KR920008359Y1 - Lead frame - Google Patents

Lead frame Download PDF

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Publication number
KR920008359Y1
KR920008359Y1 KR2019890017651U KR890017651U KR920008359Y1 KR 920008359 Y1 KR920008359 Y1 KR 920008359Y1 KR 2019890017651 U KR2019890017651 U KR 2019890017651U KR 890017651 U KR890017651 U KR 890017651U KR 920008359 Y1 KR920008359 Y1 KR 920008359Y1
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KR
South Korea
Prior art keywords
lead frame
lead
pad
inner end
silver plating
Prior art date
Application number
KR2019890017651U
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Korean (ko)
Other versions
KR910009945U (en
Inventor
변광유
Original Assignee
현대전자산업 주식회사
정몽헌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 현대전자산업 주식회사, 정몽헌 filed Critical 현대전자산업 주식회사
Priority to KR2019890017651U priority Critical patent/KR920008359Y1/en
Publication of KR910009945U publication Critical patent/KR910009945U/en
Application granted granted Critical
Publication of KR920008359Y1 publication Critical patent/KR920008359Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

내용 없음.No content.

Description

리드프레임Leadframe

제1도는 리드프레임을 나타낸 도면.1 is a view showing a lead frame.

제2a도는 종래의 리드프레임의 부분평면도로서 패드의 전영역과 리드내측 단부에 은도금이된 상태를 도시하는 도면.FIG. 2A is a partial plan view of a conventional lead frame, showing a state where silver plating is applied to the entire region of the pad and the inner end portion of the lead. FIG.

제2b도는 제2a도의 리드프레임에 다이부착 및 와이어 본딩을 실시한 상태의 도면.FIG. 2B is a diagram in which die attach and wire bonding are performed on the lead frame of FIG. 2A. FIG.

제3a도는 본 고안의 리드프레임의 부분평면도로서, 패드에는 은도금이 되지 않고, 리드내측 단부의 와이어 본딩이 될부분만 은도금이 된 상태를 도시하는 도면.3A is a partial plan view of the lead frame of the present invention, in which the pad is not silver plated, and only a portion of the lead inner end portion that is to be wire bonded is silver plated.

제3b도는 제3a도의 리드프레임에 다이부착 및 와이어 본딩을 실시한 상태의 도면.FIG. 3B is a diagram in which die attach and wire bonding are performed on the lead frame of FIG. 3A. FIG.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 패드(Pad) 2 : 리드1 Pad 2 Lead

3 : 접착물질 4 : 다이3: adhesive material 4: die

7 : 접속부7 connection

본 고안은 IC 리드프레임에 관한 것으로, 특히 리드프레임의 패드 및 리드내측 단부에 은도금 하던 것을 내측 리드의 와이어 본딩영역에만 은도금을시킨 리드프레임에 관한 것이다.The present invention relates to an IC lead frame, and more particularly, to a lead frame in which silver plating is applied only to a pad and a lead inner end portion of the lead frame only to the wire bonding region of the inner lead.

일반적으로, 다이부착(Die Attach)공정 후에 와이어 본딩 공정을 실시하는데, 이때 와이어는 금선을 사용하며, 리드 내측 부분과 다이(칩)의 연결부분을 와이어로 연결해야 한다. 이때 리드 내측 부분에 와이어를 접속할때 공정의 편의를 돕고, 접촉저항을 줄이기 위하여 리드프레임의 패드 상부 및 리드내측 단부에 은도금을 시켰다.In general, the wire bonding process is performed after the die attach process, wherein the wire is made of gold wire, and a connection portion between the lead inner portion and the die (chip) must be connected by a wire. At this time, in order to facilitate the process when connecting the wire to the inner part of the lead, silver plating was applied to the upper end of the pad and the inner end of the lead of the lead frame.

그러나, 종래의 리드프레임은 패드 상부 및 리드내측 단부에 은도금을 함으로써, 불필요한 부분까지 은도금이 되어 IC 제조단가를 높이는 문제점이 있었다.However, the conventional lead frame has a problem of increasing the IC manufacturing cost by silver plating up to the unnecessary portion by silver plating on the upper part of the pad and the inner side of the lead.

따라서, 본 고안은 상기의 문제점을 해결하도록 리드프레임의 리드내측 단부에서 와이어 본딩이 되는 부분만 은도금 시켜 IC제조원가를 낮출수 있는 리드프레임을 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a lead frame capable of lowering IC manufacturing costs by silver plating only a portion of the lead inner end of the lead frame to solve the above problem.

이하, 본 고안을 첨부된 도면을 참고하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

제1도는 리드프레임(10)을 나타낸 평면도로써, 공지된 리드프레임과 동일하므로 설명을 생략하기로 한다.FIG. 1 is a plan view of the lead frame 10, which is the same as a known lead frame and will not be described.

