JPH031549A - Integrated circuit chip feeder - Google Patents

Abstract

PURPOSE:To reduce the number of chip handlings and eliminate a jig for conveying a separated chip by a method wherein an ultrasonic wave is applied to an indicated chip and the indicated chip only is taken out from a wafer without giving influence upon adjoining chips and mounted on the predetermined position of a predetermined lead frame. CONSTITUTION:A separating collet 10 is placed directly above a chip 1 in accordance with map data concerning marks indicating whether respective chips are acceptable or defective and positions of the respective chips. The separating collet 10 is driven by an activator and its attracting part is pressed against the chip 1. The ultrasonic wave absorber 121 of the attracting part presses the respective side parts of chips 11-14 adjacent to the chip 1. Then the chip 1 is attracted to the separating collet 10 by vacuum suction and ultrasonic vibration is applied to cut the separating grooves 10 of the chip 1. A chip detecting sensor 17 detects that the chip 1 is separated and lifted from the wafer 2 and the separating collet 1 and a pressure collet 12 are made to ascend as a unified unit. The separated and lifted chip 1 is conveyed with the separating collet 10 onto a lead frame by a robot arm and fixed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention involves separating each integrated circuit chip of a wafer on which a circuit pattern is formed, picking it up and transporting it to a lead frame, and placing it in a predetermined position on the lead frame. The present invention relates to an integrated circuit chip supply device mounted at a location.

[Prior Art] Conventionally, a wafer on which a circuit pattern has been formed is non-through cut into, for example, a certain chip size using a dicing saw in a dicing process, and then an adhesive sheet with an adhesive layer provided on the surface is applied to the back side of the wafer. All chips on the wafer are divided at once on the adhesive sheet by applying a chip breaker to the adhesive sheet.

FIG. 4 is a schematic perspective view of a jig type integrated circuit chip supply device.

For example, defective chips are marked with ink or the like on the divided chip surfaces during the circuit test performed in the wafer test process before the dicing process, so good chips are selected from among the divided chips 41. Only the chips are sorted, packed into a chip magazine 42, etc., and supplied to the next die bonding process. In the die bonding process, chips are picked up one by one from a magazine 42 containing only good chips by a transporting collet 43 of an integrated circuit chip supply device installed in a die bonding device (not shown, hereinafter referred to as die bonder). A device is placed on a positioning stage 44 for positioning the chip, where the chip is positioned using V-claws, etc., and picked up again by a bonding collet 46, which is also provided in the die bonder, and which grips the side surface of the chip. 46, the bonding collet 46 is moved and mounted on the lead frame 45 at a predetermined position.

FIGS. 5(a) and 5(b) are schematic perspective views of a direct pickup type integrated circuit chip supply apparatus from a chip-divided wafer.

In this method, a divided wafer 58 on which an adhesive sheet 60 has been applied, which has been divided all at once and fixed to a wafer frame 59, is directly supplied to the die bonder, and the adhesive sheet 60 is fixed on the wafer frame 59, which is fixed by pulling the adhesive sheet 60. Only the good chips detected and stored by the upper mark are picked up by the transporting collet 43 using the push-up bin 61 and supplied to the positioning stage 45.

[Problems to be Solved by the Invention] The above-described conventional integrated circuit chip supply device stores the divided chips 41 in the chip magazine 42 and transfers the divided chips 41 from the chip magazine 42 or the divided wafer 58 to the positioning stage 44. Supply and further positioning stage 4
4 to the package substrate 45 and the number of times of chip handling, the chips may not be cracked or chipped.
There is a high possibility of causing damage such as damage, which may reduce the yield in the integrated circuit chip mounting process.Also, since both methods divide the chip and then feed it to the die bonder, transportation and handling of the divided chip is difficult. The disadvantage is that the handling of the integrated circuit chip is complicated, as an upper jig must be used, and a positioning stage for the integrated circuit chip is essential to correct misalignment of the position and posture of the integrated circuit chip during division. There is.

SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated circuit chip supply device that requires less handling and does not require a jig for transporting divided chips.

[Means for Solving the Problems] The integrated circuit chip supply device of the present invention includes: a wafer stage on which a wafer is fixed and positioned; a detection unit that detects alignment marks on a wafer placed on the wafer stage; an oscillator; an adsorption unit that adsorbs the surface of a specified chip on a wafer positioned on a wafer stage; and an ultrasonic excitation unit that applies ultrasonic waves from an ultrasonic oscillator to the chip when the adsorption unit adsorbs the chip. a separation collet consisting of an actuator that linearly moves the separation collet; a chip detection sensor that detects whether or not the separation collet has separated the chips that it has attracted from the wafer; and a separation collet that is moved by the actuator so that the absorption part From the time the specified chip is contacted until the chip is separated from the wafer stage and floats, all the depths adjacent to the chip are pressed, and when the chip is separated from the wafer and floats, the A pressure collet that guides the side surface of the chip, an actuator that moves the pressure collet in a straight line, and a pass/fail mark that is pre-marked on each chip on the wafer after the alignment mark is detected by the detection unit. a chip information reading unit that reads and stores the position of the chip on the wafer; a chip information reading unit that holds the separating collet and the pressurizing collet so that their moving directions are perpendicular to the wafer stage; and the actuators of both collets are attached. A robot arm that moves the robot arm three-dimensionally, a robot arm drive mechanism that moves the robot arm three-dimensionally, and a separation collet that is located directly above the chip that is marked with a good mark stored in the chip reading section. The robot includes a control unit that controls a robot arm drive mechanism so that the attracted separation collet moves onto the lead frame.

[Operation] A non-through-cut wafer is positioned and placed on the wafer stage, the separation collet is adsorbed to the specified chip, and the chips adjacent to the chip are pressed, and the ultrasonic wave is applied to the specified chip. The divided chips are separated by applying vibration to the chip, extracting only the chip from the wafer without affecting adjacent chips, and mounting it at a predetermined position on a predetermined lead frame. There is no need to store the chips in a chip magazine or provide a positioning stage, reducing the number of handling operations and eliminating the need for jigs.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an embodiment of the integrated circuit chip supply device of the present invention, and FIGS. 2(a), (b), to (g) are steps of the integrated circuit chip supply device shown in FIG. FIGS. 3(a) and 3(b) are perspective views showing the operation, and sectional views showing how chips are extracted from a through-cut wafer and a non-through-cut wafer, respectively.

This integrated circuit chip supply device is an LSI chip supply device, and includes a separation collet 10, an ultrasonic oscillator (not shown), a pressure collet 12, a wafer stage 5, a detection section 6,
It consists of a chip reader (not shown) and a robot. The robot is supported by a support 7, one end of which moves up and down along the support 7 and is rotatable, and the other free end supports a separation collet 10 and a pressure collet 12 whose movement direction is perpendicular to the wafer stage 5. and the robot arm 8 to which these actuators 14, 15 are attached.
, a robot arm drive mechanism (not shown) that moves the robot arm three-dimensionally, and a control section (not shown) that controls the robot arm drive mechanism (not shown). The separation collet 10 is a cylindrical collet adapter 10 with a rectangular contact surface no larger than the surface of the LSI chip 1. and a suction hole 10°(
2 (g)), an ultrasonic oscillator (not shown) provided on the upper part of the collet adapter 103 transmits ultrasonic waves at or near the resonant frequency of the chip 1 to the chip 1 via the collet adapter 103. These are attached to the free end of the robot arm 8 via an arm 13 that is moved vertically to the wafer stage 5 by an actuator 14. The pressurizing collet 12 has a rectangular downward projecting portion 12 with each of its lower four sides projecting downward. is formed,
It is a cube in which a through hole 123 through which the collet adapter 103 passes is provided at the center of its upper end, concentrically with the adapter, and an ultrasonic absorber 121 is attached to each lower end of the downward protrusion 124, so that ultrasonic waves can be absorbed between the downward protrusion 124 and The inner wall of the absorber 121 has a size such that when the adsorbed chip 1 is separated and floated, the side surface becomes a guide to be lifted along the inner wall, and the thickness of the wall is set so that the adsorbed chip 1 is separated and floated. Chip 18.1□+13 adjacent to chip 1 until separation and levitation
A chip detection sensor 1 is provided on at least one set of opposing sides of the downward protrusion 12 to detect whether or not the separation collet 10 holds a chip.
7, and a support arm 12 that moves vertically by driving an actuator 15 along a linear guide 16 vertically provided near the free end of the robot arm 8.
□ is installed at a right angle. The wafer stage 5 is provided at a fixed position relative to the support column 7, and the wafer stage 5
．． , .

A chip reading section (not shown) reads the good/bad mark marked in advance on each chip on the aligned wafer 2 and stores it together with the position of each chip on the wafer 2.

Next, the operation of this embodiment will be explained in Figs. 2(a) to (g).
) will be explained with reference to FIGS. 3(a) and 3(b).

The wafer 2, which has been non-through cut to the depth of the dividing groove 1° (FIG. 2(a)) leaving a thickness determined by the material of the wafer 2, is fixed with its back side on the wafer stage 5, and the detection unit 6 After the alignment mark 4 is detected and aligned, first, the chip information reading unit ( (not shown).

On the other hand, the lead frame 20 is fixed at a predetermined position on the lead frame stand 9 which is fixed relative to the support column 7. Next, when the operator instructs to supply the chips 1, the robot arm 8 uses the map data to position the plow separating collet 10 directly above the chips 1 (FIG. 2(a)). .

Next, the actuator 14 is driven to cause the separating collet 10 to press the suction part onto the chip 1, and then the actuator 15 is driven to lower the pressurizing collet 12.
The ultrasonic absorber 12. is chip 1 of chips 11-14
(FIG. 2(b)). next,
The chip 1 is attracted to the separation collet 10 by drawing a vacuum from the vacuum hole 10□, and then the ultrasonic vibrator 11 is activated to apply ultrasonic vibration to cut the separation groove 1° of the chip 1 to remove the chip. 1 from the wafer 2 (FIG. 2(C)). After applying ultrasonic waves for a certain period of time, the adsorption surface of the separation collet 10 is raised to the inner upper end of the downward protrusion 124 of the pressure collet. At this time, the chip detection sensor 17 detects that the chip 1 is separated and floating from the wafer 2 (Fig. 2 (d), Fig. 3 (b)), and the separation collet that adsorbs the chip 1 subsequently 10 and the pressurizing collet 12 rise together (FIG. 2(e)). At this time, the chip sensor 17
If no chip is detected, only the separation collet 10 descends again, and the adsorption and ultrasonic vibration are repeated. Next, the separated and floated chip 1 is transported by the robot arm 8 to just above the lead frame 20 together with the separating collet 10, and is then lowered to a predetermined position on the lead frame 20 and pressed against the inner wall of the pressurizing collet 12. It is guided and reaches the top of the lead frame 20, and the back surface is scrubbed with the dropped bonding agent 21 by a means not shown, and is pressed and fixed to the lead frame 20. Separation collet 10. The pressure collet 12 is replaced depending on the size of the chip.

In addition, in the case of a through-cut wafer, the chip separation operation using ultrasonic vibration is not performed, and the separation collet 1O is simply adsorbed to the chip 1, as shown in FIG. By only slightly raising the collet 10, the adhesive sheet 1B can be peeled off by the pressing action of the pressure collet 12, and there is no need to push the chip 1 up from below as in the conventional direct pickup method.

[Effects of the Invention] As explained above, the integrated circuit chip supply device of the present invention separates (divides) only predetermined non-defective chips from a positioned wafer through non-through cutting or through cutting, and places them on a lead frame. Because it is directly transported and loaded,
The number of times of chip handling after the dicing process is reduced to less than half compared to conventional methods, greatly reducing chip damage caused by handling, and eliminating the need for jigs such as chip magazines and wafer frames for pulling adhesive sheets, making chip handling between processes easier. This has the effect of greatly simplifying the process.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an embodiment of the integrated circuit chip supply device of the present invention, and FIGS. 2(a), (b), to (g) are steps of the integrated circuit chip supply device shown in FIG. A perspective view showing the operation, Figures 3(a) and 3(b) are cross-sectional views showing the state in which chips are separated from a through-cut wafer and a non-through-cut wafer, respectively, and Figure 4 is a conventional jig connection. FIG. 5(a) is a schematic perspective view of the integrated circuit chip supplying device of the method. (b) is a schematic perspective view of a direct pickup type integrated circuit chip supply device. 1.1□, 1□, ~, 14・-LSI chip, 1°・・
・Dividing groove, 16.-adhesive sheet, 2.. wafer,
3... Oriental flat, 4... Alignment mark, 5... Wafer stage, 6... Detection section,
7--Strut, 8--Robot arm, 9--Lead frame, 10--Separation collet, 101--Suction hole, 102
-...Evacuation tube, 10-...Collet adapter, 11...Ultrasonic excitation unit, 12...Pressure collet,
12,... Ultrasonic absorber, 12□... Support arm,
123--through hole, 124--downward protrusion,
13--Arm, 14.15--Actuator, 16--Linear guide, 17--Chip sensor, 20--Lead frame, 21--Binding agent. Patent applicant Nippon Telegraph and Telephone Corporation

Claims (1)

[Claims] 1. An integrated circuit chip supply device that separates each integrated circuit chip on a wafer on which a circuit pattern is formed individually from the wafer, picks it up, transports it to a lead frame, and mounts it at a predetermined position on the lead frame. A wafer stage that is fixed and positioned, a detection unit that detects alignment marks on the wafer placed on the wafer stage, an ultrasonic oscillator, and a surface of a designated chip on the wafer that is positioned on the wafer stage. A separation collet consisting of a suction part, an ultrasonic excitation part that applies ultrasonic waves from an ultrasonic oscillator to the chip when the suction part adsorbs the chip, and an actuator that moves the separation collet in a straight line. A chip detection sensor detects whether or not the chip has been separated from the wafer, and the separation collet is moved by an actuator and the adsorption unit contacts the designated chip until the chip is separated from the wafer stage and floats. a pressure collet that presses all chips adjacent to the chip and guides the side surface of the chip when the chip is separated from the wafer and floats; an actuator that moves the pressure collet in a straight line; and an actuator that moves the pressure collet in a straight line; A chip information reading unit that reads the pass/fail mark pre-marked on each chip on the wafer after being detected by the detection unit and stores it together with the position of the chip on the wafer; a separation collet and a pressure collet. is held so that its movement direction is perpendicular to the wafer stage, and a robot arm to which the actuators of both collets are attached, a robot arm drive mechanism that moves the robot arm three-dimensionally, and a memory stored in a chip reader. A robot including a control unit that controls a robot arm drive mechanism such that a separation collet is positioned directly above a chip marked with a good mark, and the separation collet that has attracted the chip moves onto a lead frame. An integrated circuit chip supply device having: