JP2013043105A - Coating device and coating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a pattern on a surface and a back face of a coating target with good accuracy of the relative position.SOLUTION: This coating device 1 forming the pattern by coating the surface Wa and the back face Wb of the coating target W with liquid includes: a coating head 4 discharging the liquid from a nozzle; an imaging part 6 capable of imaging the coating target W; and a control device 9 that detects the position of the pattern formed on the surface Wa of the coating target W on the basis of an image obtained by imaging, by the imaging part 6, the pattern formed on the surface Wa of the coating target W by the liquid discharged from the nozzle of the coating head 4, and adjusts the coating position of the liquid relative to the back face Wb of the coating target W by the coating head 4 on the basis of the detected position.

Description

  Embodiments described herein relate generally to a coating apparatus and a coating method.

  The coating device is used when manufacturing various electric devices such as a display device and a semiconductor device. For example, when a metal layer to be a circuit pattern is formed on a glass substrate, a functional thin film such as a resist is used as a semiconductor. It is used when forming on a wafer.

  This coating apparatus includes an inkjet coating head that ejects a coating liquid individually as droplets from a plurality of ejection holes (for example, nozzles) toward a coating target such as a substrate. The coating head and the coating target While relatively moving the object, a plurality of droplets are sequentially applied to the application surface of the application object to form a pattern.

  In such a coating apparatus, a pattern may be formed on both the front and back surfaces of the coating object, but depending on the product, the pattern is formed on the surface of the coating object and on the back surface of the coating object. In some cases, the relative positional relationship with the back surface pattern is regarded as important. For this reason, a coating apparatus has been proposed in which an alignment mark is formed on either the front surface or the back surface of a coating object, the alignment mark is detected from both the front and back sides, and the pattern formation position is adjusted (for example, Patent Documents). 1).

JP 2011-100360 A

  However, in the above-described coating apparatus, the alignment mark is formed before the pattern is formed, and then the pattern formation position, that is, the coating liquid coating position is adjusted with reference to the alignment mark, and then applied to the front and back surfaces of the coating object. Form a pattern. At this time, since the same alignment mark is used as a reference for both the front surface and back surface pattern formation, if the surface pattern displacement and the back surface pattern displacement occur in different directions, the relative displacement between the front surface pattern and the back surface pattern will occur. The amount gets bigger.

  In particular, it is rare that the positional deviation of the front surface pattern and the positional deviation of the back surface pattern are in the same direction, and they usually occur in different directions. For this reason, the amount of deviation of the aforementioned relative position tends to increase, and the relative position accuracy between the front surface pattern and the back surface pattern decreases due to the increase of the amount of deviation.

  The problem to be solved by the present invention is to provide a coating apparatus and a coating method capable of forming a pattern with high relative positional accuracy on the front and back surfaces of a coating object.

  The coating apparatus according to the embodiment of the present invention is a coating apparatus that forms a pattern by applying a liquid to the front and back surfaces of an application object, and can apply an image to the application head that discharges the liquid from a nozzle and the application object. And the position of the pattern formed on the surface of the coating object based on the captured image obtained by imaging the pattern formed on the surface of the coating object by the liquid ejected from the nozzle of the coating head and the nozzle of the coating head. And a control device that detects and adjusts the application position of the liquid with respect to the back surface of the application object by the application head based on the detected position.

  The coating apparatus according to the embodiment of the present invention is a coating apparatus that forms a pattern by applying a liquid to the front surface and the back surface of an application object, and when forming a pattern on the back surface of the application object, The application position of the liquid with respect to the back surface of the object to be applied is adjusted based on the position of the pattern formed on the front surface.

  An application method according to an embodiment of the present invention is an application method in which a liquid is applied to the front surface and back surface of a coating object to form a pattern. When a pattern is formed on the back surface of a coating object, The application position of the liquid with respect to the back surface of the object to be applied is adjusted based on the position of the pattern formed on the front surface.

  According to the present invention, it is possible to form a pattern with high relative position accuracy on the front surface and the back surface of a coating object.

It is a figure which shows schematic structure of the coating device which concerns on one Embodiment of this invention. It is a flowchart which shows the flow of the coating process which the coating device shown in FIG. 1 performs. It is explanatory drawing for demonstrating the alignment of the surface in the application | coating process shown in FIG. It is explanatory drawing for demonstrating the pattern formation of the surface in the application | coating process shown in FIG. It is explanatory drawing for demonstrating the alignment of the back surface in the application | coating process shown in FIG. It is explanatory drawing for demonstrating the modification of the alignment of the back surface shown in FIG. It is explanatory drawing for demonstrating the modification of the coating device shown in FIG.

  An embodiment of the present invention will be described with reference to the drawings.

  As shown in FIG. 1, a coating apparatus 1 according to this embodiment includes a stage 2 on which a coating object W such as a glass substrate or a resin substrate is placed, and a stage moving apparatus that moves the stage 2 in the Y-axis direction. 3, a plurality of coating heads 4 that discharge droplets toward the coating object W on the stage 2, a head support unit 5 that supports these coating heads 4, an imaging unit 6 such as a camera, and imaging thereof The imaging support part 7 which supports the part 6, the stage moving apparatus 3, the head support part 5, the mount frame 8 which supports the imaging support part 7, etc., and the control apparatus 9 which controls each part are provided.

  The stage 2 has a placement surface on which the application object W is placed, and is provided on the stage moving device 3 so as to be movable in the Y-axis direction. The application object W is placed on the stage 2 by its own weight. However, the present invention is not limited to this. For example, a mechanism such as an electrostatic chuck or an adsorption chuck is provided to hold the application object W. May be. In addition, when coating is performed on both the front surface Wa and the back surface Wb of the coating target W, the coating target W is turned upside down (reversed from front to back) by the operator or the robot after the surface Wa is completely coated. After that, the back surface Wb is applied.

  The stage moving device 3 is a moving device that guides and moves the stage 2 in the Y-axis direction, and is fixed to the upper surface of the gantry 8. The stage moving device 3 is electrically connected to the control device 9, and its driving is controlled by the control device 9. As the stage moving device 3, for example, a feed screw type moving mechanism using a servo motor as a driving source or a linear motor type moving mechanism using a linear motor as a driving source can be used.

  The coating heads 4 are provided on the head support portion 5 along the X-axis direction perpendicular to the Y-axis direction, for example, in a staggered or linear manner over the entire width of the stage 2 in the X-axis direction. These coating heads 4 are inkjet type coating heads that eject (spray) coating liquid individually as droplets from a plurality of ejection holes (for example, nozzles) toward the upper surface of the coating object W on the stage 2. is there. Each coating head 4 is electrically connected to the control device 9, and the driving thereof is controlled by the control device 9.

  Here, the coating liquid is supplied to each coating head 4 through a pipe such as a tube from a coating liquid tank that stores the coating liquid. As the coating solution, for example, a solution containing a solute such as a metal or a pigment remaining as a residue on the coating object W and a solvent for dissolving (dispersing) the solute can be used.

  The head support portion 5 is formed in a gate shape elongated in the X-axis direction, and is provided on the upper surface of the gantry 8 so as to straddle the stage moving device 3 on the gantry 8. The beam portion of the head support portion 5 is parallel to the X-axis direction and is horizontal to the mounting surface of the stage 2, and the leg portion of the head support portion 5 is fixed to the upper surface of the gantry 8.

  The imaging part 6 is provided in the imaging support part 7 so that the application | coating target object W on the stage 2 can be imaged. The imaging unit 6 images the application target W on the stage 2 from a predetermined imaging position, and in particular, a part of the outer shape of the application target W and a part of the pattern formed on the application target W. Or the like as an imaging object. In addition, the imaging unit 6 has a function of focusing (focusing) on the imaging target according to control by the control device 9. For example, a CCD (charge coupled device) camera or an infrared camera can be used as the imaging unit 6. In the present embodiment, as a part of the outer shape of the application target W, for example, the corner of the application target W is used as an alignment mark, so that the imaging unit 6 places the application target W at a predetermined position on the stage 2. It is provided so that the corner used as the alignment mark can be taken into the imaging region (preferably in the center of the imaging region) in the mounted state.

  The imaging support unit 7 includes an arm 7a that holds the imaging unit 6 and a support column 7b that supports the arm 7a. The support column 7 b is fixed to the upper surface of the gantry 8. In the present embodiment, the imaging unit 6 is fixed to the imaging support unit 7. However, the present invention is not limited to this, and the imaging unit 6 may be formed to be movable in the vertical direction (lifting direction). Further, the imaging unit 6 may be formed to be movable in the X-axis direction and the Y-axis direction so that the imaging unit 6 can be moved according to the position of the imaging target on the application target W. In addition, when there are a plurality of imaging objects on the application target W, a plurality of imaging units 6 may be provided, and a plurality of imaging objects may be shared by the plurality of imaging units 6 and imaged. Also in this case, the plurality of imaging units 6 may be individually movable in the X-axis direction, the Y-axis direction, and / or the vertical direction.

  The gantry 8 is a support base that is installed on the floor surface and supports the stage moving device 3, the head support portion 5, the imaging support portion 7 and the like at a predetermined height position from the floor surface. The upper surface of the gantry 8 is formed into a flat surface, and the stage moving device 3, the head support unit 5, the imaging support unit 7, and the like are provided on the upper surface of the gantry 8. A control device 9 is provided inside the gantry 8.

  The control device 9 includes a control unit that centrally controls each unit, and a storage unit that stores various types of information and various programs (none of which are shown). The various information includes application information such as application patterns (pattern data) on both the front and back surfaces and application speed, and the information is stored in the storage unit in advance. Note that a memory, a hard disk drive (HDD), or the like can be used as the storage unit.

  Next, a coating process (coating operation) performed by the above-described coating apparatus 1 will be described. In addition, the control apparatus 9 of the coating device 1 performs a coating process based on various programs and various information.

  As shown in FIG. 2, in response to the application start instruction, the control device 9 first performs alignment with the surface Wa of the application target W (step S1). At this time, the surface W of the application object W is placed on a predetermined position on the stage 2 with the surface Wa of the surface Wa being the upper surface, and the surface Wa is the surface to be applied. Further, in this state, a corner portion used as the alignment mark M <b> 1 that is a part of the outer shape of the application target W is located in the imaging region of the imaging unit 6.

  In the alignment of the surface Wa in step S1, as shown in FIG. 3, a part of the surface Wa of the coating object W included in the imaging region R is imaged by the imaging unit 6, and the captured image is imaged by the control device 9. For example, the corner that is a part of the outer shape of the application target W, that is, the lower left corner in FIG. 3 is recognized as the alignment mark M1 by pattern matching. At this time, the focus of the imaging unit 6 is adjusted to the surface Wa of the application target W, and the position of the imaging region R is fixed.

  Thereafter, the control device 9 obtains the coordinates of the alignment mark M1 in the imaging region R, recognizes the position of the alignment mark M1 on the stage 2, and grasps the position of the coating object W on the stage 2. The Further, a correction amount (for example, a deviation amount in the X-axis direction or a Y-axis direction amount) for correcting the formation position (application position of the application liquid) of the predetermined pattern for the surface Wa from the position of the application object W on the stage 2. Deviation amount) is calculated, and the calculated correction amount is used to correct predetermined pattern data (pattern data for the surface Wa).

  Here, for example, in the calculation of the displacement (displacement amount) of the application target W, the displacement in the X-axis direction, the Y-axis direction, and the rotation (θ) direction is obtained from the captured image of the alignment mark M1. The positional deviation in the X-axis direction and the Y-axis direction is obtained based on the deviation between the position of the intersection of the two linear portions of the L-shaped outer shape in the alignment mark M1 and a preset position. Further, the positional deviation in the θ direction is obtained based on the inclination of one linear portion of the L-shaped outer shape of the alignment mark M1 with respect to the X-axis direction or the Y-axis direction. For example, in FIG. 3, the angle formed by the vertical straight line portion of the alignment mark M1 and the X-axis direction is obtained. The stage moving device 3 is controlled so as to eliminate such deviations in the X axis direction, the Y axis direction, and the θ direction. In this case, the stage moving device 3 is configured to be capable of moving in the X-axis direction and rotating in addition to moving in the Y-axis direction. As a method of correction based on the calculated positional deviation, for example, the position of the application target W may be corrected in addition to correcting the application pattern data in accordance with the positional deviation of the application target W. .

  In this way, the position of the alignment mark M1 is used as a reference, and the pattern formation position (application liquid application position) with respect to the surface Wa of the application target W is adjusted. The pattern data for the surface Wa is data in which a pattern formation position (for example, each dropping position) with respect to the surface Wa of the application target W is defined by coordinates, but is not limited thereto.

  Returning to FIG. 2, when the alignment of the surface Wa in step S1 is completed, a pattern is formed on the surface Wa of the application target W (step S2).

  In the pattern formation in step S2, pattern data corrected using the alignment mark M1 as a reference is used, and a predetermined pattern P1 is formed on the surface Wa of the coating object W as shown in FIG. As the predetermined pattern P1, a circuit pattern is formed. However, the present invention is not limited to this, and another pattern may be formed. The alignment mark M1 functions as an alignment mark for forming the pattern P1 on the surface Wa of the application target W.

  At the time of pattern formation, the control device 9 controls the stage moving device 3 and each coating head 4 based on the pattern data corrected with the alignment mark M1 as a reference, and the stage 2 on which the coating object W is placed. Is applied in such a manner that droplets are sequentially ejected toward the surface Wa, which is the upper surface of the application target W on the stage 2, while moving the application target W relative to each application head 4. The predetermined pattern P1 is formed on the surface Wa of the coating object W.

  Returning to FIG. 2, when the pattern formation in step S <b> 2 is completed, the application target W on the stage 2 is turned over so that the left and right are reversed from the state shown in FIG. 4 by an operator or a robot. That is, the coating object W is placed on the stage 2 with its back surface Wb being the top surface. In this state, alignment with respect to the back surface Wb of the application target W is performed (step S3). At this time, the coating object W is placed at a predetermined position on the stage 2 with the back surface Wb being the top surface, the back surface Wb is the surface to be coated, and the surface of the coating object W A part of the pattern P1 formed on Wa is included in the imaging region of the imaging unit 6.

  In the alignment of the back surface Wb in step S3, as shown in FIG. 5, a part of the pattern P1 formed on the surface Wa of the application target W included in the imaging region R is imaged by the imaging unit 6 from the back surface Wb side. The Further, the captured image is image-processed by the control device 9, and a lower left corner of a part of the pattern P1 on the surface Wa, for example, a rectangular block (see a dotted line in FIG. 5) located at the left end in FIG. Is recognized as the alignment mark M2. At this time, the focus of the imaging unit 6 is adjusted to the surface Wa of the application target W, and the imaging region R is fixed. Note that the application target W has transparency or light projecting property that allows the imaging unit 6 to image the pattern P1 on the front surface Wa from the back surface Wb.

  Here, since the position of the imaging region R and the position of the pattern P1 formed on the surface Wa of the application target W are known in advance, when the application target W is turned over, which part of the pattern P1 is the imaging region R. Whether it is located within can be determined by calculation. Therefore, a part having a feature that can be used as an alignment mark among a part of the pattern P1 to be located in the imaging region R is registered in advance as the alignment mark M2. In this example, the lower left corner of a rectangular block (see the dotted line in FIG. 5) located at the left end in FIG. 5 is registered in advance as an alignment mark M2.

  Thereafter, the control device 9 obtains the coordinates of the alignment mark M2 in the imaging region R, recognizes the position of the alignment mark M2 on the stage 2, and the position of the coating object W on the stage 2, that is, The position of the pattern P1 is grasped. Further, a correction amount (for example, a deviation amount in the X-axis direction or a deviation amount in the Y-axis direction) for correcting the formation position (application liquid application position) of the predetermined pattern for the back surface Wb from the position of the pattern P1. The calculated correction amount is used to correct predetermined pattern data (pattern data for the back surface Wb).

  In this way, the alignment mark M2 is used as a reference, and the pattern formation position (application liquid application position) on the back surface Wb of the application object W is adjusted. The pattern data for the back surface Wb is data that defines the pattern formation position (for example, each dropping position) with respect to the back surface Wb of the coating object W by coordinates, like the pattern data for the front surface Wa described above. However, it is not limited to this. Further, in calculating the positional deviation of the application object W, that is, the positional deviation (deviation amount) of the pattern P1, the positional deviation of the pattern P1 using the alignment mark M2 (similar to the calculation of the positional deviation using the alignment mark M1). It is possible to obtain a positional deviation with respect to a preset position on the stage 2.

  Returning to FIG. 2, when the alignment of the back surface Wb in step S3 is completed, a pattern is formed on the back surface Wb of the coating object W (step S4), and the process is terminated.

  In the pattern formation in step S4, pattern data corrected with reference to the alignment mark M2 is used, and a predetermined pattern (not shown) is formed on the back surface Wb of the application target W. As this predetermined pattern, a circuit pattern is formed in accordance with the circuit pattern formed on the surface Wa described above, but is not limited to this, and other patterns may be formed. The alignment mark M2 functions as an alignment mark for forming a pattern on the back surface Wb of the application target W.

  Also during the pattern formation, as described above, the control device 9 controls the stage moving device 3 and each coating head 4 based on the coating information including the pattern data corrected with the alignment mark M2 as a reference, and applies the coating object W. Is moved toward the back surface Wb which is the upper surface of the coating object W on the stage 2 while moving the coating object W relative to each coating head 4. Application is performed by sequentially discharging droplets, and a predetermined pattern is formed on the back surface Wb of the application target W.

  Here, in the case where the coating liquid for pattern formation is a coating liquid whose drying is accelerated by heating, a drying process by heat is provided between step S2 and step S3 and after step S4. Also good. When the pattern forming coating solution is a coating solution that is dried by ultraviolet irradiation, a drying step by ultraviolet irradiation may be provided between step S2 and step S3 and after step S4. .

  When the above-described drying step is provided, the pattern P1 formed on the surface Wa of the application target W is sufficiently dried, and then the next process can be performed on the application target W. . As a result, the pattern P1 formed on the surface Wa of the application object W is prevented from being destroyed by contact with the worker, robot, stage 2 and the like when the front and back are reversed. Can be prevented.

  As described above, according to the present embodiment, when a pattern is formed on the back surface Wb of the application target W, the position of the pattern P1 formed on the front surface Wa of the application target W is used as a reference, that is, the pattern P1. A part of the alignment mark M2 is used as a reference, and a pattern formation position (application liquid application position) with respect to the back surface Wb of the application target W is adjusted using the alignment mark M2 as a reference.

  Therefore, when a pattern is formed on the back surface Wb of the coating object W, the pattern P1 formed on the front surface Wa, that is, a part of the surface pattern becomes the alignment mark M2 for the back surface Wb, so that a part of the surface pattern is formed. It is used as a reference for the formation position of the back surface pattern. Thereby, since the formation position of the back surface pattern is aligned with the surface pattern, the surface pattern of the coating object W is compared with the case where both the front surface Wa and the back surface Wb of the coating object W are based on the same alignment mark. It is possible to improve the relative position accuracy between the back surface pattern and the back surface pattern. In this way, when patterns are formed on the front surface Wa and the rear surface Wb of the application object W, the patterns can be formed with high relative positional accuracy. Therefore, when the product to be produced and the circuit pattern are formed, the quality of the product such as the circuit board can be improved.

  Furthermore, by using a part of the pattern formed on the surface Wa of the coating object W as the alignment mark M2, the alignment mark forming process is performed as compared with the case where the alignment mark is formed on either the front or back of the coating object. Therefore, the time required for forming the alignment mark can be saved, and the entire production time can be shortened. In addition, since there is no need to form an alignment mark, the above-described effects can be obtained even when there is no space (margin) on the surface Wa where the alignment mark is provided.

  Further, a part of the circuit pattern is used as a part of the pattern formed on the surface Wa of the application target W. The circuit pattern includes many straight parts (for example, corners) orthogonal to the outer shape, and even if the imaging region R of the imaging unit 6 is fixed, the orthogonal part is surely within the imaging region R of the imaging unit 6. Therefore, a part of the pattern formed on the front surface Wa of the coating object W can be more reliably used as the alignment mark M2 for the back surface Wb. Furthermore, when a circuit pattern having a high required drawing position accuracy is formed, a coating device having a coating accuracy that satisfies the required accuracy is used. Therefore, the alignment mark M2 formed by the coating device also has a high position accuracy. Become a thing. As a result, the correction amount can be obtained accurately using the alignment mark M2 with high accuracy, and therefore the relative positional accuracy between the front surface pattern and the back surface pattern of the application object W can be improved more reliably.

  When a pattern is formed on the surface Wa of the application target W, a part of the outer shape of the application target W is used as an alignment mark M1, and the pattern of the pattern Wa with respect to the surface Wa of the application target W is determined based on the position of the alignment mark M1. By adjusting the formation position (application position of the application liquid), it is possible to form a pattern at an accurate position with respect to the surface Wa of the application object W. Therefore, in pattern formation for the surface Wa of the application object W However, the pattern can be formed with high positional accuracy.

  In the above-described embodiment, a part of the circuit pattern which is the pattern P1 formed on the front surface Wa of the application target W is used as the alignment mark M2 for the back surface Wb. However, the present invention is not limited to this.

  For example, as shown in FIG. 6, a pattern P1 including a mark P1a is formed on the surface Wa of the coating object W separately from the circuit pattern, and the mark P1a is used as an alignment mark M2 for the back surface Wb. May be. This mark P1a is a part of the pattern P1, and is formed in the coating process for forming the pattern P1. The formation position of the mark P1a is a position that is in the imaging region R when the application target W is turned over. Such a mark P1a is, for example, included in the pattern data in advance, or the mark P1a is stored in advance, and is read before the pattern P1 is drawn and embedded in the pattern data. As described above, when the mark P1a to be the alignment mark M2 is included in the pattern P1, there is always a portion that can be used as the alignment mark M2 in the pattern P1. You can definitely get it. In addition, since it is possible to select a shape suitable for use as an alignment mark as the shape of the mark P1a, it is possible to improve position detection accuracy and stabilize mark recognition (recognition errors are less likely to occur). Can do.

  Further, in the above-described embodiment, the application target W having transparency or light projecting property that allows the imaging unit 6 to image the pattern P1 on the front surface Wa from the back surface Wb is used, but is not limited thereto. Instead, for example, a coating object that does not have transparency or light projecting property may be used. However, in this case, it is impossible for the imaging unit 6 to image the front surface Wa from the back surface Wb side of the application target W.

  For this reason, as shown in FIG. 7, in addition to the imaging unit 6 on the upper surface side that images the upper surface of the coating object W on the stage 2, the imaging unit on the lower surface side that images the lower surface of the coating object W on the stage 2 6 must be provided. The imaging unit 6 on the lower surface side is provided in a hole formed in the stage 2 or is incorporated in the stage 2 having transparency or light projecting property. Thereby, in alignment of the back surface Wb of step S3, it becomes possible to image the surface Wa of the coating object W not by the imaging unit 6 on the upper surface side but by the imaging unit 6 on the lower surface side. For this reason, a part of the pattern P1 formed on the front surface Wa of the coating object W can be recognized as the alignment mark M2 for the back surface Wb.

  In the above-described embodiment, the imaging unit 6 is provided above the stage 2. However, the present invention is not limited to this. For example, when the imaging unit 6 is in the way, the inside of the stage 2 or the stage 2 is used. You may provide below. When the imaging unit 6 is provided inside the stage 2, the imaging unit 6 is provided in a hole formed in the stage 2, or is incorporated in the stage 2 having transparency or light projecting property. Further, when the imaging unit 6 is provided below the stage 2, the stage 2 is formed of a material having transparency or light projecting property.

  Moreover, in the above-mentioned embodiment, although the pattern is formed in the surface Wa and the back surface Wb of the application | coating target object W with one coating apparatus 1, it is not restricted to this, For example, two coating apparatuses 1 The first coating apparatus 1 may form a pattern on the surface Wa of the coating object W, and the second coating apparatus 1 may form a pattern on the back surface Wb of the coating object W. Double-sided pattern formation by the coating apparatus 1 may be performed. In addition, delivery of the coating target W between the first and second coating apparatuses 1 is performed by an operator or a robot. Furthermore, you may arrange | position the drying processing apparatus for drying the coating liquid apply | coated to the application | coating target object W between the coating apparatuses 1 of the 1st unit and the 2nd unit.

  In the above-described embodiment, the portion used as the alignment mark M2 is selected from the pattern P1 according to the position of the imaging region R in which the alignment mark M1 is imaged. However, the present invention is not limited to this, and when there is no portion having a feature suitable for use as the alignment mark M2 at a position corresponding to the imaging region R, the pattern P1 is located outside the position of the imaging region R. You may make it select the part used as alignment mark M2 from a part. In such a case, since the alignment mark M2 cannot be captured at the position of the imaging region R where the alignment mark M1 is imaged, the imaging unit 6 is provided so as to be movable to a position where the alignment mark M2 can be imaged, or imaging is performed. An imaging unit for imaging the alignment mark M2 may be provided separately from the unit 6.

  In the embodiment described above, one alignment mark M1 and one alignment mark M2 are provided. However, the present invention is not limited to this, and two or three or more may be provided. In this case, a plurality of imaging units 6 may be arranged according to the number of marks, or a single imaging unit 6 may be moved to the imaging position of each mark each time.

  As mentioned above, although some embodiment of this invention was described, these embodiment is shown as an example and is not intending limiting the range of invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

DESCRIPTION OF SYMBOLS 1 Application | coating apparatus 4 Application | coating head 6 Imaging part 9 Control apparatus M1 Alignment mark M2 Alignment mark P1 Pattern P1a Mark W Application | coating object Wa Front surface Wb Back surface

Claims (9)

A coating apparatus that forms a pattern by applying a liquid to the front and back surfaces of a coating object,
An application head for discharging the liquid from a nozzle;
An imaging unit capable of imaging the application object;
The position of the pattern formed on the surface of the coating object based on the captured image obtained by capturing the pattern formed on the surface of the coating object by the liquid ejected from the nozzle of the coating head by the imaging unit And a control device for adjusting the application position of the liquid with respect to the back surface of the application object by the application head based on the detected position;
A coating apparatus comprising: The pattern formed on the surface of the application object is a circuit pattern,
The coating apparatus according to claim 1, wherein the imaging unit images a part of the circuit pattern. The pattern formed on the surface of the application object is a pattern including alignment marks,
The coating apparatus according to claim 1, wherein the imaging unit images the alignment mark. A coating apparatus that forms a pattern by applying a liquid to the front and back surfaces of a coating object,
When forming a pattern on the back surface of the coating object, the application position of the liquid with respect to the back surface of the coating object is adjusted based on the position of the pattern formed on the surface of the coating object. apparatus.   When forming a pattern on the surface of the application object, a part of the outer shape of the application object is used as an alignment mark, and the application position of the liquid on the surface of the application object is adjusted using the alignment mark as a reference. The coating apparatus according to claim 1, wherein the coating apparatus is characterized in that: An application method for forming a pattern by applying a liquid to the front and back surfaces of an application object,
When forming a pattern on the back surface of the coating object, the application position of the liquid with respect to the back surface of the coating object is adjusted based on the position of the pattern formed on the surface of the coating object. Method.   The pattern formed on the surface of the coating object is a circuit pattern, and the application position of the liquid with respect to the back surface of the coating object is adjusted based on a part of the circuit pattern. Application method.   The pattern formed on the surface of the application object is a pattern including an alignment mark, and the application position of the liquid with respect to the back surface of the application object is adjusted based on the position of the alignment mark. 6. The coating method according to 6.   When forming a pattern on the surface of the application object, a part of the outer shape of the application object is used as an alignment mark, and the application position of the liquid on the surface of the application object is adjusted using the alignment mark as a reference. The coating method according to claim 6, wherein the coating method is characterized in that

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