JP5082358B2 - Coating device, mounting device, and electronic component manufacturing method - Google Patents

Description

  The present invention relates to a coating apparatus for applying a paste-like treatment agent such as flux to circuit elements such as IC (Integrated Circuit) and electronic components packaged with the circuit element, a mounting apparatus equipped with this coating apparatus, a coating method thereof, an electronic The present invention relates to a component manufacturing method and the electronic component.

  In a manufacturing process of an electronic component, for example, there are FC (Flip Chip), CSP (Chip Size Package), PoP (Package on Package), and the like as techniques for mounting circuit elements such as IC (Integrated Circuit) on a substrate. In such a mounting process, flux is applied to the electrodes of circuit elements such as solder bumps. This is to prevent the electrodes from being oxidized or to increase the wettability of the electrodes so that the circuit element and the substrate are easily attached.

  As an apparatus for applying a flux and mounting an electronic component on a substrate, there is an apparatus in which a concave portion is provided on a flux holding member (rotating plate) (see, for example, Patent Document 1). In the apparatus of Patent Document 1, flux is stored in the recess, and an electrode ball of an electronic component is immersed in the recess. The depth of the recess corresponds to the flux film thickness. Further, in the apparatus of Patent Document 1, a plurality of concave portions having different depths are provided on one plate, and can cope with a plurality of types of electronic components.

JP 2005-347775 (paragraphs [0051], [0062], [0074])

  However, in the apparatus of Patent Document 1, for example, when a flux having the same film thickness is continuously applied to two or more electronic components, the flux holding member must be rotated at least once or more. This degrades the processing efficiency.

In view of the circumstances as described above, an object of the present invention, a providing child a technique that can increase the efficiency of the coating process of treating agent such as a flux, also a treating agent such as a flux stably on the plate The object is to provide a technology that can exist and reduce maintenance.

In order to achieve the above object, a coating apparatus according to the present invention comprises:
A plate provided rotatably and supplied with a paste-like treatment agent;
A film forming member that is disposed with a gap on the plate, and forms a film of the treatment agent on the plate by passing the gap by the rotation of the plate;
The film forming member has an upper wall that faces the plate and presses the processing agent toward the film forming member by rotation of the plate against the plate, and an outer peripheral wall provided on an outer peripheral side of the rotation by the plate. A pressing member disposed in proximity to,
A moving mechanism for moving the film forming member so as to change the size of the gap;
Control means for controlling movement of the moving mechanism in accordance with information on the electronic component to be processed.

  In this invention, the film thickness of the processing agent apply | coated to a plate can be changed automatically. Therefore, the efficiency of the treatment agent coating process can be increased. Moreover, since the film thickness of the processing agent is controlled with high accuracy, the reliability of the film thickness of the processing agent applied to the electronic component is improved.

  According to one form of this invention, the said control means forms the said film | membrane of the said processing agent by 1st film thickness according to 1st electronic component information among the information of the said electronic component, Then, the said plate Is rotated by a predetermined angle equal to or less than one rotation, and the film of the treatment agent is different from the first film thickness in accordance with second electronic component information different from the first electronic component information. The moving mechanism is controlled so as to form with a film thickness. Thereby, for example, two different types of electronic components can be continuously applied with the treatment agent.

  When the treatment agent is smoothed by the film forming member, the treatment agent adhering to the film forming member rises, but the swell is pressed from above by the pressing member. Thereby, problems, such as a processing agent flowing out of a plate, can be solved and a processing agent can exist stably on a plate. Therefore, maintenance can also be reduced.

  According to one form of this invention, the said pressing member has the upper wall facing the said plate, and the outer peripheral wall provided in the outer peripheral side of rotation by the said plate. Thereby, it is possible to suppress the swell of the processing agent particularly on the rotating outer peripheral side on the plate, and to prevent the processing agent from flowing out of the plate. The pressing member may further have an inner peripheral wall facing the outer peripheral wall.

  According to one form of this invention, the said upper wall has an inner surface which approaches the said plate gradually as it goes to the said film formation member. Thereby, the processing agent is gradually pressed down, and a clean processing agent film can be formed in front of the film forming member. “Gradually” includes both “continuously” and “stepwise” meanings. The same applies hereinafter.

  According to one form of this invention, the said upper wall has an inner surface which approaches a plate gradually as it goes to the said outer peripheral wall. Thereby, the processing agent staying on the outer peripheral side can flow to the inner peripheral side, and the rising of the processing agent on the outer peripheral side can be effectively suppressed.

  According to an aspect of the present invention, the upper wall includes an inner surface and a plurality of grooves formed in the inner surface in the circumferential direction of the rotation. Thereby, a processing agent comes to flow along the groove | channel of the circumferential direction inside a pressing member. Therefore, it can suppress that a processing agent moves to the outer peripheral side.

  According to an aspect of the present invention, the upper wall includes an inner surface and a plurality of grooves formed on the inner surface so that the processing agent gradually moves toward the inner peripheral side of the rotation by the rotation of the plate. . Thereby, since a processing agent comes to flow to the inner peripheral side, the rising of the processing agent on the outer peripheral side can be effectively suppressed.

  According to an aspect of the present invention, the coating apparatus detects a movement of the pressing member, a support mechanism that supports the pressing member so that the pressing member moves by pressure when the processing agent flows. Detection means. For example, when the processing agent is consumed and reaches a predetermined amount from the initial state where the processing agent is supplied onto the plate, the position of the pressing member changes from the initial state. Therefore, by detecting the movement of the pressing member, the amount of the processing agent pressed by the pressing member can be confirmed. As a result, the film thickness of the treatment agent on the plate can be easily managed.

  According to an aspect of the present invention, the support mechanism elastically supports the pressing member. Thereby, the position of the pressing member is accurately determined according to the amount of the processing agent. As a result, the detection accuracy of the position by the detection means is improved.

  According to one form of this invention, it has the hinge mechanism which is provided in the film | membrane formation member side of the said pressing member, and rotates the said pressing member. In the present invention, the pressing member moves as the pressing member rotates about the hinge mechanism. That is, the processing agent flows from the side opposite to the film forming member side of the pressing member.

  According to an aspect of the present invention, the support mechanism includes a hinge mechanism that rotates the pressing member, and a spring that elastically holds the pressing member. Thereby, the position of the pressing member is accurately determined according to the amount of the processing agent. As a result, the detection accuracy by the detection means is improved. In the case of the present invention, the hinge mechanism may be arranged on either the film forming member side or the treatment agent inflow side on the opposite side.

  According to one form of this invention, the said support mechanism has a linear moving mechanism which the said pressing member supports so that a linear movement is possible. The pressing member may be moved by its own weight. Alternatively, the support mechanism may further include a spring that elastically supports the pressing member. The moving direction of the linear moving mechanism may be the vertical direction or the oblique direction.

  According to an aspect of the present invention, the coating apparatus further includes detection means for detecting the movement of the pressing member, and the pressing member acts like a leaf spring. Similarly, in the present invention, the position of the pressing member is determined with high accuracy, and the detection accuracy by the detection means is improved.

  According to an aspect of the present invention, the pressing member is made of a transparent or translucent material. The transparency of the pressing member may be such that the remaining amount of the processing agent between the pressing member and the plate can be visually confirmed.

  According to an aspect of the present invention, the coating apparatus further includes a cover provided on the plate. Thereby, dust and dust can be prevented from adhering to the plate and the processing agent. Moreover, drying of a processing agent can be suppressed and the lifetime of a processing agent can be extended.

  According to one form of this invention, the said cover is arrange | positioned adjacent to the said pressing member. Since the treatment agent is most present under the pressing member, drying of the treatment agent can be suppressed.

  According to an aspect of the present invention, the pressing member has an opening provided on the upstream side, and the cover has a wall member provided so as to close a part of the opening. Thereby, drying of the processing agent pressed by the pressing member can be suppressed. Further, for example, when the holding head for holding the electronic component of the mounting apparatus cannot hold the electronic component and is left on the processing agent, even if the plate rotates and the electronic component moves, it hits the wall member. That is, it is possible to prevent the electronic component from moving to the pressing member.

  As described above, according to the present invention, a treatment agent that can increase the efficiency of coating treatment with a treatment agent such as flux can be stably present on the plate.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing an electronic component mounting apparatus according to an embodiment of the present invention. The mounting apparatus 10 is an apparatus for mounting another electronic component on a certain electronic component. Typically, a circuit element such as a BGA (Ball Grid Array) is mounted on a printed wiring board. The mounting apparatus 10 is used particularly for FC (Flip Chip) technology, PoP (Package on Package) technology, CSP (Chip Size Package) technology, and the like. The two electronic components processed by the mounting apparatus 10 are bonded by thermocompression bonding or other methods in another apparatus.

  The mounting apparatus 10 includes a mounting mechanism 1, a flux application unit 5, a tray 11, a parts cassette 7, and the like.

  The mounting mechanism 1 is a mechanism that holds an electronic component W to be processed, such as a circuit element, and mounts it on, for example, the printed wiring board 3. Specifically, the mounting mechanism 10 moves the suction nozzle 29 that holds the electronic component W, the mounting head 8 to which the suction nozzle 29 is mounted, and the mounting head 8 in three axes (X axis, Y axis, and Z axis). A head moving mechanism 2 is provided. The head moving mechanism 2 uses, for example, ball screw driving, belt driving, linear motor driving, or other driving methods. The suction nozzle 29 holds the electronic component W by vacuum suction using a vacuum generation source (not shown), for example. Instead of vacuum suction, it may be mechanically held.

  The mounting mechanism 10 includes an image processing camera 9 that observes the position and the like of the electronic component W sucked by the suction nozzle 29. The camera 9 is disposed below the suction nozzle 29. However, the arrangement may be anywhere and may be arranged at the same height as the suction nozzle 29 or higher. In that case, imaging can be performed using reflection from a mirror or the like. As the imaging element of the camera 9, for example, a CCD (Charge Coupled Device), a CMOS (Complementary Metal-Oxide Semiconductor), or the like may be used.

  The parts cassette 7 stores a tape for TAB (Tape Automated Bonding). In the tray 11, the electronic components W are accommodated vertically and horizontally. The parts cassette 7 is supported by the support base 6. The electronic component W may be supplied by the parts cassette 7. The flux application unit 5 is also supported by the support base 6. The parts cassette 7 and the flux application unit 5 are configured to be detachable from the support base 6. Similarly, the tray 11 may be detachable from the tray support base 41.

  FIG. 2 is a perspective view showing the flux application unit 5. The flux application unit 5 includes an application unit 16, a drive unit 17, and an electrical unit 18 in this order from the front. FIG. 3 is a perspective view showing the application unit 16. 4 is a plan view of the application unit 16, and FIG. 5 is a cross-sectional view taken along line AA in FIG.

  The application unit 16 includes a base 19, a plate 12 provided on the base 19 and supplied with a flux as a paste-like treatment agent, and a squeegee 25 disposed on the plate 12 with a gap m (see FIG. 5). , Located near the squeegee 25 and includes a pressing block 26 that presses the flux against the plate 12. The application unit 16 includes an elevating mechanism 21 that moves up and down as a moving mechanism that moves the squeegee 25. As shown in FIG. 5, the elevating mechanism 21 includes a servo motor 22 fixed by a member (not shown), for example. A ball screw 22 a is connected to the rotation shaft of the servo motor 22. The elevating mechanism 21 includes a column 23 erected substantially vertically, and the column 23 is provided with a guide rail 23a. A linear guide 24 is provided on the guide rail 23a so as to be movable up and down. A connection member 24 a connected to the ball screw 22 a is fixed to the upper part of the linear guide 24. A mounting member 27 is connected to the linear guide 24, and a squeegee 25 is mounted on the mounting member 27. A stepping motor may be used instead of the servo motor 22.

  The plate 12 is circular, for example, and has a side wall 12a on the outer periphery thereof. The squeegee 25 is a film forming member that forms a film by leveling the flux supplied onto the plate 12. The squeegee 25 is made of a material such as metal, resin, glass or ceramics. A gap m between the squeegee 25 and the film forming surface 12b of the plate 12 is set to a predetermined distance t. As will be described later, the plate 12 rotates around the central axis 28 (see FIG. 5). Therefore, the flux supplied onto the plate 12 passes through the gap m, whereby a flux film having the distance t (film thickness t) is formed. The flux is supplied onto the plate 12 manually or automatically. In this case, the flux may be supplied manually by an operator, or a flux supply device (not shown) may be provided on the plate 12. When this supply device is provided, the flux is supplied onto the plate 12 manually or automatically.

  FIG. 6 is a diagram illustrating a control system of the coating unit 16, the driving unit 17, and the mounting apparatus 10. The drive unit 17 is connected to a motor 31, a pair of timing pulleys 37 a and 37 b to which a timing belt 34 is applied, and a rotating shaft 32 of the motor 31 via a coupling 33, and transmits the rotation to the timing pulley 37 a. 36 and a worm wheel 35. The timing pulley 37 b is connected to the central axis 28 of the plate 12. With such a configuration, the plate 12 rotates about the central axis 28 by driving the motor 31.

  The mounting apparatus 10 includes a main control unit 42, an electronic component information storage unit 43, and a communication interface 44. The electrical unit 18 of the flux application unit 5 includes a control unit 46, a film thickness management table storage unit 47, and a communication interface 45.

  Information regarding the electronic component W is stored in the electronic component information storage unit 43. Hereinafter, the information regarding the electronic component W is simply referred to as electronic component information. The electronic component information will be described later. The main control unit 42 controls the driving of the head moving mechanism 2 and the timing thereof, and extracts electronic component information (or a part of the electronic component information) from the electronic component information storage unit 43 to the electrical unit 18. Send it out.

  The film thickness management table storage unit 47 stores a table in which electronic component information is associated with the film thickness of the flux film formed on the plate 12 of the application unit 16. The control unit 46 controls driving of the motor 31 and its timing. Further, the control unit 46 controls the drive of the servo motor 22 according to the electronic component information acquired from the mounting apparatus 10 side, and also controls the timing thereof.

  The communication interfaces 44 and 45 include the concept of software and hardware necessary for communication, for example. For example, any communication means such as a LAN (Local Area Network) or RS-232C may be used as the communication means.

  FIG. 7 is a perspective view showing the pressing block 26. The pressing block 26 is arranged on the upstream side of the squeegee 25 by the rotation of the plate 12. Typically, the pressing block 26 is fixed to the squeegee 25 with screws in the screw holes 26a and the like. However, the fixing means may be other means. In addition to the case where the pressing block 26 is fixed to the squeegee 25, the pressing block 26 may be fixed to another member (not shown) such as the base 19 via an appropriate member.

  As shown in FIG. 4, the pressing block 26 has a shape of a part of a circle. The angle θ is set to, for example, about 60 °, but is not limited thereto. The pressing block 26 has an upper wall 26b facing the plate 12 and an outer peripheral wall 26c provided on the rotating outer peripheral side. The pressing block 26 has an inner peripheral wall 26d provided on the inner peripheral side. The lower end 26g of the outer peripheral wall 26c and the lower end 26h of the inner peripheral wall 26d are separated from the plate 12 by a predetermined distance s (see FIG. 8). The relationship between the distance s and the distance t is s> t. However, s and t may be substantially the same. Or s <t may be sufficient.

  FIG. 8 is a cross-sectional view taken along the outer peripheral wall 26 c of the pressing block 26. In other words, the pressing block 26 has an upstream opening 26e and a downstream opening 26j, and further has an internal region 26i through which the flux passes from the upstream opening 26e to the downstream opening 26j. The arrow indicates the direction of rotation of the plate 12. Further, the inner surface 26f of the upper wall 26b is formed obliquely so as to gradually approach the plate 12 toward the squeegee 25. That is, the height of the inner region 26i gradually decreases from the upstream opening 26e toward the downstream opening 26j. As a result, the flux F is gradually pressed when the plate 12 is rotated, and a clean flux film can be formed before being smoothed by the squeegee 25.

  The pressing block 26 is made of metal, resin, glass, ceramics, or the like. In the case of resin or glass, it may be made of a transparent or translucent material so that the internal region can be visually recognized.

  FIG. 9A is a side view showing an example of the electronic component W processed by the flux application unit 5. FIG. 9B is a plan view thereof. This electronic component W is a BGA type circuit element. Electrode balls 38 made of solder or gold are two-dimensionally arranged on the back surface of the packaging. FIG. 9C is a diagram illustrating dimensions of each part of the electronic component W illustrated in FIGS. 9A and 9B.

  FIG. 10 is a diagram illustrating an example of electronic component information stored in the electronic component information storage unit 43. For example, for the electronic component information whose electronic component ID is “A”, for the electronic component information whose electronic component ID is “B”, the component thickness a is a1, the horizontal dimension b is b1,. Different electronic component information is defined for each ID such that the thickness a is a2, the lateral dimension b is b2, and so on.

