KR970024057A - High Reliability Semiconductor Chip Packages - Google Patents

High Reliability Semiconductor Chip Packages Download PDF

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Publication number
KR970024057A
KR970024057A KR1019950038137A KR19950038137A KR970024057A KR 970024057 A KR970024057 A KR 970024057A KR 1019950038137 A KR1019950038137 A KR 1019950038137A KR 19950038137 A KR19950038137 A KR 19950038137A KR 970024057 A KR970024057 A KR 970024057A
Authority
KR
South Korea
Prior art keywords
semiconductor chip
resin
bonded region
wire bonded
electrode pad
Prior art date
Application number
KR1019950038137A
Other languages
Korean (ko)
Inventor
윤진현
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950038137A priority Critical patent/KR970024057A/en
Publication of KR970024057A publication Critical patent/KR970024057A/en

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

열경화성의 수지가 와이어 본딩된 영역의 리드 프레임의 내부 리드와 반도체칩의 전극 패드에 봉지되어 성형수지가 그 와이어 본딩된 영역에 직접 접촉하지 않음으로써 와이어 본딩된 영역에서의 열적 스트레스가 저감되고 흡습에 의한 부식이 방지되어 높은 반도체 칩 패키지의 신뢰성이 향상된다.The thermosetting resin is encapsulated in the inner lead of the lead frame of the wire bonded region and the electrode pad of the semiconductor chip so that the molding resin does not directly contact the wire bonded region, thereby reducing thermal stress in the wire bonded region and reducing moisture absorption. Corrosion is prevented and the reliability of the high semiconductor chip package is improved.

Description

고신뢰성의 반도체 칩 패키지High Reliability Semiconductor Chip Packages

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 의한 고신뢰성의 반도체 칩 패키지의 구조를 나타낸 단면도이다.2 is a cross-sectional view showing the structure of a highly reliable semiconductor chip package according to the present invention.

Claims (3)

전극 패드를 갖는 반도체 칩과, 그 반도체 칩이 탑재된 다이 패드와 배부 리드를 갖는 리드 프레임과, 그 내부 리드와 그 전극 패드를 와이어 본딩하는 와이어와. 그 반도체 칩과 내부 리드 및 와이어를 봉지하는 성형 수지의 몸체를 갖는 반도체 칩 패키지에 있어서, 그 전극 패드의 와이어 본딩된 영역과 그 성형수지의 몸체사이에 존재하는 수지를 포함하는 고신뢰성의 반도체 칩 패키지.A semiconductor chip having an electrode pad, a lead frame having a die pad on which the semiconductor chip is mounted, and a distribution lead, a wire for wire bonding the internal lead and the electrode pad. A semiconductor chip package having a semiconductor chip and a body of molded resin for encapsulating internal leads and wires, the semiconductor chip package comprising a resin existing between the wire bonded region of the electrode pad and the body of the molded resin package. 제 1 항에 있어서, 그 내부 리드의 와이어 본딩된 영역과 그 성형수지의 몸체사이에 수지에 존재하는 것을 특징으로 하는 고신뢰성의 반도체 칩 패키지.The semiconductor chip package of claim 1, wherein the resin is present in the resin between the wire bonded region of the inner lead and the body of the molding resin. 제 1 항에 있어서, 그 내부 리드와 전극 패드의 와이어 본딩된 영역과, 그 성형수지의 몸체사이에 수지가 존재하는 것을 특징으로 하는 고신뢰성의 반도체 칩 패키지.The semiconductor chip package according to claim 1, wherein a resin is present between the inner lead and the wire bonded region of the electrode pad and the body of the molding resin. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950038137A 1995-10-30 1995-10-30 High Reliability Semiconductor Chip Packages KR970024057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950038137A KR970024057A (en) 1995-10-30 1995-10-30 High Reliability Semiconductor Chip Packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950038137A KR970024057A (en) 1995-10-30 1995-10-30 High Reliability Semiconductor Chip Packages

Publications (1)

Publication Number Publication Date
KR970024057A true KR970024057A (en) 1997-05-30

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ID=66584347

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950038137A KR970024057A (en) 1995-10-30 1995-10-30 High Reliability Semiconductor Chip Packages

Country Status (1)

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KR (1) KR970024057A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100829593B1 (en) * 2007-04-30 2008-05-14 삼성전자주식회사 Semiconductor package and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100829593B1 (en) * 2007-04-30 2008-05-14 삼성전자주식회사 Semiconductor package and method of manufacturing the same

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