KR970053649A - Wireless Semiconductor Package - Google Patents
Wireless Semiconductor Package Download PDFInfo
- Publication number
- KR970053649A KR970053649A KR1019950048243A KR19950048243A KR970053649A KR 970053649 A KR970053649 A KR 970053649A KR 1019950048243 A KR1019950048243 A KR 1019950048243A KR 19950048243 A KR19950048243 A KR 19950048243A KR 970053649 A KR970053649 A KR 970053649A
- Authority
- KR
- South Korea
- Prior art keywords
- bonding
- semiconductor package
- chip
- inner leads
- leads
- Prior art date
Links
Abstract
본 발명은 반도체 패키지 관한 것으로서, 보다 상세하게는 칩사이즈 크기의 반도체 패키지를 구형하며 와이어 접착공정이 필요없도록 한 와이어리스 반도체 패키지에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a wireless semiconductor package in which a semiconductor package having a chip size is spherical and no wire bonding process is required.
이와 같은 본 발명의 와이어리드 반도체 패키지는 상면에 복수개의 본딩패드들을 갖는 반도체칩; 상기 복수개의 본딩패드들과 마주보도록 배열된 복수개의 리드들; 내부리드들로부터 연장되는 복수개의 외부 리드들; 상기 각 내부리드와 그에 대응되게 배열된 본딩패드가 전기적으로 연결되도록 접착시키는 복수개의 도전체 범프(BUMP)들; 상기 칩의 일부 상면과 내부리드들을 접착시키는 다이본드용 테이프; 그리고 상기 칩과 내부리드들을 봉지수지로 몰딩한 패키지 몸체로 구성된다.Such a wire lead semiconductor package of the present invention includes a semiconductor chip having a plurality of bonding pads on an upper surface thereof; A plurality of leads arranged to face the plurality of bonding pads; A plurality of outer leads extending from the inner leads; A plurality of conductor bumps (BUMPs) for bonding each of the inner leads and bonding pads arranged correspondingly thereto to be electrically connected to each other; A die-bonding tape for bonding a portion of the chip to the upper surface and the inner leads; And a package body molded by molding the chip and the inner leads into an encapsulating resin.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명에 따른 반도체 패키지의 단면도이다.3 is a cross-sectional view of a semiconductor package according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048243A KR970053649A (en) | 1995-12-11 | 1995-12-11 | Wireless Semiconductor Package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950048243A KR970053649A (en) | 1995-12-11 | 1995-12-11 | Wireless Semiconductor Package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053649A true KR970053649A (en) | 1997-07-31 |
Family
ID=66594460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950048243A KR970053649A (en) | 1995-12-11 | 1995-12-11 | Wireless Semiconductor Package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053649A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000050605A (en) * | 1999-01-12 | 2000-08-05 | 박천주 | Solderless and Wireless Socket-type Circuit Board pressed and adhered with multi-layered conductible circuit panel |
KR20110063614A (en) * | 2009-12-05 | 2011-06-13 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Pressure-contact-connected power semiconductor module with hybrid pressure accumulator |
-
1995
- 1995-12-11 KR KR1019950048243A patent/KR970053649A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000050605A (en) * | 1999-01-12 | 2000-08-05 | 박천주 | Solderless and Wireless Socket-type Circuit Board pressed and adhered with multi-layered conductible circuit panel |
KR20110063614A (en) * | 2009-12-05 | 2011-06-13 | 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 | Pressure-contact-connected power semiconductor module with hybrid pressure accumulator |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |