KR20090052627A - Pick up head and flip chip bonder having the same - Google Patents

Pick up head and flip chip bonder having the same Download PDF

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Publication number
KR20090052627A
KR20090052627A KR1020070119233A KR20070119233A KR20090052627A KR 20090052627 A KR20090052627 A KR 20090052627A KR 1020070119233 A KR1020070119233 A KR 1020070119233A KR 20070119233 A KR20070119233 A KR 20070119233A KR 20090052627 A KR20090052627 A KR 20090052627A
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KR
South Korea
Prior art keywords
chip
support
pick
magnet
unit
Prior art date
Application number
KR1020070119233A
Other languages
Korean (ko)
Other versions
KR101165034B1 (en
Inventor
옥지태
Original Assignee
삼성테크윈 주식회사
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Priority to KR20070119233A priority Critical patent/KR101165034B1/en
Publication of KR20090052627A publication Critical patent/KR20090052627A/en
Application granted granted Critical
Publication of KR101165034B1 publication Critical patent/KR101165034B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Abstract

The present invention provides a pickup head and a flip chip bonder having the same. The pick-up head is installed on the support, the support is movable in a direction away from or close to the chip pick-up unit for picking up the semiconductor chip, and the magnetic force against the external force applied when the external force is applied to the chip pick-up unit And first and second magnets respectively provided in the support and the chip pick-up unit so as to exert an elastic force. Therefore, according to the present invention, since the first magnet and the second magnet are installed to be spaced apart from each other in the pickup head and are provided to face the same polarity, even when a minute external force is applied to the chip pickup part for picking up the semiconductor chip, It is possible to exert elastic force by magnetic force against external force. Therefore, according to the present invention, it is possible to mitigate and absorb the shock applied to the semiconductor chips during the pickup of the semiconductor chips by the elastic force exerted as described above.

Flip chip, bonder

Description

Pick up head and flip chip bonder having same {Pick up head and flip chip bonder having the same}

The present invention relates to a pickup head and a flip chip bonder having the same, and more particularly, to a pickup head for picking up and transferring a semiconductor chip separated into a predetermined size and a flip chip bonder having the same.

In general, a semiconductor manufacturing process includes a Fab (FAB) process for forming a plurality of semiconductor chips on a semiconductor wafer, and a plurality of semiconductor chips formed in the fab process separately, and the separated semiconductor chips are individually packaged ( package) assembly process.

In addition, the assembly process includes a wafer mounting process in which an adhesive tape is attached to the back side of the wafer to prevent the semiconductor chips from being separated when the wafer is sawed, and a plurality of semiconductors in the wafer mounted using a diamond cutter. A wafer sawing process of separating the chips into individual pieces, and a chip bonding process of picking up the separated semiconductor chips and bonding them to a printed circuit board.

Among the above processes, the chip bonding process is performed by bonders. The bonders include die bonders, wire bonders, and flip chip bonders. Typically, die bonders and wire bonders are used continuously, and flip chip bonders are used separately.

Here, a die bonder refers to a device for picking up a semiconductor chip (also referred to as a 'die') manufactured by a semiconductor chip manufacturing process and bonding the printed circuit board to the printed circuit board. Refers to a device for bonding leads formed on a circuit board to each other with wires such as gold wires. In addition, the flip chip bonder forms a separate solder bump on a pad, which is an input / output terminal of the semiconductor chip, and then flips the semiconductor chip to turn a circuit pattern such as a carrier substrate or a circuit tape. A device that bonds directly to (Pattern).

Meanwhile, in order for the bonding operations of the semiconductor chips to be smoothly performed by the bonders, the picking operations of the semiconductor chips should be performed smoothly.

However, the pick-up operation of the semiconductor chips bonded to the adhesive tape may not be smooth due to the adhesive force of the adhesive tape.

Therefore, the semiconductor chip pick-up apparatus which picks up the semiconductor chips smoothly from the adhesive tape and picks up these semiconductor chips is used. .

1 shows an example of a conventional semiconductor chip pickup device.

Referring to FIG. 1, a conventional semiconductor chip pick-up apparatus 20 is disposed below the adhesive tape 12 so that the semiconductor chips 14 attached on the adhesive tape 12 are disposed thereon. And a pickup head 25 for picking up and picking up the semiconductor chips 14 pushed up thereon.

Accordingly, a portion of the semiconductor chips 14 attached to the adhesive tape 12 may be partially moved from the adhesive tape 12 by the action of the eject unit 23 that pushes the semiconductor chips 14 from the bottom to the top thereof. When being separated, the pickup head 25 smoothly absorbs and picks up the semiconductor chips 14 which are partially separated in this way.

On the other hand, the thickness of the semiconductor chips formed on the semiconductor wafer by the fab process according to the development of the process technology is getting thinner and thinner, it is fixed to the semiconductor chips 14 at the time of the pickup of the semiconductor chips 14 as described above When an impact greater than or equal to magnitude is applied, the semiconductor chips 14 are broken.

Therefore, the pickup head 25 has elastic means such as a coil spring (not shown) or an air cylinder (not shown) to alleviate and absorb the shock applied to the semiconductor chips 14 when the semiconductor chips 14 are picked up. Is provided.

However, in the coil spring as described above, it is very difficult to adjust the elastic force to the semiconductor chips 14. In other words, the coil spring must exert an elastic force against the minute external force to absorb and mitigate the shock applied to the semiconductor chips 14. In the case of the conventional coil spring, the coil spring may not exert the elastic force against the minute external force. In addition, it is very difficult to produce a coil spring to exert an elastic force against such an external force.

In addition, in the case of the air cylinder, a regulator is required to adjust the elastic force, and thus, the mechanism is complicated and expensive. In addition, the initial slip is unnatural, that is, a stick slip phenomenon occurs. There is a problem that it is very difficult to control to exert the elastic force against the external force.

Accordingly, the present invention has been made in view of the above problems, and a problem to be solved by the present invention is a pickup head capable of exerting elastic force against fine external forces in order to alleviate and absorb shocks applied to semiconductor chips and the same. It is to provide a flip chip bonder provided.

In addition, another problem to be solved by the present invention is to provide a pickup head and a flip chip bonder having the same easy to adjust the size of the elastic force.

According to the first aspect of the present invention for solving the above problems, a pickup head is provided. The pickup head includes a support; A chip pick-up unit installed on the support, the chip pick-up unit being installed to be movable in a direction away from or close to the support; And first and second magnets respectively provided to the support and the chip pick-up unit so as to exert an elastic force by magnetic force with respect to the applied external force when an external force is applied to the chip pick-up unit.

In another embodiment, the first magnet and the second magnet may be installed to be spaced apart at regular intervals facing each other, the polarities may be installed to face the same polarity.

In another embodiment, the support may be provided with a set screw for adjusting the distance between the first magnet and the second magnet.

In another embodiment, a vacuum hole may be formed at one end of the chip pick-up unit to suck the semiconductor chip by vacuum, and a vacuum line may be connected to a side of the chip pick-up unit to provide a vacuum to the vacuum hole. have.

In another embodiment, the pickup head may further include a rotary motor connected to the support to rotate the support so that the semiconductor chip picked up by the chip pick-up unit is flipped.

On the other hand, according to the second aspect of the present invention for solving the above problems, there is provided a flip chip bonder. The flip chip bonder may include a wafer stage on which a wafer having a plurality of separated semiconductor chips is seated; A bonding head for bonding the semiconductor chips to a substrate or a circuit tape; And a flip head which picks up the semiconductor chip provided on the wafer on the wafer stage and flips the picked up semiconductor chip to the bonding head. The flip head is installed on the support, the support is movable in a direction away from or close to the chip pick-up unit for picking up the semiconductor chip, and the magnetic force against the external force applied when the external force is applied to the chip pick-up unit And first and second magnets respectively provided in the support and the chip pick-up unit so as to exert an elastic force.

According to the present invention, since the first magnet and the second magnet, which are installed to be spaced apart from each other on the pickup head and are provided to face the same polarity, are provided with a chip pick-up part for picking up the semiconductor chip, even when a minute external force is applied, the external force is applied to the external force. The elastic force by the magnetic force can be exerted. Therefore, according to the present invention, by the elastic force exerted as described above it is possible to mitigate and absorb the shock applied to the semiconductor chips during the pickup of the semiconductor chips it is possible to prevent the breakage of the semiconductor chips.

In addition, the pickup head according to the present invention is provided with a set screw to adjust the distance between the magnets spaced apart from each other, that is, the distance between the first magnet and the second magnet. Therefore, the worker or the like can very easily adjust the magnitude of the elastic force exerted by the magnetic force through the set screw or the like.

Hereinafter, with reference to the accompanying Figures 2 to 5 will be described in detail preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided to ensure that the disclosed subject matter is thorough and complete, and that the scope of the invention to those skilled in the art will fully convey. Like numbers refer to like elements throughout.

2 is a perspective view showing an embodiment of a flip chip bonder according to the present invention.

2, a flip chip bonder 100 according to an embodiment of the present invention may include a wafer loader 110, a wafer stage 130, a vision camera 140, a pickup head 160, and a bonding head 180. And a central controller (not shown) for overall control of the flip chip bonder 100 of the present invention.

The wafer loader 110 has a magazine 90 loaded with a plurality of wafer frames 80. The magazine 90 is formed in a box type so that a plurality of wafer frames 80 are loaded in the vertical direction. In this case, the wafer frame 80 serves to fix the wafer 70 to an upper surface thereof through an adhesive tape (not shown) and the like, and may support only the edge of the wafer 70.

In addition, the wafer 70 fixed to the wafer frame 80 includes a plurality of semiconductor chips. In this case, each of the plurality of semiconductor chips is in a sliced state, that is, in a separated state. Accordingly, the pickup head 160 serving as the chip suction head may individually pick up each semiconductor chip provided in the wafer 80.

The wafer stage 130 fixes the wafer frame 80 that fixes the wafer 70, and moves and rotates the wafer frame 80 in the X, Y, and R directions as the process proceeds. Therefore, the wafer stage 130 is provided with a driving unit 134 for moving and rotating the wafer frame 130 in the X, Y, and R directions. In one embodiment, the driving unit 134 may include an X-axis moving motor 131, a Y-axis moving motor 132 and a wafer stage rotation motor 133. In this case, the X-axis rotation motor 131 serves to move the wafer stage 130 that fixes the wafer frame 80 in the X direction to move the wafer frame 80 in the X direction, and the Y-axis movement motor. 132 serves to move the wafer stage 130 that fixes the wafer frame 80 in the Y direction to move the wafer frame 80 in the Y direction, and the wafer stage rotation motor 133 is a wafer frame ( It serves to rotate the wafer stage 130 that fixes the wafer frame 80 to rotate the 80.

In addition, a gripper 125 transferring the wafer frame 80 loaded in the magazine 90 of the wafer loader 110 to the wafer stage 130 between the wafer loader 110 and the wafer stage 130. And a guide 120 for guiding the wafer frame 80 transferred by the gripper 125. In this case, the wafer frame 80 loaded in the magazine 90 of the wafer loader 110 may be smoothly transferred to the wafer stage 130 through the gripper 125 and the guide 120.

The vision camera 140 is fixed to the upper side of the wafer stage 130 and serves to recognize patterns that have been taught in advance. In one embodiment, the vision camera 140 is fixed above the central portion of the wafer stage 130, and is installed to be movable up and down.

In addition, a backup pin 150 indicating a chip pick-up position is provided at the center of the wafer stage 130 facing the vision camera 140. At this time, the backup pin 150 is installed to be movable in a predetermined distance up and down direction, and serves to raise the semiconductor chip located above the predetermined distance so that the semiconductor chip located thereon is picked up.

The pickup head 160 picks up a semiconductor chip on the wafer 70 positioned on the wafer stage 130 and supplies the semiconductor chip to the bonding head 180, which is a semiconductor chip bonding unit.

