KR970053681A - Package with die pad structure to prevent package cracking - Google Patents

Package with die pad structure to prevent package cracking Download PDF

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Publication number
KR970053681A
KR970053681A KR1019950068131A KR19950068131A KR970053681A KR 970053681 A KR970053681 A KR 970053681A KR 1019950068131 A KR1019950068131 A KR 1019950068131A KR 19950068131 A KR19950068131 A KR 19950068131A KR 970053681 A KR970053681 A KR 970053681A
Authority
KR
South Korea
Prior art keywords
package
die pad
cracking
molding resin
prevent
Prior art date
Application number
KR1019950068131A
Other languages
Korean (ko)
Inventor
이민호
이관재
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950068131A priority Critical patent/KR970053681A/en
Publication of KR970053681A publication Critical patent/KR970053681A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 패키지에 관한 것으로, 리드프레임의 다이 패드를 분리하고 절곡되게 제작함으로써, 성형 수지와 다이 패드간이 결합력을 증대시켜 패키지 신뢰성 테스트와 같은 가혹 상황에서 발생되는 패키지 균열을 방지할 수 있는 패키지 균열을 방지할 수 있는 특징을 갖는다.The present invention relates to a package, by separating and bending the die pad of the leadframe, thereby increasing the bonding force between the molding resin and the die pad to prevent the package cracks generated in harsh conditions such as package reliability test It has a feature that can prevent.

Description

패키지 균열을 방지하기 위한 다이패드 구조를 갖는 패키지Package with die pad structure to prevent package cracking

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명에 의한 패키지 균열을 방지하기 위한 다이 패드 구조를 갖는 패키지를 나타내는 단면도.3 is a cross-sectional view showing a package having a die pad structure for preventing package cracking according to the present invention.

Claims (3)

복수개의 본딩 패드를 갖는 칩과; 그 칩의 일 측면과 접착된 다이 패드와, 상기 본딩 패드들에 각기 대응되어 전기적 연결된 내부리드들과, 그 내부리드들에 일체형으로 형성된 외부리드들을 포함하는 리드프레임과; 상기 칩과 내부리드들을 포함하는 전기적 연결 부분을 봉지·내재한 성형 수지를 포함하고, 상기 다이 패드의 다른 면에 딤플이 형성되어 상기 성형 수지와의 결합력을 증대시킨 패키지에 있어서, 상기 리드프레임의 다이 패드를 복수개로 분할하고, 그 분할된 다이 패드들을 서로 연결하는 연결 바와 그 연결 바가 절곡되어 상기 성형 수지와의 결합력을 증대시킴으로써 패키지 균열을 방지할 수 있는 것을 특징으로 하는 패키지 균열을 방지하기 위한 다이 패드 구조를 갖는 패키지.A chip having a plurality of bonding pads; A lead frame including a die pad bonded to one side of the chip, inner leads electrically connected to the bonding pads, and outer leads integrally formed on the inner leads; A package including a molding resin encapsulating and incorporating an electrical connection portion including the chip and inner leads, wherein a dimple is formed on the other surface of the die pad to increase bonding strength with the molding resin. A package bar can be prevented by dividing the die pad into a plurality of pieces, and the connecting bar connecting the divided die pads to each other is bent to increase the bonding force with the molding resin, thereby preventing package cracking. Package having a die pad structure. 제1항에 있어서, 상기 다이 패드의 연결 바가 다운 셋된 것을 특징으로 하는 패키지 균열을 방지하기 위한 다이 패드 구조를 갖는 패키지.The package according to claim 1, wherein the connection bar of the die pad is set down. 제1항에 있어서, 상기 다이 패드가 4개로 분할된 것을 특징으로 하는 패키지 균열을 방지하기 위한 다이패드 구조를 갖는 패키지.The package having a die pad structure for preventing package cracking according to claim 1, wherein the die pad is divided into four parts. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950068131A 1995-12-30 1995-12-30 Package with die pad structure to prevent package cracking KR970053681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950068131A KR970053681A (en) 1995-12-30 1995-12-30 Package with die pad structure to prevent package cracking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950068131A KR970053681A (en) 1995-12-30 1995-12-30 Package with die pad structure to prevent package cracking

Publications (1)

Publication Number Publication Date
KR970053681A true KR970053681A (en) 1997-07-31

Family

ID=66637570

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950068131A KR970053681A (en) 1995-12-30 1995-12-30 Package with die pad structure to prevent package cracking

Country Status (1)

Country Link
KR (1) KR970053681A (en)

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