JP2005347775A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which allows the transfer of flux to electronic components of which the bump's heights differ to be transferred precisely with sufficient productive efficiency, and which is provided with a low-cost flux holding device. <P>SOLUTION: This electronic component mounting apparatus mounts an electronic component 30 on a substrate by a transfer head (32), and is provided with a moving means for moving the transfer head, a flux feed section (10) which is disposed on a moving path of the transfer head by the moving means, and which applies flux films with a plurality of different thicknesses, and transfer controlling sections (26, 34) which make the electronic component held in the transfer head selectively go up and down to some one of the flux films by controlling the moving means, and transfer the flux to the electronic component. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic component mounting machine and a mounting method.

  As shown in FIG. 4, the electronic component mounting machine 100 has the electronic component mounted at the tip in order to mount the electronic component 104 supplied by the electronic component supply device 102 such as a tape feeder at a predetermined position on the substrate 106. An electronic component suction nozzle 108 that can vacuum-suck and release 104, a head portion 110 that supports the electronic component suction nozzle 108 so as to be movable in the Z-axis direction and rotatable about the θ-axis, and the head portion 110 An XY drive unit 112 that is supported so as to be movable in the XY axis direction, and a flux holding device 114 for transferring the flux to the bump (terminal unit) 104A of the electronic component 104 are provided.

  As shown in FIG. 5, the electronic component 104 is mounted on the substrate 106 so that the bumps 104A on the lower surface side and the pads 106A on the substrate 106 coincide.

  In order to securely bond the electronic component 104 onto the substrate 106, a paste-like flux is generally transferred to either the bump 104 </ b> A of the electronic component 104 or the pad 106 </ b> A on the substrate 106.

  Since the flux is corrosive, it is transferred to the minimum necessary only for the joint, and is washed and removed after the joint.

  When the distance between the bumps of the electronic component is relatively large, the distance between the pads on the substrate is also large, and the flux is transferred to the pad 106A side by a printing machine or the like.

  On the other hand, for example, in the case of an electronic component with a small bump interval such as a flip chip, the pad interval on the substrate is also small, and it is difficult to apply flux to the pad side with a printing machine or the like. The bump of the electronic component is brought into contact with the flux that is thinly extended on the flux holding device, and the flux is transferred to the bump side.

  FIG. 6 shows a structure of a general flux holding device.

  The flux holding device 114 includes a dish-shaped flux reservoir 118 rotatably supported on a base member 116, a blade 120, an arm 124 disposed horizontally to support the upper end of the blade 120, It has a support column 126 that supports the arm 124 so that the vertical position can be adjusted, and a micrometer 128.

  The flux storage portion 118 includes a disc-shaped bottom plate 118A and a ring-shaped side wall 118B protruding upward from the outer peripheral portion of the bottom plate 118A. The flux storage portion 118 stores flux inside and is rotated around a central axis by an actuator (not shown). It is driven.

  The blade 120 is a substantially rectangular plate-like body, and its lower end is disposed close to the upper surface of the bottom plate 118A, and both ends in the horizontal direction are disposed in the vicinity of the central axis and in the vicinity of the inner peripheral portion of the side wall 118B.

  As shown in FIG. 7, the flux on the rotational direction side of the blade 120 is leveled to a constant thickness equal to the clearance between the lower end of the blade 120 and the bottom plate 118A, while the flux on the opposite side is It is dammed up by the blade 120 and rises above the flux on the traveling side in the rotational direction.

  By adjusting the vertical position of the arm 124, the clearance between the blade 120 and the bottom plate 118A, that is, the thickness of the flux on the bottom plate 118A can be adjusted.

  The clearance amount can be confirmed by the micrometer 128.

  The electronic component 104 is lowered from above the flux that has been uniformed to a certain thickness, and the bump 104A on the lower surface side of the electronic component 104 is brought into contact with the bottom plate 118A so that the flux is transferred to the bump 104A. Has been. By adjusting the clearance so that the flux on the bottom plate 118A is slightly thinner than the height of the bump 104A, the flux is transferred only to the bump 104A.

  As described above, the flux holding device 114 can reliably transfer the flux only to the bump part even if the electronic component has a small bump interval, but transfers the flux to the electronic component having a different bump height. In this case, it is necessary to readjust the clearance, and this adjustment has a problem that the productivity of the substrate is lowered.

  In addition, when two or more types of electronic components having different bump heights are mounted on one substrate, two or more flux holding devices adjusted to different clearances must be installed, which increases equipment cost. There was a problem.

  Further, when the flux is transferred to the electronic component, the rotation of the flux storage unit 118 is temporarily stopped. However, since the thickness of the flux is different on both sides of the blade 120, the flux has the same thickness due to gravity. Tend to flow. For this reason, the flux having a thickness equal to the clearance once swells thicker than the clearance with time, and the flux may be transferred to a portion other than the bump of the electronic component.

  Further, since the flux in the flux reservoir 118 also flows by acceleration / deceleration, the flux reservoir 118 cannot be suddenly accelerated or decelerated, and the transfer of the flux to the electronic component is continuously performed at short time intervals. In such a case, the flux storage portion may not be rotated by a sufficient angle during the transfer of the flux to each electronic component. For this reason, the part used for the transfer of the flux in the flux storage part may be used again for the transfer of the flux without passing through the blade, and the flux may not be accurately transferred to the electronic component.

  Furthermore, since the stored flux is always exposed to the atmosphere, there is a problem that the change of the component with time is likely to proceed due to evaporation of the solvent component.

  The present invention has been made in view of the above problems, and is capable of realizing a low-cost flux holding that can realize accurate and efficient transfer of flux to electronic components having different bump heights. An object of the present invention is to provide an electronic component mounting machine equipped with the apparatus.

  The present invention provides an electronic component mounting machine for mounting an electronic component on a substrate by a transfer head as in claim 1, a moving means for moving the transfer head, and a movement of the transfer head by the moving means A flux supply unit that is provided in the path and supplies a plurality of flux films having different film thicknesses, and an electronic component held by the transfer head by controlling the moving means is selectively selected with respect to any of the flux films. The above object is achieved by an electronic component mounting machine comprising a transfer control unit that moves the flux up and down to transfer the flux to the electronic component.

  According to a second aspect of the present invention, the flux supply unit has one or more recesses having a substantially horizontal surface on the sliding surface that faces upward in a substantially horizontal plane, and holds the paste-like flux in the recess. A flux holding member, a scraping member that contacts the sliding surface of the flux holding member at a substantially horizontal lower end, and an actuator that drives at least one of the scraping member and the flux holding member in a horizontal direction It is characterized by comprising.

  According to a third aspect of the present invention, a plurality of the concave portions are formed at different depths.

  According to another aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component on a substrate by a transfer head as in claim 4, wherein the flux supply unit supplies a plurality of flux films having different film thicknesses; The transfer head holding the electronic component is moved to the flux supply unit, and the electronic component held by the transfer head is selectively raised and lowered with respect to one of the flux films to transfer the flux to the electronic component. The present invention provides an electronic component mounting method comprising a step and a step of transporting and mounting an electronic component onto which a flux has been transferred onto a substrate by a transfer head.

  According to the present invention, it is possible to achieve an excellent effect that the transfer of flux to electronic components having different bump heights can be accurately and efficiently produced by a single flux holding device at a low cost.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1 to 3, the flux holding device 10 of the electronic component mounting machine according to the embodiment of the present invention has a sliding surface 12 </ b> A having an upward substantially horizontal plane, and a concave portion 14 having a bottom surface 14 </ b> A having a substantially horizontal plane. A flux holding member 12 that is formed and holds the paste-like flux in the recess 14, and a scraping member 16 that contacts the sliding surface 12A of the flux holding member 12 at a substantially horizontal lower end portion 16A; An actuator 18 that rotationally drives the flux holding member 12, and the scraping member 16 and the flux holding member 12 slide relative to each other in the horizontal direction, so that an excessive amount is provided on the sliding surface 12A. The replenishment flux stored in the scrape 16 is scraped by the scraping member 16, and the scraped flux fills the recess 14 in the unfilled state. Is the flux in the recess 14 is characterized in that it is held equal to the depth 14B of the concave portion 14 in thickness.

  In addition, the flux holding device of the electronic component mounting machine according to the present invention can be applied to various conventional electronic component mounting machines without any particular restrictions on the configuration of other parts of the electronic component mounting machine excluding the flux holding device. Therefore, the description of the part excluding the flux holding device in the electronic component mounting machine is omitted.

  The flux holding member 12 is a substantially disk-like body and is disposed substantially horizontally and is pivotally supported by the base member 20 so as to be rotatable about the central axis.

  A gear 12B is coaxially attached to the lower surface side of the flux holding member 12 so as to rotate integrally with the flux holding member 12.

  A plurality of (four in the present embodiment) the recesses 14 are spaced apart from the central axis at substantially equal intervals in the circumferential direction, and rotate in the circumferential direction as the flux holding member 12 rotates. Has been. The recesses 14 are formed so that the depths 14B are different from each other.

  The scraping member 16 has a vertical cylindrical side wall 16B, the lower end of the side wall 16B is the lower end portion 16A, and the sliding surface 12A on the rotation locus of the recess 14 at the lower end portion 16A. It is fixedly installed on the base member 20 via a bracket 22 so as to abut against the inner wall of the side wall 16B, and a replenishing flux is stored inside the side wall 16B.

  A position symmetrical to the installation position of the scraping member 16 across the central axis of the flux holding member 12 is a flux transfer position.

  Further, the scraping member 16 is closed at the upper end side by the top plate 16C, and the supply of air from the outside to the upper side of the replenishing flux stored inside is restricted.

  A plug 16D is detachably attached to the top plate 16C, and by removing the plug 16D, flux can be supplied from the attachment hole of the plug 16D to the inside of the scraping member 16.

  Further, a lattice-shaped throttle member 24 is provided inside the scraping member 16 to restrict the flow of replenishing flux inside the scraping member 16.

  On the outside and inside of the sliding locus of the scraping member 16 (relative sliding locus of the scraping member 16 as viewed from the flux holding member 12) on the sliding surface 12A of the flux holding member 12. The ring-shaped recovery grooves 25A and 25B are formed along the sliding locus.

  The actuator 18 is an electric motor and is fixedly installed on the base member 20. A gear 18A is attached to the output shaft of the actuator 18 so as to rotate integrally with the output shaft.

  The gear 18A meshes with and engages with the gear 12B of the flux holding member 12, and the actuator 18 rotates the flux holding member 12 through the gears 18A and 12B.

  A first control means 26 is connected to the actuator 18.

  A sensor 28 is provided in the vicinity of the outer periphery of the flux holding member 12 and in the vicinity of the upper portion of the sliding surface 12A.

  The sensor 28 is a transmissive optical sensor composed of a pair of light projectors 28A and light receivers 28B, and the light projected from the light projectors 28A to the light receivers 28B passes near the upper part of the recess 14 located at the flux transfer position. And is fixed to the base member 20 via a bracket 28C.

  Thereby, the sensor 28 can detect at least one of the electronic component 30 that approaches and separates from the concave portion 14 at the flux transfer position and the electronic component suction nozzle 32 that vacuum-sucks the electronic component 30. Second control means 34 is connected to the light receiver 28 </ b> B and the actuator 18.

  Reference numeral 30 </ b> A in the figure denotes a bump formed to protrude from the lower surface side of the electronic component 30.

  Next, the operation of the flux holding device 10 will be described.

  When the actuator 18 rotationally drives the flux holding member 12, the sliding surface 12 </ b> A and the lower end portion 16 </ b> A of the scraping member 16 slide while the concave portion 14 rotates to move the scraping member. Pass under 16.

  When the concave portion 14 is in an unfilled state (a state having a void portion), the replenishing flux stored in the scraping member 16 flows and fills the concave portion 14 by gravity.

  Further, since the lower end portion 16A of the scraping member 16 is in contact with and slides on the sliding surface 12A, the flux above the sliding surface 12A is scraped by the lower end portion 16A, and the It remains in the scraping member 16.

  At this time, the flux holding member 12 is sufficiently filled with the flux in the recess 14 and the flux in the recess 14 is not scraped together with the flux above the recess 14 due to viscosity. The first control means 26 drives and controls the actuator 18 so that the sliding speed between the scraping member 16 and the scraping member 16 becomes the fastest.

  Thereby, the thickness of the flux in the recess 14 is kept equal to the depth 14B of the recess 14.

  Further, since the rotation speed of the flux holding member 12 is high, the work efficiency of the flux transfer work described later is good.

  Furthermore, since the replenishing flux is sealed and stored in the scraping member 16, the evaporation of the solvent and the like is limited to a very small amount, and the change with time of the component is small.

  Further, the upper end side of the scraping member 16 is closed, so that the supply of air from the outside to the upper side of the replenishing flux stored inside is restricted. Therefore, when the replenishing flux decreases, the replenishing flux Negative pressure is generated above the flux.

  As a result, the downward flow of the replenishing flux is restricted, so that the replenishing flux flows out from between the lower end portion 16A of the scraping member 16 and the sliding surface 12A of the flux holding member 12. Limited.

  Further, since the throttle member 24 also restricts the flow of the supplementary flux inside the scraping member 16, the flow of the supplementary flux is also restricted by the throttle member 24.

  That is, the flux holding device 10 can fill the concave portion 14 with a necessary and sufficient amount of flux to keep the thickness of the flux in the concave portion 14 constant, and the replenishing flux can be removed. Since the sealing member 16 is sealed and the change with time is limited, the flux consumption efficiency is good.

  On the other hand, when a small amount of replenishing flux flows out on the sliding surface 12A of the flux holding member 12 (excluding the concave portion 14), the scraping member 16 removes the flowed out flux from the lower end portion 16A. Are guided to the recovery grooves 25A and 25B while being scraped off on the outer peripheral surface of the.

  Since the fluxes that have flowed out of these collection grooves 25A and 25B are collected and stored, the flux that has flowed out does not flow onto the recesses 14.

  That is, the flux in the recess 14 rotates and moves to the flux transfer position while being maintained at a thickness equal to the depth 14B of the recess 14.

  Next, the action of transferring the flux to the electronic component 30 by the flux holding device 10 will be described.

  When transferring the flux to the electronic component 30, the concave portion 14 having the depth 14B suitable for the electronic component 30 is selected, and the concave portion 14 is rotationally moved to the flux transfer position by the actuator 18 and stopped. .

  Here, the depth 14B suitable for the electronic component 30 means a depth slightly shallower than the height of the bump (terminal) 30A on the lower surface side of the electronic component 30.

  In this state, the electronic component 30 and the electronic component suction nozzle 32 are lowered from above the flux transfer position, and the lower end of the bump 30A is brought into contact with the bottom surface of the recess 14.

  As a result, as shown in FIG. 3, the bump 30A enters the flux in the recess 14, but the flux in the recess 14 has a thickness equal to the depth 14B of the recess 14. The vicinity of the upper end of 30A does not enter the flux.

  At this time, the light projected from the projector 28A is blocked by at least one of the electronic component 30 and the electronic component suction nozzle 32 and does not reach the light receiver 28B.

  Accordingly, the second control unit 34 detects that the electronic component 30 is approaching the concave portion 14 at the flux transfer position, and holds the actuator 18 in a stopped state.

  Next, when the electronic component 30 and the electronic component suction nozzle 32 are raised, the flux is transferred to the bumps 30A of the electronic component 30 by viscosity.

  Since the flux in the recess 14 is stable at a thickness equal to the depth 14B of the recess 14, the flux is accurately transferred only to the bump 30A of the electronic component 30.

  That is, the flux is erroneously transferred between the bumps 30A of the electronic component 30 and the like, and corrosion of portions other than the bumps 30A in the electronic component 30 and portions other than the pads on the substrate on which the electronic component 30 is mounted. This will not cause any problems.

  During the above-described flux transfer operation, the concave portion 14 located on the side opposite to the flux transfer position is located below the scraping member 16, so that the scraping member 16 causes the concave portion 14 to be The flux in the recess 14 is sealed without being exposed to air, and the change with time of the component is limited.

  As the electronic component 30 and the electronic component suction nozzle 32 are raised, the light projection from the light projector 28A reaches the light receiver 28B again.

  As a result, the second control means 34 detects that the electronic component 30 and the electronic component suction nozzle 32 are separated from the concave portion 14 at the flux transfer position, and drives the actuator 18 for the next flux transfer. Then, the flux holding member 12 is driven to rotate.

  For example, when the flux is transferred to an electronic component having a bump having the same height as the bump 30A of the electronic component 30, the flux holding member 12 is rotated once.

  The concave portion 14 at the flux transfer position is in an unfilled state in which a part of the flux held inside is transferred to the electronic component 30, but the scraping member 16 is rotated by the rotation of the flux holding member 12. , And filled with the flux to return to the flux transfer position again. Thereby, the flux can be accurately transferred to the bumps of the electronic component as described above.

  When transferring the flux to an electronic component having a bump having a height different from that of the bump 30A of the electronic component 30, the concave portion 14 having the depth 14B suitable for the height of the bump is selected and the flux is selected. The holding member 12 is rotated 1/4 or 1/2 and rotated to the flux transfer position, and the flux transfer operation is performed in the same manner as described above.

  The rotation speed of the flux holding member 12 can be easily detected by attaching a rotary encoder to any one of the actuator 18 and the gears 12B and 18A. By driving and controlling the actuator 18 based on the detected number of rotations, the arbitrary concave portion 14 can be stopped at the flux transfer position.

  As described above, the flux holding device 10 can easily and quickly realize transfer of flux to a plurality of types of electronic components having different bump heights, and can be produced at low cost. Efficiency is good.

  Further, when the concave portion 14 passes under the scraping member 16, the flux in the concave portion 14 is made equal in thickness to the depth 14B of the concave portion 14, and the upper surface of the flux in the concave portion 14 is Since it is leveled to the same height as the sliding surface 12A, the flux in the recess 14 does not flow due to gravity.

  That is, the flux in the concave portion 14 is accurately held at a thickness equal to the depth 14B of the concave portion 14, so that accurate flux transfer can be realized at all times. The flux holding device 10 is reliable. high.

  Further, since the flux is held in the recess 14 having a relatively small volume, the flux in the recess 14 hardly flows even if the recess 14 is rotated at a relatively rapid acceleration / deceleration.

  For this reason, the flux holding member 12 can be rotated and stopped at short time intervals while keeping the thickness of the flux in the recess 14 constant. Accordingly, even when the flux is continuously transferred to the electronic component at short time intervals, the concave portion 14 is continuously rotated and moved between the scraping member 16 and the flux transfer position. Transfer of a proper flux can be realized. That is, the production efficiency of the flux holding device 10 is good not only when electronic components having different bump heights but also when flux is transferred to electronic components having the same bump height.

  Further, the sensor 28 detects the approach / separation of the electronic component to the concave portion 14 at the flux transfer position, and the second control means 34 can quickly drive the actuator 18. Only when the electronic component is approaching, the rotation of the flux holding member 16 can be stopped to minimize the stopping time of the flux holding member 16. That is, the sensor 28 and the second control means 34 also increase the production efficiency of the flux holding device 10.

  Further, the flux holding member 12 has a substantially disc shape, and the concave portion 14 is rotated with the rotation of the flux holding member 12. Therefore, the flux holding member 12 is horizontally moved with the movement of the concave portion 14. The flux holding device 10 is compact and has a simple structure and low cost without protruding in the direction.

  In the example of the present embodiment, the flux holding device 10 has a configuration in which the flux holding member 12 is rotationally driven and the scraping member 16 is fixedly installed so that both slide. The flux holding device may be a flux holding device in which the flux holding member is fixedly installed, the scraping member rotates and the two slide, and the both move and slide. It is good.

  Further, a flux holding device in which the flux holding member and the scraping member relatively move linearly in the horizontal direction and slide both may be used.

  Furthermore, in the example of the present embodiment, the flux transfer position is a fixed position, but the present invention is not limited to this. For example, the position of the recess is fixed, and an electronic component is placed in each recess. It may be moved to transfer the flux.

  In the example of the present embodiment, the scraping member 16 includes a cylindrical side wall 16B. However, the present invention is not limited to this, and the hollow square side wall or the hollow hemispherical side wall is not limited thereto. It is good also as a scraping member which surrounds the flux for replenishment from a horizontal direction.

  Furthermore, in the example of the present embodiment, the lattice-shaped diaphragm member 24 is provided inside the scraping member 16, but the present invention is not limited to this, and a mesh or sponge shape is provided. It is good also as an aperture member.

  Furthermore, when the flux is highly viscous and difficult to flow out of the replenishing flux, a scraping member that limits the flux outflow only by the side wall without providing a throttle member may be used.

  In the example of the present embodiment, the upper end side of the scraping member 16 is closed by the top plate 16C. However, the present invention is not limited to this, and the replenishing flux flows out to the outside. In the case where it is difficult and the change with time of the flux component is not a problem, a scraping member whose inner side is released to the atmosphere without being clogged at the upper end side may be used.

  Further, when the change of the flux component with time is not a problem, it is made of, for example, a single plate, scrapes the replenishing flux without storing the replenishing flux, and fills the recess. It may be a take-up member.

  On the other hand, when the change of the flux component with time is particularly problematic, a plurality of scraping members for sealing and storing the supplementary flux are provided, for example, one of the recesses 14 stops at the flux transfer position. These scraping members may be arranged on all the other recesses 14 when they are in contact.

  In the example of the present embodiment, a plurality of the recesses 14 are formed in the flux holding member 12 at different depths. However, the present invention is not limited to this, and the bottom surface has a plurality of steps. One concave portion having a stepped hole shape or groove shape may be formed in the flux holding member.

  On the other hand, when the flux is continuously transferred to electronic parts having the same bump height, a plurality of recesses having the same depth may be formed on the flux holding member.

  By doing so, the flux holding member can be repeatedly rotated and stopped at a rotation angle smaller than one rotation, and the flux transfer operation can be continuously performed, so that the production efficiency is good.

  Further, a groove-shaped recess having a constant depth may be formed in the flux holding member.

  Further, when the flux transfer operation is performed at a relatively long time interval, only one concave portion having a constant hole shape may be formed.

  Further, in the present embodiment, the recess 14 is slightly larger than the electronic component 30 and is shown in FIG. 1 and the like. However, the present invention is not limited to this, and the recess 14 is arranged in the circumferential direction. Further expansion may be possible.

  By doing so, even when the recess 14 is stopped slightly deviated from the flux transfer position, the bump 30A of the electronic component 30 is reliably lowered into the recess 14 to transfer the flux. Can do.

  In the present invention, the bottom surface of the concave portion is a substantially horizontal plane, but the substantially horizontal plane here is a plane having minute odor distribution and unevenness within a range where accurate flux transfer is performed as described above. It is meant to include.

  That is, when flux is transferred due to such an odor and unevenness, if the bump of the electronic component comes into contact with the bottom surface of the recess, the electronic component may be slightly inclined, but the flux is not transferred to some of the bumps. If the flux is not transferred to the top end of some of the bumps and is within the range where accurate flux transfer is performed, an odor distribution that causes such a slight amount of electronic component inclination and This means that the presence of irregularities is allowed.

  In the example of the present embodiment, the flux holding member 12 has two recovery grooves 25A and 25B. However, the present invention is not limited to this, and the replenishment from the scraping member 16 is performed. In the case where the direction in which the flux for use flows out to one of the collecting grooves, only one of the collecting grooves may be formed.

  In this case, since the flux that has flowed out due to centrifugal force tends to flow radially outward, it is preferable to form the outer collection groove 25A.

  Furthermore, when the supplementary flux does not flow out from the scraping member, or when the amount of outflow is very small, a flux holding member in which only a recess is formed without forming a recovery groove may be used.

  In the example of the present embodiment, the sensor 28 is a transmissive optical sensor, but the present invention is not limited to this, and may be a reflective optical sensor.

The perspective view which shows the whole structure of the flux holding | maintenance apparatus which concerns on the example of embodiment of this invention. Sectional drawing which expands and shows the principal part structure of the flux holding device Sectional drawing which expands and shows the flux transfer work in the flux holding device The perspective view which shows the whole structure of the conventional electronic component mounting machine Side view showing bonding state between bumps of conventional electronic component and pads of substrate Sectional drawing which expands and shows the whole structure of the flux holding device in the conventional electronic component mounting machine Sectional drawing which shows the principal part structure of the flux holding device

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Flux holding device 12 ... Flux holding member 12A ... Sliding surface 14 ... Recess 14A ... Bottom 14B ... Depth 16 ... Scraping member 16A ... Lower end 18 ... Actuator 26 ... First control means 28 ... Sensor 30 ... Electronics Component 32 ... Electronic component suction nozzle (transfer head)
34 ... Second control means

Claims (4)

  An electronic component mounting machine for mounting an electronic component on a substrate by a transfer head, wherein the transfer means moves the transfer head, and a plurality of film thicknesses are arranged in a transfer path of the transfer head by the transfer means. A flux supply unit for supplying a flux film and an electronic component held on the transfer head by controlling the moving means are selectively moved up and down relative to one of the flux films to transfer the flux to the electronic component. An electronic component mounting machine comprising a transfer control unit. In claim 1,
The flux supply part is formed substantially horizontally with a flux holding member for holding a paste-like flux in the recess, in which one or more recesses having a bottom surface in a substantially horizontal plane are formed on a sliding surface in an approximately horizontal plane upward. An electronic device comprising: a scraping member that contacts a sliding surface of the flux holding member at a lower end portion; and an actuator that drives at least one of the scraping member and the flux holding member in a horizontal direction. Parts mounting machine. In claim 2,
An electronic component mounting machine, wherein a plurality of the recesses are formed at different depths.   An electronic component mounting method for mounting an electronic component on a substrate by a transfer head, the step of supplying a plurality of flux films having different film thicknesses by a flux supply unit, and the flux supply of the transfer head holding the electronic component A step of transferring the flux to the electronic component by selectively raising and lowering the electronic component held by the transfer head with respect to any of the flux films, and transferring the electronic component to which the flux has been transferred And a step of transporting and mounting the substrate on a substrate by a head.

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