KR960001725Y1 - Attachment jig for rubber-attached soldering plate - Google Patents
Attachment jig for rubber-attached soldering plate Download PDFInfo
- Publication number
- KR960001725Y1 KR960001725Y1 KR92026787U KR920026787U KR960001725Y1 KR 960001725 Y1 KR960001725 Y1 KR 960001725Y1 KR 92026787 U KR92026787 U KR 92026787U KR 920026787 U KR920026787 U KR 920026787U KR 960001725 Y1 KR960001725 Y1 KR 960001725Y1
- Authority
- KR
- South Korea
- Prior art keywords
- rubber
- soldering
- plate
- attached
- chip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
내용 없음.No content.
Description
제1도는 본 고안의 전체구성도1 is an overall configuration diagram of the present invention
제2도는 제1도의 A-A선 단면도2 is a cross-sectional view taken along the line A-A of FIG.
제3도는 제1도의 B-B선 단면도3 is a cross-sectional view taken along the line B-B of FIG.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 상판 12 : 솔더링용 홀10 top plate 12 soldering hole
14 : 하판 16 : 장착부14: lower plate 16: mounting portion
18 : 리드프레임 20 : 와이어18: lead frame 20: wire
22 : 칩(CHIP) 24 : 러버(RUBBER)22: chip 24: rubber
본 고안은 상판에 러버(RUBBER)가 부착된 솔더링기판 장착지그에 관한 것으로서, 특히 상기 장착지그의 상판에 형성된 솔더링홀의 양측에 러버를 부착하여 하판에 놓이는 리드프레임의 와이어와 칩의 접합부를 밀착시켜주어 견고하게 솔더링될 수 있도록한 러버가 부착된 솔더링기판 장착지그에 관한 것이다.The present invention relates to a soldering board mounting jig having a rubber (RUBBER) attached to the upper plate, and in particular, by attaching the rubber to both sides of the soldering hole formed in the upper plate of the mounting jig to closely contact the junction of the wire and the chip of the lead frame placed on the lower plate. The present invention relates to a soldering substrate mounting jig having a rubber attached to it so that it can be soldered firmly.
일반적으로 솔더링기판 장착지그는 하판에 칩(CHIP)이 놓이는 장착부에 칩을 일정간격으로 놓고 양측에는 리드프레임의 와이어를 칩에 맞추어 놓은 상태에서 솔더링용 홀을 갖는 상판을 덮어 이 홀로 레이저빔이 통과하여 칩과 와이어가 솔더링되는 데 사용되는 것으로 이러한 종래의 솔더링기판 장착지그는 상판과 하판이 덮어지면서 상판이 리드프레임의 와이어를 정확히 누르지 못하여 칩과 와이어가 들뜨는 현상이 발생되어 솔더링이 견고하게 되지 못하여 불량이 발생되는 문제점이 있어왔다.In general, the soldering board mounting jig covers the top plate with soldering holes while the chips are placed at regular intervals in the mounting area where the chip is placed on the lower plate, and the wires of the lead frame are aligned with the chips on both sides. This is used for soldering chips and wires. In this conventional soldering board mounting jig, the top plate and the bottom plate are covered, and the top plate does not press the wire of the lead frame accurately, causing the chip and wire to be lifted, and thus the soldering is not firm. There has been a problem that a defect occurs.
따라서, 본 고안은 상기한 종래의 문제점을 개선하기 위하여 안출한 것으로서 상판과 하판으로 구성되는 솔더링기판의 상판에 리드프레임의 와이어를 균일하고 정확하게 눌러 칩에 밀착시켜 줄 수 있도록 러버(RUBBER)를 부착하여 솔더링이 견고하게 될 수 있도록 하는데 본 고안의 목적이 있는 것이다.Therefore, the present invention has been devised to improve the above-mentioned problems, and attaches a rubber (RUBBER) to press the wire of the lead frame uniformly and accurately to the upper plate of the soldering substrate composed of the upper plate and the lower plate. It is the purpose of the present invention to ensure that the soldering is robust.
이하 본 고안을 첨부된 도면을 이용하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 고안의 솔더링기판에 리드프레임과 칩이 놓여지는 전체 구성을 나타낸 것으로서, 상판(10)에는 솔더링용 홀(12)이 중앙에 다수개 형성되고 그 양측에는 러버(24)가 부착되며 하판(14)에는 칩(22)이 놓여지는 장착부(16)가 중앙에 형성되어 있는 것이다.1 is a view showing the overall configuration in which the lead frame and the chip is placed on the soldering substrate of the present invention, the upper plate 10 has a plurality of soldering holes 12 are formed in the center and the rubber 24 is attached to both sides thereof. In the lower plate 14, a mounting portion 16 on which the chip 22 is placed is formed in the center.
제2도는 제1도의 A-A선 단면도로 러버(24)가 상판(10)에 부착되어 상판(10)의 면보다 돌출되어 있는 것이다.FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1, wherein the rubber 24 is attached to the top plate 10 to protrude from the surface of the top plate 10.
상기와 같이 형성된 본 고안의 설치사용에 따른 작용효과를 설명하면 다음과 같다.Referring to the effect of the installation and use of the present invention formed as described above are as follows.
칩(22)을 하판(14)의 장착부(16)에 놓고 양 옆으로 리드프레임(18)을 칩(22)에 와이어(20)가 솔더링되도록 정렬한 후 상판(10)을 덮게 되면 상판(10)의 솔더링용 홀(12) 양측에 부착된 러버(24)가 제3도에서 보는 바와 같이 칩(22)과 와이어(20)가 놓여지는 부분을 눌러주어 칩(22)에서 와이어(20)가 들뜨지 않고 밀착을 시켜준 상태에서 솔더링 작업을 하게 되는 것이다.When the chip 22 is placed on the mounting portion 16 of the lower plate 14, the lead frame 18 is aligned on both sides such that the wires 20 are soldered to the chip 22, and then the upper plate 10 is covered. The rubber 24 attached to both sides of the soldering hole 12 of FIG. 2 presses the portion where the chip 22 and the wire 20 are placed, as shown in FIG. Soldering work will be carried out in a state of close contact without lifting.
이상에서 설명한 바와 같이, 본 고안은 상판과 하판으로 이루어지는 솔더링용 기판 장착지그의 상판에 형성된 솔더링용 홀의 양측에 러버를 부착하여 솔더링 작업시 리드프레임의 와이어와 칩을 견고히 밀착시켜 주어 종래에 발생하던 들뜨는 현상을 방지하게 되어 솔더링 작업이 정확하게 이루어져 제품의 불량 발생률 저하로 생산성이 향상되고 제품의 품질 및 신뢰성이 향상되는 효과를 얻게된 고안이다.As described above, the present invention attaches the rubber to both sides of the soldering hole formed on the upper plate of the soldering board mounting jig consisting of the upper plate and the lower plate to firmly adhere the wires and chips of the lead frame during the soldering operation. It is designed to prevent the lifting, so that the soldering work is accurate, resulting in improved productivity and reduced product quality and reliability.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92026787U KR960001725Y1 (en) | 1992-12-28 | 1992-12-28 | Attachment jig for rubber-attached soldering plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR92026787U KR960001725Y1 (en) | 1992-12-28 | 1992-12-28 | Attachment jig for rubber-attached soldering plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR940017896U KR940017896U (en) | 1994-07-28 |
| KR960001725Y1 true KR960001725Y1 (en) | 1996-02-22 |
Family
ID=19347921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR92026787U KR960001725Y1 (en) | 1992-12-28 | 1992-12-28 | Attachment jig for rubber-attached soldering plate |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960001725Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102410948B1 (en) * | 2017-09-29 | 2022-06-20 | 삼성전자주식회사 | Jig for bonding a semiconductor chip, apparatus for bonding a semiconductor chip including the jig, and method of bonding a semiconductor chip using the apparatus |
-
1992
- 1992-12-28 KR KR92026787U patent/KR960001725Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR940017896U (en) | 1994-07-28 |
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| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| LAPS | Lapse due to unpaid annual fee |