KR970077547A - Separated die pad and semiconductor chip package and manufacturing method using same - Google Patents
Separated die pad and semiconductor chip package and manufacturing method using same Download PDFInfo
- Publication number
- KR970077547A KR970077547A KR1019960019006A KR19960019006A KR970077547A KR 970077547 A KR970077547 A KR 970077547A KR 1019960019006 A KR1019960019006 A KR 1019960019006A KR 19960019006 A KR19960019006 A KR 19960019006A KR 970077547 A KR970077547 A KR 970077547A
- Authority
- KR
- South Korea
- Prior art keywords
- die pad
- chip
- tie bars
- semiconductor chip
- bonding
- Prior art date
Links
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- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
본 발명은 분리된 다이패드를 이용한 반도체 칩 패키지 및 제조 방법에 관한 것으로, 연장된 타이바들을 갖는 패드리스 리드프레임은 시탬핑(stamping)법에 의해 제작되고, 분리된 다이패드의 하부면은 식각(etching)법에 의해 딤플(dimple)이 형성되고, 열압착 방법에 의해 다이패드와 연장된 타이바들이 접착됨으로써, 리드프레임의 제조에 있어서 대향 생산 및 저렴한 단가를 실현하는 동시에 다이패드의 평탄도를 유지할 수 있으며, 딤플의 형성이 용이한 장점이 있다.The present invention relates to a semiconductor chip package and a manufacturing method using a separate die pad, wherein a padless lead frame having extended tie bars is manufactured by a stamping method, and the bottom surface of the separated die pad is etched. Dimples are formed by the etching method, and the die pads and the extended tie bars are bonded by the thermocompression method, thereby achieving opposing production and low cost in the manufacture of the lead frame, and at the same time flatness of the die pads. It can be maintained, there is an advantage that the formation of the dimple is easy.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명의 일실시예에 의한 연장된 타이바들에 칩이 접착된 다이패드가 접착되는 상태를 나타내는 평면도.3 is a plan view showing a state in which a die pad bonded to a chip is attached to extended tie bars according to an embodiment of the present invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960019006A KR970077547A (en) | 1996-05-31 | 1996-05-31 | Separated die pad and semiconductor chip package and manufacturing method using same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960019006A KR970077547A (en) | 1996-05-31 | 1996-05-31 | Separated die pad and semiconductor chip package and manufacturing method using same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970077547A true KR970077547A (en) | 1997-12-12 |
Family
ID=66284111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960019006A KR970077547A (en) | 1996-05-31 | 1996-05-31 | Separated die pad and semiconductor chip package and manufacturing method using same |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970077547A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100819794B1 (en) * | 2002-04-02 | 2008-04-07 | 삼성테크윈 주식회사 | Lead-frame and method for manufacturing semi-conductor package using such |
KR100833938B1 (en) * | 2002-03-28 | 2008-05-30 | 삼성테크윈 주식회사 | Lead-frame for semiconductor package and method for manufacturing lead-frame |
-
1996
- 1996-05-31 KR KR1019960019006A patent/KR970077547A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100833938B1 (en) * | 2002-03-28 | 2008-05-30 | 삼성테크윈 주식회사 | Lead-frame for semiconductor package and method for manufacturing lead-frame |
KR100819794B1 (en) * | 2002-04-02 | 2008-04-07 | 삼성테크윈 주식회사 | Lead-frame and method for manufacturing semi-conductor package using such |
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |