JP6001438B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a processing head for processing a substrate and a processing apparatus using the processing head. The present invention relates to a component mounting apparatus that adsorbs an electronic component and mounts the electronic component on a substrate, for example.

Currently, the work of mounting electronic components on boards of various electrical products is automated, and a component mounting apparatus is used at that time. Electronic components to be mounted on a board are becoming smaller and smaller year by year. The miniaturization of electronic components is expected to continue in the future, and further high-speed and high-precision mounting is required for component mounting apparatuses. In order to realize high-speed and high-precision mounting, high-speed operation is required for the operation axis of the nozzle that holds the component.
Prior art includes Patent Documents 1 to 6.

JP 2007-72046 A JP 05-251897 A JP-A-2005-217090 JP 2005-537630 A Japanese Patent Laid-Open No. 06-216587 JP 2003-008295 A

  In Patent Document 1, two cameras are necessary, and the camera field of view is from an oblique direction. Therefore, in order to measure an accurate mounting error, it is necessary to perform image processing before mounting. Although application of image processing to the present invention is not excluded, for high-speed component mounting, component mounting is preferably performed in a short time, and image processing time is preferably shorter.

  The present invention includes a camera having an optical axis substantially parallel to the normal line of the surface on which the substrate is to be mounted, and a nozzle that draws a trajectory inclined with respect to the optical axis of the camera. It reaches the optical axis of the camera on the substrate.

  According to the present invention, it is possible to improve at least one of mounting accuracy and mounting speed.

1 is a top view of an entire component mounting apparatus according to a first embodiment. FIG. 2 is an arrow view when the component mounting apparatus in FIG. 1 is observed from an arrow 130 in FIG. 1. FIG. 3 is a diagram illustrating a first configuration of a head actuator 113. The figure explaining the up-and-down operation | movement of the nozzle shaft 311. FIG. The figure explaining rotation operation of the nozzle shaft 311. Explanatory drawing which looked at the nozzle rotation motor 316 from the lower surface. The figure explaining the 2nd structure of the head actuator 113. FIG. The figure explaining the detail of the nozzle 317 of a 1st structure, and the nozzle 317 of a 2nd structure. The flowchart explaining the component mounting in a 2nd structure. The figure explaining the head actuator 700 of a 2nd structure from the nozzle 712 side. The figure explaining the positional relationship of a head actuator and a camera. The figure explaining the other positional relationship of a head actuator and a camera. The figure explaining the image obtained by the system of FIG. The figure explaining the image which the camera 901 in the 2nd structure acquired. The figure explaining further in detail about a 2nd structure. The figure explaining the components supply apparatus 151 in a 1st structure. The figure explaining the components supply apparatus 151 in a 2nd structure. FIG. 6 is a diagram illustrating a second embodiment. FIG. 7 is a diagram for explaining Example 2 (continuation). FIG. 6 is a diagram illustrating Example 3; 9 is a flowchart for explaining a third embodiment. FIG. 6 is a diagram illustrating Example 4; FIG. 6 is a diagram illustrating Example 5;

  Hereinafter, embodiments will be described with reference to the drawings.

  FIG. 1 is a top view of the entire component mounting apparatus according to the first embodiment. The substrate 123 is transported to the electronic component mounting position by the substrate guide 191 from the left side of the drawing.

  A first Y beam 101, a second Y beam 102, and a third Y beam 180 are arranged in a direction orthogonal to the substrate transport direction. In the third Y beam 180, a guide 181 for defining the traveling direction of X beams 103 and 105, which will be described later, and a guide 182 for defining the traveling direction of the X beams 104 and 106 are arranged.

  The X beams 103 and 105 are moved by the first Y beam 101 and the third Y beam 180. The X beams 104 and 06 are moved by the second Y beam 102 and the third Y beam 180. More specifically, the X beams 103, 104, 105, 106 are made to move in the substrate transport direction by actuators 107, 108 such as linear motors arranged in the first Y beam 101 and the second 102, respectively. Therefore, it moves in the substantially orthogonal direction.

  Actuators 109, 110, 111, and 112 such as linear motors are disposed on the X beams 103, 104, 105, and 106, respectively. The actuators 109, 110, 111, and 112 are respectively provided with head actuators 113, 114, 115, and 116 for mounting electronic components on the substrate 123. Here, the actuators 109, 110, 111, and 112 can be configured to be inexpensive and lightweight by using a mechanism such as a ball screw instead of a linear motor.

  The head actuators 113, 114, 115, and 116 are substantially orthogonal to the Y beams 101 and 102 (substantially horizontal to the substrate transport direction) by the actuators 109, 110, 111, and 112, respectively. Driven.

  Component supply devices 151, 152, 153, and 154 that supply electronic components to the head actuators 113, 114, 115, and 116 are disposed at both ends of the first Y beam 101 and the second Y beam 102. The head actuator 113 supplies electronic components from the component supply device 151. The head actuator 114 supplies electronic components from the component supply device 153. The head actuator 115 replenishes electronic components from the component supply device 152. The head actuator 116 replenishes electronic components from the component supply device 154.

