JPS6213840B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for mounting microelectronic components onto an electronic circuit board.

Conventionally, leadless type microelectronic components (hereinafter referred to as chip components), such as chip resistors and chip-type multilayer ceramic capacitors, have been attached to substrates (hereinafter referred to as substrates) constituting electronic circuits. Apply adhesive or cream solder to the board in advance by screen printing, dispenser method, etc., then temporarily attach the chip components to the specified locations on the board, and then solder the electrode parts of the chip components and the designated circuit locations on the board. A common method is to solder by immersing it in a tank. However, with this method, it is necessary to apply adhesive or cream solder to predetermined locations in advance, and a coating device such as a scriwer printing machine is required in a separate process from mounting the chip components. In addition, the process of applying adhesive materials such as adhesives and cream solder and the process of mounting chip components are separated, and there are problems such as the need to be careful in handling sticky boards between these processes. It was a lot.

The present invention aims to eliminate the above-mentioned conventional drawbacks and provide a rational method for mounting electronic components.

A detailed explanation will be given below based on the drawings. FIG. 1 shows an electronic component mounting apparatus for carrying out one implementation method of the present invention, and a transport device 4 capable of positioning and fixing a board 2 and a board 3 at predetermined positions is arranged on a main body 1 of the mounting apparatus. ing. Also, on the main body 1, there is a device that can move independently from the transport device 4 to any point on the XY orthogonal two coordinates on a horizontal plane and regulate its position.
An XY table 5 is provided. Reference numeral 6 denotes a chip component supply unit which is provided on the XY table 5 so as to be movable only in the X direction, and electronic component tapes of different types are arranged in the X direction. On the XY table 5, there is prepared a dispenser device 8 which can intermittently supply and apply a minute amount of adhesive 7 onto the substrate 2, which is arranged at predetermined intervals in the X direction, and a chip component supply section 6. A mounting device 10 for picking up the chip components 9 and mounting them on the board 3 is fixed. The relative positions of the dispenser mounting 8 and the mounting device 10 on the XY table 5 correspond to the relative positions of the substrates 2 and 3 positioned on the transport device 4, that is, the dispenser device 6 on the substrate 2 The adhesive 7 always corresponds to the mounting position of the chip component 8 on the substrate 3 by the mounting device 9.

Next, the principle of the mounting method of the present invention will be explained based on FIGS. 2 and 3. Second
In the figures and FIG. 3, for convenience of explanation, the XY table is shown at the top, and the dispenser device fixed to the table is shown at the bottom. In the figure, the dispenser device 100 and the mounting device 101 always maintain the relative positions shown in the figure on the XY table 102, and first, the first substrate 103 is placed on the transfer device 104 on the side of the dispenser device 100. Fixed position. In this state, the XY table 102 is moved intermittently in the order of a predetermined program, and each time it moves, the dispenser device 100
A fixed amount of adhesive 105 is applied onto 03. After the application of the adhesive material 105 at multiple points is completed, the substrate 103 is moved to the mounting device 101 side as shown in FIG.
It is repositioned and fixed on the transport device 104 (at this time, the adhesive coated substrate 103 is fixed on the substrate 106
becomes. ).

Next, in FIG. 3, the dispenser device 10
A new substrate 103 is fixed on the 0 side, and the XY table 102 is moved again intermittently in the order of a predetermined program, and each time it is moved, a fixed amount of adhesive 10 is placed on the substrate 103 by the dispenser device 100.
Apply step 5. At the same time, this time glue 10
The mounting device 101 is placed on the coated substrate 106 of No. 5.
The chip component 107 is mounted by the following steps. By repeating the above operations, the adhesive 105 is attached to the substrate 103 by operating one XY table 102.
The coating and mounting of the chip component 107 onto the substrate 106 can be performed simultaneously and efficiently. After mounting the chip components, the board 106 is attached to the chip components 107 using a solder dip device outside the device, as in the conventional example.
The electrode portion of the board 106 is soldered to a predetermined part of the circuit of the board 106, and a completed board is obtained.

Next, other embodiments of the present invention will be described.
In FIG. 4, three substrates 201, 202, and 203 are positioned at predetermined positions on a conveying device 200, and a cream solder coating device 20 is attached to each substrate 201, 202, and 203, respectively.
4. Chip component mounting device 205, heating device 206
The XY table 207 on which the board 20 is placed is moved intermittently in the order of a predetermined program in the same way as in the embodiment shown in FIGS.
Applying cream solder to the board 202, mounting the chip component 208 to the board 202, and melting and fixing the solder to the board 203 by locally heating are performed simultaneously.

In this method, all the steps up to the finished board can be efficiently performed within the same device, so there is no need to perform soldering in a separate process, making it the most rational method.

Next, a fifth example of still another embodiment of the present invention will be described.
This will be explained with reference to FIG. In the case of this embodiment, unlike the embodiment shown in FIGS. 2 and 3, a dispenser device 300 and a chip component mounting device 301
are placed at a predetermined interval, but are not placed on the XY table and are fixed. Conversely, XY table 3
02 is located below the working position of the dispenser device 300 and the chip component mounting device 301, and the board 303 is placed thereon. FIG. 6 shows that in the position of the dispenser device 300, the same device 300
The adhesive material 304 is applied to the substrate 303 by the method, and at the same time, a chip component 305 is mounted on the adhesive material 304 applied by the chip component mounting device 301 at the position of the chip component mounting device 301.
Dispenser device 300 and mounting device 30
The relative movement between 1 and the substrate is exactly the same as the relationship shown in FIGS. This embodiment is advantageous in that it is not necessary to place both of the devices 300 and 301, which are relatively heavy, on the XY table, but the printed circuit board transport device and the XY table on which the printed circuit board is placed are The relationship becomes a little more complicated.

FIG. 7 shows still another embodiment of the present invention, and in this case, the relationship is the same as that between the embodiment of FIGS. 2 and 3 and the embodiment of FIGS. 5 and 6, and the embodiment of FIG. , dispenser device 400 and chip component mounting device 40
1 and the heating device 402 are fixed, and the printed circuit board 4
03, 404, and 405 are placed on the XY table 406, and relatively the same operation as in the embodiment shown in FIG. 4 is performed.

Although the effects of the present invention are clear from the above explanation, they can be summarized as follows.

(1) No special equipment such as a screen printing machine is required in the pre-process of the device.

(2) Since the adhesive coated substrate is handled only within the mounting device, preparation of the substrate is easy.

(3) It becomes possible to mount electronic components onto a board in high-speed succession within the same device, making it possible to realize a highly efficient device.

(4) It can be combined with an NC device, etc., and the position of the table can be changed arbitrarily, so by programming it, a flexible device can be realized.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus used in one method of implementing the present invention, FIGS. 2 and 3 are principle diagrams showing a method of implementing the present invention, and FIGS. 4 to 7 are diagrams of the present invention. It is a principle diagram showing another implementation method. 9,105,305...Parts, 2,3,10
3,104,201,202,203,303,
403,404,405...Substrate, 4,104,
200,302,406...Table, 7,10
5,208,304...Fixing material, 8,10
0,204,300,400...dispenser device, 10,101,205,301,401...
...Mounting device, 206,402...Fixing device.

Claims (1)

[Scope of Claims] 1. A dispenser device that prepares at least two substrates on which components are to be mounted on a table while maintaining predetermined relative positions, and supplies a material for fixing the substrates and the components; A mounting device for mounting components onto the board is arranged in the same positional relationship as the relative positional relationship between the two boards, and a portion of the table and a portion consisting of the dispenser device and the mounting device are placed relative to each other. After the movement and one positioning operation, supply of fixing material to the board and mounting of components onto the board are performed separately and simultaneously for each of the two boards on the table, and this positioning is performed. By performing the operation multiple times to respectively supply the fixing material and mount the parts to a plurality of predetermined locations on the board, and then sequentially move the board from the position corresponding to the dispenser device to the mounting device,
A method of mounting electronic components that sequentially supplies fixing material and mounts components to the same position on a board. 2. Prepare at least three boards on which parts are to be mounted on a table while maintaining a predetermined relative positional relationship, and a dispenser device that supplies material for fixing the boards and parts, and mounting the parts to the boards. A mounting device for fixing the fixing material and a fixing device for the fixing material that is fixed by heating etc. are arranged in the same positional relationship as the relative positional relationship between the three substrates. The device and the fixing device are relatively moved, and after one positioning operation, the fixing material is supplied to the board, the parts are mounted on the board, and the fixing material is fixed as described above. This is done separately and simultaneously for each of the three boards on the table, and this positioning operation is performed multiple times to supply fixing materials to multiple predetermined locations on each board, attach parts, and fix the parts. After fixing the material, the substrates are sequentially placed from the position corresponding to the dispenser device to the mounting device,
A method for mounting electronic components that sequentially supplies a fixing material to a plurality of the same positions on the same board, mounts the components, and fixes the fixing materials by transferring the electronic components to a fixing device.