッタ7で切断された過剰分のクリーム半田吸引
機構(図示せず)とが一体内に配設されている。
Further, the profiling material 4 and the cream solder cylinder 6 form a terminal pattern 3 corresponding to the terminal lead 2a of the FP element 2.
A cream solder cutter 7 that can move up and down as appropriate and a cream solder suction mechanism (not shown) for the excess cream solder cut by the cream solder cutter 7 are installed in front of the tracing material 4 in the direction of movement across the upper surface of a. placed inside the body.

次に上記装置を用いて半田付けする方法ないし手段につ
いて述べるとならい材4に附設されたクリーム半田シリ
ンダ6の半田噴出口6atfiFP素子2の所定の端子
リード2a上に位置するようXYテーブル1を駆動して
位置合わせする。
Next, the method or means for soldering using the above device will be described. The XY table 1 is driven so that the solder spout 6 of the cream solder cylinder 6 attached to the profile material 4 is positioned on a predetermined terminal lead 2a of the atfiFP element 2. to align.

このXYテーブル1の駆動に連動してクリーム半田シリ
ンダ6からクリーム半田5を半田付はパターン乃至端子
パターン3a上に順次噴出させその端子パターン群を横
切るようにクリーム半田を被着される。一方ここで被着
したクリーム半田5が過剰の場合つまり半田クリーム5
の盛上り高さや被着幅が所定の範囲を超えている分く例
えば第2図A部分)については半田クリームカッタ7で
切除しクリーム半田用桟構で除去してクリーム半田5の
被着量を常に所定の範囲内に規制する。上記FP素子2
の一辺の端子リード2a対応する端子パターン3aにつ
いてのクリーム半田5被着が終了した時点でXYテーブ
ル1を駆動しFP素子2の他の辺の端子リード2a群が
対応する端子パターン群にクリーム半田供給シリンダ6
の半田噴出口と対応させて同様にクリーム半田5を所定
量被着さ才る工程を返す。かくしてFP素子2の端子リ
ードに対応する配線基板上の端子パターン2aを横切ら
して所定量のクリーム半田をそれぞれ被着させた後、前
記FP素子2をその端子リード2aと対応する端子パタ
ーン3aが対接するよう位置決め、載置する。次いで例
えばレーザビームをクリーム半田被着部に照射(走査)
することによって端子リード2は配線基板2上の対応す
る端子パターンと容易かつ確実に半田付すされる。
In conjunction with the drive of the XY table 1, the cream solder 5 is sequentially ejected from the cream solder cylinder 6 onto the soldering pattern or terminal pattern 3a, and the cream solder is applied across the group of terminal patterns. On the other hand, if the cream solder 5 deposited here is excessive, that is, the solder cream 5
If the bulge height or coating width exceeds a predetermined range (for example, part A in Fig. 2), the solder cream cutter 7 is used to cut it out and the cream solder crosspiece structure is used to remove it to reduce the coating amount of cream solder 5. always be regulated within a predetermined range. The above FP element 2
When the cream solder 5 has been applied to the terminal pattern 3a corresponding to the terminal lead 2a on one side, the XY table 1 is driven to apply cream solder to the terminal pattern group corresponding to the terminal lead 2a group on the other side of the FP element 2. Supply cylinder 6
The process of depositing a predetermined amount of cream solder 5 in the same way as in the solder spout is repeated. After applying a predetermined amount of cream solder across the terminal pattern 2a on the wiring board corresponding to the terminal lead of the FP element 2, the FP element 2 is bonded to the terminal pattern 3a corresponding to the terminal lead 2a of the FP element 2. Position and place them so that they are facing each other. Then, for example, a laser beam is irradiated (scanned) onto the cream solder area.
By doing so, the terminal leads 2 can be easily and reliably soldered to the corresponding terminal patterns on the wiring board 2.

なお上記においてはクリーム半田供給シリンダ6からの
クリーム半田5の供給量が過剰の場合クリーム半田カッ
タ7で切断し吸引機構で吸引除去したがクリーム半田カ
ッタ7での切断除去だ(ブでもよいしさらに吸引機槽た
りによって行なってもよい。
In the above case, if the amount of cream solder 5 supplied from the cream solder supply cylinder 6 is excessive, it is cut by the cream solder cutter 7 and removed by suction by the suction mechanism. It may also be carried out using a suction tank or the like.