For example, when there is no electronic component to be mounted on the head actuator 113, the X beam 103 is moved to the front (or above) the component supply device 151 by the actuator 107, and the head actuator 113 attracts the electronic component to the nozzle. Become. This replenishment operation is the same for the head actuators 114, 115, and 116.
In the component mounting apparatus, cameras 117, 118, 119, and 120 for confirming the postures of the electronic components sucked by the nozzles are disposed between the component supply devices 151, 152, 153, and 154 and the substrate 123. The postures of the supplied electronic components are confirmed by the cameras 117, 118, 119, and 120, respectively.

  If tilt is detected in the posture, the head actuators 113, 114, 115, 116 adjust the tilt of the electronic component.

  At this camera position, each of the head actuators 113, 114, 115, 116 is imaged by the cameras 117, 118, 119, 120 along the route to the substrate 123, so that the efficiency is high. In addition, the control unit 124 performs processing and control of various operations described above, and processing and control of various operations described later.

  2 is an arrow view when the component mounting apparatus of FIG. 1 is observed from the arrow 130 of FIG. Here, the structure around the first Y beam 101 and the head actuator 113 will be described in detail, but the same applies to other head actuators.

  An actuator 107 is disposed on the first Y beam 101. An X beam 103 is connected to the actuator 107. One end of the X beam 103 is connected to the actuator, and the other end of the X beam 103 is connected to the guide 181. The X beam 103 moves in a direction substantially perpendicular to the transport direction of the substrate 123 on the loading platform 201.

  An actuator 109 is disposed on the side surface of the X beam 103. A head actuator 113 is connected to the actuator 109. The head actuator 113 is effectively moved in parallel with the substrate transport direction by the actuator 109.

  In the component mounting apparatus of the present embodiment, the head actuators 113, 114, 115, and 116 each move independently. Therefore, a component mounting apparatus that is faster than the conventional one can be configured.

  In addition, although FIG. 1 demonstrated the case where there were four X beams, the number of X beams may not be four. The X beams 103, 104, 105, and 106 may be removable. In that case, for example, different types of head actuators can be connected, and mounting of more various parts can be realized. With the beam configuration described above, each head actuator 113, 114, 115, 116 can be freely driven independently.

  Next, a first configuration of the head actuator 113 will be described. Although the configuration of the head actuator 113 is described here, the configuration of the other head actuators 114, 115, and 116 is the same.

  FIG. 3 is a front view of the head actuator 113. The head frame 301 is connected to the X beam 103 in FIG. The nozzle up / down motor 302 is connected to the frame 301. A ball screw 308 is connected to the nozzle up / down motor 302. Further, the end of the ball screw 308 is supported by a guide 318. An arm 309 is connected to the ball screw 308. The tip of the arm 309 has a structure (concave type) that sandwiches a convex portion 350 (convex portion) formed at least around the nozzle moving portion 310.

  A nozzle shaft 311 having a hollow structure is connected to the nozzle moving unit 310. Further, the nozzle shaft 311 is connected to the rotor 313. A nozzle 317 for adsorbing an electronic component having an opening is detachably connected to the tip of the nozzle shaft 311. Although not shown, the head actuator 113 also has a pump for generating a suction force for sucking the nozzle 317.

The nozzle rotation motor 316 is connected to the frame 301, and the nozzle shaft 311 is rotated by the interaction between the nozzle rotation motor 316 and the rotor 313.
Next, the configuration of the head actuator 113 will be described in more detail with respect to the nozzle selection operation, the vertical operation, and the rotation operation.

  FIG. 4 is a diagram illustrating details of the vicinity of the center spline 306, the nozzle selection belt 307, the nozzle moving unit 310, the nozzle shaft 311, and the nozzle base 320 of the head actuator 113.

  First, the vertical movement of the nozzle will be described. The nozzle moving unit 310 is connected to the center spline 306. The center spline 306 serves as a guide for defining the moving direction of the nozzle moving unit.

  The nozzle moving part 310 has at least the convex part 350 (convex part) around the aforementioned part, and the convex part is held by the arm 309. Further, an L-shaped arm 351 is connected to the convex portion 350. The tip of the arm 351 is disposed in a notch 352 (in other words, a recess) of the nozzle base 320. Further, each nozzle shaft 311 is disposed on the nozzle pedestal 320 via the rotating body 353.

  When the arm 309 is moved up and down by the nozzle up / down motor 302, the nozzle movator 310, the arm 351 connected thereto, the rotating body 353 on the tip of the arm 351, and the rotating body 353 are connected accordingly. The nozzle shaft 311 moves up and down.

  Next, the nozzle selection operation will be described. In the center spline 306, when the nozzle selection belt 307 is rotated by the nozzle selection motor 303, the center spline 306 is also rotated, and the nozzle moving unit 310 connected to the center spline 306 and the nozzle pedestal 320 are also synchronized in the same angle. Rotate. As the nozzle pedestal 320 rotates, the notch 352 also rotates. Thereby, an arbitrary nozzle shaft 311 on the nozzle pedestal can be selected.

