JP3496642B2 - Bonding paste transfer device, transfer pin, and bonding paste transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an equipment for transferring bonding past, a transfer pin and a method for transferring the bonding paste, in which the bonding past is applied to a work without any trouble by transferring by stabilizing the application quantity. SOLUTION: The transfer face of the lower edge 22a of the transfer pin 22 for transfer of the bonding part to a rectangle coating area provided on a work face of a plane face having a plane face 22b parallel to the coating plane of the work provided corresponding to a diagonal coating line settled by connecting the diagonal line of the coating region and an inclined portion having a inclined face 22c inclined to outer periphery formed in the range out of the flat portion. By this, the bonding past is surely applied to corner points, also the amount of the bonding past adhered to the transfer face is easily regulated by regulating the burying depth of the transfer pin in the bonding past.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding paste transfer device, a transfer pin, and a bonding paste transfer method for transferring a bonding paste for bonding an electronic component to a work by transfer.

[0002]

2. Description of the Related Art In a die bonding process for bonding a semiconductor chip to a lead frame, a bonding paste (hereinafter simply referred to as "paste") is applied to a bonding position of the lead frame before mounting the semiconductor chip. . A transfer method is known as a method for applying this paste. In this application method, the transfer pin is moved to bring the lower end surface of the transfer pin into contact with the liquid surface of the paste to attach the paste, and then the transfer pin is moved to transfer the paste attached to the transfer pin to the application target surface. To do. 2. Description of the Related Art Conventionally, a transfer pin having a rectangular transfer surface to which a paste is attached according to the shape of a semiconductor chip is generally used.

[0003]

However, when the paste is applied by the transfer pin having the transfer surface shape, there are the following problems in securing an appropriate application amount. In other words, if paste is applied using transfer pins that are relatively large in size to the semiconductor chip in order to increase the overall application amount, the paste application amount becomes excessive and the paste is spread by the mounted semiconductor chip. Unnecessarily, the paste easily squeezes out of the range of the semiconductor chip. If the size of the transfer pin is reduced in order to prevent the paste from excessively protruding, the spread of the paste in the corner portion of the semiconductor chip after mounting the semiconductor chip is insufficient. In either case, the amount of paste applied becomes excessive or insufficient, which causes a bonding failure.

Therefore, an object of the present invention is to provide a bonding paste transfer device, a transfer pin, and a bonding paste transfer method that can stabilize the coating amount and transfer the bonding paste onto a workpiece by transfer.

[0005]

According to a first aspect of the present invention, there is provided a bonding paste transfer device for transferring a bonding paste supplied to a paste supply section to a rectangular coating area set on a work surface by a transfer pin. A transfer device, a paste supply unit for shaping the liquid surface of the bonding paste to be flat, a work holding unit for holding a work, a transfer head having a transfer pin for transferring the bonding paste, and a lower end of the transfer pin. And an immersion depth adjusting means for adjusting an immersion depth of the bonding paste immersed in the liquid surface, and the bonding paste is transferred and applied to the transfer surface at the lower end of the transfer pin to which the bonding paste adheres. It is set to include the diagonal application line from the inside of the application area to each corner point in the application range. A flat portion having a flat surface parallel to the coating plane of the workpiece, which is provided corresponding to the coating line, and a flat portion of the transfer pin, which is provided in a range other than the flat portion, extends from the center of the transfer surface toward the outer edge portion. And an inclined portion having a plurality of inclined surfaces that are separated from each other toward the base side.

The transfer pin of the bonding paste according to claim 2 is a transfer pin of the bonding paste for adhering the bonding paste to the transfer surface at the lower end and transferring it to a rectangular coating area set on the surface of the work. The transfer surface is provided corresponding to the application line set including the diagonal application line extending from the inside of the application area to each corner point in the application range where the bonding paste is transferred and applied, and is parallel to the application plane of the workpiece. A flat portion having a flat surface, and a slanted portion provided in a range other than the flat portion and having a plurality of slanted surfaces which are separated from the flat surface toward the outer edge portion from the center of the transfer surface toward the base side of the transfer pin. Prepared

A transfer pin of the bonding paste according to a third aspect is the transfer pin of the bonding paste according to the second aspect, wherein the diagonal application lines connect opposite corner points of the application area and intersect each other. It is set along two diagonal lines.

The transfer pin of the bonding paste according to a fourth aspect is the transfer pin of the bonding paste according to the second aspect, wherein the coating line extends from two different points in the coating area toward two corner points. It includes a diagonal coating line and a central coating line set at the center of the coating area along a straight line connecting the two points.

A method of transferring a bonding paste according to claim 5, wherein the bonding paste supplied to the paste supply unit is transferred to a rectangular coating area set on the surface of the work by a transfer pin. The transfer surface to which the paste on the lower end surface of the transfer pin adheres is set so as to include a diagonal coating line extending from the inside of the coating area to each corner point in the coating range where the bonding paste is transferred and coated. A flat portion having a flat surface parallel to the application plane of the work, which is provided corresponding to the line, and the flat surface of the transfer pin extending from the center of the transfer surface to the outer edge portion in a range other than the flat portion. And a sloped portion having a plurality of slopes that are separated from each other, and the lower end of the transfer pin is immersed in the liquid surface of the bonding paste. The by adjusting the immersion depth adjusting means adjusts the amount of adhered bonding paste to adhesion area and the transfer surface bonding paste adheres to the transfer surface of.

According to the present invention, the transfer surface to which the paste on the lower end surface of the transfer pin is attached is a diagonal application line extending from the inside of the application area to each corner point in the application range where the bonding paste is transferred and applied. A flat portion having a flat surface parallel to the coating plane of the workpiece, which is provided corresponding to the set coating line, and the flat surface which is provided in a range other than this flat portion from the center of the transfer surface to the outer edge portion. Since the bonding paste can be reliably applied to the corner points of the application area by using the configuration including the inclined portion having a plurality of inclined surfaces that are separated from the transfer pin to the base side of the transfer pin, By adjusting the immersion depth, it is possible to easily adjust the amount of bonding paste applied to the work using transfer pins of the same size.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) FIG. 1 is a front view of a transfer apparatus for bonding paste according to Embodiment 1 of the present invention, and FIG. 2A is a front view of the bonding paste according to Embodiment 1 of the present invention. 2B is a partial perspective view of the transfer area of the bonding paste according to the first embodiment of the present invention, and FIG. 3 is a partially enlarged perspective view of the transfer pin of the bonding paste according to the first embodiment of the present invention. FIG. 4 is a shape explanatory view of a transfer surface of the transfer pin of the bonding paste according to the first embodiment of the present invention, FIG. 5 is a partially enlarged cross-sectional view of the transfer pin of the bonding paste according to the first embodiment of the present invention, and FIG. FIG. 7 is a partial cross-sectional view of the bonding paste transfer device according to the first embodiment of the present invention, and FIG. 7 is a process explanatory view of the bonding paste transfer method according to the first embodiment of the present invention.

First, a transfer device for a bonding paste will be described with reference to FIG. In FIG. 1, the work holding unit 1 includes a moving table 2. A holder 3 is provided on the moving table 2, and the holder 3 holds a lead frame 4 which is a work. The work may be a circuit board other than the lead frame 4. The bonding paste supply unit 5 is provided on the side of the work holding unit 1.
Is provided. The bonding paste supply unit 5 is
A container 6 having a flat bottom is provided, and a bonding paste 7 (hereinafter simply referred to as “paste 7”) is applied to the bottom of the container 6.

A squeegee unit 9 having a squeegee 8 is provided in the container 6, and the squeegee unit 9 is connected to a belt 12 banded between pulleys 10 and 11. By driving the motor 13 to rotate the pulley 11, the squeegee unit 9 horizontally moves, and the horizontal movement causes the squeegee 8 to flatten the paste 7 on the bottom surface of the container 6. As a result, the paste 7 is applied to the bottom surface of the container 6 with a uniform thickness t. Here, the vertical position of the squeegee 8 can be finely adjusted by the adjusting mechanism 8a, and the thickness t of the paste coating film formed in the container 6 can be set to a desired value.

