JPH0354898A - Electronic component mounting device - Google Patents

Electronic component mounting device

Info

Publication number
JPH0354898A
JPH0354898A JP1190982A JP19098289A JPH0354898A JP H0354898 A JPH0354898 A JP H0354898A JP 1190982 A JP1190982 A JP 1190982A JP 19098289 A JP19098289 A JP 19098289A JP H0354898 A JPH0354898 A JP H0354898A
Authority
JP
Japan
Prior art keywords
component
movable
moving table
mounting
component supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1190982A
Other languages
Japanese (ja)
Other versions
JP2797484B2 (en
Inventor
Takahiro Yonezawa
隆弘 米澤
Masayuki Seno
瀬野 眞透
Wataru Hirai
弥 平井
Takeshi Okada
毅 岡田
Muneyoshi Fujiwara
宗良 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1190982A priority Critical patent/JP2797484B2/en
Publication of JPH0354898A publication Critical patent/JPH0354898A/en
Application granted granted Critical
Publication of JP2797484B2 publication Critical patent/JP2797484B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To accelerate a component supply unit by providing a second moving table movable in parallel on a first moving table movable in parallel. CONSTITUTION:A mounting component supplying unit 2 to a board 10 is mounted on a moving table 11a, and the board 10 is supported to a predetermined position by securing means 7 of a positioning unit. Components are sequentially held from a supplying position 1a by a head 5 of a unit 3, a table 4 is rotated, and moved to a mounting position 3a. A unit 6 moves the board 10 in X- and Y-directions, set to the position 3a, and the head 5 is mounted. The table 11a is driven by a ball screw and a nut or a rack and a pinion, and the table 11b is driven by a linear motor. When one table is roughly operated and the other is finely operated and composed of a position returning loop, its positioning accuracy is improved. With this structure, an increase in an inertia due to an increase in size of the moving table can be coped.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電子部品を吸着して回路基板に装着する場合
等に利用される部品実装装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a component mounting apparatus used for sucking electronic components and mounting them on a circuit board.

従来の技術 従来から、電子部品を回路基板に装着する電子部品装着
装置として、多数の電子部品を収容した部品供給ユニッ
トを複数並列させて移動テーブル上に設置するとともに
、この移動テーブルを部品供給ユニットの並列方向に移
動可能に構成することによって所定位置で任意の部品供
給ユニットに収容された電子部品を取り出せるようにし
、方、回路基板の電子部品を装着すべき位置が所定の位
置に来るように、供給された回路基板を位置決めする手
段を設け、前記所定の部品取り出し位置で電子部品を保
持して位置決めされた回路基板の所定位置に部品を装着
する部品装着手段を設けたものは良く知られている。
Conventional technology Conventionally, as an electronic component mounting apparatus for mounting electronic components onto a circuit board, a plurality of component supply units containing a large number of electronic components are arranged in parallel and installed on a movable table, and this movable table is used as a component supply unit. By configuring the parts to be movable in the parallel direction, it is possible to take out the electronic components housed in any component supply unit at a predetermined position, and the position on which the electronic components of the circuit board should be mounted is at a predetermined position. It is well known that a device is provided with a means for positioning a supplied circuit board, and a component mounting means for holding an electronic component at the predetermined component removal position and mounting the component at a predetermined position on the positioned circuit board. ing.

発明が解決しようとする課題 このような電子部品実装装置において、1枚の回路基板
に多種類の電子部品を実装する場合に対応できるように
、また回路基板の種類変更時に部品供給ユニットの入れ
替えを少なくして切換えのためのロスタイムを少なくす
るために、前記移動テーブルに多数の部品供給ユニット
を設置するようにすると、移動テーブルが大型化するた
めにその移動手段の駆動力を大きくしなければならず、
かつイナーシャが大きくなるために高速化が困難となる
等の問題がある。
Problems to be Solved by the Invention In such an electronic component mounting apparatus, in order to be able to handle the case where many types of electronic components are mounted on one circuit board, it is also possible to replace the component supply unit when changing the type of circuit board. If a large number of component supply units are installed on the moving table in order to reduce the loss time due to switching, the moving table becomes larger and the driving force of the moving means must be increased. figure,
In addition, there are problems such as increasing the inertia, making it difficult to increase the speed.

課題を解決するための手段 本発明は、上記課題を解決するため、部品供給部は、並
列方向に移動可能な第1移動テーブルと、前・記第■移
動テーブルの上に並列方向に移動可能な第2移動テーブ
ルを有し、その上に複数の前記部品供給ユニットを設置
してなることを特徴とする。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a component supply unit that is movable in parallel directions above a first moving table that is movable in parallel directions and above the first moving table (1). The present invention is characterized in that it has a second movable table, on which a plurality of the component supply units are installed.

作   用 本発明によると、部品供給部が並列方向に移動可能な第
l移動テーブルと、前記第l移動テーブルの上に並列方
向に移動可能な第2移動テーブルを有することで、部品
供給部の高速化が図れる。
According to the present invention, the component supply section has a first moving table that is movable in parallel directions, and a second moving table that is movable in parallel directions above the first moving table. Speed-up can be achieved.

さらに、一方の移動テーブルの動きを粗動作、もう一方
の移動テーブルを微動作かつ位置フィードバックループ
を構成することで、位置決め精度の向上が図れる。
Furthermore, positioning accuracy can be improved by configuring a position feedback loop in which one moving table is coarsely moved and the other moving table is finely moved.

実  施  例 以下、本発明の一実施例を第2図に基づいて説明する。Example Hereinafter, one embodiment of the present invention will be described based on FIG. 2.

第2図において、1は多数の部品供給ユニット2を並列
配置した部品供給部で、後で詳細に説明するように任意
の部品供給ユニット2を所定の部品供給位置1aに位置
決めし得るように構戊されている。前記部品供給ユニッ
ト2には、多数の部品を一列状に保持したテープ状部品
集合体が装着されており、その部品を一端部に設けた部
品取り出し位置2aに順次送り出し可能に構成されてい
る。
In FIG. 2, reference numeral 1 denotes a component supply section in which a large number of component supply units 2 are arranged in parallel.As will be explained in detail later, the component supply unit 1 is constructed so that any component supply unit 2 can be positioned at a predetermined component supply position 1a. It's hollowed out. The component supply unit 2 is equipped with a tape-shaped component assembly holding a large number of components in a line, and is configured to be able to sequentially feed the components to a component take-out position 2a provided at one end.

3は、旋回型の部品装着ユニットで、一定軸心回りに間
歇回転可能な回転テーブル4に複数の装着ヘッド5が等
間隔で配置されている。前記回転テーブル4は装着ヘッ
ド5の配置間隔で間歇回転し、この装着ヘッド5の適宜
停止位置が前記部品供給位置1aと部品装着位置3aに
設定されている。前記装着ヘソド5は、上下移動可能な
吸着ノズル(図示せず)を備えており、部品供給位置1
aで下降して部品を吸着した後上昇し、部品装着位置3
aで下降して部品の吸着を解除することによって部品を
装着した後上昇するように構成されている。
Reference numeral 3 denotes a rotating component mounting unit, in which a plurality of mounting heads 5 are arranged at equal intervals on a rotary table 4 that can be rotated intermittently around a fixed axis. The rotary table 4 rotates intermittently at intervals of the mounting heads 5, and the stopping positions of the mounting heads 5 are set as appropriate at the component supply position 1a and the component mounting position 3a. The mounting head 5 is equipped with a suction nozzle (not shown) that is movable up and down, and is located at the component supply position 1.
Go down at step a and pick up the parts, then go up and move to part mounting position 3.
It is configured such that it descends at point a and releases the suction of the component, and then rises after mounting the component.

6は、部品を装着すべき回路基板10の位置決めユニッ
トで、図示しない供給手段にて供給された回路基板10
を所定位置で固定支持する固定手段7がX方向に移動可
能なXテーブル8上に設置され、かつこのXテーブル8
がY方向に移動可能なYテーブル9上に設置され、固定
支持された回路基板10の任意の位置を前記部品装着位
置3aに位置決めし得るように構成されている。
Reference numeral 6 denotes a positioning unit for the circuit board 10 on which components are to be mounted, and the circuit board 10 is supplied by a supply means (not shown).
A fixing means 7 for fixing and supporting the
is placed on a Y table 9 that is movable in the Y direction, and is configured such that the fixedly supported circuit board 10 can be positioned at any desired position at the component mounting position 3a.

次に、前記部品供給部1の構威を詳細に説明する。前記
部品供給ユニット2は、第2移動テーブルllaに複数
並列して設置されている。この第2移動テーブルlla
は部品供給ユニット2の並列方向に延びるリニア駆動モ
ータ12に沿って移動自在に支持され、このリニア駆動
モータには、第1移動テーブルllbに設置されている
。この第1移動テーブルllbは部品供給ユニット2の
並列方向に延びるガイドフレームl3に沿っテ移送自在
に支持され、このガイドフレーム13の1側部にはボー
ルねじ釉14が配設され、そのナット部が第1移動テー
ブルllbに固定されている。ボールねじ軸14の一端
は、駆動モータ15の出力軸に取付けられている。ここ
でガイドフレーム13の長さは少なくとも第2移動テー
ブル1)aの倍以上の長さを要し、リニア駆動モータ及
びボールねじ軸の長さは、それぞれの長さの和が、少な
くとも第2移動テーブル1)aの2倍以上の長さを要す
る。
Next, the structure of the component supply section 1 will be explained in detail. A plurality of the component supply units 2 are installed in parallel on the second moving table lla. This second moving table lla
are movably supported along a linear drive motor 12 extending in the parallel direction of the component supply unit 2, and this linear drive motor is installed on the first moving table llb. This first moving table llb is supported so as to be freely movable along a guide frame 13 extending in the parallel direction of the component supply units 2, and a ball screw glaze 14 is disposed on one side of the guide frame 13, and a nut portion thereof is provided with a ball screw glaze 14. is fixed to the first moving table llb. One end of the ball screw shaft 14 is attached to the output shaft of the drive motor 15. Here, the length of the guide frame 13 is at least twice as long as the second moving table 1) a, and the lengths of the linear drive motor and the ball screw shaft are such that the sum of their respective lengths is at least twice as long as the second moving table 1) a. Moving table 1) Requires at least twice the length of a.

