KR970024057A - High Reliability Semiconductor Chip Packages - Google Patents
High Reliability Semiconductor Chip Packages Download PDFInfo
- Publication number
- KR970024057A KR970024057A KR1019950038137A KR19950038137A KR970024057A KR 970024057 A KR970024057 A KR 970024057A KR 1019950038137 A KR1019950038137 A KR 1019950038137A KR 19950038137 A KR19950038137 A KR 19950038137A KR 970024057 A KR970024057 A KR 970024057A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor chip
- resin
- bonded region
- wire bonded
- electrode pad
- Prior art date
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
열경화성의 수지가 와이어 본딩된 영역의 리드 프레임의 내부 리드와 반도체칩의 전극 패드에 봉지되어 성형수지가 그 와이어 본딩된 영역에 직접 접촉하지 않음으로써 와이어 본딩된 영역에서의 열적 스트레스가 저감되고 흡습에 의한 부식이 방지되어 높은 반도체 칩 패키지의 신뢰성이 향상된다.The thermosetting resin is encapsulated in the inner lead of the lead frame of the wire bonded region and the electrode pad of the semiconductor chip so that the molding resin does not directly contact the wire bonded region, thereby reducing thermal stress in the wire bonded region and reducing moisture absorption. Corrosion is prevented and the reliability of the high semiconductor chip package is improved.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에 의한 고신뢰성의 반도체 칩 패키지의 구조를 나타낸 단면도이다.2 is a cross-sectional view showing the structure of a highly reliable semiconductor chip package according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038137A KR970024057A (en) | 1995-10-30 | 1995-10-30 | High Reliability Semiconductor Chip Packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038137A KR970024057A (en) | 1995-10-30 | 1995-10-30 | High Reliability Semiconductor Chip Packages |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970024057A true KR970024057A (en) | 1997-05-30 |
Family
ID=66584347
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038137A KR970024057A (en) | 1995-10-30 | 1995-10-30 | High Reliability Semiconductor Chip Packages |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970024057A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100829593B1 (en) * | 2007-04-30 | 2008-05-14 | 삼성전자주식회사 | Semiconductor package and method of manufacturing the same |
-
1995
- 1995-10-30 KR KR1019950038137A patent/KR970024057A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100829593B1 (en) * | 2007-04-30 | 2008-05-14 | 삼성전자주식회사 | Semiconductor package and method of manufacturing the same |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |