KR970053675A - Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation - Google Patents

Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation Download PDF

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Publication number
KR970053675A
KR970053675A KR1019950065930A KR19950065930A KR970053675A KR 970053675 A KR970053675 A KR 970053675A KR 1019950065930 A KR1019950065930 A KR 1019950065930A KR 19950065930 A KR19950065930 A KR 19950065930A KR 970053675 A KR970053675 A KR 970053675A
Authority
KR
South Korea
Prior art keywords
chip
lead
resin
lead frame
bonding pads
Prior art date
Application number
KR1019950065930A
Other languages
Korean (ko)
Inventor
조장호
백중현
장태섭
이경선
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950065930A priority Critical patent/KR970053675A/en
Publication of KR970053675A publication Critical patent/KR970053675A/en

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Abstract

본 발명은 수지의 흐름을 억제하는 수단을 갖는 LOC구조의 리드프레임에 관한 것으로 패키지내에 수지를 주입할 때 미충진이나 보이드 등의 몰딩불량을 방지하는 것을 목적으로 한다.The present invention relates to a lead frame of a LOC structure having a means for suppressing the flow of resin, and an object thereof is to prevent molding defects such as unfilled or voids when resin is injected into a package.

이를 위한 본 발명은 중앙부에 복수개의 본딩패드가 구비된 반도체칩과 상기 칩의 상면에 절연테이프 등으로 부착한 리드와 상기 리드와 상기 칩상의 상기 본딩패드를 전기적으로 접속된 연결한 금속와이어와 상기 칩과 상기 리드를 포함하는 일정부위를 수지몰딩한 볼딩컴파운드로 구성된 LOC타입 반도체 패키지에서, 상기 칩의 양쪽 측면의 최소한 어느 한쪽의 리드상에 수지흐름 억제수단을 형성한 것을 특징으로 한다.To this end, the present invention provides a semiconductor chip having a plurality of bonding pads in a central portion thereof, a lead attached to an upper surface of the chip by an insulating tape, and a metal wire electrically connected to the lead and the bonding pads on the chip. In a LOC type semiconductor package composed of a molding compound in which a chip and a predetermined portion including the lead are resin molded, the resin flow suppressing means is formed on at least one of the leads of both sides of the chip.

이와 같은 구조의 본 발명에 의한 리드프레임은 캐비티내에 수지충전시 캐비티 폭방향에 따른 유동선단의 "W"형상의 폭을 저감시키므로써 캐비티 단부에서의 미충진이나 보이드 등의 몰딩불량을 제어할 수 있으며 리드프레임의 구조를 변경하지 않기 때문에 몰딩불량 제거에 따른 휨 불량에의 악영향을 제거할 수 있다.The lead frame according to the present invention with such a structure can control the molding defect such as unfilled or void at the end of the cavity by reducing the width of the "W" shape of the flow end along the cavity width direction when the resin is filled in the cavity. In addition, since the structure of the lead frame is not changed, the bad influence on the bending failure due to the removal of the molding defect can be eliminated.

Description

반도체 봉지시 유동형태를 개선하기 위한 리드프레임 구조Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명의 리드프레임 구조의 단면도(A)와 부분상세도(B) 및 다른 실시예(C).3 is a cross-sectional view (A) and partial detail (B) and another embodiment (C) of the leadframe structure of the present invention.

Claims (3)

중앙부에 복수개의 본딩패드(6)가 구비된 반도체칩(4)과 상기 칩의 상면에 절연테이프(5)등으로 부착한리드(2)와 상기 리드와 상기 칩상의 상기 본딩패드(6)를 전기적으로 접속된 연결한 금속와이어(3)와 상기 칩과 상기 리드(2)를 포함하는 일정부위를 수지몰딩한 몰딩컴파운드(7)로 구성된 LOC타입 반도체 패키지에서, 상기 칩의 양쪽 측면의 최소한 어느 한쪽의 리드상에 수지흐름 억제수단을 형성한 것을 특징으로 하는 리드프레임 구조.A semiconductor chip 4 having a plurality of bonding pads 6 in a central portion thereof, a lead 2 attached to an upper surface of the chip with an insulating tape 5, and the lead and the bonding pads 6 on the chip are formed. In a LOC type semiconductor package comprising electrically connected connected metal wires (3) and a molding compound (7) resin-molded at a predetermined portion including the chip and the lead (2), at least either side of the chip A lead frame structure, wherein a resin flow inhibiting means is formed on one lead. 제1항에 있어서, 상기 수지흐름 억제수단을 상기 리드의 측면으로부터 하향절곡된 돌출편(7,8,9)인 것을 특징으로 하는 리드프레임 구조.The lead frame structure according to claim 1, wherein the resin flow inhibiting means is a protruding piece (7, 8, 9) bent downward from the side surface of the lid. 제2항에 있어서, 상기 돌출편은 반원현(7)이나 사각형(8) 혹은 한 변이 아치형인 사각형(9)의 어느 하나인 것을 특징으로 하는 리드프레임 구조.3. The leadframe structure according to claim 2, wherein the protruding piece is either a semicircle string (7), a quadrilateral (8), or a quadrilateral (9) with one side arcuate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950065930A 1995-12-29 1995-12-29 Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation KR970053675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950065930A KR970053675A (en) 1995-12-29 1995-12-29 Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950065930A KR970053675A (en) 1995-12-29 1995-12-29 Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation

Publications (1)

Publication Number Publication Date
KR970053675A true KR970053675A (en) 1997-07-31

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Application Number Title Priority Date Filing Date
KR1019950065930A KR970053675A (en) 1995-12-29 1995-12-29 Leadframe Structure to Improve Flow Pattern in Semiconductor Encapsulation

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KR (1) KR970053675A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034731A (en) * 1997-10-30 1999-05-15 윤종용 Lead-on chip lead frames and packages using them
KR100610955B1 (en) * 2000-12-26 2006-08-10 앰코 테크놀로지 코리아 주식회사 Leadframe for semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990034731A (en) * 1997-10-30 1999-05-15 윤종용 Lead-on chip lead frames and packages using them
KR100610955B1 (en) * 2000-12-26 2006-08-10 앰코 테크놀로지 코리아 주식회사 Leadframe for semiconductor package

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