JPS61268372A - Apparatus for transferring and supplying coating agent - Google Patents

Abstract

PURPOSE:To make it possible to thinly and uniformly apply a coating agent to a substrate by transferring the same without dripping, by providing an elastomer having water absorbability to the coating pin for transferring the coating agent. CONSTITUTION:Flux 14 is injected in the sponge on a coating agent supply table 4 rotated to a C-direction by a motor 5 and absorbed therewith. When a coating pin 1 is fallen from above in this state, the coating agent supply table 14 is stopped and the sponge 12 is contacted with the rubber 13 provided to the leading end of the coating pin 1 and a definite amount of the flux 14 in the sponge 12 is absorbed by the rubber 13 and raised without dripping to be transferred to the direction shown by an arrow A. The coating pin 1 moved to the predetermined position on a substrate 2 is fallen to the direction shown by an arrow B to apply a definite amount of the flux 14 to the substrate 2 by the rubber 13. By this method, the flux is thinly and uniformly applied to accurately and surely mount electronic parts.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an apparatus for mounting electronic components onto a board, in which a coating agent is transferred and supplied in order to mount the electronic components with a coating agent in the process before mounting the electronic components onto the substrate. This relates to a device for

2, -/ Prior Art In recent years, integrated circuit electronic components on substrates have made remarkable progress, becoming increasingly fine and complex, and the types of electronic components are countless. Among the electronic components, in the process of mounting a flip chip onto a substrate, an epoxy bond type film and a low viscosity flux are used as a coating agent.

Conventionally, as shown in FIG. A pulley 9 and a coating agent supplying table 4 are rotating in the C direction via a timing belt 7, and a flux 14 is injected into a groove of this coating agent supplying table 4. The coating pin 1 moves from above in the Hitoyoshi direction and the B direction to coat the substrate 2 on the guide rail 3 with the flux 14.

The application pin 1 has a flat surface to which it is applied, and the application pin 1 descends into the groove of the coating agent supplying table 4 and receives the flux 14.
was deposited, descended in the Hitoyoshi direction (arrow) and B direction (arrow), and was transferred and coated on the substrate 2. after that,
As shown in FIG. 4, an electronic component (flip chip) 16 is transferred to the position where the flux 3 of the substrate 2 is coated with the -7 flux 14 and mounted in the hole.

Problems to be Solved by the Invention However, in the above conventional coating agent transfer and supply device, since the flux 14 has a low viscosity as described above, a large amount of flux 14 adheres to the attachment surface of the coating pin 1 and transfers. Flux 14 may drip during the process, or
As shown in FIG. 4, even when an electronic component 15 (flip chip) was mounted, it was mounted in a floating state due to a large amount of flux 14. In particular, if the electronic components 16 are mounted in a floating state, they may be misaligned when the board 2 is being transported, and the positions of the bumps 16 and the circuit patterns on the board 20 may be misaligned, making it impossible to perform accurate wiring. However, this resulted in the problem of producing defective products. Therefore, the present invention attempts to apply a fixed amount of coating agent to the substrate.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention provides a coating agent supply device for supplying a coating agent, and a transfer device equipped with a coating pin for transferring and applying the coating agent to a substrate. A water-absorbing elastic body is provided at the tip of the applicator pin to attach or adsorb the coating agent from the coating agent supply device.

Effect With the above structure, a certain amount of the coating agent is absorbed by the elastic body of the coating pin, and the coating agent can be transferred and applied thinly and uniformly to the substrate without dripping.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.

In FIG. 1, a substrate 2 is positioned on a guide rail 3 for transporting and positioning a substrate 2'jz, and a coating agent supply device 6 is disposed on the right side thereof.

The coating agent supply device 6 is configured such that a coating agent supplying table 4 fixed to a shaft 7) is rotated by a motor 5 through a pulley 8 via a timing belt, and from a pulley 9 to a shaft 7). A sponge 12 is provided. Above this, the coating pin 1 of the transfer device moves in the entry direction (arrow) and the B direction (arrow). The applicator pin 1 is removably attached and has a water-absorbing rubber 13 on its lower surface.

In the above configuration, the flux 14 is injected into the spon') 12 on the coating agent supply table 4 rotating in the C direction (arrow) so that the flux 14 is supplied from the outside by the motor 6, and is absorbed. The applicator pin 1 descends from above, the applicator supply table 14 stops, the sponge 12 and the rubber 13 of the applicator pin 1 come into contact, and the sponge 1
A certain amount of flux 14 in 2 is absorbed into the rubber 13, and the liquid rises without dripping and is transferred in the inlet direction (arrow).

The coating pin 1 moved to a predetermined position on the substrate 2 moves in the B direction (
arrow) and a certain amount of flux 14 is released by the rubber 13.
can be applied to the substrate 2.

As a result, the flux 14 is applied thinly and uniformly, and the electronic component 16 (flip chip) is not floating due to the flux 14 and is mounted accurately and reliably as shown in FIG.

Effects of the Invention In the present invention, by providing a water-absorbing rubber on the coating pin that transfers the coating agent, a large amount of the coating agent does not adhere to the coating pin, and there is no dripping. Since the coating agent is thinly and uniformly applied to the board as if stamped, electronic components can be mounted reliably, and there is no misalignment between the board and electronic components due to movement of the board.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a coating agent transfer and supply device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing the mounting state of electronic components by an electronic component mounting device equipped with the same device, and FIG. 3 is a conventional FIG. 4 is a sectional view showing a state in which an electronic component is mounted by an electronic component mounting apparatus equipped with the same device. 1... Application pin, 2... Substrate, 4...
...Applicant Chiful, 12...Sponge,
13...Rubber.

Claims (2)

[Claims] (1) A coating agent supply device that supplies a coating agent, and a transfer device equipped with a coating pin that transfers the coating agent from the coating agent supply device and applies it to the substrate, and the coating agent is attached to the tip of the coating agent pin. A coating agent transfer and supply device characterized by being provided with a water-absorbing elastic body that adheres or adsorbs. (2) The coating agent transfer and supply device according to claim 1, characterized in that a water-absorbing sponge is provided to supply a fixed amount of the coating agent to the coating agent supply device.