A transfer head 20 is disposed above the work holding unit 1 and the bonding paste supply unit 5 so as to be movable by a transfer head moving unit. The transfer head 20 includes a transfer tool 21 having a transfer pin 22 and an elevating mechanism 23 for elevating the transfer tool 21.
The transfer tool 21 detachably holds the base of the transfer pin 22. The transfer head 20 is connected to a nut 25 by a bracket 24, and the nut 25 is attached to the frame 2
A feed screw 28, which is held by No. 6 and is rotationally driven by an X-axis motor 27, is screwed in. Further, the frame 26 is connected to a Y-axis table 30 driven by a Y-axis motor 29. The Y-axis table 30, the X-axis motor 27, the feed screw 28, the nut 25, and the elevating mechanism 23 are transfer head moving means for moving the transfer head 20 relative to the bonding paste supply unit 5 and the work (lead frame 4). Make up.

By controlling the X-axis motor 27, the Y-axis motor 29, and the lifting mechanism 23 by the control unit 31,
The transfer head 20 can move to cause the transfer pin 22 to perform a predetermined operation. With the transfer tool 21 positioned on the bonding paste supply unit 5, the transfer pin 22 is lowered to contact the paste 7 applied to the container 6,
Then, by raising the transfer pin 22, the paste 7 is attached to the lower end portion of the transfer pin 22.

Then, the transfer head 20 is moved onto the work holding portion 1 to move the transfer pin 22 up and down with respect to the lead frame 4. As a result, as shown in FIG. 2A, the paste 7 attached to the lower end portions of the transfer pins 22 is applied to the upper surface of the lead frame 4 in a rectangular coating area 4a corresponding to the chips mounted on the lead frame 4. Then, it is applied by transfer.

Next, the application area of the paste 7 to be transferred and applied to the application area 4a and the detailed shape of the lower end portion of the transfer pin 22 will be described. As shown in FIG. 2B, the paste 7 is applied to the application area 4a by transfer application in the following application range. The coating range includes diagonal coating lines L1 and L2 diagonally set from the inside of the coating area 4a toward each corner point C, and a central coating range A set in the central portion of the coating area 4a. Is set. Here, the diagonal application lines L1 and L2 are set along two diagonal lines D1 and D2 that connect the opposing corner points C of the application area 4a and intersect each other.

Next, the transfer surface (the surface to which the paste 7 is attached) of the transfer pin 22 set corresponding to the above-mentioned application range will be described. As shown in FIGS. 3 and 4A, a flat portion having a flat surface 22b parallel to the coating plane of the lead frame 4 is diagonally applied to the transfer surface of the lower end portion 22a of the transfer pin 22 during the transfer operation. It is formed corresponding to the lines L1 and L2. And, EE cross section of FIG. 4 (b), (c), F
As shown in the −F cross section, the range of the transfer surface other than the flat portion 22b is a slope 22 which is separated from the flat surface toward the base side of the transfer pin 22 from the central portion of the transfer surface toward the outer edge portion.
It is an inclined portion having a plurality of c.

Since the transfer surface of the lower end portion 22a of the transfer pin 22 has the above-mentioned shape, the following effects can be obtained when the paste 7 is transferred and applied. Figure 5
Shows the relationship between the depth of immersion of the lower end 22a of the transfer pin 22 into the paste 7 and the amount of the paste 7 when the lower end 22a of the transfer pin 22 is brought into contact with the paste 7 to adhere the paste 7 to the transfer pin 22. ing.

The lower end 22a of the transfer pin 22 is attached to the paste 7
By immersing the paste 7 from the liquid surface, the paste 7 adheres to the transfer surface on the lower surface of the lower end portion 22a. At this time, the flat surface 2
Since 2b is completely immersed in the paste 7, the paste 7 is attached to the entire flat surface. On the other hand, with respect to the sloped portion other than the flat portion, the area where the paste 7 adheres is as shown in FIGS. 5 (a) and 5 (b), respectively. It depends on the size.

That is, as shown in FIG. 5A, when the lower end 22a is immersed from the liquid surface of the paste 7 by the immersion depth d1, the paste 7 adheres to the slope 22c within the range of the adhesion width b1. Then, as shown in FIG. 5B, when the lower end portion 22a is immersed by d2 larger than the immersion depth d1, the paste 7 is applied to the slope 22c in the range of the adhesion width b2 larger than b1 described above. Adhere to. Therefore, by adjusting the immersion depth of the lower end 22a of the transfer pin 22 into the liquid surface of the paste 7, the adhesion area where the paste 7 adheres to the transfer surface and the amount of the paste 7 adhered to the lower end 22a are adjusted. It becomes possible to do. In particular, at the center of the transfer pin 22, it is possible to freely control the amount of the paste 7 that is attached.

Next, referring to FIG. 6, an immersion depth adjusting means for adjusting the immersion depth of the lower end portion 22a of the transfer pin 22 into the liquid surface of the paste 7 will be described. FIG. 6A shows a method of adjusting the immersion depth with respect to the flat bottom surface 6a of the container 6 by using the adjusting mechanism 8a for adjusting the vertical position of the squeegee 8. That is, in this method, the vertical position of the squeegee 8 is adjusted so that the thickness t of the coating film of the paste 7 formed on the container 6 becomes equal to the desired immersion depth.
Then, when the transfer pin 22 is moved down onto the paste 7 for transfer, the transfer pin 22 is moved down until the lowering of the transfer pin 22 is blocked by the bottom surface of the container 6. As a result, the lower end portion 22a of the transfer pin 22 has the paste 7 having a desired immersion depth.
Immerse yourself in. Therefore, in this example, the adjusting mechanism 8a of the squeegee 8 serves as the immersion depth adjusting means.

FIG. 6B shows a mechanism 2 for raising and lowering the transfer pin 22.
3 shows an example of adjusting the immersion depth. In this case, the thickness t of the coating film of the paste 7 formed on the container 6
Is formed thicker than a desired immersion depth d, and the transfer pin 22 is lowered with respect to the coating film of the paste 7.
Then, the control unit 31 controls the lifting mechanism 23,
The transfer pin 22 is lowered so that the lower end portion 22a is immersed in the paste 7 by a desired immersion depth d. Therefore, in this example, the elevating mechanism 23 and the control unit 31 serve as immersion depth adjusting means. The immersion depth adjusting means may be one that mechanically adjusts the descending stroke of the transfer pin 22, one that adjusts the height of the container 6, or the like.

The bonding paste transfer device is configured as described above, and the bonding paste transfer method will be described below with reference to the drawings. Figure 1
In the process, the transfer head 20 is moved to move the transfer tool 21.
Is moved onto the bonding paste supply unit 5. Then, the transfer pin 22 is lowered with respect to the container 6 and then, as shown in FIG.
As shown in, the lower end 22a is immersed from the liquid surface of the paste 7 by a desired immersion depth d. The immersion depth d is obtained in advance as application data indicating the immersion depth required to apply the optimum amount of paste 7 in a desired application range. For the adjustment of the immersion depth, any method shown in FIGS. 6A and 6B may be used.

Then, the transfer pin 22 is raised. Then, as shown in FIG. 7B, the lower end portion 22 of the transfer pin 22 is
In the transfer surface of a, the paste 7 is attached to the entire flat surface, and the paste 7 is attached to the inclined portion only in the attachment range corresponding to the immersion depth d. After that, the transfer head 20 is moved onto the work holding part 1, the transfer tool 21 is lowered onto the lead frame 4, and the paste 7 attached to the transfer surface of the transfer pin 22 is brought into contact with and attached to the surface of the lead frame 4. .

After that, the transfer pin 22 is lifted, so that the paste 7 adhered to the lower end surface of the transfer pin 22.
Is applied by transfer to the application area 4a of the lead frame 4 as shown in FIG. 7 (c). In this transfer coating, for the diagonal coating lines L1 and L2 shown in FIG. 2B with respect to the rectangular coating area 4a, the flat portion formed in the diagonal direction toward the corner point C ensures the paste. 7 can be applied. With respect to the central part application range A, the optimum amount of paste 7 is applied to the central part of the application area 4a by setting the immersion depth d.

The amount of the paste 7 applied to the central portion of the application area 4a affects the amount of the paste 7 protruding from the side portion of the semiconductor chip 40. In the transfer pin 22 according to the present embodiment, the amount of paste 7 applied to the central portion of the application area 4a is adjusted by adjusting the immersion depth without changing the amount of paste 7 applied near the corner point C. Can be increased or decreased. Therefore, since the immersion depth can be adjusted by paying attention to the amount of the paste 7 applied to the central portion of the application area 4a, it is easy to set the immersion depth condition.

FIG. 7D shows the paste 7 in this way.
The semiconductor chip 40 is formed on the upper surface of the lead frame 4 coated with
It shows a state in which is mounted and pressed. In the present embodiment, since the appropriate amount of the paste 7 is applied to both the diagonal application lines L1 and L2 and the central application area A shown in FIG. Chip 4
When 0 is pressed onto the paste 7, the paste 7 is spread over the entire bonding surface of the semiconductor chip 40 without excess or deficiency. Therefore, problems such as excess paste 7 squeezing out of the semiconductor chip 40 and bonding defects of the semiconductor chip 40 due to partial shortage of the paste 7 near the corners do not occur.

(Second Embodiment) Next, another example of the shape of the transfer pin mounted on the transfer tool 21 will be described with reference to FIGS. 8 and 9. 8A is an enlarged bottom view of the transfer pin according to the second embodiment of the present invention, FIG. 8B is a plan view of the transfer area of the bonding paste according to the second embodiment of the present invention, and FIG. FIG. 7 is a shape explanatory view of a transfer surface of a transfer pin of the bonding paste according to the second embodiment.

The transfer pin 22 'shown in FIG. 8A has a rectangular coating area 4 as compared with the transfer pin 22 shown in the first embodiment, which is intended for a substantially square coating area.
It is intended for a '. As shown in FIG. 8B, the coating range set in the coating area 4a ′ is a diagonal coating line L3 from two different points P1 and P2 in the coating area 4a ′ to two corner points C1 and C2, respectively. , L4
And a central coating line L5 set at the central portion of the coating area 4a ′ along a straight line Q connecting the two points P1 and P2.

Diagonal coating lines L3 and L in this coating range
4. As shown in FIGS. 8A and 9A, the lead frame 4 is formed on the transfer surface of the lower end portion 22′a of the transfer pin 22 ′ corresponding to the central coating line L5 during the transfer operation. A flat portion having flat surfaces 22'b and 22'd parallel to the coating plane of is formed. The flat surface 22'd is the coating area 4
It is a central flat surface corresponding to a central coating line L5 set along a straight line Q connecting points P1 and P2 in a '. And E'-E 'cross section of FIG.9 (b), (c), F'-F'
As shown in the cross section, the range of the transfer surface other than the flat surfaces 22'b, 22'd is from the flat surface 22'b, 22'd to the base side of the transfer pin 22 'from the center of the transfer surface toward the outer edge. It is an inclined portion having a plurality of slopes 22'c that are separated from each other.

Even with the transfer pin 22 'having such a transfer surface shape, as in the case where the transfer pin 22 is used, a diagonal line including the vicinity of the corner point shown in FIG. With respect to each of the coating lines L3 and L4 and the central coating line L5, the paste 7 can be reliably transferred by the flat surfaces 22′b and 22′d, and the transfer pins 22 ′ to the paste 7 can be transferred to the paste 7 similarly to the first embodiment. By adjusting the immersion depth, the coating area 4 including the central coating area A '
An appropriate amount of paste 7 can be applied to the application range of a '.

In the first and second embodiments, the transfer pins 22 and 22 'have a rectangular cross section. However, the transfer pins 22 and 22' have a shape capable of forming a flat portion and a sloped portion as shown in the respective embodiments. If necessary, a shape other than a rectangle such as a circular cross section may be used. Further, in each of the embodiments, an example in which a continuous flat portion is formed is shown, but for the purpose of adjusting the coating amount distribution, the flat portion may be partially interrupted to form an intermittent shape. Furthermore, in Embodiments 1 and 2, point-like protrusions may be formed on the flat portion. This dot-shaped protrusion
The immersion depth may be controlled by making contact with the bottom surface of the paste, or the spread of the paste 7 may be controlled by making contact with the work.

[0034]

According to the present invention, the transfer surface, to which the paste on the lower end surface of the transfer pin is attached, is diagonally applied from the inside of the application area to the corner points of the application area where the bonding paste is transfer-applied. A flat portion having a flat surface parallel to the coating plane of the workpiece, which is provided corresponding to the coating line set including the line, and which is provided in a range other than the flat portion, from the center of the transfer surface to the outer edge portion. Since it has a configuration with a sloped part that has multiple slopes that move away from the flat surface to the base side of the transfer pin, it is possible to reliably apply the bonding paste to the corner points of the application area and to the bonding paste of the transfer pin. By adjusting the immersion depth of, the amount of the bonding paste attached to the transfer surface can be easily adjusted by using the transfer pins of the same size.

[Brief description of drawings]

FIG. 1 is a front view of a bonding paste transfer device according to a first embodiment of the present invention.

FIG. 2A is a partial perspective view of a bonding paste transfer device according to the first embodiment of the present invention. FIG. 2B is a plan view of a bonding paste transfer area according to the first embodiment of the present invention.

FIG. 3 is a partially enlarged perspective view of a transfer pin of the bonding paste according to the first embodiment of the present invention.

FIG. 4 is an explanatory view of the shape of the transfer surface of the transfer pin of the bonding paste according to the first embodiment of the present invention.

FIG. 5 is a partially enlarged sectional view of a transfer pin of the bonding paste according to the first embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of the bonding paste transfer device according to the first embodiment of the present invention.

FIG. 7 is a process explanatory diagram of a bonding paste transfer method according to the first embodiment of the present invention.

8A is an enlarged bottom view of the transfer pin according to the second embodiment of the present invention, and FIG. 8B is a plan view of the transfer area of the bonding paste according to the second embodiment of the present invention.

FIG. 9 is an explanatory view of the shape of the transfer surface of the transfer pin of the bonding paste according to the second embodiment of the present invention.

[Explanation of symbols]

1 Work holding part 4 lead frame 5 Bonding paste supply section 7 (bonding) paste 21 Transfer Tool 22 Transfer pin 22a lower end 22b flat surface 22c slope

Claims (5)

(57) [Claims] 1. A bonding paste transfer device for transferring a bonding paste supplied to a paste supply section to a rectangular coating area set on a surface of a work by a transfer pin, and shaping the liquid surface of the bonding paste flat. A paste supply unit, a work holding unit for holding a work, a transfer head having a transfer pin for transferring the bonding paste, and a depth of immersion of the lower end of the transfer pin into the liquid surface of the bonding paste. The transfer surface to which the bonding paste is attached at the lower end of the transfer pin has a pair of immersion depth adjusting means for facing the respective corner points from the inside of the application area within the application range in which the bonding paste is transferred and applied. It has a flat surface that is provided corresponding to the coating line set including the square coating line and is parallel to the coating plane of the workpiece. A carrier part and an inclined part provided in a range other than the flat part and having a plurality of slopes which are separated from the flat face toward the base side of the transfer pin from the center of the transfer face toward the outer edge part. Bonding paste transfer device. 2. A transfer pin of a bonding paste for adhering the bonding paste to a transfer surface at the lower end and transferring it to a rectangular coating area set on the surface of the work, wherein the transfer surface is coated with the bonding paste. A flat portion having a flat surface parallel to the coating plane of the workpiece, which is provided corresponding to the coating line including the diagonal coating line extending from the inside of the coating area to each corner point in the coating range. A bonding paste comprising a sloped portion having a plurality of slopes which are provided in a range other than the flat portion and which are separated from the center of the transfer surface toward the outer edge portion toward the base side of the transfer pin from the flat surface. Transfer pin. 3. The bonding paste according to claim 2, wherein the diagonal coating line is set along two diagonal lines that connect opposing corner points of the coating area and intersect each other. Transfer pin. 4. The coating line is set at the center of the coating area along a diagonal coating line extending from two different points in the coating area to two corner points and a straight line connecting the two points. 3. A central application line is included.
Transfer pin of the bonding paste described. 5. A transfer method of a bonding paste for transferring a bonding paste supplied to a paste supply unit to a rectangular coating area set on a surface of a work by a transfer pin, wherein the paste on the lower end surface of the transfer pin is attached. The transfer surface is provided on the coating plane of the work provided corresponding to the coating line including the diagonal coating line from the inside of the coating area to each corner point in the coating range where the bonding paste is transferred and coated. A flat portion having a parallel flat surface, and an inclined portion provided in a range other than the flat portion and having a plurality of inclined surfaces that are separated from the flat surface toward the base side of the transfer pin from the center of the transfer surface toward the outer edge portion. By adjusting the depth of immersion of the lower end of the transfer pin into the liquid surface of the bonding paste by the immersion depth adjusting means. Transfer method of bonding paste and adjusting the amount of adhered adhesion area and the bonding paste to the transfer surface bonding paste transfer surface is attached.