제2a도, 제2b도, 제3a도 및 제3b도는 제1도의 "a"부분을 확대하여 도시한 것이다.2A, 2B, 3A and 3B are enlarged views of part "a" of FIG.

제2a도는 제1도의 "a"부분을 확대하여 나타낸 종래의 리드프레임으로써, 종래의 다이부착 공정 전의 도면으로서, 리드프레임의 패드(1)의 전체 상부면과 리드(2)의 내측단부에 은도금(빗금친 부분)이 된 상태를 도시한다.FIG. 2A is a conventional lead frame in which the portion “a” of FIG. 1 is enlarged, before the conventional die attaching process. FIG. The state which became (hatched part) is shown.

제2b도는 제2a도의 은도금 처리된 패드(1)상부에 은 에폭시 또는 폴리머 등의 접착물질(3)을 바른 다음, 다이(Die)(4)를 부착하고 다이(4)의 접속부(7)와 리드(2)내측단부의 은도금된 영역(8)간에 배선(5)으로 와이어 본딩을 실시한 상태의 도면이다.FIG. 2B shows an adhesive material 3 such as silver epoxy or polymer on top of the silver plated pad 1 of FIG. It is a figure of the state which wire-bonded with the wiring 5 between the silver-plated area | region 8 of the inner end part of the lead 2. As shown in FIG.

제2a도 및 제2b도에 도시된 바와 같이, 불필요한 부분 즉 리드프레임의 패드와 리드 내측단부에 불필요한 부분까지 은도금이 형성됨을 볼수 있다. 여기에서 은도금을 하는 이유는 와이어 본딩시 접촉저항을 줄이고 와이어 본딩이 견고하게 하기 위함이다.As shown in FIGS. 2A and 2B, it can be seen that silver plating is formed up to unnecessary portions, that is, unnecessary portions of the pad and the inner inner end of the lead frame. The reason for the silver plating here is to reduce the contact resistance during wire bonding and to make the wire bonding firm.

제3a도는 본 고안의 리드프레임을 도시하되, 종래의 리드프레임에서 불필요한 부분에 은도금을 방지하고 꼭 필요한 리드내측의 본딩영역에만 은도금처리된 상태의 도면으로서 리드프레임의 패드(1)에는 전혀 은도금을 하지 않고 또한 리드(2)내측단부에서 본딩영역이 아닌 부분은 은도금처리가 되지 않은 것을 알수 있다.FIG. 3a shows a lead frame of the present invention, which prevents silver plating on unnecessary portions of a conventional lead frame and is silver plated only in a bonding area inside a lead which is necessary. In addition, it can be seen that the portion other than the bonding area at the inner end of the lid 2 is not subjected to the silver plating process.

제3b도는 제2b도와 같은 방법으로 리드프레임의 패드(1)접착물질(3)을 바른 다음, 패드(1)상부에 다이(4)를 부착한 후, 와이어 본딩공정으로 다이(4)의 접속부(7)와 리드(2)의 내측단부의 본딩영역(9)사이에 배선(5)을 본딩시킨 상태를 나타낸 도면이다.FIG. 3b shows the pad 1 adhesive material 3 of the lead frame in the same manner as in FIG. FIG. 7 is a view showing a state in which the wiring 5 is bonded between the bonding area 9 of the inner end of the lead 2 and the lead 7.

상술한 바와같이, 본 고안의 리드프레임을 불필요한 곳에 은도금을 실시하지 않아 IC 제조단가를 낮출수 있는 효과가 있다.As described above, since the silver plating is not performed on the lead frame of the present invention, the IC manufacturing cost can be reduced.

Claims (1)

리드프레임에 있어서, 칩을 올려놓은 패드 상부면에는 전혀 은도금이 되지 않고, 리드내측 단부에서 와이어 본딩 될 부분에만 은도금이된 구조로 이루어진 것을 특징으로 하는 리드프레임.In the lead frame, the lead frame is characterized in that the upper surface of the pad on which the chip is placed is not silver plated at all, and is silver plated only at the portion to be wire bonded at the inner end of the lead.
KR2019890017651U 1989-11-28 1989-11-28 Lead frame KR920008359Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019890017651U KR920008359Y1 (en) 1989-11-28 1989-11-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019890017651U KR920008359Y1 (en) 1989-11-28 1989-11-28 Lead frame

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KR910009945U KR910009945U (en) 1991-06-29
KR920008359Y1 true KR920008359Y1 (en) 1992-11-20

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ID=19292394

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Application Number Title Priority Date Filing Date
KR2019890017651U KR920008359Y1 (en) 1989-11-28 1989-11-28 Lead frame

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101021600B1 (en) * 2001-07-09 2011-03-17 스미토모 긴조쿠 고잔 가부시키가이샤 Lead frame and its manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101021600B1 (en) * 2001-07-09 2011-03-17 스미토모 긴조쿠 고잔 가부시키가이샤 Lead frame and its manufacturing method

Also Published As

Publication number Publication date
KR910009945U (en) 1991-06-29

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