  FIG. 11 is a diagram showing an example of the film thickness management table stored in the film thickness management table storage unit 47. In this example, film thicknesses “t1”, “t2” of the flux formed on the plate 12 for each ID (see FIG. 10) “A”, “B”, “C”,. , “T3”,...

  FIG. 12 is a table showing the types of flux. In addition to these fluxes, any paste-like treatment agent such as cream solder or adhesive may be used.

  The operation of the mounting apparatus configured as described above will be described. FIG. 13 is a diagram illustrating the operations in order. FIG. 20 is a flowchart showing the operation.

  The main control unit 42 sends the electronic component information of the electronic component W accommodated in the tray 11 or the ID of the electronic component information to the electrical unit 18 (step 2001). The control unit 46 acquires the electronic component information and the like (step 2002). Then, the control unit 46 extracts the film thickness management table from the film thickness management table storage unit 47, and drives the servo motor 22 according to the film thickness value to control the height position of the squeegee 25 (step 2003). ). The controller 46 rotates the plate 12 supplied with the flux (step 2004). Thereby, a flux film is formed with a film thickness corresponding to the ID. When the flux film is formed, the control unit 46 stops the rotation of the plate 12 (step 2005). The stop timing may be, for example, when the plate 12 is rotated a predetermined number of times. In this case, the number of rotations may be determined in advance according to the type of flux. Alternatively, the rotation stop timing may be manually performed by an operator.

  The mounting head 8 is moved by driving the head moving mechanism 2 in accordance with the control of the main control unit 42. For example, as shown in FIG. 13A, the electronic component W is taken out from the tray 11 by the suction nozzle 29 by the movement of the mounting head 8. As shown in FIG. 13B, when the electronic component W is taken out, the suction nozzle 29 moves to a position above the camera 9 by driving the head moving mechanism 2. The electronic device W is illuminated by the lighting device 48. Then, the position of the electronic component W with respect to the suction nozzle 29 is recognized by image processing by the camera 9, and the amount of displacement is recorded.

  The suction nozzle 29 moves to a position on the plate 12 on which the flux film is formed while sucking the electronic component W. The moving position at this time is a position corrected by the amount of the suction position deviation of the electronic component W. That is, not the suction nozzle 29 but the electronic component W moves so as to be in a predetermined position. As shown in FIG. 13C, the suction nozzle 29 descends from the position by driving the head moving mechanism 2, and applies the flux to the electronic component W (step 2006). At this time, of course, the plate 12 is not rotating. For example, the electronic component W may be applied with the flux on the side opposite to the squeegee 25, that is, at a position separated by about 180 °. However, the application position on the plate 12 is not limited to this, and may be, for example, a position away from the squeegee 25 in the rotation direction by 60 °, 90 °, 120 °, or other angles. This angle also depends on the size of the electronic component W.

  When flux is applied to the electronic component W, the suction nozzle 29 moves to a position above the camera 9. The electronic device W is illuminated by the lighting device 48. Then, the position of the electronic component W with respect to the suction nozzle 29 is recognized again by image processing by the camera 9, and the amount of positional deviation is recorded. Thereafter, the suction nozzle 29 moves the electronic component W to a predetermined position above the printed wiring board 3 in consideration of the positional deviation of the electronic component W. Then, as shown in FIG. 13D, the suction nozzle 29 is lowered, and the electronic component W is placed and mounted at a predetermined position on the printed wiring board 3 (step 2006).

  Either of the recognition processing of the position of the electronic component W by the camera 9 before and after the flux application can be omitted.

  FIG. 14 is a diagram illustrating an example of the relationship between the type of the circuit element that is the electronic component W and the film thickness of the flux F. In FIG. 14A, for example, when the ball diameter is 0.8 mm and the pitch is 1.5 mm, the film thickness t is 0.3 mm. In FIG. 14B, for example, when the ball diameter is 0.6 mm and the pitch is 1 mm, the film thickness t is 0.2 mm. In FIG. 14C, for example, when the ball diameter is 0.3 mm and the pitch is 0.65 mm, the film thickness t is 0.15 mm. The relationship between the types of circuit elements and the flux film thickness shown in FIGS. 14A to 14C is merely an example, and is not limited thereto. For example, if the flux film thickness is tmm and the ball diameter is fmm, then t = (1/3 to 1/2) f.

  Thus, in the present embodiment, the flux film thickness can be automatically changed for each different type of electronic component W, and mounting becomes easy. In particular, different types of electronic components W can be continuously mounted on one printed wiring board 3. For example, as shown in FIG. 15A, for example, a flux is applied in the region 121 to the electronic component with ID “A”. It is assumed that the plate rotates clockwise. Subsequently, the height position of the squeegee 25 is changed according to the film thickness value in the film thickness management table. Then, as shown in FIG. 15B, for example, the plate 12 further rotates clockwise by about 120 ° and stops, and flux is applied to the electronic component W with ID “B” in the region 122. If it does in this way, it will become possible to apply | coat a flux to the electronic component W of a different kind continuously about every 120 degrees. Of course, the coating process may be performed for each rotation angle smaller than 120 °.

  In the device disclosed in Japanese Patent Application Laid-Open No. 2005-347775 described above, a plurality of concave portions having different depths are provided on one plate, and can cope with a plurality of types of electronic components.

  As shown in FIG. 16, for example, an apparatus in which concave portions are provided at intervals of 120 ° is assumed. The depths of the recesses 212a, 212b, and 212c are different from t1, t2, and t3, respectively. In this case, for example, when flux is continuously applied to a plurality of electronic components with the same film thickness, the plate must be rotated 360 ° every time processing of one electronic component is completed.

  For example, it is assumed that the flux is applied at a position 180 degrees away from the squeegee 225 (the position of the recess 212b). The rotation direction of the plate 212 is clockwise. In this case, when a flux having a film thickness t2 is applied in the recess 212b and then a flux having a film thickness t3 is applied in the recess 212c, the plate 212 must be rotated by 240 °.

  FIG. 17A is a table showing the rotation angle of the plate necessary for switching the film thickness in the apparatus shown in FIG. For example, if the film thickness before switching is t1 and the film thickness after switching is t2, a rotation of 240 ° is necessary. This results in poor processing efficiency. Further, since the type of film thickness depends on the number of recesses, there is a limit to increasing the type of film thickness.

  FIG. 17B is a table showing the rotation angle of the plate 12 necessary for switching the film thickness in the flux application unit 5 according to the present embodiment. Here, it is assumed that a flux application process is performed on one electronic component W by rotating the plate 12 every 120 °. Thus, a rotation of 120 ° is sufficient for all. In the case of the conventional apparatus of FIG. 17A, when all the angles shown in this table are added, it is 2160 °. In the case of the present embodiment shown in FIG. 17B, adding all the angles results in 1080 °, which is twice the efficiency as compared with the conventional case. In the present embodiment, the film thickness can be freely set.

  Thus, in the flux application unit 5 according to the present embodiment, the processing efficiency is improved and the processing speed can be increased. The necessity for speeding up such a flux coating process will be described below.

  The mounting apparatus 10 according to the present embodiment is a model in which one suction nozzle 29 is mounted on the mounting head 8, and a so-called 1by1 mounting method is shown. However, there is a model in which a plurality of suction nozzles are mounted on the mounting head (for example, JP-A-2001-77594). In the apparatus described in this document, processing is performed on a plurality of electronic components. That is, a flux application process is continuously performed on a plurality of electronic components. Therefore, in this case, the speed of flux application becomes a factor that limits the speed of mounting electronic components, and high speed is required to change the film thickness.

  In the present embodiment, since the film thickness of the flux is controlled with high accuracy, the reliability of the film thickness of the flux applied to the electronic component W is improved.

  Next, the operation and effect of the pressing block 26 will be described, but before that, the movement of the flux when the pressing block 26 is not provided will be described.

  FIG. 18 is a diagram for explaining the operation when the flux film is formed by the squeegee 225 when the pressing block 26 is not provided. Now, the rotation direction of the plate 212 is clockwise. As shown in FIGS. 18A and 18B, the flux F supplied on the plate 212 is leveled by the squeegee 225. At this time, out of the flux F on the upstream side of the squeegee 225, the flux F (lower part) in contact with the plate 212 is circumferentially together with the plate 212 due to its viscosity and frictional force with the plate 212. Moving. As shown in FIG. 18B, the lower part of the flux F that has progressed in the circumferential direction passes through the gap between the squeegee 225 and the plate 212. However, the upper part hits the squeegee 225. As a result, the flux F in the upper part rises along the displacement surface 225a of the squeegee 225. The raised flux F does not receive the rotational force (frictional force) from the plate 212, receives the pressing force from the squeegee 225, and moves in a direction substantially perpendicular to the displacement surface 225a. As a result, the flux F moves from the original position to the outer peripheral side of the plate 212 and descends again to contact the plate 212. As a result, as shown in FIG. 18C, the flux F flows so as to move to the outer peripheral side while rotating spirally. FIG. 28 is a photograph showing the state of the flux F that has moved to the outer peripheral side.

  Next, a case where the pressing block 26 is present will be described. 19 is a cross-sectional view taken along line BB in FIG. For example, the flux F is supplied onto the plate 12 on the upstream side of the pressing block 26. At this time, the plate 12 may be rotating or may be stopped. The flux F on the rotating plate 12 passes through the inner region 26 i of the pressing block 26. As described above, most of the flux F flows spirally on the upstream side of the squeegee 25, and rises to move toward the outer peripheral side. As shown in FIG. 19, the pressing block 26 can suppress this rise. Thereby, the problem that the flux F flows out of the plate 12 can be solved, and the flux F can be stably present on the plate 12. Therefore, maintenance can also be reduced.

  In particular, the pressing block 26 can suppress the swelling of the processing agent on the outer peripheral side by the outer peripheral wall 26c.

  Further, as described above, the inner surface of the upper wall 26 b of the pressing block 26 is formed obliquely so as to gradually approach the plate 12 toward the squeegee 25. Therefore, a clean flux film can be formed before leveling with the squeegee 25.

  Conventionally, as shown in FIG. 29, when the amount of the flux F on the plate 212 decreases, most of the flux F adheres to the squeegee 225, and the flux F does not adhere to the plate 212. There is a case. On the other hand, according to the present embodiment, the flux F can be stably sent to the squeegee 25 by the pressing block 26, so that such a conventional problem can be solved.

  If the coating amount of the flux F is too small or not applied, it causes connection failure. Further, if the amount of the flux F is too much, it causes a defect in solder formation, and if it remains, the corrosion of the remaining flux F will harm the product. Therefore, the film thickness of the flux F must be managed sufficiently.

  Next, a pressing block according to another embodiment of the present invention will be described. In the following description, the description of the pressing block 26 according to the embodiment shown in FIG. 7 and FIG.

  21 is a view seen in the same direction as the cross-sectional view shown in FIG. The inner surface 56f of the upper wall 56b of the pressing block 56 gradually approaches the plate 12 toward the outer peripheral wall 56c. The inner surface 56f may be a flat surface or a curved surface. As a result, the pressure of the flux F is increased on the outer peripheral side of the inner region of the pressing block 56. As a result, the flux F staying on the outer peripheral side can flow to the inner peripheral side, and the rising of the flux F on the outer peripheral side can be effectively suppressed.

  The upper wall 66b of the pressing block 66 shown in FIG. 22 has a plurality of grooves 66k on its inner surface 66f. The arrow indicates the direction of rotation of the plate 12. FIG. 23 is a sectional view of the pressing block 66 in the radial direction of the plate 12. These grooves 66k are formed along the circumferential direction of rotation. Accordingly, the flux F flows along the circumferential groove 66k in the inner region of the pressing block 66. That is, even if the movement of the flux F as described with reference to FIG. 18 occurs, the flux F only rises in each groove 66k, and the movement of the flux F toward the outer peripheral side can be suppressed.

  In the pressing block 76 shown in FIG. 24, a plurality of grooves 76k formed on the inner surface 76f are formed so as to gradually move toward the inner peripheral side of the rotation as the distance from the side where the squeegee 25 is arranged to the upstream side. Yes. Thereby, since the flux F flows to the inner peripheral side along these grooves 76k, the rising of the flux F on the outer peripheral side can be effectively suppressed.

  A combination of the pressing block 66 or 76 shown in FIG. 22 or 24 and the pressing block 56 shown in FIG. 21 is also conceivable. That is, the inner surface 66f (or 76f) in which each groove 66k (or 76k) of the pressing block 66 (or 76) shown in FIG. 22 (or FIG. 24) is formed is the outer periphery like the inner surface 56f shown in FIG. The structure which approaches the plate 12 gradually as it goes to the side may be sufficient.

  FIG. 25 is a perspective view showing a flux application unit according to another embodiment of the present invention. In the following description, the description of the same members and functions of the flux application unit 5 according to the embodiment shown in FIG. 2 will be simplified or omitted, and different points will be mainly described.

  On the plate 12 of this flux application unit, in addition to the squeegee 25 and the pressing block 26, a cover 53 covering the plate 12 is disposed. The cover 53 is made of metal, resin, glass, ceramics, or other materials. In the case of resin or glass, the cover 53 may be made of a transparent or translucent material so that the remaining amount of flux on the plate can be visually recognized. The cover 53 may be attached to the column 23, the base 19, and other fixed members (not shown). The cover 53 may be detachably attached to members such as the column 23.

  By providing such a cover 53, it is possible to prevent dust and dirt from adhering to the plate 12 and the flux. Moreover, drying of the flux can be suppressed, and the life of the flux can be extended.

  As shown in FIG. 25, the cover 53 is not necessarily required to cover the entire region other than the region covered with the pressing block 26 in the region on the plate 12. For example, it may be a size that covers the same angle of about 60 ° as the pressing block 26, or may be a size larger than that. When the cover 53 covers the entire region other than the region covered with the pressing block 26 in the region on the plate 12, a form in which a part of the cover 53 is a lid that opens and closes is also conceivable. By providing such a lid, the flux can be supplied onto the plate 12 by opening the lid.

  FIG. 26 is a perspective view showing a modification of the cover. The arrow indicates the direction of rotation of the plate 12. FIG. 27 is a cross-sectional view showing an example in which the cover 63 is arranged close to the pressing block 26. The cover 63 has, for example, a screw hole 63d on the upstream side, and is attached to the base 19 with screws (not shown). Further, the cover 63 includes a wall member 63 a provided so as to close a part of the opening 26 e of the pressing block 26. Thereby, drying of the flux F in the inner region 26 i of the pressing block 26 can be suppressed. Further, for example, when the suction nozzle 29 of the mounting apparatus 10 fails to suck the electronic component W and the electronic component W remains on the flux F, the electronic component W remains on the wall even if the plate 12 rotates and the electronic component W moves. It hits the member 63a. In other words, the presence of the wall member 63a can prevent the electronic component W from moving to the inner region 26i of the pressing block 26.

  FIG. 30 is a diagram showing a main part of a flux application unit according to still another embodiment of the present invention.

  The application unit 116 of the flux application unit includes a plate 12, a squeegee 25, and a pressing plate 57. The application unit 116 includes an optical sensor 54 disposed above the pressing plate 57 and a support mechanism 61 that supports the pressing plate 57. The pressing plate 57 has the same function as the pressing block 26. The support mechanism 61 includes a hinge portion 58 that connects the pressing plate 57 and the squeegee 25, and a spring 62 provided between the holding member 55 that holds the optical sensor 54 and the pressing plate 57. One end of the holding member 55 is fixed to the squeegee 25, for example. However, the holding member 55 may be fixed to the base 19 (see FIG. 2) or other fixed members. The optical sensor 54 has a function of detecting the amount of movement of the pressing plate 57. As the optical sensor 54, for example, a reflective optical sensor is used, and the moving position of the pressing plate 57 is detected by detecting the amount of reflected light.

  The pressing plate 57 is provided with a folded portion 57a on the upstream side. The pressing plate 57 is urged by a spring 62 toward the plate 12 side. Due to the spring force, the pressing plate 57 is in contact with the plate 12 in the initial state shown in FIG. In the initial state shown in FIG. 30, the folded portion 57a of the pressing plate 57 is directed obliquely upward.

  As shown in FIG. 31A, when the flux F is smoothed by the squeegee 25, the flux F rises upstream of the squeegee 25. The pressing plate 57 receives pressure from the flux F when the flux F flows. However, the swell of the flux F is suppressed by the downward pressing force of the pressing plate 57.

  Thus, the pressing plate 57 has the same effect as the pressing block 26 as described above. Further, the folding portion 57 a of the pressing plate 57 makes it easy for the flux F to easily enter under the pressing plate 57 by the rotation of the plate 12 in the initial stage. Thereby, the flux F is smoothly sent to the squeegee 25 side.

  The pressing plate 57 may not be a flat plate, but may have a curved surface, an outer peripheral wall 26c as in the pressing block 26, or the like.