[発明の効果] 上記の如く本発明方法によればFP素子の端子リードが
半田付けする部分に被着するクリーム半田量は常に所定
量に制御される。
[Effects of the Invention] As described above, according to the method of the present invention, the amount of cream solder deposited on the portion to which the terminal lead of the FP element is soldered is always controlled to a predetermined amount.

つまりFP素子端子リードとこの端子リードに対応する
配線基板」二の端子パターンとの半田付けに関与するク
リーム半田量は容易に適正化される。
In other words, the amount of cream solder involved in soldering between the FP element terminal lead and the second terminal pattern of the wiring board corresponding to this terminal lead can be easily optimized.

従って半田付けされた端子リード間の空気的短絡や過剰
半田量に起因する半田ボールの起生ちなく信頼性の高い
電気的接続が常に達成されることになる。
Therefore, a reliable electrical connection is always achieved without the occurrence of air shorts between soldered terminal leads or solder balls caused by excessive amounts of solder.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第2図は本発明方法実施態様を示ず側面図
および斜視図である。 1・・・・・・XYテーブル 2・・・・・・FP素子 3・・・・・・配線基板 4・・・・・・ならい材 5・・・・・・クリーム半田 6・・・・・・クリーム半田供給シリンダ7・・・・・
・カッタ 出願人     株式会社 東芝 代理人 弁理士 須 山 佐 − 第1図 第21ヅ
1-2 are side and perspective views showing an embodiment of the method of the present invention. 1...XY table 2...FP element 3...Wiring board 4...Profiling material 5...Cream solder 6... ...Cream solder supply cylinder 7...
・Catta applicant Toshiba Corporation Patent attorney Sa Suyama - Figure 1, Figure 21

Claims (1)

【特許請求の範囲】[Claims]  XYテーブルに保持された配線基板上にフラットパッ
ケージ型素子を配置し、このフラットパッケージ型素子
のリード端子を対応する前記配線基板上の端子パターン
にクリーム半田層を介して接続するに当り、前記配線基
板に対してZ軸方向に可動で前記配線基板に対するなら
い材に支持されかつ前記ならい材によって配線基板に対
する位置が定められたシリンダから前記配線基板の端子
パターン群上にその端子パターン群を横切るようにクリ
ーム半田を順次供給し、過剰分のクリーム半田をカッタ
ないし吸着機構で除去してから前記フラットパッケージ
型素子のリード端子と対応する配線基板の端子パターン
トとを位置合せして半田付けする手段を含む配線基板に
フラットパッケージ型素子を半田付けする方法。
When placing a flat package type element on a wiring board held on an XY table and connecting the lead terminals of this flat package type element to the corresponding terminal patterns on the wiring board via a cream solder layer, A cylinder movable in the Z-axis direction with respect to the board, supported by a tracing material for the wiring board, and whose position relative to the wiring board is determined by the tracing material, is moved onto the terminal pattern group of the wiring board so as to cross the terminal pattern group. Means for sequentially supplying cream solder to the substrate, removing the excess cream solder with a cutter or a suction mechanism, and then aligning and soldering the lead terminals of the flat package type element and the corresponding terminal pattern of the wiring board. A method of soldering a flat package type element to a wiring board containing.
JP30250487A 1987-11-30 1987-11-30 Method for soldering flat package type element to wiring board Pending JPH01143393A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30250487A JPH01143393A (en) 1987-11-30 1987-11-30 Method for soldering flat package type element to wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30250487A JPH01143393A (en) 1987-11-30 1987-11-30 Method for soldering flat package type element to wiring board

Publications (1)

Publication Number Publication Date
JPH01143393A true JPH01143393A (en) 1989-06-05

Family

ID=17909758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30250487A Pending JPH01143393A (en) 1987-11-30 1987-11-30 Method for soldering flat package type element to wiring board

Country Status (1)

Country Link
JP (1) JPH01143393A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186254B2 (en) 2005-08-04 2012-05-29 Lintec Corporation Sheet cutting device and cutting method
US8277282B2 (en) 2005-10-04 2012-10-02 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming apparatus and ultrasonic trimming method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8186254B2 (en) 2005-08-04 2012-05-29 Lintec Corporation Sheet cutting device and cutting method
US8277282B2 (en) 2005-10-04 2012-10-02 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming apparatus and ultrasonic trimming method
US8512094B2 (en) 2005-10-04 2013-08-20 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming method
US8591285B2 (en) 2005-10-04 2013-11-26 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming apparatus
US8632377B2 (en) 2005-10-04 2014-01-21 Nihon Shoryoku Kikai Co., Ltd. Ultrasonic trimming method

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