JPS61219467A - Laser soldering device for flexible circuit board - Google Patents

Laser soldering device for flexible circuit board

Info

Publication number
JPS61219467A
JPS61219467A JP6070985A JP6070985A JPS61219467A JP S61219467 A JPS61219467 A JP S61219467A JP 6070985 A JP6070985 A JP 6070985A JP 6070985 A JP6070985 A JP 6070985A JP S61219467 A JPS61219467 A JP S61219467A
Authority
JP
Japan
Prior art keywords
flexible circuit
circuit board
laser
soldering
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6070985A
Other languages
Japanese (ja)
Inventor
Hiroo Okawa
宏男 大川
Minoru Fujimoto
実 藤本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6070985A priority Critical patent/JPS61219467A/en
Publication of JPS61219467A publication Critical patent/JPS61219467A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To easily solder by flexible circuit board the space between printing boards having differential step by forming the recess with angles on the tip of absorption part and by facilitating the transfer of flexible circuit board and the positioning to the soldering part. CONSTITUTION:The recess having angles is formed on the tip of the absorption part of a laser irradiating head 9, exhausted by the tube 16 for evacuation and a flexible circuit substrate 8 is absorbed and fixed thereto. The vacuum absorption is stopped by placing the flexible circuit substrate 8 on the stepped substrates 1, 2 with the movement of the laser irradiating head 9. The substrates 1, 2 and flexible circuit substrate 8 are soldered by making laser beam 14 incident from irradiating aperture and by melting the solder paste 15 coated on the substrates 1, 2 in advance.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はレーザによるはんだ付け装置に係り、管に、段
差のあるプリント基、板間をフレキシブ）Ｉ／回路基板
によりはんだ付けする装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a laser soldering apparatus, and more particularly, to an apparatus for soldering a tube, a printed circuit board with a step, and a flexible I/circuit board between the boards.

〔発明の背景〕[Background of the invention]

従来、レーザを用いたはんだ付け装置には特開昭５９−
９２１６３号公報にあるようなフラットパッケージ等を
対象としたものであった。すなわち、第４図（特開昭５
９−９２１６３号公報）において、基板１に被着された
フラットパッケージパターン２上の所定の位置に置かれ
たリード端子３のはんだ付部位を、加圧板５で加圧しな
がらレーザビーム６を照射してハンダペースト４を溶融
してはんだ付けする。このように、従来装置はフラット
パッケージ等をはんだ付けするもので、フレキシブルな
回路基板を段差のある基板間にはんだ付けすることには
論及されていなかった。Conventionally, a soldering device using a laser was disclosed in Japanese Patent Application Laid-Open No. 1983-
It was aimed at flat packages such as those described in Publication No. 92163. In other words, Fig. 4 (Unexamined Japanese Patent Publication No. 5
9-92163), a laser beam 6 is irradiated to the soldering portion of a lead terminal 3 placed at a predetermined position on a flat package pattern 2 attached to a substrate 1 while being pressed by a pressure plate 5. to melt the solder paste 4 and solder it. As described above, the conventional apparatus is for soldering flat packages and the like, and there is no mention of soldering flexible circuit boards between boards with differences in level.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、フレキンプル基板をレーザを用いて自
動はんだ付けするもので、高効率及び品質の安定性をね
らうはんだ付け装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering device that automatically solders flexible printed circuit boards using a laser and aims to achieve high efficiency and quality stability.

〔発明の概要〕[Summary of the invention]

本発明のポイントは、レーザ照射ヘッドに真空吸着機能
をつけ、フレキシブル回路基板の基板への搭載位置決め
を、このレーザ照射ヘッドで行なえるようにした事にあ
る。The key point of the present invention is that the laser irradiation head is equipped with a vacuum suction function, so that the laser irradiation head can be used to position the flexible circuit board on the board.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例を第１図により説明する。ｌは
プリント親基板、７はその上に取付けられた小形子基板
であり、８はこれらの間を接続するフレキシフル回路基
板である。９はレーザ照射ヘッドで真空吸着機能があり
、また、ロボット等の移動機構（図示せず）に取付けら
れる。これによりフレキシフル回路基板８を吸着搬送す
る。An embodiment of the present invention will be described below with reference to FIG. 1 is a printed main board, 7 is a small child board mounted thereon, and 8 is a flexible circuit board that connects these. Reference numeral 9 denotes a laser irradiation head which has a vacuum suction function and is attached to a moving mechanism (not shown) such as a robot. As a result, the flexible circuit board 8 is suctioned and conveyed.

１０はレーザ発振器でレーザ光はこれにより１１の光分
岐装置、１２の光ファイバーケーフル、１３の光ファイ
バー螢通すレーザ照射ヘッド９に導かれる。10 is a laser oscillator, and the laser beam is thereby guided to a laser irradiation head 9 passing through an optical branching device 11, an optical fiber cable 12, and an optical fiber 13.

第２図においてレーザ照射孔１４、光ファイバー１３で
ある。１５は真空吸着用の孔で、チューブ１６により真
空引きされる。また、照射ヘンド９の下面はＶ形になっ
ており、フレキシブル回路基板移載時は第２図のように
フレキシブル回路基板はこのＶ形に添った形で吸着され
る。In FIG. 2, the laser irradiation hole 14 and the optical fiber 13 are shown. Reference numeral 15 denotes a hole for vacuum suction, which is evacuated by a tube 16. Further, the lower surface of the irradiation hand 9 is V-shaped, and when the flexible circuit board is transferred, the flexible circuit board is attracted along this V-shape as shown in FIG.

第３図はフレキシブル回路基板位置決め、レーザによる
はんだ付け作業を示す。レーザ照射ヘラ１−９が下降し
、基板】、７に接触した後、真空吸着をやめると、フレ
キシブル回路基板８の両端は照射ヘン１−〇に押えられ
る。FIG. 3 shows the flexible circuit board positioning and laser soldering work. After the laser irradiation spatula 1-9 descends and comes into contact with the substrate 1-7, vacuum suction is stopped, and both ends of the flexible circuit board 8 are pressed by the irradiation hens 1-0.

次に５．レーザ光が１４の照射孔より入射し、予め下の
基板１，２に塗られていたハンタペース１〜１５を溶融
してはんだ付けをする。本実施例によれば、手作業に比
較してフレキシブル回路基板のはんだ付けが能率的、か
つ、精度良く行なわれる。Next 5. Laser light enters through the irradiation hole 14 to melt and solder the hunter pastes 1 to 15 previously applied to the lower substrates 1 and 2. According to this embodiment, soldering of a flexible circuit board can be performed more efficiently and accurately than when soldering is done manually.

〔発明の効果〕〔Effect of the invention〕

発明によれば、はんだ付けの品質かはんだの自動化によ
り、高効率、品質の安定性が確保できるようになった。According to the invention, high efficiency and quality stability can be ensured by improving the quality of soldering or by automating soldering.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の全体構成図、第２図、第３
図は本発明によるレーザ照射ヘッド断面図、第４図は従
来技術を示す図である。 １・・プリント親基板、７・・・小形子基板、８・・・
フレキシブル回路基板、９・・・レーザ照射ヘラ１（，
１３・光ファイバー、１６・・・真空引用チューブ、１
２・・・光フアイバーケーブル、１１・・・光分岐器、
ｌＯ・・・レーザ発振器。Figure 1 is an overall configuration diagram of an embodiment of the present invention, Figures 2 and 3.
The figure is a sectional view of a laser irradiation head according to the present invention, and FIG. 4 is a diagram showing a conventional technique. 1...Printed main board, 7...Small child board, 8...
Flexible circuit board, 9...Laser irradiation spatula 1 (,
13. Optical fiber, 16... Vacuum quotation tube, 1
2... Optical fiber cable, 11... Optical splitter,
lO...Laser oscillator.

