KR970053675A - Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation - Google Patents
Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation Download PDFInfo
- Publication number
- KR970053675A KR970053675A KR1019950065930A KR19950065930A KR970053675A KR 970053675 A KR970053675 A KR 970053675A KR 1019950065930 A KR1019950065930 A KR 1019950065930A KR 19950065930 A KR19950065930 A KR 19950065930A KR 970053675 A KR970053675 A KR 970053675A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- lead
- resin
- lead frame
- bonding pads
- Prior art date
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Abstract
본 발명은 수지의 흐름을 억제하는 수단을 갖는 LOC구조의 리드프레임에 관한 것으로 패키지내에 수지를 주입할 때 미충진이나 보이드 등의 몰딩불량을 방지하는 것을 목적으로 한다.The present invention relates to a lead frame of a LOC structure having a means for suppressing the flow of resin, and an object thereof is to prevent molding defects such as unfilled or voids when resin is injected into a package.
이를 위한 본 발명은 중앙부에 복수개의 본딩패드가 구비된 반도체칩과 상기 칩의 상면에 절연테이프 등으로 부착한 리드와 상기 리드와 상기 칩상의 상기 본딩패드를 전기적으로 접속된 연결한 금속와이어와 상기 칩과 상기 리드를 포함하는 일정부위를 수지몰딩한 볼딩컴파운드로 구성된 LOC타입 반도체 패키지에서, 상기 칩의 양쪽 측면의 최소한 어느 한쪽의 리드상에 수지흐름 억제수단을 형성한 것을 특징으로 한다.To this end, the present invention provides a semiconductor chip having a plurality of bonding pads in a central portion thereof, a lead attached to an upper surface of the chip by an insulating tape, and a metal wire electrically connected to the lead and the bonding pads on the chip. In a LOC type semiconductor package composed of a molding compound in which a chip and a predetermined portion including the lead are resin molded, the resin flow suppressing means is formed on at least one of the leads of both sides of the chip.
이와 같은 구조의 본 발명에 의한 리드프레임은 캐비티내에 수지충전시 캐비티 폭방향에 따른 유동선단의 "W"형상의 폭을 저감시키므로써 캐비티 단부에서의 미충진이나 보이드 등의 몰딩불량을 제어할 수 있으며 리드프레임의 구조를 변경하지 않기 때문에 몰딩불량 제거에 따른 휨 불량에의 악영향을 제거할 수 있다.The lead frame according to the present invention with such a structure can control the molding defect such as unfilled or void at the end of the cavity by reducing the width of the "W" shape of the flow end along the cavity width direction when the resin is filled in the cavity. In addition, since the structure of the lead frame is not changed, the bad influence on the bending failure due to the removal of the molding defect can be eliminated.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3도는 본 발명의 리드프레임 구조의 단면도(A)와 부분상세도(B) 및 다른 실시예(C).3 is a cross-sectional view (A) and partial detail (B) and another embodiment (C) of the leadframe structure of the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065930A KR970053675A (en) | 1995-12-29 | 1995-12-29 | Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065930A KR970053675A (en) | 1995-12-29 | 1995-12-29 | Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970053675A true KR970053675A (en) | 1997-07-31 |
Family
ID=66622812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950065930A KR970053675A (en) | 1995-12-29 | 1995-12-29 | Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970053675A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
KR100610955B1 (en) * | 2000-12-26 | 2006-08-10 | 앰코 테크놀로지 코리아 주식회사 | Leadframe for semiconductor package |
-
1995
- 1995-12-29 KR KR1019950065930A patent/KR970053675A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990034731A (en) * | 1997-10-30 | 1999-05-15 | 윤종용 | Lead-on chip lead frames and packages using them |
KR100610955B1 (en) * | 2000-12-26 | 2006-08-10 | 앰코 테크놀로지 코리아 주식회사 | Leadframe for semiconductor package |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |