KR970053649A - Wireless Semiconductor Package - Google Patents

Wireless Semiconductor Package Download PDF

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Publication number
KR970053649A
KR970053649A KR1019950048243A KR19950048243A KR970053649A KR 970053649 A KR970053649 A KR 970053649A KR 1019950048243 A KR1019950048243 A KR 1019950048243A KR 19950048243 A KR19950048243 A KR 19950048243A KR 970053649 A KR970053649 A KR 970053649A
Authority
KR
South Korea
Prior art keywords
bonding
semiconductor package
chip
inner leads
leads
Prior art date
Application number
KR1019950048243A
Other languages
Korean (ko)
Inventor
오성호
안희영
Original Assignee
문정환
Lg 반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체주식회사 filed Critical 문정환
Priority to KR1019950048243A priority Critical patent/KR970053649A/en
Publication of KR970053649A publication Critical patent/KR970053649A/en

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Abstract

본 발명은 반도체 패키지 관한 것으로서, 보다 상세하게는 칩사이즈 크기의 반도체 패키지를 구형하며 와이어 접착공정이 필요없도록 한 와이어리스 반도체 패키지에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a wireless semiconductor package in which a semiconductor package having a chip size is spherical and no wire bonding process is required.

이와 같은 본 발명의 와이어리드 반도체 패키지는 상면에 복수개의 본딩패드들을 갖는 반도체칩; 상기 복수개의 본딩패드들과 마주보도록 배열된 복수개의 리드들; 내부리드들로부터 연장되는 복수개의 외부 리드들; 상기 각 내부리드와 그에 대응되게 배열된 본딩패드가 전기적으로 연결되도록 접착시키는 복수개의 도전체 범프(BUMP)들; 상기 칩의 일부 상면과 내부리드들을 접착시키는 다이본드용 테이프; 그리고 상기 칩과 내부리드들을 봉지수지로 몰딩한 패키지 몸체로 구성된다.Such a wire lead semiconductor package of the present invention includes a semiconductor chip having a plurality of bonding pads on an upper surface thereof; A plurality of leads arranged to face the plurality of bonding pads; A plurality of outer leads extending from the inner leads; A plurality of conductor bumps (BUMPs) for bonding each of the inner leads and bonding pads arranged correspondingly thereto to be electrically connected to each other; A die-bonding tape for bonding a portion of the chip to the upper surface and the inner leads; And a package body molded by molding the chip and the inner leads into an encapsulating resin.

Description

와이어리스 반도체 패키지Wireless Semiconductor Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 따른 반도체 패키지의 단면도이다.3 is a cross-sectional view of a semiconductor package according to the present invention.

Claims (2)

상면에 복수개의 본딩패드들을 갖는 반도체칩; 상기 복수개의 본딩패드들과 마주보도록 배열된 복수개의 리드들; 내부리드들로부터 연장되는 복수개의 외부 리드들; 상기 각 내부리드와 그에 대응되게 배열된 본딩패드가 전기적으로 연결되도록 접착시키는 복수개의 도전체 범프(BUMP)들; 상기 칩의 일부 상면과 내부리드들을 접착시키는 다이본드용 테이프; 그리고 상기 칩과 내부리드들을 봉지수지로 몰딩한 패키지 몸체로 구성됨을 특징으로 하는 와이어리스 반도체 패키지.A semiconductor chip having a plurality of bonding pads on an upper surface thereof; A plurality of leads arranged to face the plurality of bonding pads; A plurality of outer leads extending from the inner leads; A plurality of conductor bumps (BUMPs) for bonding each of the inner leads and bonding pads arranged correspondingly thereto to be electrically connected to each other; A die-bonding tape for bonding a portion of the chip to the upper surface and the inner leads; And a package body in which the chip and the inner leads are molded with an encapsulating resin. 제1항에 있어서, 상기 도전체 범프는 금 또는 은으로 형성됨을 특징으로 하는 와이어 리스 반도체 패키지.The wireless semiconductor package of claim 1, wherein the conductor bumps are formed of gold or silver. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950048243A 1995-12-11 1995-12-11 Wireless Semiconductor Package KR970053649A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950048243A KR970053649A (en) 1995-12-11 1995-12-11 Wireless Semiconductor Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950048243A KR970053649A (en) 1995-12-11 1995-12-11 Wireless Semiconductor Package

Publications (1)

Publication Number Publication Date
KR970053649A true KR970053649A (en) 1997-07-31

Family

ID=66594460

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950048243A KR970053649A (en) 1995-12-11 1995-12-11 Wireless Semiconductor Package

Country Status (1)

Country Link
KR (1) KR970053649A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000050605A (en) * 1999-01-12 2000-08-05 박천주 Solderless and Wireless Socket-type Circuit Board pressed and adhered with multi-layered conductible circuit panel
KR20110063614A (en) * 2009-12-05 2011-06-13 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Pressure-contact-connected power semiconductor module with hybrid pressure accumulator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000050605A (en) * 1999-01-12 2000-08-05 박천주 Solderless and Wireless Socket-type Circuit Board pressed and adhered with multi-layered conductible circuit panel
KR20110063614A (en) * 2009-12-05 2011-06-13 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Pressure-contact-connected power semiconductor module with hybrid pressure accumulator

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E902 Notification of reason for refusal
E601 Decision to refuse application