JPH0682914B2 - Adhesive attachment device for printed circuit boards - Google Patents
Adhesive attachment device for printed circuit boardsInfo
- Publication number
- JPH0682914B2 JPH0682914B2 JP63294438A JP29443888A JPH0682914B2 JP H0682914 B2 JPH0682914 B2 JP H0682914B2 JP 63294438 A JP63294438 A JP 63294438A JP 29443888 A JP29443888 A JP 29443888A JP H0682914 B2 JPH0682914 B2 JP H0682914B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- adhesive
- dispenser
- mounting coordinate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、プリント基板に電子部品を仮付けするための
接着剤をプリント基板に付着せしめるための接着剤付着
装置に関する。Description: TECHNICAL FIELD The present invention relates to an adhesive application device for applying an adhesive for temporarily attaching an electronic component to a printed circuit board to the printed circuit board.
（発明の概要） 本発明は、プリント基板に電子部品を仮付けするための
接着剤をプリント基板に付着せしめるための接着剤付着
装置であって、接着剤の付着動作においても電子部品装
着のための座標をそのまま利用できる構成としたもので
ある。(Summary of the Invention) The present invention is an adhesive application device for attaching an adhesive for temporarily attaching an electronic component to a printed circuit board, and for mounting an electronic component in the adhesive attaching operation. The coordinates can be used as they are.
（従来の技術） 従来、プリント基板に接着剤を付着せしめるには、スク
リーン印刷機を用いるか、あるいはディスペンサー装置
を用いプリント基板をXYテーブルに載置してNC制御で座
標を決めて一箇所毎に接着剤を付着させる方法が一般的
に行なわれている。プログラムの変更で異なるプリント
基板にも速やかに対応できることから後者の方法が普及
している。また、プリント基板を固定してディスペンサ
ー装置の方を移動可能にして座標を決める場合もある。
さらに、特公昭62-13840号のように、２枚のプリント基
板を同一XYテーブル上に載置し、一方のプリント基板上
では電子部品の装着を行うと同時に他方のプリント基板
上ではディスペンサー装置で接着剤の付着動作を実行す
る構成も提案されている。(Prior Art) Conventionally, in order to attach an adhesive to a printed circuit board, a screen printing machine is used, or a dispenser device is used to place the printed circuit board on an XY table and the coordinates are determined by NC control to determine each position. A method of attaching an adhesive to the is generally used. The latter method is popular because it can respond to different printed circuit boards quickly by changing the program. Further, the coordinates may be determined by fixing the printed circuit board and making the dispenser device movable.
Furthermore, as in Japanese Examined Patent Publication No. 62-13840, two printed circuit boards are placed on the same XY table, and electronic parts are mounted on one printed circuit board while the other printed circuit board is mounted by a dispenser device. A configuration has also been proposed in which an adhesive attaching operation is performed.
（発明が解決しようとする課題） ところで、１個の電子部品を仮固定するための接着剤の
付着点数は、電子部品の固定をより確実にするために、
複数点数にすることが要望されている。そのためには、
ディスペンサー装置の接着剤吐出口を複数にするか、１
個の電子部品に対して複数の付着点の座標を決めるよう
にプリント基板（又はディスペンサー装置）を移動させ
るXYテーブルを制御して１点づつ付着させて行く必要が
ある。(Problems to be Solved by the Invention) By the way, the number of adhesion points of an adhesive for temporarily fixing one electronic component is set in order to more securely fix the electronic component.
It is required to have multiple points. for that purpose,
There are multiple adhesive outlets on the dispenser device, or 1
It is necessary to control the XY table that moves the printed circuit board (or the dispenser device) so as to determine the coordinates of a plurality of attachment points for each electronic component, and attach them one by one.
一方、電子部品の種類や形状は増える傾向にあり、１個
の部品に最適な接着剤の付着間隔や付着点数は多種多様
になる。従って、ディスペンサー装置の接着剤吐出口を
複数にする場合は異なる吐出口を多数用意する必要があ
り（一般に吐出口だけを多数にして切り換えることは難
しく、接着剤を収容したシリンジに１組の吐出口を付け
たものを複数用意する）、更にそれらの吐出口を切り換
える機構を必要とし、その機構も複雑になるため、多様
な付着間隔についての対応に限界がある。On the other hand, the types and shapes of electronic components tend to increase, and the optimum adhesive attachment intervals and attachment points for a single component will vary. Therefore, it is necessary to prepare a large number of different ejection ports when there are a plurality of adhesive ejection ports of the dispenser device (it is generally difficult to switch only a large number of ejection ports, and it is difficult to switch one ejection port to a syringe containing adhesive). A plurality of outlets are provided), and a mechanism for switching those outlets is required, and the mechanism becomes complicated, so there is a limit in dealing with various adhesion intervals.
また付着点の座標を決めながら１点づつ付着させる方法
においては、ディスペンサー装置に複数種の吐出口を用
意する必要がない代わりに、電子部品装着のための座標
をそのまま使うことができず、専用の座標入力を必要と
する。In addition, in the method of adhering one by one while deciding the coordinates of the adhering points, it is not necessary to prepare plural kinds of ejection ports in the dispenser device, but the coordinates for mounting the electronic parts cannot be used as they are, Requires input of coordinates.
本発明は、以上の問題点を解決して、プリント基板への
電子部品装着座標をそのまま使うことが可能で、任意の
接着剤付着間隔及び付着点数を選ぶことが可能なプリン
ト基板への接着剤付着装置を提供することを目的とす
る。The present invention solves the above problems and allows the electronic component mounting coordinates on the printed circuit board to be used as it is, and the adhesive for the printed circuit board can be selected with arbitrary adhesive adhesion intervals and adhesion points. An object is to provide an attachment device.
（課題を解決するための手段） 上記目的を達成するために、本発明は、プリント基板を
支持する基板支持手段と、当該プリント基板に接着剤を
付着させるディスペンサー部と備えたプリント基板への
接着剤付着装置において、前記プリント基板と前記ディ
スペンサー部との相対位置を変化させる装着座標位置決
め手段を設けるとともに、該装着座標位置決め手段で決
められた前記プリント基板上の装着座標位置を基準とし
て前記ディスペンサー部を移動させる付着点位置決め手
段を設け、 前記装着座標位置決め手段による前記装着座標位置の１
回の位置決めに対して当該装着座標位置を基準として前
記付着点位置決め手段で決められる任意の位置に任意の
点数、前記プリント基板への接着剤の付着動作を実行す
る構成としている。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a substrate supporting means for supporting a printed circuit board, and a dispenser section for adhering an adhesive to the printed circuit board. In the agent adhering device, mounting coordinate positioning means for changing the relative position of the printed board and the dispenser section is provided, and the dispenser section is based on the mounting coordinate position on the printed board determined by the mounting coordinate positioning means. And a mounting point positioning means for moving the mounting coordinate position by the mounting coordinate positioning means.
With respect to the one-time positioning, the attachment operation of the adhesive to the printed circuit board is performed at an arbitrary position determined by the attachment point positioning means with reference to the mounting coordinate position.
（作用） 本発明のプリント基板への接着剤付着装置においては、
プリント基板とディスペンサー部との相対位置を装着座
標位置決め手段で変化させてプリント基板上の電子部品
装着座標位置に前記ディスペンサー部の原点位置が来る
ようにし、前記装着座標位置を基準とし当該装着座標位
置と接着剤付着点間の位置ずれに対応させてさらに前記
プリント基板とディスペンサー部との相対位置を付着点
位置決め手段で変化させるようにしている。この結果、
プリント基板への電子部品装着座標をそのまま使用して
前記装着座標位置決め手段を制御でき、前記付着点位置
決め手段の動きを接着剤の付着点間隔や点数に応じて制
御することにより任意の付着点間隔及び点数に対応でき
る。さらに、複数枚のプリント基板に対応させて複数個
のディスペンサー部を設けて各プリント基板に同時に接
着剤付着動作を行うことにより接着剤付着速度の高速化
を図ることができる。(Operation) In the adhesive adhering device to the printed circuit board of the present invention,
The relative position between the printed circuit board and the dispenser unit is changed by the mounting coordinate positioning means so that the origin position of the dispenser unit comes to the electronic component mounting coordinate position on the printed circuit board, and the mounting coordinate position is used as a reference. Further, the relative position between the printed circuit board and the dispenser portion is changed by the attachment point positioning means in response to the positional deviation between the adhesive attachment points. As a result,
The mounting coordinate positioning means can be controlled by using the mounting coordinates of the electronic component on the printed circuit board as it is, and the attachment point positioning means can be controlled in accordance with the attachment point spacing and the number of points of the adhesive to set an arbitrary attachment point spacing. And can correspond to the points. Further, by providing a plurality of dispenser units corresponding to a plurality of printed circuit boards and simultaneously performing an adhesive applying operation on each printed circuit board, it is possible to speed up the adhesive applying speed.
（実施例） 以下、本発明に係るプリント基板への接着剤付着装置の
実施例を図面に従って説明する。(Embodiment) An embodiment of an adhesive adhering device to a printed circuit board according to the present invention will be described below with reference to the drawings.
第１図は本発明の第１実施例を示す。この図において
は、１は本体架台上に設置されたXYテーブルであり、こ
のXYテーブル１上に２枚のプリント基板2A,2Bが載置、
固定されている。また、本体架台の一部で構成される固
定ベース３の下面にはXYテーブル4A,4Bの固定部がそれ
ぞれ取り付け固定され、各XYテーブル4A,4Bの可動部に
それぞれディスペンサー部5A,5Bが昇降自在に取り付け
られている。各ディスペンサー部は接着剤を収容した接
着剤収容シリンジ６の下端に吐出口７を設けた構造であ
り、吐出口７の下降時にプリント基板上に接着剤を付着
させる機能を備えている。FIG. 1 shows a first embodiment of the present invention. In this figure, reference numeral 1 is an XY table installed on the main frame, and two printed circuit boards 2A and 2B are placed on the XY table 1.
It is fixed. Further, the fixed parts of the XY tables 4A and 4B are attached and fixed to the lower surface of the fixed base 3 which is a part of the main body stand, and the dispenser parts 5A and 5B are moved up and down to the movable parts of the XY tables 4A and 4B, respectively. It is attached freely. Each dispenser portion has a structure in which the ejection port 7 is provided at the lower end of the adhesive-accommodating syringe 6 that accommodates the adhesive, and has a function of adhering the adhesive on the printed circuit board when the ejection port 7 descends.
ここで、ディスペンサー部5Aは、プリント基板2Aに対応
して設けられ、ディスペンサー部5Bはプリント基板2Bに
対応して設けられているものである。また、XYテーブル
4A,4Bは各々のテーブル中心を移動の基準点（ディスペ
ンサー部の原点位置）としており、XYテーブル4A,4Bの
基準点の位置と間隔に対して相対的に同じ位置関係を保
ってプリント基板2A,2Bが載置されている。前記XYテー
ブル１はプリント基板2A,2Bとディスペンサー部5A,5Bと
の相対位置を変化させる装着座標位置決め手段として働
く。また、XYテーブル4A,4Bはプリント基板上の電子部
品装着座標位置を基準にして移動する付着点位置決め手
段として働き、XYテーブル4Aはディスペンサー部5Aに対
応させて設けられたものであり、XYテーブル4Bはディス
ペンサー部5Bに対応させて設けられたものである。Here, the dispenser portion 5A is provided corresponding to the printed circuit board 2A, and the dispenser portion 5B is provided corresponding to the printed circuit board 2B. Also, XY table
4A and 4B use the center of each table as the reference point of movement (origin position of the dispenser part), and the printed circuit board 2A keeps the same positional relationship relative to the reference point position and spacing of the XY tables 4A and 4B. , 2B are placed. The XY table 1 functions as mounting coordinate positioning means for changing the relative positions of the printed boards 2A, 2B and the dispenser parts 5A, 5B. Further, the XY tables 4A and 4B act as attachment point positioning means that move based on the electronic component mounting coordinate position on the printed circuit board, and the XY table 4A is provided corresponding to the dispenser section 5A. 4B is provided corresponding to the dispenser section 5B.
以上の第１実施例の構成の動作を第２図（Ａ）の接着剤
付着点が２点の場合で説明する。第２図中、10はプリン
ト基板上の接続ランドであり、両接続ランド間の中心０
が電子部品装着座標位置となり、付着点P1,P2は中心Ｏ
をはさんで等距離D/2の位置で例えばＸ軸方向の直線上
にあるものとする。P1,P2間の距離はＤである。The operation of the configuration of the first embodiment described above will be described in the case where there are two adhesive attachment points in FIG. In FIG. 2, 10 is a connection land on the printed circuit board, and the center 0 between both connection lands is 0.
Is the electronic component mounting coordinate position, and the attachment points P 1 and P 2 are the center O
It is assumed that they are on a straight line in the X-axis direction at a position of equidistant distance D / 2 across. The distance between P 1 and P 2 is D.
まず、第２図（Ａ）の中心Ｏの座標を決める移動をXYテ
ーブル１で行い、電子部品装着座標のプログラムは中心
Ｏの座標を指示する。このXYテーブル１でプリント基板
2A,2Bの位置を変化させることによって、XYテーブル4A,
4Bの基準点（ディスペンサー部5A,5Bの原点位置）を電
子部品装着座標位置である第２図（Ａ）の中心Ｏに一致
させる。この動作は、今までの装着座標プログラムと同
一プログラムで２枚のプリント基板に対して同時に実行
できる。First, the movement for determining the coordinates of the center O in FIG. 2A is performed on the XY table 1, and the electronic component mounting coordinate program designates the coordinates of the center O. Printed circuit board with this XY table 1
By changing the position of 2A, 2B, XY table 4A,
The reference point of 4B (the origin position of the dispenser parts 5A, 5B) is made to coincide with the center O of FIG. 2 (A) which is the electronic component mounting coordinate position. This operation can be simultaneously executed on two printed circuit boards by the same program as the mounting coordinate program up to now.
上記のXYテーブル１の動作とともに、XYテーブル4A,4B
に対して付着点P1,P2の座標、付着点間隔Ｄ及び付着点
の配列方向（第２図（Ａ）の場合はＸ軸方向）を装着座
標プログラムとは別のプログラムで指示し、XYテーブル
4AはＸ軸方向に＋D/2だけディスペンサー部5Aを移動さ
せ、XYテーブル4Bは−D/2だけディスペンサー部5Bを移
動させ、ディスペンサー部5Aの吐出口７を付着点P1に、
ディスペンサー部5Bの吐出口７を付着点P2にそれぞれ一
致させて各ディスペンサー部の下降によってプリント基
板2A上の付着点P1及びプリント基板2B上の付着点P2に接
続剤を付着せしめる。プリント基板2Aは次工程において
プリント基板2Bの位置に移送して付着点P2への接着剤の
付着を行うことによって１個の電子部品装着座標位置に
ついての２つの付着点への接着剤塗布が完了する。Along with the operation of XY table 1 above, XY tables 4A and 4B
, The coordinates of the attachment points P 1 and P 2 , the attachment point interval D, and the arrangement direction of the attachment points (X-axis direction in the case of FIG. 2A) are designated by a program different from the mounting coordinate program, XY table
4A moves the dispenser part 5A by + D / 2 in the X-axis direction, and the XY table 4B moves the dispenser part 5B by -D / 2, and the discharge port 7 of the dispenser part 5A is attached to the attachment point P 1 .
Allowed to adhere a connection agent to the attachment point P 2 on the dispenser portion 5B of the discharge port 7 of the attachment point P attachment points on the printed circuit board 2A by descending the two respective to match the in each dispenser unit P 1 and the printed board 2B. In the next step, the printed circuit board 2A is moved to the position of the printed circuit board 2B and the adhesive is applied to the adhesion point P 2 , so that the adhesive can be applied to the two adhesion points at one electronic component mounting coordinate position. Complete.
第２図（Ｂ）の付着点配置の場合には、XYテーブル１を
第２図（Ａ）の場合と同様に動作させるとともに、XYテ
ーブル4A,4Bに対して付着点P3,P4の座標、付着点間隔Ｄ
及び付着点の配列方向（第２図（Ｂ）の場合はＹ軸方
向）を装着座標プログラムとは別のプログラムで指示
し、XYテーブル4AはＹ軸方向に＋D/2だけディスペンサ
ー部5Aを移動させ、XYテーブル4Bは−D/2だけディスペ
ンサー部5Bを移動させ、ディスペンサー部5Aの吐出口７
を付着点P3に、ディスペンサー部5Bの吐出口７を付着点
P4にそれぞれ一致させて各ディスペンサー部の下降によ
ってプリント基板2A上の付着点P3及びプリント基板2B上
の付着点P4に接着剤を付着せしめる。In the case of the attachment point arrangement of FIG. 2 (B), the XY table 1 is operated in the same manner as in the case of FIG. 2 (A), and the attachment points P 3 and P 4 of the XY tables 4A and 4B are set. Coordinates, attachment point spacing D
And the arrangement direction of the attachment points (Y axis direction in the case of FIG. 2B) is specified by a program different from the mounting coordinate program, and the XY table 4A moves the dispenser unit 5A by + D / 2 in the Y axis direction. Then, the XY table 4B moves the dispenser portion 5B by -D / 2, and the dispenser portion 5A discharge port 7
To the attachment point P 3 and the discharge port 7 of the dispenser portion 5B to the attachment point
The adhesive is applied to the attachment point P 3 on the printed board 2A and the attachment point P 4 on the printed board 2B by lowering the respective dispenser parts so as to match P 4 respectively.
上記第１実施例によれば、電子部品装着座標プログラム
をそのまま利用でき、しかも１個の装着座標位置につい
ての２つの付着点に対応させて２個のディスペンサー部
を設けており、接着剤付着動作の所要時間を短縮（１点
付けの場合と同じに）することができる。According to the first embodiment, the electronic component mounting coordinate program can be used as it is, and further, two dispenser units are provided corresponding to two attaching points for one mounting coordinate position, and the adhesive attaching operation is performed. It is possible to shorten the required time (as in the case of one point).
第３図は本発明の第２実施例を示す。この図において、
XYテーブル１の固定部は本体架台の一部で構成される固
定ベース３の下面に固定され、XYテーブル１の可動部下
面にはXYテーブル4A,4Bの固定部がそれぞれ取り付け固
定され、各XYテーブル4A,4Bの可動部にそれぞれディス
ペンサー部5A,5Bが昇降自在に取り付けられている。一
方、２枚のプリント基板2A,2Bは本体架台上の基板支持
手段（単なるテーブル等）９で固定的に保持されてい
る。この場合もXYテーブル4A,4Bの基準点の位置と間隔
に対して相対的に同じ位置関係を保ってプリント基板2
A,2Bが支持され、前記XYテーブル１はプリント基板2A,2
Bとディスペンサー部5A,5Bとの相対位置を変化させる装
着座標位置決め手段として働く。また、XYテーブル4A,4
Bはプリント基板上の電子部品装着座標位置を基準にし
て移動する付着点位置決め手段として働く。なお、その
他の構成及び接着剤の付着動作は前述の第１実施例と実
質的に同様である。FIG. 3 shows a second embodiment of the present invention. In this figure,
The fixed part of the XY table 1 is fixed to the lower surface of the fixed base 3 which is a part of the main frame, and the fixed parts of the XY tables 4A and 4B are attached and fixed to the lower surface of the movable part of the XY table 1, respectively. Dispenser parts 5A and 5B are attached to the movable parts of the tables 4A and 4B so as to be vertically movable. On the other hand, the two printed boards 2A and 2B are fixedly held by board supporting means (simple table or the like) 9 on the main frame. In this case as well, the printed circuit board 2 maintains the same relative positional relationship with respect to the positions and intervals of the reference points of the XY tables 4A and 4B.
A and 2B are supported, and the XY table 1 is a printed circuit board 2A and 2B.
It functions as a mounting coordinate positioning means for changing the relative position between B and the dispenser parts 5A, 5B. Also, XY table 4A, 4
B functions as an attachment point positioning unit that moves based on the electronic component mounting coordinate position on the printed circuit board. The rest of the configuration and the adhesive attaching operation are substantially the same as those in the first embodiment.