  In addition, since the rotating body 353 such as the roller is in contact with the nozzle pedestal 320, the influence of friction when the nozzle pedestal 320 rotates can be reduced. Here, considering the influence of dust generation, it is desirable that the hardness of the rotating body 353 and the hardness of the nozzle base 320 are the same.

  With such a configuration, it is possible to efficiently perform the nozzle selection operation and the vertical operation within the limited space of the head actuator 113.

  Next, the rotation operation of the head will be described with reference to FIG. The nozzle rotation motor 316 rotates the rotor 313 to rotate the nozzle shaft 311 attached to the rotor 313 with the center of the rotor 313 as the rotation axis. Accordingly, the rotating body 353 such as a roller attached to the nozzle shaft 313 rotates on the nozzle base 320. As a result, an arbitrary nozzle shaft 311 can be moved to an arbitrary angle, and can be moved onto the L-shaped arm 351.

  FIG. 6 is an explanatory view of the nozzle rotation motor 316 as seen from the lower surface. The plurality of nozzles 317 are concentrically arranged at a distance r (reference numeral 606) from the center of the rotor 313. The arrangement may not be concentric, that is, the distance r may be different for each nozzle 317.

  An electronic component 603 is vacuum-sucked by the nozzle 317. During component mounting, the nozzle 317 can be rotated and moved from the position 604 to the position 607 in the direction of the arrow 608 by the nozzle rotation motor 316 and the rotor 313. When the nozzle 317 moves to the position 607, the ideal position of the electronic component 603 is the position 610. However, an undesirable factor (for example, disturbance such as vibration, encoder value reading error) when the nozzle 317 is moved by the rotor 313. If the motor does not stop at the ideal position due to the heat generated by the motor, the position of the electronic component 603 after the nozzle 317 has moved may be not the position 610 but the position 611 separated by the error 613.

  Next, a second configuration of the head actuator 113 will be described. FIG. 7 is a diagram illustrating a second configuration of the head actuator 113. The head frame 701 is connected to the X beam 103 in FIG. The nozzle up / down motor 702 is connected to the frame 701. A ball screw 703 is connected to the nozzle up / down motor 702. Further, the end of the ball screw 703 is supported by a guide 704. An arm 705 is connected to the ball screw 703. The tip of the arm 705 has a structure (concave shape) that sandwiches a convex portion 707 (convex portion) formed at least around the nozzle moving portion 706.

The nozzle moving portion 706 is formed with an arm extending from the convex portion 707 toward the nozzle shaft 708 and a rolling mechanism connected to the tip of the arm. An example of a rolling mechanism is a ball 709. An inclined plate 710 is formed at the end of each nozzle shaft 708, and the selection operation of the nozzle shaft 708 is performed by the ball 709 rolling on the plate 710. As the nozzle moving unit 706 descends, the arm and ball 709 pushes the plate 710, and as a result, the nozzle shaft 708 descends. Although details will be described later, a spring is disposed between the nozzle 712 and the rotor 711, and when the nozzle moving unit 706 moves up after being lowered, it is pushed by the ball 709 by the force of returning to the initial state of the spring. The nozzle shaft 708 returns to the initial position.
The nozzle shaft 708 is connected to the rotor 711. A nozzle 712 for adsorbing an electronic component 603 having an opening is detachably connected to the tip of the nozzle shaft 708.

The nozzle rotation motor 713 is connected to the head frame 701 and has a function of rotating the nozzle 712 group as a head center rotation axis by interaction with the rotor 711.
The second configuration also has a nozzle selection motor 307 for driving the nozzle selection belt 307 and the nozzle selection belt 307.

  The center spline 306 serves as a guide for defining the moving direction of the nozzle moving unit 706.

  The center shaft 304 is a nozzle shaft 708 arranged concentrically and a hollow casing arranged inside the nozzle 712. The center shaft 304 plays a role of a passage for leading the vacuum passage when the electronic component is vacuum-adsorbed by the nozzle 712 together with the rotary joint 305 and wiring for controlling the camera 901 described later to the control unit 124.

  Next, details of the periphery of the nozzle 317 having the first configuration and the nozzle 317 having the second configuration will be described with reference to FIG. The nozzle 317 of the first configuration is arranged so that its trajectory 811 is substantially parallel to the normal line 810 of the surface on which the substrate 123 is to be mounted. A spring 801 is disposed on the back surface of the nozzle 317. The spring 801 is contracted by a predetermined force with the nozzle 317 in the initial position.

Next, the second configuration will be described. A camera 901 for recognizing the component mounting position is arranged inside the nozzle 712 arranged concentrically, more specifically, at the center of a substantial concentric circle. The optical axis 812 of the camera 901 is substantially parallel to the normal 810 of the surface on which the substrate 123 is mounted. Here, “substantially parallel” does not need to be strictly parallel, for example, and can be allowed to be negligible error or not parallel to an acceptable level for achieving the effects of the present embodiment, Such a state is also meant to be within the scope of the disclosure herein.
The nozzle 712 is arranged such that its locus 813 is inclined with respect to at least one (preferably both) of the normal 810 and the optical axis 812. The focal point 814 of the camera 901 is adjusted to be substantially on the substrate 123. Note that the focal point 814 does not need to be on the surface of the substrate 123 in a strict sense, and it is sufficient that the surface of the substrate 123 is substantially within the focal depth of the camera 901. This can also be expressed as that the holding unit that holds the substrate 123 of this embodiment holds the substrate so that the substrate 123 is substantially within the depth of focus of the camera 901.