  As shown in FIG. 31B, the flux F is consumed and the amount of the flux F is reduced. Then, the pressing plate 57 is rotated downward about the hinge portion 58 by the force of the spring 62. When the amount of reflected light detected by the optical sensor 54 is equal to or less than a predetermined threshold, the control unit 46 (see FIG. 6) determines that the amount of the flux F is equal to or less than the predetermined amount, and stops the rotation of the plate 12. Alternatively, the control unit 46 may issue a warning by sound, light, an image, or other means when the amount of light reflected by the optical sensor 54 becomes a predetermined value or less.

  According to the present embodiment, by detecting the movement of the pressing plate 57, the amount of the flux F pressed by the pressing plate 57 can be confirmed. As a result, the film thickness of the flux F on the plate 12 can be easily managed.

  In addition, since the support mechanism 61 elastically supports the pressing plate 57, the position of the pressing plate 57 is determined with high accuracy according to the amount of the flux F. As a result, the detection accuracy of the position by the optical sensor 54 is improved.

  Although the support mechanism 61 includes the hinge portion 58 and the spring 62, the support mechanism 61 may include any one of them.

  The hinge portion 58 may or may not support the pressing plate 57 elastically. When supporting elastically, the hinge part 58 should just contain spring members, such as a torsion coil spring and a torsion bar spring.

  The elastic support mechanism 61 is not provided, that is, the hinge portion and the spring are not provided, and the pressing plate itself may act like a leaf spring. In this case, the pressing plate 57 is appropriately designed to have a thickness or material that acts as a leaf spring.

  Instead of the optical sensor, a sensor such as a magnetic sensor, an electrostatic sensor, or a strain gauge may be provided.

  FIG. 32 is a diagram showing another embodiment of the application unit of the flux application unit shown in FIG. The application unit 216 according to this embodiment includes a pressing plate 67 that is bent substantially at a right angle. That is, the pressing plate 67 includes a first plate 67a and a second plate 67b, and a rotation shaft 68 between these plates 67a. The rotating shaft 68 is connected to the base 19 and a fixed member (not shown).

  The optical sensor 54 is attached to the squeegee 25. A spring 62 is provided between the squeegee 25 and the end of the second plate 67 b of the pressing plate 67. Further, a stopper 69 that restricts the rotation of the pressing plate 67 is provided. The lower part 25a of the squeegee 25 is formed in a circular arc shape. Accordingly, for example, the pressing plate 67 can be rotated while the end portion of the first plate 67a of the pressing plate 67 and the lower portion 25a of the squeegee 25 are as close as possible.

  Referring to FIG. 32A, when the amount of the flux F is relatively large, a predetermined spring force of the spring 62 acts on the pressing plate 67, and the flux F is applied to the plate 12 by the first plate 67a of the pressing plate 67. Pressed. As shown in FIG. 32B, when the amount of flux F decreases, the second plate 67b approaches the optical sensor 54 by the return force of the spring 62. When the pressing plate 67 is rotated to a predetermined position, the movement is restricted by the stopper 69. At this time, the optical sensor 54 detects the position. At this time, a warning may be issued as described above.

  The bending angle of the pressing plate 67 is a right angle, but is not limited to a right angle. Further, the stopper 69 is not necessarily required. For example, the pressing plate 67 is disposed at an optimal initial position by appropriately setting the spring force of the spring 62.

  FIG. 33 is a plan view showing an application part of a flux application unit according to still another embodiment. 34 is a cross-sectional view taken along line CC in FIG. The application unit 316 according to this embodiment includes a squeegee 85, a pressing block 86, a linear moving mechanism 81 that linearly moves the pressing block 86, and an optical sensor 54 that is disposed above the pressing block 86. Further, in this embodiment, the application unit 316 includes a cover 77 disposed close to the pressing block 86. The cover 77 has the same function as the cover 53 shown in FIG.

  The linear moving mechanism 81 includes, for example, a guide rail 72 provided on the squeegee 85 and a linear guide 74 connected to the pressing block 86 and moving along the guide rail 72. The optical sensor 54 is held by a holding member 75 attached to the base 19 with screws 78. The optical sensor 54 reflects the emitted light by the upper surface 86a of the pressing block 86 and receives the reflected light.

  In the application unit 316 having such a configuration, the pressing block 86 is lowered by the linear moving mechanism 81 with its own weight as the amount of flux decreases. The optical sensor 54 detects the amount of flux by detecting the vertical position of the pressing block 86.

  The guide rail 72 of the linear moving mechanism 81 is not necessarily provided on the squeegee 85, and may be provided on another fixed member (not shown). The pressing block 86 is shown to descend by its own weight. However, the pressing block 86 may be elastically supported by an elastic member such as a spring.

  The flux amount is detected when the plate 12 rotates and the flux pressure increases, or immediately after the plate 12 stops.

  Embodiments according to the present invention are not limited to the embodiments described above, and other various embodiments are conceivable.

  In each of the above embodiments, the plate 12 has a form in which a flux film is formed on the squeegees 25 and 85. However, a form in which the squeegees 25 and 85 move along the plate 12 is also conceivable. In this case, a moving mechanism for moving the squeegees 25 and 85 along the plate 12 is required instead of the mechanism for rotating the plate 12. In this case, the plate may be disk-shaped or other shape such as a rectangle. Further, the squeegees 25 and 85 may reciprocate on the plate by the moving mechanism.

  The shape, size, arrangement, and the like of each member constituting the mounting apparatus 10 and the flux application unit 5 according to each of the above embodiments can be appropriately changed.

It is a perspective view which shows the mounting device of the electronic component which concerns on one embodiment of this invention. It is a perspective view which shows a flux application unit. It is a perspective view which shows an application part. It is a top view which shows an application part. It is the sectional view on the AA line in FIG. It is a figure which shows the control system of an application part, a drive part, and a mounting apparatus. It is a perspective view which shows the pressing block which concerns on one Embodiment. It is sectional drawing seen along the outer peripheral wall of a pressing block. (A) is a side view which shows the example of the electronic component processed with a flux application unit. (B) is a plan view thereof. It is a figure which shows the example of the electronic component information memorize | stored in the electronic component information storage part. It is a figure which shows the example of the film thickness management table memorize | stored in the said film thickness management table. It is the table | surface which showed the kind of flux. It is a figure which shows operation | movement of a mounting apparatus in order. It is a figure which shows the example of the relationship between the kind of circuit element which is an electronic component, and a flux film thickness. In the flux application apparatus which concerns on this Embodiment, it is a figure for demonstrating the rotation angle of the plate in the case of apply | coating a flux to a several kind of electronic component. In the conventional apparatus, it is a figure for demonstrating the rotation angle of the plate in the case of apply | coating a flux to several types of electronic components. (A) is a table | surface which shows the rotation angle of the plate required for switching of a film thickness in the apparatus shown in FIG. (B) is a table | surface which shows the rotation angle of the plate required for switching of a film thickness in the flux application unit which concerns on this Embodiment. It is a figure for demonstrating an effect | action when a flux film | membrane is formed with a squeegee when there is no pressing block. It is the BB sectional view taken on the line in FIG. It is a flowchart which shows operation | movement of the mounting apparatus of FIG. It is sectional drawing which shows the pressing block which concerns on other embodiment. It is a perspective view which shows the pressing block which concerns on another embodiment, and shows the pressing block which has a some groove | channel. It is sectional drawing of the pressing block shown in FIG. Furthermore, it is sectional drawing which shows the pressing block which concerns on another embodiment, and shows the pressing block which has the some groove | channel formed so that it might go to an inner peripheral side. It is a perspective view which shows the flux application unit which concerns on other embodiment of this invention. It is a perspective view which shows the modification of the said cover. FIG. 27 is a cross-sectional view showing an example in which the cover shown in FIG. 26 is arranged close to the pressing block. In the conventional apparatus, the state of the flux which moved to the outer peripheral side is a photograph. It is a figure which shows the state in which the quantity of the flux on a plate decreased in the conventional apparatus. It is a figure which shows the application part of the flux application unit which concerns on another embodiment of this invention. It is a figure which shows operation | movement of the application part shown in FIG. It is a figure which shows another embodiment of the application part of the flux application unit which concerns on another embodiment. It is a top view which shows the application part of the flux application unit which concerns on another embodiment. It is CC sectional view taken on the line in FIG.

Explanation of symbols

m ... gap θ ... angle F ... flux 1 ... mounting mechanism 3 ... printed wiring board 5 ... flux application unit 10 ... mounting device 12 ... plates 16, 116, 216 ... application unit 17 ... drive unit 18 ... electrical unit 21 ... lifting mechanism 25, 85 ... Squeegee 26, 56, 66, 76, 86 ... Pressing block 26b, 56b, 66b, 76b ... Upper wall 26c ... Outer wall 26f, 56f, 66f, 76f ... Inner surface 42 ... Main control unit 43 ... Electronic component information Storage unit 46 ... Control unit 53, 63, 77 ... Cover 54 ... Optical sensor 57, 67 ... Pressing plate 58 ... Hinge unit 61 ... Support mechanism 62 ... Spring 63 ... Cover 63a ... Wall member 66k, 76k ... Groove 81 ... Linear movement mechanism

Claims (4)

A plate provided rotatably and supplied with a paste-like treatment agent;
A film forming member that is disposed with a gap on the plate, and forms a film of the treatment agent on the plate by passing the gap by the rotation of the plate;
The film forming member has an upper wall that faces the plate and presses the processing agent toward the film forming member by rotation of the plate against the plate, and an outer peripheral wall provided on an outer peripheral side of the rotation by the plate. A pressing member disposed in proximity to,
A moving mechanism for moving the film forming member so as to change the size of the gap;
And a control unit that controls movement of the moving mechanism in accordance with information on an electronic component to be processed. The coating apparatus according to claim 1,
The control means forms the treatment agent film with a first film thickness in accordance with first electronic component information among the electronic component information, and then rotates the plate by a predetermined angle of one rotation or less. And moving the treatment agent film in a second film thickness different from the first film thickness according to second electronic component information different from the first electronic component information. Coating device that controls the mechanism. A plate provided rotatably and supplied with a paste-like treatment agent;
A film forming member that is disposed with a gap on the plate, and forms a film of the treatment agent on the plate by passing the gap by the rotation of the plate;
The film forming member has an upper wall that faces the plate and presses the processing agent toward the film forming member by rotation of the plate against the plate, and an outer peripheral wall provided on an outer peripheral side of the rotation by the plate. A pressing member disposed in proximity to,
A moving mechanism for moving the film forming member so as to change the size of the gap;
Control means for controlling the movement of the moving mechanism according to information on the electronic component to be processed; and the electronic component can be moved while holding the electronic component, and the processing agent applied to the plate is transferred to the electronic component And a mounting mechanism for mounting the electronic component to which the processing agent is attached on a predetermined component. According to the information of the electronic component to be processed, the position of the film forming member is controlled so as to change the gap between the plate supplied with the paste-like processing agent and the film forming member,
The plate is rotated by using a pressing member that has an upper wall facing the plate and an outer peripheral wall provided on the outer peripheral side of the rotation by the plate and is disposed close to the film forming member. By forming the film of the treatment agent on the plate by passing the treatment agent through the gap after the treatment agent toward the film forming member is pressed against the plate by the upper wall of the pressing member ,
Attaching the treatment agent formed on the plate to the electronic component;
A method of manufacturing an electronic component, wherein the electronic component having the treatment agent attached thereon is placed on a predetermined component.