次に動作を説明する。まず、第2移動テーブル1)a上
に回路基板10に装着すべき各種部品を収容した複数の
部品供給ユニット2を設置する。
Next, the operation will be explained. First, a plurality of component supply units 2 containing various components to be mounted on the circuit board 10 are installed on the second moving table 1)a.

また、供給手段にて回路基板10を位置決めユニット6
の固定手段7に供給して所定位置に固定支持する。
Further, the circuit board 10 is placed in the positioning unit 6 by the supply means.
It is supplied to the fixing means 7 of and fixedly supported at a predetermined position.

この状態から、移動テーブルlla及びllbがそれぞ
れ移動し、予め設定された部品の装着順序に基づいて、
装着すべき部品を収容した部品供給ユニット2が順次部
品供給位置1aに対応位置する。この時、各移動テーブ
ルの移動距離及び移動速度は、この位置決め時間が最短
となる様、各々決められる。
From this state, the moving tables lla and llb each move, and based on the preset parts mounting order,
The component supply units 2 containing components to be mounted are sequentially positioned corresponding to the component supply position 1a. At this time, the moving distance and moving speed of each moving table are determined so that this positioning time is the shortest.

こうして部品供給位置1aに位置した部品は順次部品装
着ユニット3の装着ヘッド5にて保持された後、回転テ
ーブル4が回転することによって部品装着位置3aに移
動する。一方、前記位置決めユニット6によって回路基
板10がX,Y方向に移動して、上記予め設定された部
品の装着順序に従って部品を装着すべき位置が順次部品
装着位置3aに位置ぎめされ、前記装着ヘッド5にて保
持された部品が回路基板10上の所定位置に順次装着さ
れる。
The components thus positioned at the component supply position 1a are sequentially held by the mounting head 5 of the component mounting unit 3, and then moved to the component mounting position 3a by rotation of the rotary table 4. On the other hand, the circuit board 10 is moved in the X and Y directions by the positioning unit 6, and the position where components are to be mounted is sequentially positioned at the component mounting position 3a according to the preset component mounting order, and the mounting head The components held at step 5 are sequentially mounted at predetermined positions on the circuit board 10.

なお、移動テーブルlla,llbの移動手段としては
、リニア駆動モータ12や、ボールねじ軸14とナット
部との組合せに限らず、ラックとビニオン等を用いても
よい。また、上記実施例では旋回型の部品装着ユニット
3を用い、回路基板10をX,Y方向に移動させて部品
を装着すべき位置を固定の部品装着位置3aに一致させ
るようにした例を示したが、回路基板10は固定設置又
は一方向にのみ移動させ、装着ヘッド5を回路基板10
の部品を装着すべき任意の位置に移動させるようにして
もよく、また、挿入機についても同等の効果が得られる
ことは言うまでもない。
Note that the means for moving the moving tables lla, llb is not limited to the linear drive motor 12 or the combination of the ball screw shaft 14 and the nut part, but a rack and a pinion or the like may be used. Further, in the above embodiment, an example is shown in which a rotating type component mounting unit 3 is used and the circuit board 10 is moved in the X and Y directions so that the position where a component is to be mounted matches the fixed component mounting position 3a. However, the circuit board 10 may be fixedly installed or moved only in one direction, and the mounting head 5 may be placed on the circuit board 10.
It goes without saying that the parts may be moved to any position where they are to be mounted, and that similar effects can be obtained with an inserter.

さらに、移動テーブルの数は複数多数あっても良いこと
は、言うまでもない。
Furthermore, it goes without saying that there may be a plurality of moving tables.

発明の効果 本発明によれば、部品供給部が並列方向に移動可能な移
動テーブルと、前記移動テーブルの上に並列方向に移動
可能な移動テーブルを有し、部品供給部の位置決め時間
が最短となるように、各々の移動速度,移動距離を決め
ることで、高速化が図れる。
Effects of the Invention According to the present invention, the component supply section has a movable table movable in the parallel direction and a movable table movable in the parallel direction on the movable table, and the positioning time of the component supply section is minimized. By determining the speed and distance of each movement, speeding up can be achieved.

また、一方の移動テーブルの動きを微動作とし、さらに
位置フィードバックループを構成することで、位置決め
精度の向上が図れる等の効果が得られる。
Further, by making the movement of one of the moving tables a slight movement and further configuring a position feedback loop, effects such as improved positioning accuracy can be obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例における電子部品実装装置の
要部断面図、第2図は本発明の同全体平面図である。 1・・・・・・部品供給部、la・・・・・・部品供給
位置、2・・・・・・部品供給ユニット、3・・・・・
・部品装着ユニット、4・・・・・・回転テーブル、5
・・・・・・装着ヘッド、6・・・・・・位置決めユニ
ット、7・・・・・・位置決めユニット固定手段、8,
9・・・・・・X−Yテーブルユニソト、10・・・・
・・回路基板、lla・・・・・・第2移動テーブル、
1)b・・・・・・第1移動テーブル、12a・・・・
・・リニア[動モータ、l3・・・・・・ガイドフレー
ム、14・・・・・・ポールねじ軸、15・・・・・・
駆動モータ。
FIG. 1 is a sectional view of a main part of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the entire same according to the present invention. 1... Parts supply section, la... Parts supply position, 2... Parts supply unit, 3...
・Component mounting unit, 4...Rotary table, 5
... Mounting head, 6... Positioning unit, 7... Positioning unit fixing means, 8,
9...X-Y table unisoto, 10...
...Circuit board, lla...Second moving table,
1) b...First moving table, 12a...
...Linear [dynamic motor, l3...Guide frame, 14...Pole screw shaft, 15...
drive motor.

Claims (3)

【特許請求の範囲】[Claims] (1)収容した複数の部品を所定の部品取出し位置に順
次送り出す複数の部品供給ユニットを、複数並列設置し
た部品供給部と、前記部品を実装する実装部材を位置決
めする実装部材の位置決め手段と、前記部品供給部の所
定位置で部品を保持してその部品を前記実装部材上に実
装する部品実装手段とを備えた部品実装装置において、
前記部品供給部は、並列方向に移動可能な第1移動テー
ブルと、この第1移動テーブルの上に並列方向に移動可
能な第2移動テーブルを有し、その上に複数の前記部品
供給ユニットを設置してなる電子部品実装装置。
(1) a component supply section in which a plurality of component supply units are installed in parallel to sequentially send out a plurality of stored components to a predetermined component extraction position; a mounting member positioning means for positioning a mounting member on which the component is mounted; A component mounting device comprising a component mounting means for holding a component at a predetermined position of the component supply section and mounting the component on the mounting member,
The component supply unit has a first moving table that is movable in parallel directions, a second movable table that is movable in parallel directions on top of the first moving table, and a plurality of the component supply units are mounted on the second movable table that is movable in parallel directions. Electronic component mounting equipment installed.
(2)第1移動テーブルの駆動部はボールネジとナット
により構成され、第2移動テーブルの駆動はリニア駆動
モータにて構成されている特許請求の範囲第1項記載の
電子部品実装装置。
(2) The electronic component mounting apparatus according to claim 1, wherein the drive section of the first movable table is constituted by a ball screw and a nut, and the drive of the second movable table is constituted by a linear drive motor.
(3)第1移動テーブルの駆動部はラックとピニオンに
より構成され、第2移動テーブルの駆動はリニア駆動モ
ータにて構成されている特許請求の範囲第1項記載の電
子部品実装装置。
(3) The electronic component mounting apparatus according to claim 1, wherein the first moving table is driven by a rack and a pinion, and the second moving table is driven by a linear drive motor.
JP1190982A 1989-07-24 1989-07-24 Electronic component mounting equipment Expired - Fee Related JP2797484B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1190982A JP2797484B2 (en) 1989-07-24 1989-07-24 Electronic component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1190982A JP2797484B2 (en) 1989-07-24 1989-07-24 Electronic component mounting equipment

Publications (2)

Publication Number Publication Date
JPH0354898A true JPH0354898A (en) 1991-03-08
JP2797484B2 JP2797484B2 (en) 1998-09-17

Family

ID=16266894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1190982A Expired - Fee Related JP2797484B2 (en) 1989-07-24 1989-07-24 Electronic component mounting equipment

Country Status (1)

Country Link
JP (1) JP2797484B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60150700A (en) * 1984-01-18 1985-08-08 松下電器産業株式会社 Electronic part mounting device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60150700A (en) * 1984-01-18 1985-08-08 松下電器産業株式会社 Electronic part mounting device

Also Published As

Publication number Publication date
JP2797484B2 (en) 1998-09-17

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