JPS5824443Y2 - Lead frame holding device - Google Patents
Lead frame holding deviceInfo
- Publication number
- JPS5824443Y2 JPS5824443Y2 JP1979084580U JP8458079U JPS5824443Y2 JP S5824443 Y2 JPS5824443 Y2 JP S5824443Y2 JP 1979084580 U JP1979084580 U JP 1979084580U JP 8458079 U JP8458079 U JP 8458079U JP S5824443 Y2 JPS5824443 Y2 JP S5824443Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- island
- lead
- holding
- heat block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】
本考案は半導体のワイヤボンディング作業時に用いられ
るアイランドダウンしたリードフレームの押え装置の改
良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of an island-down lead frame holding device used during semiconductor wire bonding work.
半導体集積回路やＬＳＩ等の製造工程におけるリードフ
レームへのワイヤボンディング作業時には、良好なボン
ディングを行なうためにリードフレームのリード側（両
端側）とペレットの付いているアイランドダウン部をヒ
ートブロックにしつがり固定しておく必要がある。During wire bonding work to lead frames in the manufacturing process of semiconductor integrated circuits, LSIs, etc., in order to ensure good bonding, the lead side (both ends) of the lead frame and the island down part with pellets are attached to a heat block. It needs to be fixed.
従来のかかるリードフレーム押え装置は、ガイドレール
に沿って送られるリードフレームの上方に押え板が配置
されており、リードフレームの下方に配置されたヒート
ブロックを上下動させ、リードフレームを押え板とヒー
トブロックとの間に挾んで押えている。In such a conventional lead frame holding device, a holding plate is placed above the lead frame that is sent along the guide rail, and a heat block placed below the lead frame is moved up and down to hold the lead frame together with the holding plate. It is held between the heat block and the heat block.
しかしながら、このアイランドダウンしたリードフレー
ムではアイランドのばね性が強く、アイランドを押えよ
うとするとリード側が浮き、リード側を押えようとする
とアイランドが浮いてしまう現象が生じ、リードフレー
ムを完全に押えることができなかった。However, in this lead frame with the island down, the island has strong springiness, and when you try to press the island, the lead side floats, and when you try to press the lead side, the island floats, making it impossible to completely press the lead frame. could not.
そこで従来はアイランドダウンした量だけヒートブロッ
クの上面を凹に加工したものが用いられているが、この
方法は同一品種しかボンディングできないので、半導体
集積回路の様に品質切換が著しいものには適さない。Conventionally, therefore, a heat block with the top surface concavely processed by the amount that the island is down has been used, but this method can only bond the same type of product, so it is not suitable for products where quality changes are significant, such as semiconductor integrated circuits. .
即ち、一台の装置で切換使用する場合は、押え板の他に
ヒートブロックも交換しなければならなく、多大の調整
時間を必要とする欠点を有する。That is, when using one device in a switching manner, it is necessary to replace the heat block as well as the presser plate, which has the drawback of requiring a large amount of adjustment time.
本考案は上記従来技術の欠点に鑑みなされたもので、リ
ードフレームの浮きをなくすることができると共に、多
品種のボンディングにも即応できるリードフレーム押え
装置を提供することを目的とする。The present invention has been devised in view of the above-mentioned drawbacks of the prior art, and it is an object of the present invention to provide a lead frame holding device that can eliminate floating of lead frames and can readily respond to bonding of various types.
以下、本考案を図示の実施例により説明する。Hereinafter, the present invention will be explained with reference to illustrated embodiments.
第１図において、１はアイランドダウン部１ａを有する
リードフレーム、２はこのリードフレーム１を両端で保
持してボンディング位置に移送するためのガイドレール
で、リードフレーム１の板厚より若干幅広のガイド溝２
ａが形成されている。In FIG. 1, 1 is a lead frame having an island down portion 1a, and 2 is a guide rail for holding this lead frame 1 at both ends and transporting it to the bonding position.The guide rail is slightly wider than the board thickness of the lead frame 1. Groove 2
a is formed.
３はガイドレール２，２間におけるボンディング位置に
配設されリードフレーム１のアイランド部１ａを支持す
る上面がフラット状のヒートブロックで、図示しない手
段で上下動可能に設けられている。Reference numeral 3 denotes a heat block having a flat upper surface, which is disposed at a bonding position between the guide rails 2, 2 and supports the island portion 1a of the lead frame 1, and is provided so as to be movable up and down by means not shown.
４はヒートブロック３に内装されたヒータである。4 is a heater built into the heat block 3.
５は支柱６，６に固定された押え板で、ガイドレール２
，２が配設された部分にはざぐり５ａが形成され、中央
部にはほぼ四角形の窓５ｂが形成されている。5 is a holding plate fixed to the pillars 6, 6, and the guide rail 2
, 2 is provided with a counterbore 5a, and a substantially rectangular window 5b is formed in the center.
この窓５ｂの下端はヒートブロック３側に突出したリー
ド押え部５Ｃを有し、このリード押え部５Ｃは割れ目５
ｄが設けられて複数に分割されており、その下面はガイ
ドレール２，２のガイド溝２ａの上面よりリードフレー
ム１のアイランドダウン量りだけ下方に突出している。The lower end of this window 5b has a lead pressing portion 5C that protrudes toward the heat block 3 side, and this lead pressing portion 5C is located at the crack 5.
d is provided and divided into a plurality of parts, and the lower surface thereof protrudes downward by the island down amount of the lead frame 1 from the upper surface of the guide groove 2a of the guide rails 2,2.
次にかかる構成よりなるリードフレーム押え装置の作用
について説明する。Next, the operation of the lead frame holding device having such a structure will be explained.
リードフレーム１は第１図に示すように、フリーの状態
でガイドレール２，２のガイド溝２ａに案内されて送ら
れる。As shown in FIG. 1, the lead frame 1 is guided in a free state by the guide grooves 2a of the guide rails 2, 2 and sent.
そして、リードフレーム１のボンディング部が押え板５
の窓５ｂ部に位置しリードフレーム１の送りが停止され
ると、第２図に示すようにヒートブロック３が上昇しリ
ードフレーム１のアイランドダウン部１ａを押え板５の
リード押え部５Ｃとヒートブロック３との間に挾んで押
える。Then, the bonding part of the lead frame 1 is connected to the presser plate 5.
When the feed of the lead frame 1 is stopped at the window 5b, the heat block 3 rises as shown in FIG. Insert and press between block 3.
また前記の如くガイドレール２のガイド溝２ａの上面は
リード押え部５Ｃの下面よりリードフレーム１のアイラ
ンドダウン量りだけ上方に形成されているので、前記の
ようにアイランドダウン部１ａがリード押え部５Ｃとヒ
ートブロック３との間で挾持されたとき、リードフレー
ム１の両端上面はガイドレール２のガイド溝２ａ上面で
支持される。Further, as described above, the upper surface of the guide groove 2a of the guide rail 2 is formed above the lower surface of the lead pressing portion 5C by the amount of the island down of the lead frame 1, so that the island down portion 1a is located above the lead pressing portion 5C as described above. When the lead frame 1 is held between the lead frame 1 and the heat block 3, the upper surfaces of both ends of the lead frame 1 are supported by the upper surfaces of the guide grooves 2a of the guide rails 2.
即ち、アイランドダウン部１ａを押えてもリードフレー
ム端部も隙間なく確実に支持されている。That is, even if the island down portion 1a is pressed down, the end portion of the lead frame is also reliably supported without any gaps.
なお、上記実施例においては、ヒートブロック３のみを
上昇させる様に構成したが、押え板５も上下動可能に構
威し、リードフレーム１を位置決めする時は、まずヒー
トブロック３が上昇し、その後押え板５が下降してアイ
ランド部１ａを挟持するようにすると、リードフレーム
の浮きがより一層除去される。In the above embodiment, only the heat block 3 is raised, but the presser plate 5 is also movable up and down, and when positioning the lead frame 1, the heat block 3 is raised first. Thereafter, when the holding plate 5 is lowered to clamp the island portion 1a, floating of the lead frame is further removed.
以上の説明から明らかな如く、本考案になるリードフレ
ーム押え装置によれば、リードフレームをガイドするガ
イドレールのガイド溝の上面よりリードフレームのアイ
ランドダウン部を押えるリード押え部の下面をアイラン
ドダウン量だけ下方に突出して設けられているので、リ
ードフレームの両端部およびアイランドダウン部は確実
に押えられ、ポンチ゛イング時の不具合は完全に解消さ
れる。As is clear from the above description, according to the lead frame holding device of the present invention, the lower surface of the lead holding part that presses the island down part of the lead frame is lowered by the amount of island down than the upper surface of the guide groove of the guide rail that guides the lead frame. Since the lead frame is provided so as to protrude downward, both ends of the lead frame and the island down part can be securely pressed, and problems during punching can be completely eliminated.
また品種切換の場合もヒートブロックは交換する必要が
ないので、調整時間が著しく短縮され、多品種にも即応
できる。In addition, when changing product types, there is no need to replace the heat block, so the adjustment time is significantly shortened and it is possible to quickly respond to a wide variety of products.
第１図は本考案になるリードフレーム押え装置の一実施
例を示し、ａは平面図、ｂはリードフレーム送り状態の
断面図、第２図はリードフレーム押圧時の断面図である
。
１・・・・・・リードフレーム、１ａ・・・・・・アイ
ランドダウン部、２・・・・・・ガイドレール、２ａ・
・・・・・ガイド溝、３・・・・・・ヒートブロック、
５・・・・・・押え板、５ｂ・・・・・・窓、５Ｃ・・
・・・・リード押え部。FIG. 1 shows an embodiment of the lead frame holding device according to the present invention, in which a is a plan view, b is a sectional view in a lead frame feeding state, and FIG. 2 is a sectional view when the lead frame is pressed. 1...Lead frame, 1a...Island down section, 2...Guide rail, 2a...
...Guide groove, 3...Heat block,
5...Press plate, 5b...Window, 5C...
...Lead holding part.
Claims (1)
て、リードフレームの両端部側をガイドするガイド溝を
有する一対のガイドレールと、中央部にボンディングの
ための窓を有しこの窓部にリードフレームのアイランド
ダウン部の上面を押えるリード押え部を有する押え板と
、前記一対のガイドレール間に配設されアイランドダウ
ン部の下面を支持するヒートブロックとよりなり、アイ
ランドダウン部を押え板のリード押え部とヒートブロッ
クとで挟持した時、リード押え部の下面はガイドレール
のガイド溝の上面よりリードフレームのアイランドダウ
ン量だけ下方に突出していることを特徴とするリードフ
レーム押え装置。A device for holding down an island-down lead frame includes a pair of guide rails having guide grooves that guide both ends of the lead frame, and a window for bonding in the center, and a window for holding down the island-down part of the lead frame. It consists of a holding plate having a lead holding part that presses the upper surface, and a heat block disposed between the pair of guide rails and supporting the bottom surface of the island down part, and the island down part is held between the lead holding part of the holding plate and the heat block. A lead frame holding device characterized in that, when the lead frame is held between the lead frame and the lead frame, the lower surface of the lead holding portion protrudes downward from the upper surface of the guide groove of the guide rail by an island down amount of the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979084580U JPS5824443Y2 (en) | 1979-06-20 | 1979-06-20 | Lead frame holding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979084580U JPS5824443Y2 (en) | 1979-06-20 | 1979-06-20 | Lead frame holding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56104138U JPS56104138U (en) | 1981-08-14 |
| JPS5824443Y2 true JPS5824443Y2 (en) | 1983-05-25 |
Family
ID=29666388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979084580U Expired JPS5824443Y2 (en) | 1979-06-20 | 1979-06-20 | Lead frame holding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5824443Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2798654B2 (en) * | 1996-06-27 | 1998-09-17 | 山口日本電気株式会社 | Bonding equipment |
-
1979
- 1979-06-20 JP JP1979084580U patent/JPS5824443Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56104138U (en) | 1981-08-14 |
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