KR970018444A - Semiconductor chip package without die adhesive - Google Patents

Semiconductor chip package without die adhesive Download PDF

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Publication number
KR970018444A
KR970018444A KR1019950033395A KR19950033395A KR970018444A KR 970018444 A KR970018444 A KR 970018444A KR 1019950033395 A KR1019950033395 A KR 1019950033395A KR 19950033395 A KR19950033395 A KR 19950033395A KR 970018444 A KR970018444 A KR 970018444A
Authority
KR
South Korea
Prior art keywords
semiconductor chip
die
chip package
die pad
die adhesive
Prior art date
Application number
KR1019950033395A
Other languages
Korean (ko)
Inventor
송영희
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950033395A priority Critical patent/KR970018444A/en
Publication of KR970018444A publication Critical patent/KR970018444A/en

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Abstract

다이 접착제를 전혀 사용하지 않고 성형 수지만에 의해 그 반도체 칩이 다이패드에 접착되어 있어 다이 접착제의 사용에 따른 다이 패드와 성형수지 및 반도체 칩과의 이종의 물질이 특성 차이로 인하여 신뢰성이 떨어지게 되는 문제점이 근본적으로 해결된다.The semiconductor chip is adhered to the die pad only by molding resin without using any die adhesive, so that different materials between the die pad, the molding resin and the semiconductor chip due to the use of the die adhesive are less reliable due to the difference in properties. The problem is solved fundamentally.

Description

다이 접착제를 사용하지 않는 반도체 칩 패키지Semiconductor chip package without die adhesive

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제2도는 본 발명에 의한 다이 접착제를 사용하지 않는 반도체 칩 패키지의 구조를 나타낸 단면도.2 is a cross-sectional view showing the structure of a semiconductor chip package without using a die adhesive according to the present invention.

Claims (3)

다이 패드와 리드를 갖는 리드프레임과; 그 다이 패드상에 다이 접착제에 의해 접착제되는 반도체 칩과; 그 반도체 칩과 그 리드를 전기적으로 연결하는 와이어와; 그 반도체 칩, 다이 패드 와이어 및 리드의 일부영역을 봉지하는 성형수지로 이루어지는 반도체 칩 패키지에 있어서, 그 반도체 칩과 다이 패드가 그 다이 접착제에 의해서가 아니라 그 성형수지에 의해 접착되는 것을 특징으로 하는 다이 접착제를 사용하지 않는 반도체 칩 패키지A leadframe having a die pad and leads; A semiconductor chip glued by a die adhesive on the die pad; A wire for electrically connecting the semiconductor chip and the lead; A semiconductor chip package comprising a semiconductor chip, a die pad wire, and a molding resin for encapsulating a partial region of a lead, wherein the semiconductor chip and the die pad are bonded not by the die adhesive but by the molding resin. Semiconductor chip package without die adhesive 제1항에 있어서, 와이어 본딩시 반도체 칩을 진공 흡착하기 위한 슬롯이 상기 다이 패드에 형성되어 있는 것을 특징으로 하는 다이 접착제를 사용하지 않는 반도체 칩 패키지.The semiconductor chip package according to claim 1, wherein a slot for vacuum adsorption of the semiconductor chip at the time of wire bonding is formed in the die pad. 제1항에 있어서, 상기 리드프레임의 다운 셋(down set)된 타이 바는 주입되는 성형수지에 의한 상기 반도체 칩의 유동을 방지하는 것을 특징으로 하는 다이 접착제를 사용하지 않는 반도체 칩 패키지.The semiconductor chip package of claim 1, wherein the tie bars of the lead frame prevent the flow of the semiconductor chip by the injection molding resin.
KR1019950033395A 1995-09-30 1995-09-30 Semiconductor chip package without die adhesive KR970018444A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950033395A KR970018444A (en) 1995-09-30 1995-09-30 Semiconductor chip package without die adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950033395A KR970018444A (en) 1995-09-30 1995-09-30 Semiconductor chip package without die adhesive

Publications (1)

Publication Number Publication Date
KR970018444A true KR970018444A (en) 1997-04-30

Family

ID=66582382

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950033395A KR970018444A (en) 1995-09-30 1995-09-30 Semiconductor chip package without die adhesive

Country Status (1)

Country Link
KR (1) KR970018444A (en)

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