  The nozzle 712 is arranged such that its locus 813 substantially reaches the optical axis 812 on the substrate 123. Here, substantially, the locus 813 does not need to reach the optical axis 812 on the surface of the substrate 123 in a strict sense. If the electronic component can be mounted at a desired position, the locus 813 and the optical axis 812 A slight deviation between the two and the state where the locus 813 does not completely reach the optical axis 812 may also be expressed as “the locus 813 has reached the optical axis 812”.

The locus 813 can be replaced with an expression of a line inclined with respect to the optical axis 812 extending from the tip of the nozzle 712.
The nozzle 712 is arranged to be inclined with respect to the normal line 810 so that the locus 813 substantially reaches the focal point 814. As another expression, the locus 813 can also be expressed as reaching within the depth of focus of the camera 901. The plurality of nozzles 712 are arranged such that their trajectories 813 substantially reach the focal point 814.

  In the second configuration, the lower surface of the rotor 711 (the surface on the substrate 123 side) is recessed in a conical shape so that the rotor 711 does not appear in the image of the camera 901. As another expression, the camera 901 can be expressed as relatively protruding from the rotor 711.

  A spring 802, which is an example of an elastic body, is disposed on the back surface of the nozzle 712. The spring 802 is in an initial state (a state in which the nozzle 317 is not expanded or contracted) in a state where the nozzle 317 is in an initial position (a state away from the substrate 123 by a predetermined distance). When the nozzle moving unit 706 moves up after being lowered, the spring 802 tries to return to the initial state, and as a result, a force in the direction of the arrow 815 is generated in the nozzle 711. As a result, the nozzle 712 returns to the initial position. Note that a damping system exemplified by a hydraulic damper may be combined with the spring 802 so as to promote not only the spring 802 but also the vibration of the spring 802 on the back surface of the nozzle 712.

  Next, component mounting in the second configuration will be described with reference to FIG. The head actuator 113 is moved to the component mounting position on the design data by the first beam 101 and the X beam 103 in accordance with an instruction from the control unit 124 (step 9001).

  After moving to the component mounting position on the design data, the camera 901 obtains at least a partial image on the substrate 123. The control unit 124 recognizes an actual component mounting position by comparing the obtained image with a reference image registered in advance (step 9002). When the obtained image is subjected to a differentiation process for enhancing an edge in the image, an image process for extracting a desired color component, a data change process for reducing the processing load on the control unit 124, and a compression process. There is also.

  After obtaining the actual component mounting position, the control unit 124 moves the head actuator 113 from the current position to a position where the component mounting can be performed with respect to the actual component mounting position simply by lowering the nozzle 712. The movement of the head actuator 113 is to move the head actuator 113 so that the difference Δ (x, y) between the position where the nozzle is lowered in the image and the actual component mounting position is substantially zero. (Steps 9003 and 9004). Note that x and y represent distances in a two-dimensional orthogonal coordinate system set on the substrate 123. Further, the position where the nozzle 712 descends can also be expressed as a position where the nozzle 712 holds an electronic component. In addition, the position where the nozzle 712 descends becomes the intersection of the optical axis 812 and the locus 813 as a result, and can be equated with the center of the obtained image. This can be expressed as, for example, that the coordinate system in the image obtained by the camera 901 and the coordinate system in which the nozzle 712 defines the lowered position of the nozzle 712 substantially coincide. Further, step 9004 includes the step of rotating the nozzle 712 by the interaction of the nozzle rotation motor 713 and the rotor 711 to change at least one of the mounting angle and the mounting position. Step 9003 includes a step of determining whether Δ (x, y) = 0 by obtaining images at predetermined time intervals while the head actuator 113 is moving.

  After the control unit 124 confirms that Δ (x, y) = 0, the nozzle 712 descends and component mounting is performed (step 9005). Here, since the nozzle 712 is arranged so that the locus 813 substantially reaches the focal point 814, the component can be mounted at the actual component mounting position only by lowering the nozzle 712. In other words, in the second configuration, it is not necessary to perform processing for moving the head actuator 113 in consideration of the fact that the optical axis 812 and the locus 813 of the camera are parallel.

  Next, the advantages of the second configuration will be described in more detail. FIG. 10 is a diagram illustrating the head actuator 700 having the second configuration from the nozzle 712 side. In FIG. 10A, it is assumed that the nozzle 712 holds the electronic component 603 at a position 1003 having a radius r from the center of the rotor 711. Next, it is assumed that the nozzle 712 is rotated in the direction of the arrow 1005 by the interaction between the nozzle rotation motor 713 and the rotor 711 in order to correct at least one of the mounting angle and mounting position of the electronic component 603. FIG. 10B illustrates the position of the nozzle after rotation. It is assumed that the position of the nozzle 712 is changed from the position 1003 to the position 1012.

In FIG. 10B, if a position desired to correct at least one of the mounting angle and the mounting position is a position 1004, there is a difference in the distance e and the angle θ ₁ between the position 1004 and the position 1012. Will be. Here, in the second configuration, the optical axis 901 of the camera is substantially on the center of the rotor 711, and the nozzle 712 is inclined with respect to the normal line 810, and therefore, between the position 1004 and the position 1012. Even if there is a difference, component mounting at an actual component mounting position is possible. That is, the second configuration has a structure that is resistant to undesirable factors (for example, disturbance such as vibration, encoder value reading error, motor heat generation) when the nozzle 712 is rotated by the rotor 713. Can be expressed.

  The advantages of the second configuration will be further described. FIG. 11 is a diagram illustrating the positional relationship between the head actuator and the camera. In FIG. 11A, a camera 901 for confirming the mounting position 1103 is mounted on the head actuator 1102. In the case of FIG. 11A, the normal 810 of the surface on which the substrate 123 is to be mounted, the optical axis 812 of the camera 901, and the locus 813 drawn by the nozzle are parallel to each other. In the case of FIG. 11, after the camera 1102 recognizes the mounting position 1103, it is necessary to move the head actuator 1102 by a distance 1105 as shown in FIG. . Furthermore, in the structure of FIG. 11, it is difficult to obtain a relative positional relationship between the electronic component 1104 and the mounting position 103 after the head actuator 1102 is moved and the nozzle is lowered. However, in the second configuration, the coordinate system in the image obtained by the camera 901 substantially coincides with the coordinate system that defines the lowered position of the nozzle 712. Therefore, the head actuator 1102 is arranged as shown in FIG. It is not necessary to mount components as indicated by the arrow 1106 after the distance 1105 has been moved as shown in FIG. In the second configuration, the relative positional relationship between the electronic component 1104 and the mounting position 103 can be obtained in at least one case after the head actuator 1102 moves and after the nozzle descends. That is, the timing at which the camera 901 of the second configuration obtains the image of the substrate 123 can be arbitrarily controlled by the control unit 124, and the relative position between the electronic component held by the nozzle 712 and the mounting position after the nozzle 712 is lowered. It is also possible to obtain a positional relationship.

  FIG. 12 is a diagram for explaining another positional relationship between the head actuator and the camera. In FIG. 12, a camera 1202 for confirming the mounting position 1203 is mounted on the head actuator 1102. In FIG. 12, the optical axis of the camera 1202 is inclined with respect to the normal 810 of the surface on which the substrate 123 is to be mounted. Further, the locus 813 drawn by the nozzle holding the electronic component 1203 is parallel to the normal 810. In the case of FIG. 12, it is possible to check and mount the mounting position 1203 immediately before mounting, so that high-precision mounting is possible. However, in the method of FIG. 12, as shown in FIG. 13, the captured image is an image 1301 viewed from an oblique direction, and the error amount ΔX 1305 from the position 1307 where the nozzle 1302 holds the electronic component 1303 and descends to the mounting position 1203. And ΔY 1306 can be measured, but correction processing is required to remove the component viewed from an oblique direction when calculating the movement amount of the head actuator 1102. This correction process is undesirable for high-speed component mounting because it increases the amount of processing and the processing time of the control unit 124.

  On the other hand, in the case of the second configuration, as shown in FIG. 14, the image obtained by the camera 901 is an image 1501 when the substrate 123 is viewed from the vertical direction, so that the error amounts ΔX and ΔY are set as in the case of FIG. Despite being obtained, the undesired correction processing as shown in FIGS. 12 and 13 is substantially unnecessary. This is because, in the second configuration, the coordinate system in the image obtained by the camera 901 substantially coincides with the coordinate system that defines the lowered position of the nozzle 712, as shown in FIGS. It can also be expressed that an undesired correction process is substantially unnecessary. Of course, the system of FIGS. 11 and 12 is not denied, but those skilled in the art can understand that the second configuration is suitable for high-speed and high-precision mounting.

  Next, the second configuration will be described in more detail with reference to FIG. 15A illustrates the tip of the nozzle 317 having the first configuration, and FIG. 15B illustrates the tip of the nozzle 712 having the second configuration. The electronic component 1503 is desirably held so as to be substantially parallel to the substrate 123 in order to minimize positional displacement during mounting. In the case of FIG. 15A, the suction surface 1501 of the nozzle 317 is perpendicular to the normal 810 of the surface on which the substrate 123 is to be mounted and the locus 813 of the nozzle 317. On the other hand, in the case of FIG. 15B, the suction surface 1502 of the nozzle 712 is substantially perpendicular to the normal line 810, but is not perpendicular to the locus 712 of the nozzle 712 but is inclined. If described in relation to the surface of the substrate 123, both the suction surface 1501 and the suction surface 1502 are substantially parallel to the substrate 123. In the case of FIG. 15B, even when the nozzle 712 mounts components obliquely with respect to the substrate 123, it is possible to reduce the influence of positional deviation during mounting.

  Next, the component supply device 151 will be described. FIG. 16 is a diagram for explaining the component supply device 151. 16A is a diagram for explaining the component supply device 151 from an oblique direction, FIG. 16B is a diagram for explaining the AA ′ cross section of FIG. 16A, and FIG. 16C is FIG. 16A. It is a figure explaining the BB 'cross section of. The following description can also be applied to the component supply devices 152, 153, and 154. The component supply device 151 has a mechanism for conveying the carrier tape 1601 in which the electronic component 603 is stored in the pocket 1602 and an exposure mechanism for incising the cover tape on the pocket 1602 to expose the electronic component 603. In addition, an opening 1605 for the head actuator 113 to take out the exposed electronic component 603 is formed on the component supply device 151. If the configuration of the head actuator 113 is the first configuration, the side walls 1603 and 1604 of the opening 1605 are sufficient even if they are perpendicular to the surface on which the carrier tape 1601 is to be conveyed.

On the other hand, when the configuration of the head actuator 113 is the second configuration, it is desirable to consider that the nozzle 712 is close to the carrier tape from an oblique direction and replenishes the electronic component 603. This can be explained with reference to FIG. FIG. 17 is a diagram illustrating a component supply device 151 suitable for the second configuration. 17A is a diagram for explaining the component supply device 151 from an oblique direction, FIG. 17B is a diagram for explaining a CC ′ section of FIG. 16A, and FIG. 17C is FIG. 17A. It is a figure explaining the DD 'cross section. 17 differs from FIG. 16 in that an opening 1701 formed on the component supply device 151 has an inclined surface 1702. The inclination angle of the inclined surface 1702 is an acute angle θ ₂ , and if the inclination angle θ ₂ is an acute angle that is smaller than the angle between the optical axis 812 of the camera 901 and the locus 813 of the nozzle 712, the nozzle 712 contacts the inclined surface 1702. This is desirable because the electronic component 603 can be held without interference. Other methods for preventing the interference between the nozzle 712 and the inclined surface 1702 are conceivable. For example, a method for reducing the height h of the inclined surface with respect to the width W of the bottom surface of the opening 1701 (preferably sufficiently low) is considered. It is done.

  According to this embodiment, it is possible to mount components with high accuracy. According to this embodiment, high-speed component mounting is possible. More specifically, the effect of the present embodiment will be described as follows. (1) The difference between the position where the nozzle 712 descends and the component mounting position can be obtained by the camera 901, and the mounting accuracy can be improved by moving the nozzle 712 in consideration of the difference. Moreover, since there is no substantial displacement between the image obtained by the camera 901 and the position where the nozzle descends, it is possible to mount components without performing extra movement of the nozzle 712 or complicated correction processing. Become. (2) Even when the nozzle 712 rotates, it is possible to reduce the influence of errors caused by the rotation and perform component mounting.

  Next, Example 2 will be described. Hereinafter, parts different from the first embodiment will be mainly described. FIGS. 18 and 19 are views for explaining how the electronic component 603 is mounted on the substrate 123 via the solder 2001 by the nozzle 317 and the nozzle 712. If the head actuator 113 of the first embodiment has the first configuration, the solder 2001 is only pressed in the vertical direction 2002 of the substrate 123 as shown in FIG.

On the other hand, if the head actuator 113 has the second configuration, the nozzle mounts the electronic component 603 on the solder 2001 from the oblique direction 2102 as shown in FIG. In this case, it is conceivable that the solder 2001 extends in a direction that is not negligible in a direction parallel to the substrate 123 (for example, the direction of the arrow 2002). It is conceivable that the distance between the solder 2001 and the adjacent solder 2203 will be further narrowed in the future. Therefore, it is desirable to prevent the solder 2001 from extending in a direction parallel to the substrate 123. Therefore, in this embodiment, an inclination mechanism 2201 that can set the substrate 123 to an arbitrary inclination angle θ ₃ is disposed on the back surface of the substrate 123. As shown in FIG. 19B, the tilt mechanism 2201 can handle the state of FIG. 19A in the same manner as the state of FIG. Note that the amount by which the solder 2001 extends is influenced by, for example, the viscosity of the solder 2001, so that θ ₃ can be set to an arbitrary angle. A specific example of the tilt mechanism is a piezoelectric element that has a high displacement resolution and is capable of high-speed response.

  Next, Example 3 will be described. In the first embodiment, it has been described that the focal point 814 of the camera 901 is substantially on the surface of the substrate 123. However, as shown in FIG. 20, the position of the apex of the solder 2001 may be used to recognize the mounting position. The present embodiment takes this point into consideration. Hereinafter, differences of the present embodiment from the first embodiment will be described.

  FIG. 20 is a diagram for explaining this embodiment. In FIG. 20, the focus of the camera 901 is on a plane 2301 that passes through at least one of the vertex 2304 of the solder 2302 and the vertex 2305 of the solder 2303 and is substantially parallel to the substrate 123. In this embodiment, images around the vertex 2304 and the vertex 2305 can be clearly obtained. The component mounting position is a vertex 2304 and a midpoint 2306 of the vertex 2305. If there are three or more areas to which solder has been applied, the coordinates of the center of gravity of those vertices may be used as the component mounting positions.

FIG. 21 is a flowchart for explaining the present embodiment. The head actuator 113 is moved to the component mounting position on the design data by the first beam 101 and the X beam 103 in accordance with an instruction from the control unit 124 (step 2310).
After moving to the component mounting position on the design data, the camera 901 images the board 123 (step 2311). In this embodiment, at least one of an image around the vertex 2304 of the solder 2302 and an image around the vertex 2305 of the solder 2303 is obtained.

  The control unit 124 compares the coordinates of the vertex 2304 and the coordinates of the vertex 2305 of the solder 2303 by comparing at least one of the image around the vertex 2304 and the image around the vertex 2305 of the solder 2303 with the previously registered reference image. At least one of them is obtained (step 2312).

Next, a midpoint (x _c , y _c ) is obtained from the coordinates of the vertex 2304 and the coordinates of the vertex 2305 of the solder 2303 (step 2313).

After obtaining the coordinates of the midpoint, the control unit 124 determines the difference Δ (x _c , y) between the midpoint (x _c , y _c ) and the position where the nozzle set in advance in the image is lowered. It is determined whether y _c ) is substantially zero (step 2314).

If Δ (x _c , y _c ) is not zero, the control unit 124 moves the head actuator 113 so that Δ (x _c , y _c ) is effectively zero (step 2316).
After the control unit 124 confirms that Δ (x, y) = 0, the nozzle 712 descends and component mounting is performed (step 2316).

  The change from the state of the first embodiment to the state of the third embodiment can be performed by changing the position of the focal point 814 to a desired position.

  The idea of the present invention is not limited to the component mounting apparatus. Although solder is applied to the substrate before the component mounting process, the idea of the present invention can be applied to the solder application process. In Example 3, a case where the idea of the present invention is applied to a solder coating process will be described. Hereinafter, parts different from the other embodiments will be mainly described.

  FIG. 22 is a diagram for explaining this embodiment. The nozzle shaft 708 is filled with solder 2501. The solder 2501 is applied to a desired position on the substrate 123 via the nozzle 712. The solder 2501 can be applied on the substrate 123 as a substantial point 2507. In this embodiment, the head actuator 113 is moved as illustrated by arrows 2502 and 2503 by the first beam 101 and the X beam 103, so that a desired solder pattern can be drawn.

  Further, in this embodiment, it is also possible to fill the nozzle shaft 2504 with the solder 2506 and apply the solder 2506 through the nozzle 2505. In this embodiment, the solder 2501 and 2506 can be applied to the same region of the substrate 123 at substantially the same timing to form substantially one solder region, and the solders 2501 and 2506 can be applied to the substrate 123 at different timings. Can be applied.

  In this embodiment, since the head actuator 113 includes the camera 901, while observing the shape of the solder 2501 and 2506 applied on the substrate 123 and the shape of the solder pattern formed on the substrate 123, the solder actuators 2501 and 2506 Application can be performed.

  The idea of the present invention is not limited to the component mounting apparatus. For example, the idea of the present invention can be applied to a processing apparatus that performs some processing on a sample. In Example 4, the case where the idea of the present invention is applied to a processing apparatus for processing a sample will be described. Hereinafter, parts different from the other embodiments will be mainly described.

FIG. 23 is a diagram for explaining this embodiment. A sample 2402 is placed on a substrate 2401 exemplified by a petri dish or a preparation. Examples of the type of the sample 2402 include foods, tissues collected from living bodies, cells, and blood. The nozzle shaft 708 is filled with a chemical solution 2403. Types of the chemical liquid 2403 include food materials, drugs, liquids obtained by diluting them, and gel substances. The chemical solution 2403 is applied and injected into the sample 2402 by the nozzle 712. That is, the nozzle shaft 708 and the nozzle 712 of this embodiment constitute a substantial dispensing system.
The nozzle 712 can change the speed at which the sample 2402 is approached to avoid at least one of undesirable movement, deformation, and damage of the sample 2402. As an example of changing the speed, as shown in vectors 2407 to 2409, the nozzle 712 can decrease the speed as it approaches the sample 2402. If the point at which the nozzle 712 changes the speed is applied to the first embodiment, it is possible to prevent a relatively thin component from being damaged during mounting.

The optical axis 812 of the camera 901 is substantially parallel to the normal 810 of the surface on which the substrate 2401 is to be mounted. An intersection 2414 between the locus 2412 of the nozzle 712 and the locus 2413 of the nozzle 2411 is on the optical axis 812 on the camera 901 but at a position lower than the substrate 2401 in the Z direction. If it is the position of such an intersection 2414, the nozzle 712 and the nozzle 2411 can apply and inject | pour the chemical | medical solution 2403, 2410 to the sample 2402 at the substantially same timing. Further, the optical axis 812, the trajectory 2412, and the trajectory 2413 are designed to reach into the sample 2402.
Note that the chemical solutions 2403 and 2410 may be the same type or different types. The height of the intersection 2414 can be changed by driving the height adjustment mechanism 2405 in the direction of the arrow 2406. As an example of the height adjusting mechanism 2405, at least one or more piezoelectric elements arranged on the back surface of the substrate 2401 can be cited.

  As mentioned above, although demonstrated using the Example of this invention, this invention is not limited to an Example. The present invention can be widely applied to processing apparatuses that perform some processing on a sample on a substrate, and the configuration of the head actuator is not limited to the contents of the present embodiment. In addition, the contents described in each embodiment can be mutually replaced and combined.

DESCRIPTION OF SYMBOLS 101 ... 1st Y beam 102 ... 2nd Y beam 103, 104, 105, 106 ... 1st X beam 107, 108, 109, 110, 111, 112 ... Actuator 113, 114, 115, 116 ... Head actuator 117, 118, 119, 120 ... Camera 121, 122 ... Component supply device 123 ... Substrate 124 ... Control unit 302 ... Nozzle up / down motor 303 ... Nozzle selection motor 304 ... Center shaft 305 ... Rotary joint 306 ... Center spline 307 ... For nozzle selection Belt 308 ... Ball screw 351 ... Arm 310 ... Nozzle moving part 311 ... Nozzle shaft 317 ... Nozzle

Claims (23)

A mounting section for mounting components on the board;
A moving system for moving the mounting portion relative to the substrate,
The mounting portion is
A plurality of nozzles for mounting components on the substrate;
And a camera,
The optical axis of the camera is substantially parallel to the normal of the surface on which the substrate is to be mounted;
The trajectories of the plurality of nozzles are inclined with respect to the optical axis,
The locus of the plurality of nozzles substantially reaches the optical axis on the substrate, and the plurality of nozzles descend to one point on the optical axis . The component mounting apparatus according to claim 1,
The mounting portion has a rotating portion that changes the position of the plurality of nozzles by rotating,
The component mounting apparatus according to claim 1, wherein an optical axis of the camera is on a center of the rotating portion. In the component mounting apparatus according to claim 2,
A plurality of the nozzles are arranged concentrically with respect to the rotating part, and the camera is arranged at the center of the nozzles arranged concentrically. In the component mounting apparatus according to claim 2 or claim 3,
The component mounting apparatus according to claim 1, wherein a lower surface of the rotating portion is recessed in a conical shape. In the component mounting apparatus according to any one of claims 1 to 4 ,
Based on an image of at least a part of the board obtained by the camera, a processing unit for obtaining a component mounting position,
The component mounting apparatus, wherein the moving system moves the mounting unit to the component mounting position. In the component mounting apparatus according to claim 5 ,
A holding part for holding the substrate;
The component mounting apparatus, wherein the holding unit holds the substrate so that the substrate is within a depth of focus of the camera. In the component mounting apparatus according to claim 6 ,
The component mounting apparatus according to claim 1, wherein a focal point of the camera is substantially on the substrate, and a locus of the nozzle reaches the focal point. In the component mounting apparatus according to claim 7 ,
The component mounting apparatus, wherein the mounting portion changes a speed at which the nozzle approaches the substrate. In the component mounting apparatus according to claim 8 ,
The component mounting apparatus, wherein the mounting portion decreases a speed at which the nozzle approaches the substrate as the nozzle approaches the substrate. In the component mounting apparatus according to claim 9 ,
The component mounting apparatus, wherein the mounting portion includes an elastic body connected to the nozzle. In the component mounting apparatus according to claim 10 ,
The component mounting apparatus according to claim 1, wherein the elastic body is in an initial state with the nozzle being in an initial position. The component mounting apparatus according to claim 11 ,
The component mounting apparatus, wherein the mounting unit includes a damping system for focusing vibrations of the nozzle. In the component mounting apparatus according to claim 12,
A component supply unit for supplying components to the mounting unit ;
The component supply unit has an opening for the nozzle to replenish the component, and a side wall of the opening is inclined. In the component mounting apparatus according to claim 13 ,
A component mounting apparatus comprising an inclination mechanism for providing an inclination angle to the substrate. In the component mounting apparatus according to claim 14 ,
The component mounting apparatus, wherein the tilting mechanism is at least one or more piezoelectric elements disposed on the back surface of the substrate. The component mounting apparatus according to claim 1,
The component mounting apparatus, wherein the mounting portion changes a speed at which the nozzle approaches the substrate. In the component mounting apparatus according to claim 16 ,
The component mounting apparatus, wherein the mounting portion decreases a speed at which the nozzle approaches the substrate as the nozzle approaches the substrate. The component mounting apparatus according to claim 1,
The component mounting apparatus, wherein the mounting portion includes an elastic body connected to the nozzle. The component mounting apparatus according to claim 18 ,
The component mounting apparatus according to claim 1, wherein the elastic body is in an initial state with the nozzle being in an initial position. In the component mounting apparatus according to claim 19 ,
The component mounting apparatus, wherein the mounting unit includes a damping system for focusing vibrations of the nozzle. The component mounting apparatus according to claim 1,
A component supply unit for supplying components to the mounting unit ;
The component supply unit has an opening for the nozzle to replenish the component, and a side wall of the opening is inclined. The component mounting apparatus according to claim 1,
A component mounting apparatus comprising an inclination mechanism for providing an inclination angle to the substrate. The component mounting apparatus according to claim 22 ,
The component mounting apparatus, wherein the tilting mechanism is at least one or more piezoelectric elements disposed on the back surface of the substrate.