JP5078424B2 - Electronic component mounting equipment - Google Patents

Description

This invention relates to the implementation equipment for mounting an electronic component such as a semiconductor chip to a substrate such as a film-shaped tape or lead frame.

  As a mounting method for mounting a semiconductor chip as an electronic component on a substrate such as a carrier tape or a lead frame, a flip chip method is known in which a bump formed on the semiconductor chip is mounted on the upper surface of the substrate. .

  A mounting apparatus for mounting a semiconductor chip on a substrate by a flip chip method has a component supply unit. The component supply unit is provided with a wafer stage on which a synthetic resin wafer sheet is stretched. A semiconductor wafer divided into a large number of semiconductor chips is attached to the wafer sheet.

  When the semiconductor stage to be picked up by driving the wafer stage in the horizontal direction (X, Y direction) is positioned at a predetermined position, the semiconductor chip is pushed up by a push-up pin, and is picked up by a pickup nozzle constituting the reversing pickup device. Adsorbed and picked up.

  The pickup nozzle that picks up the semiconductor chip is driven to rotate 180 degrees around the axis in the horizontal direction. Thereby, the semiconductor chip is inverted in the vertical direction. That is, the surface on which the bumps of the semiconductor chip that are facing upward on the wafer stage are converted downward. Next, the inverted semiconductor chip is transferred to a mounting tool, and the semiconductor chip is mounted on the substrate by the mounting tool.

  Conventionally, when a semiconductor chip inverted by the pickup nozzle is transferred to the mounting tool, the transfer is performed at an intermediate position between a transfer unit that transfers the substrate and a component supply unit that supplies the semiconductor chip. It was like that.

  This is because the distance between the mounting tool for mounting the semiconductor chip on the substrate and the upper surface of the substrate that is pitch-fed by the transport means should be as small as possible in consideration of the mounting tact of the semiconductor chip by the mounting tool. Is done.

  On the other hand, the pickup nozzle constituting the reversing pickup device must be provided at the tip of the movable body driven in the horizontal direction so that it can be driven in the θ direction by the θ driving element and can be driven in the Z direction by the Z driving element. There is.

  For this reason, since the tip of the movable body has a limit in miniaturization, if the distance between the mounting tool and the substrate is reduced, the tip of the movable body in which the pickup nozzle is provided cannot be inserted between them. There is.

As a result, when the semiconductor chip picked up by the pick-up nozzle is delivered to the mounting tool, the delivery means and the semiconductor chip for feeding the substrate, which is a position outside the space between the substrate and the mounting tool, are supplied. It was performed at a position between the parts supply unit. Such a prior art is shown in Patent Document 1.
JP 2002-26074 A

  The position where the semiconductor chip is transferred to the mounting tool is located between the substrate and the mounting tool that stands by above the substrate. When the semiconductor chip is mounted on the substrate, it is necessary to receive the semiconductor chip by driving the mounting tool waiting above the substrate in the horizontal direction to the delivery position each time the semiconductor chip is mounted on the substrate. After receiving the semiconductor chip, it must be driven again in the horizontal direction to the mounting position above the substrate, and then driven downward in the mounting position.

  Since the mounting tool must apply a mounting load to the semiconductor chip at the time of mounting, the mounting unit on which the mounting tool is provided inevitably needs to have high rigidity, and it is inevitable that the mounting tool becomes heavy.

  For this reason, each time a semiconductor chip is mounted, the mounting unit having increased weight must be reciprocated in the horizontal direction between the semiconductor chip delivery position and the mounting position. As a result, it takes time for the mounting unit to reciprocate and to stabilize the vibration of the mounting unit after driving, which may increase the tact time and affect the mounting accuracy of the semiconductor chip. It was.

The present invention is to provide a mounting equipment of electronic components to be able to improve the shortening mounting accuracy of the tact time.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
A pickup nozzle that takes out the electronic component from the component supply unit and reverses the electronic component by 180 degrees in the vertical direction;
Horizontal driving means for driving the pickup nozzle in the horizontal direction and positioning the substrate above the portion where the electronic component is mounted;
Waiting above the substrate and receiving the electronic component from the pickup nozzle positioned above the portion where the electronic component of the substrate is mounted by the horizontal driving means, and descends without being driven in the horizontal direction. A mounting tool for mounting the electronic component on the substrate;
A horizontal movable body driven in the horizontal direction by the horizontal driving means;
A Z movable body provided on the horizontal movable body so as to be driven in a vertical direction intersecting the horizontal direction by a first Z drive source;
The pickup nozzle extends in the horizontal direction from one end of the Z movable body, and is provided at the tip so that the pickup nozzle can be driven in a rotational direction around an axis parallel to the horizontal direction by a θ drive source. An electronic component mounting apparatus comprising: an arm portion capable of entering between the mounting tool standing by above the substrate .

  According to the present invention, the electronic component that has been reversed by the pickup nozzle above the substrate on which the mounting tool waits is delivered to the mounting tool, so that the electronic component is mounted on the substrate without driving the mounting tool in the horizontal direction. Therefore, the tact time can be shortened and the mounting accuracy can be improved.

In addition, a horizontal movable body that is driven in the horizontal direction is provided with a Z movable body that is driven in the Z direction by the first Z drive source, and an arm portion is extended from one end of the Z movable body, and a tip portion of the arm portion. Since the pickup nozzle can be driven in the rotational direction, the first Z drive source for driving the Z movable body in the Z direction at the tip of the arm portion can be omitted.

  As a result, the tip of the arm portion can be reduced in size, so even if the distance between the board and the mounting tool waiting above the board is narrowed, the pickup nozzle is inserted into the gap and the electronic component is received by the mounting tool. It becomes possible to pass.

  An embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a mounting apparatus, which includes a transport apparatus 2 that transports a substrate 1 such as a film tape or a lead frame along a predetermined direction. The transport device 2 has a pair of guide rails 3 arranged in parallel at a predetermined interval, and the substrate 1 is intermittently pitched along the guide rails 3. Each time the substrate 1 is pitch-fed, it is positioned and held on the guide rail 3 by a clamper (not shown).

  When the substrate 1 is transported to a mounting position by the transport device 2, a semiconductor chip 4 which is an electronic component supplied from a component supply unit 11 described later is mounted at the mounting position. At the mounting position, a stage tool 5 that supports the lower surface of the substrate 1 is provided by a first drive mechanism 6 shown in FIG. ing.

  A mounting tool 7 for mounting the semiconductor chip 4 on the upper surface of the substrate 1 is provided above the stage tool 5 so as to be driven in the Z direction by a second driving mechanism 8.

  The component supply unit 11 has a wafer stage 12 driven in the X and Y directions by a drive source (not shown). On this wafer stage 12, a semiconductor wafer 13 divided into a large number of semiconductor chips 4 is stuck and held on a wafer sheet 14.

  Of the semiconductor chips 4 held on the wafer sheet 14, the wafer stage 12 is driven in the X and Y directions, whereby the semiconductor chip 4 positioned at a predetermined position is pushed up by a push-up pin (not shown). The semiconductor chip 4 pushed up by the push-up pin is sucked and picked up by the pickup nozzle 16 of the reverse pickup device 15.

  The reverse pickup device 15 is driven in a horizontal direction along a guide body 18 provided horizontally between the transport device 2 and the component supply unit 11. That is, the guide body 18 is provided with a guide body 21 slidably provided on the back surface of the horizontal movable body 19 constituting the reversing pickup device 15 as shown in FIG.

  The guide body 21 is driven in the horizontal direction along the guide body 18 by a linear motor (not shown) provided on the guide body 21 and the guide body 18. The guide body 18 and the horizontal movable body 19 constitute horizontal driving means for driving the reversing pickup device 15 in the horizontal direction.

  A pair of Z guide rails 22 are provided along the vertical direction at both ends in the width direction of the front surface of the horizontal movable body 19. A pair of receiving members 24 provided on the back surface of the Z movable body 23 are slidably engaged with the Z guide rail 22.

  As shown in FIG. 2, a case 25 having a U-shaped planar shape is provided on the front surface of the horizontal movable body 19. An electromagnetic coil 26 is provided in the case 25, and a magnet 27 facing the electromagnetic coil 26 is provided on the back surface of the Z movable body 23. The electromagnetic coil 26 and the magnet 27 constitute a linear motor 28 as a first Z drive source. When the electromagnetic coil 26 is energized, the Z movable body 23 can be selectively driven in the upward or downward direction along the Z guide rail 22.

  A spring 29 that elastically holds the Z movable body 23 is stretched between the front surface of the horizontal movable body 19 and the back surface of the Z movable body 23. Accordingly, when the Z movable body 23 is driven in the downward direction, it is driven against the restoring force of the spring 29, and when it is driven in the upward direction, the restoring force of the spring 29 acts. That is, the Z movable body 23 can be driven by the linear motor 28 in the upward direction and the downward direction with substantially the same driving force without being affected by its own weight.

  On one side in the width direction of the Z movable body 23 located on the transport device side, an arm portion 31 having a sufficiently small height as compared with the Z movable body 23 is extended. A θ driving source 32 is provided on one side surface of the tip of the arm portion 31 so that the axis is horizontal and the axis is orthogonal to the extending direction of the arm 31.

  A rotary body 34 is provided on the rotary shaft 33 of the θ drive source 32, and a rectangular attachment plate 35 is provided at the tip of the rotary body 34. A voice coil motor 36 as a second Z drive source is provided at one end in the width direction of the mounting plate 35. The pickup nozzle 16 is provided on the movable portion 37 of the voice coil motor 36.

  When the θ drive source 32 is operated, the mounting plate 35 is driven to rotate 180 degrees in the direction indicated by the arrow A around the axis O of the rotating shaft 33 shown in FIG. As a result, the pickup nozzle 16 provided on the mounting plate 35 via the voice coil motor 36 is rotationally driven from the state where the front end surface shown by the solid line in FIG. It has become so.

Next, an operation when the semiconductor chip 4 is mounted on the substrate 1 by the mounting apparatus having the above configuration will be described.
As shown in FIG. 1, the pick-up nozzle 16 is positioned by the wafer stage 12 and picked up in a state where the mounting tool 7 stands by above the position (mounting position) where the semiconductor chip 4 of the substrate 1 is mounted. Positioning is performed above the semiconductor chip 4. At this time, the pickup nozzle 16 is positioned by the θ drive source 32 at a rotational position where the suction surface at the tip faces downward.

  When the pickup nozzle 16 is positioned above the semiconductor chip 4 to be picked up, the linear motor 28, which is the first Z drive source, is operated to drive the Z movable body 23 in the downward direction indicated by the arrow Z in FIG. To do. Thereby, the pickup nozzle 16 can adsorb the upper surface of the semiconductor chip 4 to be picked up.

  Next, when the Z movable body 23 is driven in the upward direction by the linear motor 28 to pick up the semiconductor chip 4 attracted by the pickup nozzle 16, the θ driving source 32 is operated to rotate the pickup nozzle 16 by 180 degrees. Let Thereby, the upper and lower surfaces of the semiconductor chip 4 picked up by the pickup nozzle 16 are inverted, and the surface on which the bumps (not shown) are provided faces downward.

  If the semiconductor chip 4 is reversed, the horizontal movable body 19 provided with the Z movable body 23, that is, the reverse pickup device 15 is horizontally moved along the guide body 18 from the position indicated by the solid line in FIG. To drive.

  Then, the pickup nozzle 16 provided at the distal end portion of the arm portion 31 extending from one end in the width direction of the Z movable body 23 waits on the substrate 1 held by the transfer device 2 and above the substrate 1. Enter between the mounting tool 7. As a result, the semiconductor chip 4 sucked and held by the pickup nozzle 16 is positioned opposite to the lower end surface of the mounting tool 7.

  Next, the voice coil motor 36, which is the second Z drive source, is operated to slightly drive the movable portion 37 upward in the Z direction, and the upper surface of the semiconductor chip 4 held by suction on the suction surface of the pickup nozzle 16 Is pressed against the tip surface of the mounting tool 7. At that time, a suction force is generated in the mounting tool 7 and the suction force generated in the pickup nozzle 16 is released. Thereby, the semiconductor chip 4 is transferred from the pickup nozzle 16 to the mounting tool 7.

  When the semiconductor chip 4 is delivered to the mounting tool 7, the pickup nozzle 16 is driven downward by the voice coil motor 36, and then the reverse pickup device 15 is driven in the direction toward the component supply unit 11. That is, the arm portion 31 provided with the pickup nozzle 16 is retracted from between the substrate 1 and the mounting tool 7.

  In the process of retracting the arm portion 31, the pickup nozzle 16 is rotated 180 degrees by the θ driving source 32. As a result, the pickup nozzle 16 is positioned at a predetermined position of the component supply unit 11, and is positioned so that the suction surface at the tip faces the semiconductor chip 4 to be picked up next.

  At the same time that the pickup nozzle 16 is retracted from above the substrate 1, the mounting tool 7 holding the semiconductor chip 4 by suction is driven in the downward direction by the second drive mechanism 8. Thereby, the semiconductor chip 4 held by the mounting tool 7 is mounted at the mounting position of the substrate 1.

  In this way, the mounting tool 7 is put on standby above the substrate 1, and the tip portion provided with the pickup nozzle 16 of the arm portion 31 of the reversing pickup device 15 enters between the substrate 1 and the mounting tool 7 to pick up the pickup nozzle. The semiconductor chip 4 held in 16 is transferred to the mounting tool 7.

  Therefore, the semiconductor chip 4 picked up by the pickup nozzle 16 can be transferred to the mounting tool 7 without causing the mounting unit (not shown) provided with the generally heavy mounting tool 7 to reciprocate in the horizontal direction. it can.

  That is, since the semiconductor chip 4 can be mounted on the substrate 1 only by driving the mounting tool 7 in the vertical direction, the tact time required for mounting can be shortened. Moreover, since it is not necessary to drive the mounting tool 7 in the horizontal direction, the mounting tool 7 is unlikely to vibrate.

  Therefore, after the mounting tool 7 receives the semiconductor chip 4 from the pickup nozzle 16, the semiconductor chip 4 can be immediately mounted on the substrate 1 without waiting for the vibration of the mounting tool 7 to settle. As a result, the tact time can be shortened, and further, the mounting accuracy is not reduced by vibration.

  Since the mounting tool 7 shortens the tact time required for mounting, the mounting tool 7 is mounted on the upper surface of the substrate 1 so as to shorten the time until the semiconductor chip 4 is lowered and mounted on the substrate 1 after being received from the pickup nozzle 16. In order to make the interval as small as possible, it is made to stand by at a low position with respect to the upper surface of the substrate 1.

  On the other hand, the θ drive source 32 that rotates the pickup nozzle 16 and the pickup nozzle 16 are slightly driven in the Z direction at the tip portion of the arm portion 31 of the reversing pickup device 15 that enters between the substrate 1 and the mounting tool 7. For this purpose, only a voice coil motor 36 as a second Z drive source is provided.

  The linear motor 28 as the first Z drive source for driving the Z movable body 23 in the Z direction is not provided in the arm portion 31 but is provided between the horizontal movable body 19 and the Z movable body 23.

  Therefore, compared with the case where the linear motor 28 is provided in the arm portion 31, it is possible to reduce the size of the arm portion 31. Therefore, even if the height of the mounting tool 7 waiting above the substrate 1 is lowered, The tip of the arm portion 31 is allowed to enter between the substrate 1 and the mounting tool 7, and the semiconductor chip 4 held by the pickup nozzle 16 at the tip of the arm portion 31 can be transferred to the mounting tool 7.

  A voice coil motor 36 as a second Z drive source is provided at the tip of the arm portion 31. The voice coil motor 36 slightly raises the pickup nozzle 16 to deliver the semiconductor chip 4 to the mounting tool 7 when the semiconductor chip 4 held by the pickup nozzle 16 is positioned below the mounting tool 7. Is for.

Therefore, since the voice coil motor 36 can be a small motor, the provision of the voice coil motor 36 does not increase the size of the tip of the arm portion 31.
In addition, when the semiconductor chip 4 is delivered, the pickup nozzle 16 is driven in the upward direction by the voice coil motor 36. Therefore, compared with the case where the mounting unit (not shown) having the mounting tool 7 which is heavier than the pickup nozzle 16 is driven in the downward direction and the semiconductor chip 4 is transferred, the transfer is performed reliably and in a short time. Can be performed.

  In the above embodiment, the linear motor is used as the first Z drive source for driving the Z movable body in the vertical direction with respect to the horizontal movable body. However, instead of the linear motor, a screw shaft or a rack is used. Other drive mechanisms such as a pinion may be used.

The schematic block diagram which shows the mounting apparatus of one embodiment of this invention. The front view of a reverse pick-up apparatus. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 4 ... Semiconductor chip (electronic component), 7 ... Mounting tool, 11 ... Component supply part, 15 ... Reverse pick-up apparatus, 16 ... Pick-up nozzle, 18 ... Guide body (horizontal drive means), 19 ... Horizontal movable body (Horizontal drive means), 23 ... Z movable body, 28 ... linear motor (first Z drive source), 32 ... θ drive source, 36 ... voice coil motor (second Z drive source).

Claims (2)

A mounting device for mounting electronic components on a substrate,
A pickup nozzle that takes out the electronic component from the component supply unit and reverses the electronic component by 180 degrees in the vertical direction;
Horizontal driving means for driving the pickup nozzle in the horizontal direction and positioning the substrate above the portion where the electronic component is mounted;
Waiting above the substrate and receiving the electronic component from the pickup nozzle positioned above the portion where the electronic component of the substrate is mounted by the horizontal driving means, and descends without being driven in the horizontal direction. A mounting tool for mounting the electronic component on the substrate;
A horizontal movable body driven in the horizontal direction by the horizontal driving means;
A Z movable body provided on the horizontal movable body so as to be driven in a vertical direction intersecting the horizontal direction by a first Z drive source;
The pickup nozzle extends in the horizontal direction from one end of the Z movable body, and is provided at the tip so that the pickup nozzle can be driven in a rotational direction around an axis parallel to the horizontal direction by a θ drive source. An electronic component mounting apparatus comprising: an arm portion that can enter between the mounting tool that stands by above the substrate . The pickup nozzle is provided at the tip of the arm part so as to be driven in the Z direction by a second Z drive source at a smaller distance than the first Z drive source,
2. The electronic component mounting apparatus according to claim 1, wherein the pickup nozzle is driven upward in the Z direction by the second Z drive source when the electronic component is delivered to the mounting tool.

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