KR970018444A - Semiconductor chip package without die adhesive - Google Patents
Semiconductor chip package without die adhesive Download PDFInfo
- Publication number
- KR970018444A KR970018444A KR1019950033395A KR19950033395A KR970018444A KR 970018444 A KR970018444 A KR 970018444A KR 1019950033395 A KR1019950033395 A KR 1019950033395A KR 19950033395 A KR19950033395 A KR 19950033395A KR 970018444 A KR970018444 A KR 970018444A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- die
- chip package
- die pad
- die adhesive
- Prior art date
Links
Abstract
다이 접착제를 전혀 사용하지 않고 성형 수지만에 의해 그 반도체 칩이 다이패드에 접착되어 있어 다이 접착제의 사용에 따른 다이 패드와 성형수지 및 반도체 칩과의 이종의 물질이 특성 차이로 인하여 신뢰성이 떨어지게 되는 문제점이 근본적으로 해결된다.The semiconductor chip is adhered to the die pad only by molding resin without using any die adhesive, so that different materials between the die pad, the molding resin and the semiconductor chip due to the use of the die adhesive are less reliable due to the difference in properties. The problem is solved fundamentally.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제2도는 본 발명에 의한 다이 접착제를 사용하지 않는 반도체 칩 패키지의 구조를 나타낸 단면도.2 is a cross-sectional view showing the structure of a semiconductor chip package without using a die adhesive according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950033395A KR970018444A (en) | 1995-09-30 | 1995-09-30 | Semiconductor chip package without die adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950033395A KR970018444A (en) | 1995-09-30 | 1995-09-30 | Semiconductor chip package without die adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970018444A true KR970018444A (en) | 1997-04-30 |
Family
ID=66582382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950033395A KR970018444A (en) | 1995-09-30 | 1995-09-30 | Semiconductor chip package without die adhesive |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970018444A (en) |
-
1995
- 1995-09-30 KR KR1019950033395A patent/KR970018444A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |