KR980006166A - Lead frame for lead-on chip with groove formed in inner lead and semiconductor chip package using same - Google Patents
Lead frame for lead-on chip with groove formed in inner lead and semiconductor chip package using same Download PDFInfo
- Publication number
- KR980006166A KR980006166A KR1019960020910A KR19960020910A KR980006166A KR 980006166 A KR980006166 A KR 980006166A KR 1019960020910 A KR1019960020910 A KR 1019960020910A KR 19960020910 A KR19960020910 A KR 19960020910A KR 980006166 A KR980006166 A KR 980006166A
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- chip
- groove
- inner lead
- semiconductor chip
- Prior art date
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- Lead Frames For Integrated Circuits (AREA)
Abstract
본 발명은 리드 온 칩용 리드프레임 및 그를 이용한 반도체 칩 패키지에 관한 것으로, 비전도성 접착제가 접착되어 있지 않은 부분의 내부리드에 홈을 형성함으로써, 성형수지의 흐름을 일정하게 유지하여 내부리드와 칩사이에서 보이드가 발생되는 것을 억제할 수 있는 장점이 있다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for a lead-on chip and a semiconductor chip package using the same, wherein a groove is formed in an inner lead of a portion to which a non-conductive adhesive is not bonded, thereby maintaining a constant flow of the molding resin, and thus between the inner lead and the chip There is an advantage that can suppress the generation of voids.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3도는 본 발명의 일실시예에 의한 내부리드 하부면에 홈이 형성된 상태를 나타내는 리드온 칩 패키지의 부분 절개도.3 is a partial cutaway view of a lead-on chip package showing a state in which a groove is formed in a lower surface of an inner lead according to an embodiment of the present invention.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020910A KR980006166A (en) | 1996-06-12 | 1996-06-12 | Lead frame for lead-on chip with groove formed in inner lead and semiconductor chip package using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020910A KR980006166A (en) | 1996-06-12 | 1996-06-12 | Lead frame for lead-on chip with groove formed in inner lead and semiconductor chip package using same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980006166A true KR980006166A (en) | 1998-03-30 |
Family
ID=66284435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960020910A KR980006166A (en) | 1996-06-12 | 1996-06-12 | Lead frame for lead-on chip with groove formed in inner lead and semiconductor chip package using same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980006166A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100610955B1 (en) * | 2000-12-26 | 2006-08-10 | 앰코 테크놀로지 코리아 주식회사 | Leadframe for semiconductor package |
-
1996
- 1996-06-12 KR KR1019960020910A patent/KR980006166A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100610955B1 (en) * | 2000-12-26 | 2006-08-10 | 앰코 테크놀로지 코리아 주식회사 | Leadframe for semiconductor package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |