JPH04192434A - Tab component inserting device - Google Patents

Abstract

PURPOSE:To improve operating efficiency by sucking a TAB component punched out from carrier tape by using a suction nozzle through a through hole provided on a second die and directly inserting the TAB component into a circuit substrate supported by a stage for mounting by using the suction nozzle. CONSTITUTION:A TAB component punched out by a punch 39 is supported by a suction nozzle 22 through a through hole 46b provided on a second die 44. The suction nozzle 22 moves to a stage for outer lead bonding by a TAB component transfer means 23 while holding the TAB component. The TAB component is directly inserted into a circuit substrate which is supported by the stage for outer lead bonding by the suction nozzle 22. Thus, the chip punched out from the film carrier tape is efficiently inserted into the circuit substrate mounted on the stage of an outer lead bonding device.

Description

[Detailed Description of the Invention] [Purpose of the Invention (Industrial Application Field) This baldness is produced by TA from a film carrier tape subjected to inner lead bonding (ILB).
The present invention relates to a TAB component insertion device that punches out a B component and inserts the TAB component onto a circuit board (lead frame) placed on a stage for outer lead bonding (OLB).

(Conventional technology) T A B (Tape Automated Bon
In the ding) technology, after performing inner lead bonding (ILB), which connects the leads of the film carrier tape and the electrodes of the LSI chip via bumps,
The film carrier tape that has been determined to be completely non-defective through the resin coating process and electrical inspection process is cut into TAB parts, and the TAB parts are mounted on a circuit board (lead frame) and manufactured into products.

The process of cutting the TAB package into predetermined dimensions to obtain TAB parts is called a punching process. The process of connecting the outer leads of the punched TAB component to the electrodes of the circuit board and mounting the chip on the circuit board is called outer lead bonding (OLE).

As shown by reference numeral 1 in FIG. 5, each lead 2 of the film carrier tape 1 is bonded to an inner lead of an LSI chip 3.

The TAB component 4 is manufactured by punching out the carrier tape 1 to which the LSI chip 3 is inner lead bonded along the broken line s1, and has flexibility.

Each lead 2 of the punched TAB component 4 is easily bent by a slight external force. Therefore, after punching, the TAB component 4 is immediately inserted and bonded to a lead frame (circuit board) 5 shown in FIG. 6.

By the way, as a punching device for performing punching, there is a conventional punching device as shown in FIG. This device includes a lower mold 6 that holds the carrier tape 1 on the upper surface, and a lower mold 6 that holds the carrier tape 1 on the upper surface.
It is comprised of an upper mold 7 disposed opposite to each other, and a drive cylinder 8 disposed above the upper mold 7 to drive the upper mold 7 downward to perform a punching operation.

When the carrier tape 1 is placed on the upper surface of the lower mold 6, the upper mold 7 is lowered by the drive cylinder 8, and the TAB parts 4 are moved from the carrier tape 1 along the broken line s1 shown in FIG. Or punched out. After the TAB part 4 is punched out, the upper die 7 is driven by the drive cylinder 8 and raised, and the TAB part 4 is placed near the lower die 6.
The arm 10 of the AB component transfer device 9 rotates toward the space between the upper mold 6 and the lower mold 7. A suction head 11 is provided at the tip of the arm 10, and the punched TAB part 4 is suctioned and held by the suction head 11. Then, the TAB component 4 is transferred to the outer lead bonding device 12 by the rotation of the arm, and is inserted into the circuit board 5 shown in FIG. 6.

However, in the above-described apparatus, after punching out the TAB part 4, the upper mold 7 is raised, and then the arm 10 is punched out.
is inserted between the upper mold 6 and the lower mold 7 to compare the TAB part 4.

Therefore, it takes time to take out the TAB part 4.

Furthermore, this may cause a delay in transporting the TAB parts 4 to the outer lead bonding device 12, making it impossible to perform outer lead bonding efficiently.

Furthermore, the carrier tape 1 cannot be fed and the TAB part 4 to be punched out next can be supplied to the upper surface of the lower mold 6 until after the punched TAB part 4 is taken out. The efficiency is not good when performing continuously.

On the other hand, when suctioning the TAB component 4 with the suction head 11 provided at the tip of the arm 10, or when removing the TAB component from the suction head 11 and transporting it to the outer lead bonding device 12, etc. It is conceivable that the suctioned TAB component 4 may easily shift from the initial suction position. Therefore, in order to accurately insert the TAB component 4 onto the circuit board 5 (not shown) placed in the outer lead bonding device 12, the attitude of the TAB component 4 is detected during transportation, and the attitude of the TAB component 4 is detected during transportation. A device is needed to correct this.

(Problem to be solved by the invention) As described above, in the conventional apparatus, it takes time from punching out the TAB parts from the carrier tape to inserting the punched TAB parts onto the circuit board. Therefore, the work efficiency of outer lead bonding was sometimes poor.

This invention was made to solve the above-mentioned problems, and it is possible to efficiently insert a chip punched out of a film carrier tape onto a circuit board placed on the stage of an outer lead bonding device. It is an object of the present invention to provide a board insertion device that can perform the following operations.

[Structure of the invention] (Means and effects for solving the problem) The second invention was made to solve the above problem, and is made by punching out the TAB parts from the carrier tape and using the punched TAB parts.
a first mold equipped with a punch for adsorbing AB parts, and a second mold disposed opposite to the punch and having a through hole formed in a portion corresponding to the punch for passing the TAB part punched from the carrier tape. a mold, a moving means for moving the first mold and the second mold in directions opposite to each other to perform a punching operation; A mounting stage holding a circuit board to be inserted, and a TAB punched by the punch and passing through the through hole of the mold.
moving the suction nozzle that suctions the component and the suction nozzle that suctioned the TAB component to the mounting stage;
The present invention is characterized by comprising a TAB component conveying means for inserting the TAB component onto the circuit board.

According to configuration 2, the TAB part punched by the punch passes through the through hole provided in the second mold and is held by the suction nozzle, and the suction nozzle
While holding the component, the TAB component transport means moves it to the stage for outer lead bonding, and the suction nozzle directly inserts the TAB component onto the circuit board held on the stage for outer lead bonding.

(Embodiment) An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

FIG. 1 is a schematic configuration diagram of a TAB component insertion device.

In the figure, 15 is a pedestal. A base plate 16 is provided on the upper surface of the pedestal 15. On the upper surface of the base plate 16, a punching device 17, a mounting stage 18, and a paste stand 19 are arranged in parallel and spaced apart.

At both ends of the base plate 16, a pair of support columns 20, 20 are erected in parallel and spaced apart. This pair of support pillars 20
．． A guide rail 21 is installed at the upper end of 20,
This guide rail 21 extends across the punching device 17, the mounting stage 18, and the paste stand 19.

A first movable body 23 is slidably provided on the guide rail 21 via a first slider 24, and this first movable body 23 is connected to the punching device 17 and the stage 1.
Slide back and forth between 8. The first moving body 23 is T
A suction nozzle 22 for suctioning AB parts is held slidably in the vertical direction. This suction nozzle 22 is driven in the vertical direction along the first moving body 23 by a drive device (not shown).

Further, a second moving body 26 or a second slider 27 is slidably provided on the guide rail 21, and the second moving body slides back and forth between the stage 18 and the paste table 18. It has become. The second moving body holds a stamp head 25 that transfers the paste so as to be slidable in the vertical direction. This stamp head 2
5 drives the second moving body 2 by a drive device (not shown).
6 in the vertical direction.

The punching device 17 has a substrate 28 .

This board 28 is fixed to the upper surface of the base plate 16, and guide columns 29 are erected in parallel and spaced apart from each other at both ends of the upper surface. A first support plate 30 is provided in the middle of the guide column 29 in the vertical direction, parallel to the substrate 28, and is slidable along the guide column 29. The upper surface of a holding plate 31 is fixed to the lower surface of the support plate 30. The upper end of a drive shaft 33 of a drive cylinder 34 is fixed to the lower surface of this holding plate 31.

The drive cylinder 34 is connected to the frame 1 on the lower surface side of the board 28.
It is fixed within 5. The first support plate 30 is moved to the guide column 29 by the drive cylinder 34.
It is designed to be driven vertically along the

As shown in FIG. 2, a lower mold 35 for holding a punch 39 is provided on the upper surface of the first support plate 3°. This lower mold 35 has a lower boulder 36 whose lower surface is fixed to the upper surface of the support plate 30 . This lower holder 3
6 is provided with a punch plate 37 having a recess 37a in the center of the upper end surface.

A punch 39 is fixed to a recess 37a provided in the center of the upper surface of the punch plate 37, and its upper end protrudes upward from the upper surface of the punch plate 37. Further, the punch 39 is provided with a suction hole 39a whose one end opens at the upper end surface of the punch 39 and whose other end is connected to a vacuum means (not shown).

Furthermore, a pair of guide poles 38 and 38 are erected at both widthwise ends of the upper surface of the lower holder 36 in parallel and spaced apart.
They pass through the punch plate 37 and project upward. At the upper end of this guide pole 38.
A holding plate 4o is provided so as to be slidable along the guide poles 38, 38. The pressing plate 4o is arranged horizontally, and has a through hole 40a in the center thereof through which the upper end of the punch 39 passes. Also,
The guide pole 38 on the upper surface of the punch plate 37
．． A concave portion 37b that opens on the upper surface of the punch plate 37 is provided around the periphery of the punch plate 38. The lower end of the spring 41 is fitted into the recessed portion 37b. The spring 41 is provided to rotate around the guide pole 38, and its upper end is attached to the presser plate 40.
The holding plate 40 is fixed to the lower surface of the holding plate 40 to elastically hold the holding plate 40.

Normally, the upper end surface of the punch 39 does not protrude from the upper surface of the presser plate 40, and the presser plate 40 resists the repulsive force of the spring 41 and pushes the guide pole 3
8, the upper end of the punch 39 passes through the through hole 40a of the holding plate 40 and protrudes 8T from the upper surface 40 of the holding plate.

As shown in FIG. 1, the upper end surface of the guide column 29 has a second
The support plate 42 is fixed parallel to and spaced apart from the first support plate 30. The second support plate 42 is formed of a rectangular plate-like member, and as shown in FIG. A first notch 43 is formed.

As shown in FIG. 2, an upper mold 44 as a second mold is provided on the lower surface of the second support plate 42. As shown in FIG. The upper mold 44 has an upper holder 45 whose upper surface is fixed to the lower surface of the second support plate 42 . Above upper holder 4
5 has a second notch 45a that vertically communicates with a U-shaped notch 43 formed in the second support plate 42. Further, a holder 46 is provided on the lower surface of the upper holder 45. The area from the upper surface of the holding body 46 to the middle part in the vertical direction is the first point. Second notch 43, 45
A third notch 46a communicating in the vertical direction is bored in a. A through hole 46b facing the punch 39 is bored in the center of the lower end of the holder 46.

The through hole 46b opens at the lower end or the lower end surface of the holder 46, and the upper end opens into the third notch 46a.

Then, the suction nozzle 22 of the first movable body 23 provided on the guide rail 21 passes through the first to third notches 43.45a, 46a to the through hole 4 of the holder 46.
It is designed to be positioned and driven above 6b.

The holder 46 also has a guide hole 46 that opens on the lower surface.
Cs 46c are bored, so that when the first holding plate 30 is driven by the drive cylinder 34 and raised, the upper ends of the guide poles 38, 38 enter the guide holes 46c, 46c. ing.

A carrier tape 1 is placed around the lower end opening of the through hole 46b.
L-shaped guides 47, 47 for holding are provided at a distance. Then, the carrier tape 1 is sent by a tape feeding means (not shown), and the pair of guides 47
．． The messages are sent sequentially during the period of 47.

The mounting stage 18 has approximately the same height as the holder 46 of the upper mold 44. A guide groove 18a into which the circuit board 5 is positioned and inserted is bored in the upper end surface of the stage 18 for mounting. The circuit board 5 is inserted into the guide groove 18a by an insertion means (not shown). Further, above the mounting stage 18, a head of a bonding tool (not shown) is arranged to bond the TAB component 4 and the circuit board 5.

Further, the paste table 19 is formed at a height between the mounting stage 18 and has a supply/l1t19a provided on its upper end surface through which paste is sequentially supplied by a supply means (not shown). .

The second moving body 26 is configured to slide along the guide rail 21 in conjunction with the first moving body 23. When the first moving body 23 moves onto the punching device 17, the second moving body 26 moves onto the mounting stage 18. Further, when the first moving body 23 moves onto the mounting stage 18, the second moving body 26 moves onto the paste table 19.

In the TAB component insertion device described above, once the carrier tape 1 is inserted between the guides 47 and 47 provided on the lower surface of the holder 16 of the upper mold 44 by the tape feeding means, the drive cylinder 34 It operates to drive the first holding plate 30 upward. Then, the pair of guide poles 38, 38 are first inserted into the guide holes 46c of the holder 46 of the upper mold 44, and the lower mold 35 is inserted into the upper mold 4.
Positioning is guided with respect to 4. Next, the upper end surface of the pressing plate 40 comes into contact with the lower surface of the carrier tape 1, and the springs 4 hold both ends of the carrier tape 1 in the width direction.
It is pressed against and fixed to the holding body 46 by the repulsive force of 1. At this time, a positioning pin (not shown) engages with the feed hole la (shown in FIG. 6) of the carrier tape 1, and positions the punch 39 so that the part indicated by the broken line S1 shown in FIG. 6 faces the upper end surface of the punch 39. be done. When the first holding plate 30 is driven further upward, the punch 3
9 punches out the carrier tape 1 along the broken line s1. The TAB part 4 punched out with three punches is inserted into the through hole 46b of the holder 46 as it is. Then, with the operation of the vacuum means (not shown), the TAB part 4
is suctioned through the suction hole 39a onto the upper end surface of the punch 39a without being displaced.

Next, the first moving body 23 moves to the guide rail 21.
along the first to third notches 43.45a, 46
a, and is positioned and driven above the through hole 46b. Accordingly, the suction nozzle 22 provided on the first movable body 23 is driven downward, and the tip thereof is inserted into the through hole 46b.
and engages with the upper surface of the punched TAB part 4. After the suction nozzle 22 suctions the upper surface of the TAB component 4 by vacuum means (not shown), suction of the punch 39 is stopped and the TAB component 4 is transferred to the suction nozzle 22. This transfer is performed within the through hole 46b, and the TAB component 4 is transferred to the suction nozzle 22 without slipping or popping out.

Next, when the suction nozzle 22 rises and the first moving body 23 is slid along the guide rail 21 in the direction of the mounting stage 18, the TAB
The part 4 is taken out from the punching device 17 and conveyed to a stage 18 for mounting.

Further, while the first movable body 23 is sucking the TAB component 4 punched out by the punching device 17, the circuit board 5 inserted onto the mounting stage 18 is
The stamp head 25 of the second moving body 26 transfers the paste onto it. When the first moving body 23 slides above the mounting stage 18 while adsorbing the TAB component 4, the second moving body 26 slides above the paste table 19.

Then, as the suction nozzle 22 of the first movable body 23 descends, the stamp head 25 of the second movable body 26
also descends. When the suction nozzle 22 or the TAB component 4 is inserted into the circuit board 5, the stamp head 25 suctions the paste from the paste table 19.

On the other hand, while these operations are being performed, the punching device 17 has already punched out the next TAB component 4, so the suction nozzle 22 is able to place the TAB component on the circuit board 5.
After inserting part B 4, repeat the above operation again,
Products in which TAB parts 4 are inserted into circuit boards 5 are manufactured continuously.

According to such a TAB component insertion device, the TAB component 4 punched by the punch 39 can be inserted into the hole provided in the holder 46 of the upper mold 44 without separating the punch 39 and the upper mold 44. It can be taken out from the hole 46a by the suction nozzle 22.

Further, since the punch 39 is provided with a suction hole 39a and punches the TAB part 4 while sucking it, the TAB part 4 does not shift from the tip of the punch 39 during punching.

The TAB from the punch 39 to the suction nozzle 22
The parts 4 are received and transferred inside the through hole 46a of the holder 46. As a result, the inner wall of the through hole 46a serves as a guide, so that the TAB component 4 will not be scratched. That is, since the TAB component 4 is positioned and suctioned with high precision at the tip of the suction nozzle 22, when the TAB component 4 is inserted onto the circuit board 5 placed on the stage 18 of the mount, the Suction nozzle 22
There is no need to detect the attitude of the TAB component 4 held in the position.

In addition, the suction nozzle 22 or the TAB part 4 can be attached to the upper mold 4.
4 and directly inserts the TAB component 4 onto the circuit board 5, unlike the conventional example.
There is no need to separately provide a means for taking out the part 4 from the punching device 17 and a means for transporting the taken out TAB part 4, and there is no need for a complicated mechanism for interlocking the two means. In addition to simplifying the equipment, TAB
It is possible to speed up the insertion and attachment of the component 4.

On the other hand, since a pair of guides 47 and 47 are provided on the lower surface of the holding plate 46 of the upper mold 44, the punch 39 and the upper mold 44
The carrier tape 1 can be pitch-fed between the punch 39 and the upper die 44 without completely separating them. As a result, the next punching operation can be started immediately after the punch 39 and the upper mold 44 are separated, so that continuous punching can be performed efficiently and at high speed.

Furthermore, when inserting many types of TAB parts 4 on the circuit board 5, punching devices 17 corresponding to the types can be arranged in series along the guide rail 21. The TAB parts 4 punched out by the respective devices in the first moving body 23 can be inserted onto one circuit board 5. In such a case, it is possible to deal with it by simply changing the operating program, and it is easy to use TAB.
It is also possible to insert and attach the component 4.

Further, if polyimide, polyester, BT resin, or the like is used as the base material of the carrier tape 1, the life of the punch 39 that penetrates the carrier tape 1 will not be deteriorated.

Note that the present invention is not limited to the above-mentioned embodiment, and can be modified in various ways without departing from the spirit thereof.

For example, in the above embodiment, the movable body 23 that moves along the guide rail 21 (in the X direction) serves as the TAB component conveying means.
, an X-Y robot consisting of a suction nozzle 22 that moves in the vertical direction (Y direction) along this movable body 23 was used, but the guide rail 21 was not provided, and an arm that rotated on a horizontal plane was provided. A similar effect can be obtained by using a θ-Y robot, which has a vertically moving suction nozzle and a stamp head at the tip of its arm.

[Effects of the Invention] As described above, the present invention moves the punch provided in the first die and the second die to face each other to punch out a TAB part from the carrier tape, and then punches out the TAB part from the carrier tape. The TAB component was suctioned with a suction nozzle through a through hole provided in the second mold, and the TAB component was directly inserted into a circuit board held on a mounting stage using the suction nozzle.

Therefore, it is possible to punch out TABe products from the carrier tape at high speed, and the TAB parts can be inserted at high speed and with high precision onto the circuit board held on the mounting stage, improving work efficiency. It has the effect of being able to do something.

[Brief explanation of the drawing]

1 to 6 show an embodiment of the present invention,
FIG. 1 is a schematic configuration diagram of the TAB component insertion device, FIG. 2 and FIG. 3 are the same. FIG. 5 is a plan view of the film carrier tape after inner lead bonding, FIG. 6 is a plan view of a circuit board into which TAB parts are inserted, and FIG. 7 is a schematic configuration of a punching device that is a conventional example of the present invention. It is a diagram. 4... TAB parts, 18... Stage for mounting,
22... Suction nozzle, 23... First moving body (TA
B parts conveying means), 34... Drive cylinder (moving means), 35... Lower mold (first mold), 39... Punch, 43... First notch, 44. - Upper mold (second mold), 45a... second notch, 46... holding body, 46a... third notch, 46b... through hole. Applicant's agent Patent attorney Takehiko Suzue 18 --- Stage for Afund 22 ---=
l'J Shy nozzle 23---Flower】/) Guide to movement 4 grains 3
4-Ichiro Ward 1 Sword Nosonoda 35---Buma 2nd Recognition 39
---Travel meeting 43--- V, i/l Koto de @ 44-1124 Toshosha 45a---
12m field 46---41 bodies 4sa-434rr
ttp46b --- Figure 1 Figure 2 Figure 3 / Figure 4 Figure 6 Figure 7

Claims (1)

[Claims] a first mold equipped with a punch that punches out TAB parts from the carrier tape and adsorbs the punched TAB parts; and a first mold that is arranged opposite to the punch and holds the TAB parts punched out of the carrier tape in a portion corresponding to the punch. a second mold having a through hole formed therein; a moving means for moving the first mold and the second mold in opposite directions to perform a punching operation; and the punch and the mold. a mounting stage that holds a circuit board into which a TAB component is inserted and is spaced apart from the stage;
A suction nozzle that suctions the TAB component that has been punched out by the punch and passed through the through hole of the mold, and a suction nozzle that has suctioned the TAB component are moved to the mounting stage, and the TAB component is placed on the circuit board. TAB component conveying means for inserting the TAB component into the
AB parts insertion device.