JP2617378B2 - Component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for accurately positioning components with respect to a predetermined mounting position on a substrate by a recognition means in mounting components on a printed circuit board, and for determining whether the positioning is good or bad.

[0002]

2. Description of the Related Art Generally, when a component is automatically mounted on a board, the component is picked up by a component transfer head from a feeder for supplying the component, and the component is mounted on a board at a predetermined component mounting position. Carry to implement.

In particular, when a surface mounting component or the like having a very large number of leads is used as a component, the pitch between adjacent leads is small, and even if the position is slightly shifted, erroneous wiring occurs.

In order to prevent erroneous wiring, the position of the component and the position of the board on which the component is mounted are detected, and the positions of the components are aligned to accurately mount the component at a predetermined position on the board. Is required.

As a method for mounting such a component, as disclosed in Japanese Patent Application Laid-Open No. 60-1900, the center position and the rotation angle of the component are determined from the image of the component lead, and the mounting pattern is determined from the image of the board. 2 formed at the same time
It is proposed to determine the center position and rotation angle of the mounting pattern using two IC marks, and to move and rotate the component transfer head to mount the component at a predetermined position on the board based on the obtained positional relationship between the component and the mounting pattern. (Hereinafter referred to as Conventional Example 1).

Further, the positional relationship between the component and the mounting pattern is accurately and precisely defined, and even if the component can be mounted on the mounting pattern with high accuracy, even if the component and the mounting land are temporarily attached to each other, such as an adhesive or cream solder. There is a possibility that misalignment may occur immediately after mounting due to poor printing, etc., and it is conceivable to detect these misalignments and prevent the board with the poor mounting from flowing in the next process (reflow furnace, etc.). I have.

A method for determining the quality of component mounting is disclosed in, for example, JP-A-63-90707. This method is based on the positional relationship between land images before and after mounting. Further, Japanese Patent Application Laid-Open No. 1-309190 discloses a technique for judging from the amount of overlap between land images before and after mounting (hereinafter referred to as Conventional Example 2).

Conventionally, components are mounted on a board by a component mounter, and the quality of the mounted components is determined by a mounted component inspection machine in the next process after component mounting of the entire board is completed. And a visual inspection (hereinafter referred to as Conventional Example 3).

Further, a method of switching the field of view of a camera according to a target component when an electronic component and a printed board are recognized by a camera (Japanese Patent Laid-Open No. 63-168097) has been proposed (hereinafter referred to as Conventional Example 4).

Another conventional technique is disclosed in Japanese Unexamined Patent Publication No.
As shown in Japanese Patent Application Laid-Open No. 2-287108, by extracting a unique pattern corresponding to a unique shape of a lead row of components and extracting a shape pattern corresponding to a shape of a component in a land row of the board, the relative position of the component to the board can be improved. It has been proposed to measure the position and align the two.
Conventional example 5).

As shown in FIG. 26, when performing the cream solder printing inspection, if the cream solder print area is large with respect to the mounting land, the position of the mounting land cannot be determined, and the cream solder printing position with respect to the mounting land. Cannot be specified. Also, if the area of the mounting land and the printed area of the cream solder are the same, the mounting land is completely covered by the cream solder, so the mounting land cannot be recognized. Thus, the mounting land can be recognized. From this, it is possible to determine the quality of the printed state of the cream solder on the mounting land based on the recognition position and area of the mounting land (hereinafter referred to as Conventional Example 6).

[0012]

However, in the conventional example 1, the positional relationship between the obtained component and the mounting pattern is
When correcting the component mounting position, the mounting pattern and IC
Unless the positional relationship between the mark and the positional relationship of the imaging means between the component and the substrate is accurately and precisely defined, the component cannot be mounted on the mounting pattern with high accuracy.

Furthermore, a fine chip component or a component with a lead having a narrow lead pitch which requires mounting accuracy requires two IC marks for each component, and therefore, high-density mounting cannot be performed.

Further, in Conventional Example 2, all of the methods are methods for realizing an inspection device after mounting. Since the reference for comparison is a taught or reference substrate, a substrate actually mounted is used. Absent. For this reason, it is necessary for the variation of the mounted substrate itself to have a fixed value as an allowable range.

Furthermore, in Conventional Example 3, when visually judging the quality of a mounted component, sufficient inspection accuracy cannot be expected for a fine chip component or a component with a lead having a narrow lead pitch. I couldn't expect uniformity because of individual differences and fatigue.

Therefore, the mounted component inspecting machine must be installed in the next process of the component mounting machine. However, it is necessary to input data such as a component mounting position and a component inspecting position, and to adjust the input data. The data creation time is increased, the burden on the operator is increased, and it is difficult to handle various types of mounting boards.

Further, in the conventional example 4, a large part is first roughly recognized by a camera for a large part, and then a fine adjustment is performed by a camera for a small visual field to achieve high accuracy. In such a case, the recognition is performed twice, and there is a problem that it takes a long time in arithmetic processing and the like.

Next, in the conventional example 5, when positioning the component and the board, a high precision is required for the method of extracting and positioning the lead row of the component and the land row of the board, and the positioning means. In addition, at present, self-alignment effects in the process of melting and solidifying cream solder printed on the land of the board cannot be expected due to the shape, weight, etc. of parts with leads. As the pitch of leaded parts is becoming narrower,
There is a problem that the burden on the component mounting machine and peripheral equipment increases.

Further, in the conventional example 6, when the printing area of the cream solder is slightly increased (the influence of the dripping of the end face of the cream solder), the positional definition between the mounting land and the printing position of the cream solder is accurately determined. There was a problem that it could not be performed.