Claims (1)

【特許請求の範囲】 １、レーザはんだ付け装置において、 吸着部の先端に角度を持った凹みをつけて、フレキシブ
ル回路基板の移載及びはんだ付け部への位置決めを容易
にしたことを特徴とするフレキシブル回路基板用レーザ
はんだ付け装置。[Claims] 1. A laser soldering device, characterized in that an angled recess is formed at the tip of the suction part to facilitate the transfer and positioning of the flexible circuit board to the soldering part. Laser soldering equipment for flexible circuit boards.
JP6070985A 1985-03-27 1985-03-27 Laser soldering device for flexible circuit board Pending JPS61219467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6070985A JPS61219467A (en) 1985-03-27 1985-03-27 Laser soldering device for flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6070985A JPS61219467A (en) 1985-03-27 1985-03-27 Laser soldering device for flexible circuit board

Publications (1)

Publication Number Publication Date
JPS61219467A true JPS61219467A (en) 1986-09-29

Family

ID=13150083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6070985A Pending JPS61219467A (en) 1985-03-27 1985-03-27 Laser soldering device for flexible circuit board

Country Status (1)

Country Link
JP (1) JPS61219467A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04502126A (en) * 1988-11-02 1992-04-16 モトローラ・インコーポレイテッド How to form interconnections with solder
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
WO2000041834A1 (en) * 1999-01-18 2000-07-20 Pac Tech - Packaging Technologies Gmbh Method and device for thermally connecting the contact surfaces of two substrates
EP1186370A3 (en) * 2000-07-28 2003-11-26 Siemens Aktiengesellschaft Process and device for producing a laser weld joint

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04502126A (en) * 1988-11-02 1992-04-16 モトローラ・インコーポレイテッド How to form interconnections with solder
US5904868A (en) * 1994-06-16 1999-05-18 International Business Machines Corporation Mounting and/or removing of components using optical fiber tools
WO2000041834A1 (en) * 1999-01-18 2000-07-20 Pac Tech - Packaging Technologies Gmbh Method and device for thermally connecting the contact surfaces of two substrates
US6713714B1 (en) 1999-01-18 2004-03-30 Pac Tech-Packaging Technologies Gmbh Method and device for thermally connecting the contact surfaces of two substrates
EP1186370A3 (en) * 2000-07-28 2003-11-26 Siemens Aktiengesellschaft Process and device for producing a laser weld joint

Similar Documents

Publication Publication Date Title
US5055652A (en) Laser soldering of flexible leads
JP2009146979A (en) Photoelectric conversion device
JPS61219467A (en) Laser soldering device for flexible circuit board
JP3867284B2 (en) Method of forming solder bump
JP6932164B2 (en) How to paste electronic components
JP2008277438A (en) Electronic component, substrate, and method of manufacturing electronic component and substrate
JPS5854518B2 (en) Manufacturing method of hybrid integrated circuit
JPS62101097A (en) Mounting of radio frequency device
JPH026055A (en) Method of soldering printed circuit board and silicon chip
JP2000150771A (en) Electronic part, electrode surface treatment thereof and its device
JPH11204171A (en) Chip part
JP2628725B2 (en) Pattern forming method and brazing method
JPS6074493A (en) Method of producing printed circuit board
JP4503309B2 (en) Electronic component fixing method using relay board, relay board manufacturing method, and component mounting board provided with relay board
JPS62204591A (en) Method and apparatus for attaching electronic parts
JPS6258822B2 (en)
JPH05345406A (en) Pasty solder printing
JPH0225271A (en) Laser soldering device
JPS62137174A (en) Soldering method by laser
JPH01143393A (en) Method for soldering flat package type element to wiring board
JPH05283834A (en) Printed-circuit board and manufacture thereof
JPH0252495A (en) Method of mounting flat package ic
JPH05211390A (en) Mounting method of surface mounting part
JPH07297529A (en) Printed-circuit board and soldering method
JPH06177524A (en) Solder feeding sheet