In other words, the pick-up head 160 picks up the semiconductor chip located on the upper side of the backup pin 150 among the semiconductor chips positioned on the wafer stage 130, rotates it about 180 °, or flips it, and then rotates the semiconductor chip. It serves to supply the chip to the bonding head 180 that is a semiconductor chip bonding. In this case, as described above, the backup pin 150 raises the semiconductor chip on the upper portion thereof by a predetermined distance so that the pickup head 160 picks up the semiconductor chip.

The bonding head 180 bonds the semiconductor chip supplied from the pickup head 160 to a circuit pattern such as a carrier substrate (not shown) or the circuit tape 60. At this time, the bonding head 180 is installed to be movable in the vertical direction. Reference numeral 190 denotes a supply rail for guiding the supply of the circuit tape 60.

Hereinafter, the pickup head 160 provided in the flip chip bonder 100 of the present invention will be described in more detail with reference to FIGS. 3 to 5.

3 is an enlarged view of portion A of FIG. 2, FIG. 4 is an exploded perspective view of the pickup head shown in FIG. 3, and FIG. 5 is a side view of the pickup head shown in FIG. 4.

3 to 5, the pickup head 160 according to the exemplary embodiment of the present invention is installed on the support 164 and the support 164 and is movable in a direction away from or near to the support 164. The chip pick-up unit 165 for picking up the semiconductor chip, the support 164 and the chip pick-up unit to exert an elastic force by the magnetic force against the applied external force when an external force is applied to the chip pick-up unit 165 The first and second magnets 171 and 172 respectively installed in the 165 and the semiconductor chips picked up by the chip pick-up unit 165 are connected to the support 164 to flip the support 164. Rotating motor 162 to rotate, and a body 161 connected to the rotary motor 162 to move the rotary motor 162 in a horizontal and vertical direction as the process proceeds.

Specifically, the shaft 163 of the rotary motor 162 is connected to the side of the support 164. Thus, when the rotary motor 162 rotates the shaft 163, the support 164 is rotated with the shaft 163 of the rotary motor 162.

In addition, a movement guide 168 for guiding the movement of the chip pickup unit 165 is installed on one surface of the support 164, for example, and the chip pickup unit 165 is the movement guide 168. It is installed in). Therefore, the chip pick-up unit 165 may move in a direction away from or close to the support 164 along the movement guide 168.

In one embodiment, the movement guide 168 may be an LM guide for guiding a linear movement of the chip pick-up unit 165. In this case, the chip pick-up unit 165 may be linearly moved in a direction away from or close to the support 164 along the LM guide.

In addition, when an external force is applied to the chip pick-up unit 165, the first magnet 171 of the magnets 170 for exerting an elastic force with respect to the applied external force may face the upper surface of the support 164. One side of the pick-up unit 165, which is installed at the bottom of the chip pick-up unit 165, and the second magnet 172 is positioned at the position facing the first magnet 171, on the top surface of the support 164. It is installed to be spaced apart from the first magnet 171 by a predetermined interval (G in Fig. 5).

The first magnet 171 and the second magnet 172 are installed to face the same polarity so that a repulsive force is applied therebetween.

Therefore, when an external force is applied to the chip pick-up unit 165, the chip pick-up unit 165 is moved in a direction approaching the support 164 along the movement guide 168 by the applied external force. do.

At this time, the first magnet 171 is provided on the bottom surface of the chip pick-up unit 165, the first magnet 171 is the second magnet 172 by the movement of the chip pick-up unit 165. It moves in the direction approaching. Therefore, when the first magnet 171 and the second magnet 172 is close to within a predetermined distance (G), the repulsive force acts between the first magnet 171 and the second magnet 172, This acting repulsive force eventually pushes the chip pickup unit 165 together with the first magnet 171 in a direction away from the support 164.

That is, the first magnet 171 and the second magnet 172 exerts an elastic force by the magnetic force with respect to the applied external force when an external force is applied to the chip pick-up unit 165. Reference numeral 173 is a fitting groove provided on the upper surface of the support 164 so that the second magnet 172 is installed.

On the other hand, a set screw 174 for adjusting the distance between the first magnet 171 and the second magnet 172 is installed on the other side, the bottom surface located in the opposite direction of one surface of the support 164. In other words, the set screw 174 is installed to penetrate the support 164 in the up and down direction through the bottom of the support 164, the upper end is installed to expose or protrude into the fitting groove 173.

Accordingly, the installation position of the second magnet 172 installed in the fitting groove 173 may vary depending on the length of the set screw 174 exposed or protruding into the fitting groove 173.

As a result, the distance between the first magnet 171 and the second magnet 172 can be adjusted by the set screw 174.

In other words, the distance G between the first magnet 171 and the second magnet 172 is related to the magnitude of the repulsive force acting by their polarity, that is, the elastic force, so that the worker or the like may set the set screw 174. By rotating or reverse rotation, it is possible to adjust the elastic force generated by the magnets 170.

In addition, a vacuum hole 167 is formed at one end of the chip pick-up unit 165 so that the semiconductor chip is sucked by vacuum, and a vacuum is applied to the side of the chip pick-up unit 165 by the vacuum hole 165. A vacuum line 166 for providing is connected.

Accordingly, a vacuum is provided to the vacuum hole 167, and the chip pickup unit 165 picks up the semiconductor chip by a suction method using a vacuum provided along the vacuum line 166.

Hereinafter, the bonding method of the flip chip bonder 100 according to the present invention will be described in detail with reference to FIGS. 2 to 5.

First, when a magazine 90 having a large number of wafer frames 80 is provided, a user or the like seats the magazine 90 on the wafer loader 110 of the flip chip bonder 100, and then the gripper 125 is mounted. The wafer frame 80 of the wafer loader 110 is loaded into the wafer stage 130 by using the same.

Next, when the wafer frame 80 is loaded, the vision camera 140 rotates the wafer stage 130 to align the wafer frame 80.

Subsequently, when the alignment of the wafer frame 80 is performed, the pickup head 160 picks up the semiconductor chip by vacuum adsorption from the wafer 70 of the aligned wafer frame 80 and flips it over, After flipping, the flipped semiconductor chip is supplied to the bonding head 180, which is a semiconductor chip bonding unit. Therefore, the bonding head 180 bonds the semiconductor chip supplied from the pickup head 160 to the substrate or the circuit tape 60.

In this case, when the pickup head 160 picks up the semiconductor chip, the backup pin 150 located below the semiconductor chip is positioned above the pickup head 160 so as to smoothly pick up the semiconductor chip. When the semiconductor chip is raised a predetermined distance, if the elastic means is not provided in the pickup head 160 or the elastic means is not properly operated, the semiconductor chip to be picked up may be subjected to an impact.

However, the pick-up head 160 according to the present invention is installed so as to be spaced apart from each other so as to exert an elastic force by magnetic force against the applied external force, even when a minute external force is applied to the chip pick-up unit 165 for picking up the semiconductor chip. Since the first magnet 171 and the second magnet 172 provided to face the polarity are provided, the impact applied to the semiconductor chips during the pickup of the semiconductor chips is an elastic force exerted by the magnets 170 as described above. To be alleviated and absorbed. Therefore, by using the pickup head 160 according to the present invention, it is possible to mitigate and absorb the shock applied to the semiconductor chips during the pickup of the semiconductor chips to prevent the breakage of the semiconductor chips.

As mentioned above, although the present invention has been described with reference to the illustrated embodiments, it is only an example, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. For example, the present invention has been described using a flip chip bonder as an equipment having a pickup head as an example, but this is only an example, and the pickup head according to the present invention may be applied and mounted to various equipment in addition to the flip chip bonder. . Therefore, the scope of the present invention should be defined by the appended claims and their equivalents.

1 is a cross-sectional view showing an example of a conventional semiconductor chip pickup device.

2 is a perspective view showing an embodiment of a flip chip bonder according to the present invention.

FIG. 3 is an enlarged view of a portion A of FIG. 2.

4 is an exploded perspective view of the pickup head shown in FIG. 3.

5 is a side view of the pickup head shown in FIG. 4.

Claims (10)

Support; A chip pick-up unit installed on the support, the chip pick-up unit being installed to move in a direction away from or close to the support and picking up the semiconductor chip; And, A pickup head including first and second magnets respectively provided to said support and said chip pick-up part so as to exert elastic force by magnetic force against said applied external force when said external force is applied to said chip pick-up part. The method of claim 1, The first magnet and the second magnet is installed so as to be spaced apart from each other facing each other, the pickup head, characterized in that the polarities are installed to face the same polarity. The method of claim 2, The support head is characterized in that the set screw is installed to adjust the distance between the first magnet and the second magnet. The method of claim 1, A vacuum hole is formed at one end of the chip pick-up unit to suck the semiconductor chip by vacuum. Pick-up head, characterized in that the vacuum line for providing a vacuum to the vacuum hole is connected to the side of the chip pickup. The method of claim 1, And a rotary motor connected to the support to rotate the support such that the semiconductor chip picked up by the chip pick-up unit is flipped. A wafer stage on which a wafer having a plurality of separated semiconductor chips is seated; A bonding head for bonding the semiconductor chips to a substrate or a circuit tape; And, Picking up the semiconductor chip provided on the wafer on the wafer stage and flipping the picked up semiconductor chip to supply to the bonding head, the support is installed on the support, the support, but installed to be movable in a direction away from or close to the support A chip pick-up part for picking up a chip, and first and second magnets respectively provided on the support and the chip pick-up part so as to exert elastic force by magnetic force against the applied external force when an external force is applied to the chip pick-up part; Flip chip bonder with pickup head. The method of claim 6, The first magnet and the second magnet are installed so as to be spaced apart at regular intervals facing each other, the polarities of the flip chip bonder, characterized in that installed to face the same polarity. The method of claim 7, wherein And a set screw installed on the support to adjust a distance between the first magnet and the second magnet. The method of claim 6, A vacuum hole is formed at one end of the chip pick-up unit to suck the semiconductor chip by vacuum. Flip chip bonder, characterized in that the vacuum line for providing a vacuum to the vacuum hole is connected to the side of the chip pickup. The method of claim 6, The pickup head And a rotary motor connected to the support to rotate the support such that the semiconductor chip picked up by the chip pick-up unit is flipped.
KR20070119233A 2007-11-21 2007-11-21 Pick up head and flip chip bonder having the same KR101165034B1 (en)

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KR20070119233A KR101165034B1 (en) 2007-11-21 2007-11-21 Pick up head and flip chip bonder having the same

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Application Number Priority Date Filing Date Title
KR20070119233A KR101165034B1 (en) 2007-11-21 2007-11-21 Pick up head and flip chip bonder having the same

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KR20090052627A true KR20090052627A (en) 2009-05-26
KR101165034B1 KR101165034B1 (en) 2012-07-13

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811398A (en) * 2012-11-05 2014-05-21 英飞凌科技股份有限公司 Adjustable pick-up head and method for manufacturing a device
CN107507789A (en) * 2017-08-03 2017-12-22 宁波尚进自动化科技有限公司 One kind rotation grain-clamping table

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3845322B2 (en) * 2002-03-11 2006-11-15 松下電器産業株式会社 Weighting method using voice coil motor, component mounting apparatus using the same, and voice coil motor used therefor
JP2003347389A (en) 2002-05-23 2003-12-05 Hitachi High-Tech Instruments Co Ltd Moving apparatus for semiconductor chip
JP4733507B2 (en) * 2005-11-22 2011-07-27 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103811398A (en) * 2012-11-05 2014-05-21 英飞凌科技股份有限公司 Adjustable pick-up head and method for manufacturing a device
CN107507789A (en) * 2017-08-03 2017-12-22 宁波尚进自动化科技有限公司 One kind rotation grain-clamping table

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