第４図は本発明の第３実施例を示す。この図において、
本体架台上に設置されたXYテーブル１上に３枚のプリン
ト基板2A,2B,2Cが載置、固定されている。また、本体架
台の一部で構成される固定ベース３の下面にはXYテーブ
ル4A,4Bの固定部がそれぞれ取り付け固定され、各XYテ
ーブル4A,4Bの可動部にそれぞれディスペンサー部5A,5B
が昇降自在に取り付けられている。また、固定べース３
の下面には電子部品をプリント基板2C上に装着するため
の装着ヘッド部20が固定されている。ここで、XYテーブ
ル4A,4Bの基準点及び装着ヘッド部20の位置と間隔に対
して相対的に同じ位置関係を保ってプリント基板2A,2B,
2Cが載置されている。なお、その他の構成は前述の第１
実施例と同様である。FIG. 4 shows a third embodiment of the present invention. In this figure,
Three printed circuit boards 2A, 2B, 2C are placed and fixed on an XY table 1 installed on the main frame. In addition, the fixed parts of the XY tables 4A and 4B are attached and fixed to the lower surface of the fixed base 3 which is a part of the main frame, and the dispenser parts 5A and 5B are respectively attached to the movable parts of the XY tables 4A and 4B.
Is attached so that it can be raised and lowered. Also, fixed base 3
A mounting head unit 20 for mounting an electronic component on the printed circuit board 2C is fixed to the lower surface of the. Here, the printed boards 2A, 2B, while maintaining the same positional relationship relative to the reference point of the XY tables 4A, 4B and the position and spacing of the mounting head unit 20.
2C is placed. The other configurations are the same as those of the first
It is similar to the embodiment.
この第３実施例の場合も、XYテーブル１は電子部品装着
座標プログラムで制御され、XYテーブル4A,4Bの基準点
（ディスペンサー部5A,5Bの原点位置）を電子部品装着
座標位置に一致させたとき、装着ヘッド部20の位置とプ
リント基板2C上の電子部品装着座標位置も一致すること
になり、XYテーブル１を電子部品装着にも共用できるこ
とがわかる。Also in this third embodiment, the XY table 1 is controlled by the electronic component mounting coordinate program, and the reference points of the XY tables 4A and 4B (the origin positions of the dispenser units 5A and 5B) are made to coincide with the electronic component mounting coordinate positions. At this time, the position of the mounting head unit 20 and the electronic component mounting coordinate position on the printed circuit board 2C also match, and it can be seen that the XY table 1 can also be used for mounting electronic components.
上記第１乃至第３実施例では、XYテーブル4A,4Bをプリ
ント基板上の電子部品装着座標位置を基準にして移動す
る付着点位置決め手段として採用したが、第５図のよう
に前記ディスペンサー部5A又は5Bを搭載して回転及び偏
心動作を行う付着点位置決め手段を用いても良い。第５
図において、30は方向変換モータであり、該モータ30の
回転軸の下端に旋回枠31が固定されている。この旋回枠
31には螺旋軸32が回転自在に支持され、該螺旋軸32に取
付板33が螺合されている。取付板33には接着剤収容シリ
ンジ６の下端に吐出口７を設けたディスペンサー部5A又
は5Bが昇降自在に取り付けられている。前記旋回枠31に
は前記螺旋軸32を回転駆動して前記取付板33、すなわち
吐出口７を偏心さるための偏心用モータ33が取り付けら
れている。この第５図の付着点位置決め手段は本体架台
の固定ベースに方向変換モータ30の本体部を固定するこ
とにより取り付けることができ、旋回枠31の回転中心が
基準点となる。従って、第２図（Ａ），（Ｂ）に示す付
着点P1乃至P4等に接着剤を付着させる場合、基準点を中
心Ｏに一致させ、さらに旋回枠31の旋回方向及び吐出口
７の基準点に対する偏心量を加減することにより対応で
きる。In the above-mentioned first to third embodiments, the XY tables 4A and 4B are adopted as the attachment point positioning means which moves with reference to the electronic component mounting coordinate position on the printed circuit board, but as shown in FIG. Alternatively, an attachment point positioning means that carries 5B and performs rotation and eccentricity may be used. Fifth
In the figure, 30 is a direction changing motor, and a revolving frame 31 is fixed to the lower end of the rotating shaft of the motor 30. This swivel frame
A spiral shaft 32 is rotatably supported by 31 and a mounting plate 33 is screwed onto the spiral shaft 32. A dispenser unit 5A or 5B provided with a discharge port 7 at the lower end of the adhesive containing syringe 6 is attached to the attachment plate 33 so as to be vertically movable. An eccentric motor 33 for rotatably driving the spiral shaft 32 to eccentric the mounting plate 33, that is, the discharge port 7, is mounted on the swivel frame 31. The attachment point positioning means of FIG. 5 can be attached by fixing the main body of the direction changing motor 30 to the fixed base of the main body stand, and the rotation center of the swivel frame 31 serves as a reference point. Therefore, when the adhesive is attached to the attachment points P 1 to P 4 and the like shown in FIGS. 2A and 2B, the reference point is made to coincide with the center O, and further, the turning direction of the turning frame 31 and the discharge port 7 are provided. This can be dealt with by adjusting the amount of eccentricity with respect to the reference point.
第６図は付着点位置決め手段の他の具体例であり、とく
に１つの装着座標位置に対する接着剤の付着点が２点で
ある場合に適した構造である。この図において、方向変
換モータ30の回転軸の下端に旋回取付板35が固定され、
この旋回取付板35には接着剤収容シリンジ６の下端に吐
出口７を設けたディスペンサー部5A又は5Bが昇降自在に
取り付けられている。２つの付着点の間隔がＤの場合、
吐出口７の回転中心Ｑに対する偏心量はD/2に設定す
る。FIG. 6 shows another specific example of the attachment point positioning means, which has a structure suitable especially when there are two attachment points of the adhesive for one mounting coordinate position. In this figure, the turning mounting plate 35 is fixed to the lower end of the rotating shaft of the direction changing motor 30,
A dispenser unit 5A or 5B provided with a discharge port 7 at the lower end of the adhesive containing syringe 6 is attached to the swivel mounting plate 35 so as to be able to move up and down. If the distance between the two attachment points is D,
The eccentric amount of the discharge port 7 with respect to the rotation center Q is set to D / 2.
第６図の付着点位置決め手段によれば、２点付けの場合
に２点の付着点の配列方向のみを指定すればよく、しか
も構造も簡単である。According to the attachment point positioning means of FIG. 6, in the case of two-point attachment, only the arrangement direction of the two attachment points needs to be designated, and the structure is simple.
なお、第２図では付着点P1,P3はディスペンサー部5A
で、付着点P2,P4はディスペンサー部5Bで接着剤塗布動
作を実行したが、その逆でも良い。また、付着点がＸ軸
又はＹ軸方向上に配列されている必要はなく、任意の方
向の直線上であつても差し支え無い。また、中心Ｏに対
して付着点が対称配置でなくとも良く、この場合には付
着点の座標をプログラムで入力してやれば良い。In FIG. 2, the attachment points P 1 and P 3 are the dispenser portion 5A.
Then, although the adhesive applying operation is executed by the dispenser portion 5B at the adhesion points P 2 and P 4 , the reverse operation may be performed. Further, the attachment points do not have to be arranged on the X-axis or Y-axis direction, and may be on a straight line in any direction. Further, the attachment points do not have to be symmetrically arranged with respect to the center O. In this case, the coordinates of the attachment points may be input by a program.
上記各実施例では、１つの電子部品装着座標位置に対し
て２点の接着剤付着点を持つ場合で説明したが、３点以
上の付着点の場合にも本発明は適用可能である。この場
合には、付着点数に応じたディスペンサー部及びこれが
搭載される同数のXYテーブル（又は第５図の如き他の付
着点位置決め手段）を設け、またディスペンサー部と同
数のプリント基板をそれぞれ対応位置に支持するように
すれば良い。このように、付着点の点数に対応させてデ
ィスペンサー部やプリント基板を設けることにより、付
着点数の増減にかかわらず同一所要時間で作業を完了す
ることができる。In each of the above-described embodiments, the case where two adhesive attachment points are provided for one electronic component mounting coordinate position has been described, but the present invention is also applicable to the case where there are three or more attachment points. In this case, a dispenser unit corresponding to the number of attachment points and the same number of XY tables (or other attachment point positioning means as shown in FIG. 5) on which the dispenser units are mounted are provided, and the same number of printed circuit boards as the dispenser unit are respectively provided at corresponding positions. You should support it. In this way, by providing the dispenser section and the printed circuit board in correspondence with the number of adhesion points, the work can be completed in the same required time regardless of the increase or decrease in the number of adhesion points.
前記ディスペンサー部の吐出口７は１個の場合だけでな
く、複数にして、それらの組み合わせて１つの電子部品
装着座標位置に対する接着剤付着点を形成することもで
きる。とくにFICを複数点の接着剤で仮止めする場合に
適する。The number of the discharge port 7 of the dispenser unit is not limited to one, but a plurality of discharge ports may be combined to form an adhesive attachment point for one electronic component mounting coordinate position. It is especially suitable for temporarily fixing the FIC with adhesive at multiple points.
接着剤付着所要時間が増えるのを気にしなければ、１回
の装着座標の位置決めでXYテーブル4A,4Bの移動を複数
回行い、複数回塗布して多点数の塗布をすることも可能
である。If you do not mind that the time required for adhesive attachment increases, it is also possible to move the XY tables 4A and 4B multiple times by positioning the mounting coordinates once, and apply multiple times to apply multiple points. .
付着点位置決め手段としてのXYテーブル4A,4Bや第５図
の構成では、接着剤の付着方向、付着間隔を任意に連続
的に設定できるが、付着方向や付着間隔を間欠的に特定
の設定を行う構成としても良い。この場合には、NC制御
のモータに代えてエアーシリンダとか機械的なリンク機
構等を採用して安価に構成できる。In the XY tables 4A and 4B as the adhesion point positioning means and the configuration of FIG. 5, the adhesion direction and the adhesion interval of the adhesive can be continuously set arbitrarily, but the adhesion direction and the adhesion interval are intermittently set to a specific setting. It may be configured to perform. In this case, an air cylinder, a mechanical link mechanism, or the like may be adopted instead of the NC-controlled motor, so that the configuration can be inexpensive.
上記の各実施例では、電子部品１個をプリント基板に装
着するのに必要な接着剤付着点数に応じたディスペンサ
ー部を用意して、電子部品１個についての装着座標の１
回の位置決めで、１度の接着剤付着作業を複数のプリン
ト基板に同時に実施することを中心に説明したが、１個
のディスペンサー部及び１個の付着点位置決め用XYテー
ブルを用いた構成でも、付着点数に応じて接着剤塗布時
間が増減することを認めるのなら多点付けが可能であ
る。この場合もプリント基板の装着座標は装着プログラ
ムと同一であり、１個の電子部品に対する付着点数や付
着点配置に影響されない利点がある。In each of the above-described embodiments, a dispenser unit corresponding to the number of adhesive attachment points required to mount one electronic component on the printed circuit board is prepared, and the mounting coordinate of one electronic component is set to 1
The explanation was centered on performing one adhesive attachment operation on multiple printed boards at the same time by positioning once, but even with a configuration using one dispenser unit and one attachment point positioning XY table, If it is recognized that the adhesive application time increases or decreases depending on the number of adhesion points, multiple points can be applied. In this case as well, the mounting coordinates of the printed circuit board are the same as the mounting program, and there is an advantage that the number of attachment points and the arrangement of attachment points for one electronic component are not affected.
なお、接着剤としてクリームはんだを採用しても同様に
使用可能なことが本発明の実験により確認されている。It has been confirmed by experiments of the present invention that the same use can be made even if cream solder is used as the adhesive.
（発明の効果） 以上説明したように、本発明のプリント基板への接着剤
付着装置によれば、プリント基板への電子部品装着座標
をそのまま使うことができ、任意の接着剤付着間隔及び
付着点数を選ぶことが可能で、ひいては多種多様な電子
部品の装着に対応可能な効果がある。(Effects of the Invention) As described above, according to the adhesive adhering device for a printed circuit board of the present invention, the electronic component mounting coordinates on the printed circuit board can be used as they are, and any adhesive adhering interval and number of adhering points can be used. It is possible to choose, which has the effect of being able to accommodate mounting of a wide variety of electronic components.
第１図は本発明に係るプリント基板への接着剤付着装置
の第１実施例を示す正面図、第２図は第１実施例の動作
説明図、第３図は本発明の第２実施例の正面図、第４図
は本発明の第３実施例の正面図、第５図は付着点位置決
め手段の具体例を示す斜視図、第６図は付着点位置決め
手段の他の具体例を示す斜視図である。 1,4A,4B…XYテーブル、2A,2B,2C…プリント基板、３…
固定ベース、5A,5B…ディスペンサー部、６…接着剤収
容シリンダ、７…吐出口、P1乃至P4…付着点。FIG. 1 is a front view showing a first embodiment of a device for adhering an adhesive to a printed circuit board according to the present invention, FIG. 2 is an operation explanatory view of the first embodiment, and FIG. 3 is a second embodiment of the present invention. 4 is a front view of a third embodiment of the present invention, FIG. 5 is a perspective view showing a specific example of the attachment point positioning means, and FIG. 6 is another example of the attachment point positioning means. It is a perspective view. 1,4A, 4B ... XY table, 2A, 2B, 2C ... Printed circuit board, 3 ...
Fixed base, 5A, 5B ... dispenser unit, 6 ... adhesive receiving cylinder, 7 ... discharge port, P 1 to P 4 ... attachment point.
Claims (7)
当該プリント基板に接着剤を付着させるディスペンサー
部とを備えたプリント基板への接着剤付着装置におい
て、 前記プリント基板と前記ディスペンサー部との相対位置
を変化させる装着座標位置決め手段を設けるとともに、
該装着座標位置決め手段で決められた前記プリント基板
上の装着座標位置を基準として前記ディスペンサー部を
移動させる付着点位置決め手段を設け、 前記装着座標位置決め手段による前記装着座標位置の１
回の位置決めに対して当該装着座標位置を基準として前
記付着点位置決め手段で決められる任意の位置に任意の
点数、前記プリント基板への接着剤の付着動作を実行す
ることを特徴とするプリント基板への接着剤付着装置。1. A substrate supporting means for supporting a printed circuit board,
In a device for adhering an adhesive to a printed circuit board, which comprises a dispenser section for adhering an adhesive to the printed circuit board, with mounting coordinate positioning means for changing a relative position between the printed circuit board and the dispenser section,
Adhesion point positioning means for moving the dispenser unit based on the mounting coordinate position on the printed board determined by the mounting coordinate positioning means is provided, and the mounting coordinate position by the mounting coordinate positioning means is set to 1
A printed circuit board characterized by executing an operation of attaching an adhesive to the printed circuit board at an arbitrary position determined by the adhesion point positioning means with reference to the mounting coordinate position for one-time positioning. Adhesive attachment device.
数枚支持する基板支持手段と、前記複数枚のプリント基
板の各々に対応して設けられていて各プリント基板に接
着剤を付着させる複数個のディスペンサー部とを備えた
プリント基板への接着剤付着装置において、 前記複数枚のプリント基板と前記複数個のディスペンサ
ー部との相対位置を変化させる装着座標位置決め手段を
設けるとともに、該装着座標位置決め手段で決められた
各プリント基板上の装着座標位置を基準として各ディス
ペンサー部を移動させる付着点位置決め手段を各々のデ
ィスペンサー部に対応させて設け、 前記装着座標位置決め手段による前記装着座標位置の１
回の位置決めに対して当該装着座標位置を基準として各
付着点位置決め手段で決められる任意の位置に任意の点
数、各プリント基板への接着剤の付着動作を実行するこ
とを特徴とするプリント基板への接着剤付着装置。2. A substrate supporting means for supporting a plurality of printed circuit boards while maintaining a predetermined relative position, and a plurality of substrate mounting means provided corresponding to each of the plurality of printed circuit boards for attaching an adhesive to each printed circuit board. In a device for adhering an adhesive to a printed circuit board, which includes a plurality of dispenser parts, a mounting coordinate positioning means for changing a relative position between the plurality of printed circuit boards and the plurality of dispenser parts is provided, and the mounting coordinate positioning is performed. Adhesion point positioning means for moving each dispenser section on the basis of the mounting coordinate position on each printed circuit board determined by the means is provided corresponding to each dispenser section, and one of the mounting coordinate positions by the mounting coordinate positioning means is provided.
To a printed circuit board characterized by executing an operation of attaching an adhesive to each printed circuit board at an arbitrary position determined by each adhesion point positioning means with reference to the mounting coordinate position for one-time positioning. Adhesive attachment device.
標位置を持ちかつ該装着座標位置を基準とした同一の接
着剤付着点を複数個持ち、個々のディスペンサー部は前
記複数個の接着剤付着点のうちの一部の付着点について
のみ接着剤の付着動作を行うが、前記複数個のディスペ
ンサー部全体では前記装着座標位置を基準とした複数個
の接着剤付着点全部について接着剤付着動作を行う請求
項２記載のプリント基板への接着剤付着装置。3. The plurality of printed circuit boards have the same mounting coordinate position and a plurality of the same adhesive attachment points with the mounting coordinate position as a reference, and each dispenser portion has the plurality of adhesives. The adhesive attaching operation is performed only for some of the attaching points, but the adhesive attaching operation is performed for all of the plurality of adhesive attaching points based on the mounting coordinate position in the plurality of dispenser sections as a whole. The adhesive adhering device to a printed circuit board according to claim 2, wherein
ンサー部を搭載したXYテーブルである請求項1,2又は３
記載のプリント基板への接着剤付着装置。4. The XY table in which the attachment point positioning means is equipped with the dispenser section.
Adhesive attachment device for printed circuit board according to the above.
ンサー部を搭載して回転及び偏心動作を行うものである
請求項1,2又は３記載のプリント基板への接着剤付着装
置。5. The adhesive adhering device for a printed circuit board according to claim 1, 2 or 3, wherein the adhering point positioning means is mounted with the dispenser section to perform rotation and eccentric operation.
がXYテーブルで構成され、該XYテーブルが電子部品のプ
リント基板への装着に共用されている請求項1,2又は３
記載のプリント基板への接着剤付着装置。6. The substrate supporting means for supporting the printed circuit board is constituted by an XY table, and the XY table is commonly used for mounting electronic components on the printed circuit board.
Adhesive attachment device for printed circuit board according to the above.
1,2又は３記載のプリント基板への接着剤付着装置。7. The adhesive is cream solder.
A device for attaching an adhesive to a printed circuit board according to 1, 2, or 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63294438A JPH0682914B2 (en) | 1988-11-21 | 1988-11-21 | Adhesive attachment device for printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63294438A JPH0682914B2 (en) | 1988-11-21 | 1988-11-21 | Adhesive attachment device for printed circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02140992A JPH02140992A (en) | 1990-05-30 |
| JPH0682914B2 true JPH0682914B2 (en) | 1994-10-19 |
Family
ID=17807774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63294438A Expired - Fee Related JPH0682914B2 (en) | 1988-11-21 | 1988-11-21 | Adhesive attachment device for printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682914B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003047899A (en) * | 2001-08-08 | 2003-02-18 | Shibaura Mechatronics Corp | Paste applying apparatus |
| JP6210835B2 (en) * | 2013-10-21 | 2017-10-11 | ヤマハ発動機株式会社 | Coating device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515270A (en) * | 1978-07-19 | 1980-02-02 | Matsushita Electric Ind Co Ltd | Method of attaching electronic part |
| JPS59152689A (en) * | 1983-02-18 | 1984-08-31 | 三洋電機株式会社 | Adhesive coating device for fastening chip-shaped electronicpart |
| JPH0785513B2 (en) * | 1984-06-22 | 1995-09-13 | 松下電器産業株式会社 | Adhesive application method |
| JPH0722238B2 (en) * | 1985-07-17 | 1995-03-08 | ソニー株式会社 | Electronic component automatic mounting device |
| JPS62133794A (en) * | 1985-12-06 | 1987-06-16 | 株式会社日立製作所 | Automatic article mounting apparatus |
| JPH0760959B2 (en) * | 1988-01-11 | 1995-06-28 | 三洋電機株式会社 | Assembly equipment for electronic components |
-
1988
- 1988-11-21 JP JP63294438A patent/JPH0682914B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02140992A (en) | 1990-05-30 |
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