The present invention has been made to solve such problems, and an object of the present invention is to specify a positional relationship between a component and a mounting land so that component mounting can be performed accurately and in a mounting state. In order to perform the inspection of in real time, and to move the position of the camera by the parts, to recognize the corners of all parts, and to enable high-precision recognition only once It is still another object of the present invention to provide a component mounting apparatus that determines a component mounting position and determines the quality of cream solder printing prior to component mounting by a recognition unit provided on a component transfer head of a mounting machine body.

[0021]

In order to achieve the above object, according to the first aspect of the present invention, a component is removed from a component supply device and the component is transferred to a predetermined component mounting position on a substrate. A head and a recognizing means movable integrally with the component transfer head, the recognizing means recognizing a mounted component at a component recognizing point on a focus surface of the recognizing means, and mounting the component on a substrate to be mounted. The land is recognized on the focus surface of the recognition means, and the corresponding feature points of the mounted component and the mounted land are calculated based on the positional relationship with respect to the component transfer head, thereby aligning the mounted component and the mounted land. And

According to the second aspect of the present invention, a component transfer head that takes out a component from a component supply device and transfers the component to a predetermined component mounting position on a substrate, and is integrally movable with the component transfer head. The recognition unit recognizes a mounted component at a component recognition point on a focus surface of the recognition unit, recognizes a mounting land on a board to be mounted on the focus surface of the recognition unit, and By comparing the suction state of the component to the component transfer head before mounting and the mounting state of the component after mounting based on the component transfer head,
It is characterized in that the quality of the component mounting is determined.

Furthermore, the invention according to claim 3 is characterized in that the component mounting position is calculated by the recognition means and the quality of the component mounting is determined.

Further, according to the present invention, at least two cameras are arranged symmetrically with respect to the suction head so as to be movable in a visual field, and an image of a position recognition jig is picked up to obtain a positional relationship between the cameras. And mounting of the mounted component is performed.

According to a fifth aspect of the present invention, prior to component mounting by positioning the mounting component and the mounting land with reference to the component transfer head, the printing state of the cream solder printed on the mounting land is inspected. Features.

According to a sixth aspect of the present invention, the quality of the cream solder printing is determined from the mounting land and the position and area of the cream solder printed thereon.

[0027]

According to the present invention, the present invention comprises a component transfer head for transferring components to a predetermined component mounting position on a substrate and an image recognizing means. By recognizing the mounting land by the recognition means, the mounting component and the mounting land are aligned.

At this time, the state of adsorption of the component to the component transfer head and the mounted state of the mounted component are compared with the component transfer head as a reference, and the quality of the mounted component is determined. Further, it is also possible to calculate the component mounting position by the recognition means and determine the quality of the component mounting.

In recognizing components and the like, at least two cameras are arranged at positions symmetrical with respect to the suction head so as to be movable in a visual field, and the mounted components are mounted while imaging a position recognition jig. .

In order to align the components and the mounting lands, the printing state of the cream solder is inspected from the board surface information imaged by the recognizing means. Is performed to perform the mounting of the components. However, when the printed state of the cream solder is defective, the component is mounted after being discharged as a defective board or after correcting the cream solder.

[0031]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, the component transfer head 1 and the cameras 2-1 and 2-2 are mounted on the same base and can be transferred in the X and Y directions. The component transfer head 1 has a mechanism capable of transferring components in the vertical direction and the rotation direction. Two or four cameras 2 are arranged with the component transfer head 1 at the center, and have a field of view in a movable direction of the transfer head 1 from an oblique direction.

As described above, by synthesizing the visual fields using a plurality of cameras 2, the visual field resolution of the cameras can be enhanced, the portion that becomes a shadow of the component transfer head 1 can be recognized, and the height information of the object to be recognized can be recognized. This is advantageous in that the component transfer head 1 can be easily captured in the field of view. The unit of the component transfer head 1 and the recognition camera 2 will be hereinafter referred to as a transfer recognition unit.

The transfer recognition unit moves in the X and Y directions, but the camera 2 does not move up and down. Therefore, the camera is focused on a certain plane with respect to the movement of the transfer recognition unit (see FIG. 1). Is shown). For this reason,
The components and the pattern of the board 5 to be mounted must be on this surface.

However, conversely, if a background or the like that is not desired to be imaged is not on this surface, no image is formed because the camera is out of focus and the influence of the background can be suppressed.

The steps up to the recognition and mounting of components using such a configuration will be described below. FIG. 2A shows a state at the time of component recognition. The mounted component 3 is sucked from the feeder 4 by the component transfer head 1, lifted up to the focus surface 8 of the camera, picked up by the cameras 2-1 and 2-2, and stored in the frame memory. The composite image obtained at this time is shown in FIG.
(B).

Thereafter, the component transfer head 1 rises to a height at which it can pass, and moves to the board recognition point 7 in FIG. In balance with the operation, the component position recognition processing is performed with the component transfer head 1 as a reference.

Next, the state at the board recognition point 7 is shown in FIG.
(A). Since the component transfer head 1 is located above, the focus of the cameras 2-1 and 2-2 matches the mounting land 9 on the board surface. FIG. 3B shows a composite image obtained by imaging in this state. Since this image is also obtained by the same camera as in FIG. 2B, the position of the mounting land can be recognized based on the component transfer head 1.

The component position information obtained by FIG. 2B and the substrate position information of the mounting land 9 obtained by FIG. 3B are recognized based on the component transfer head 1. For this reason, the absolute accuracy of the entire device is not required, and the correction is performed by matching the parts and the lands. As a result, high-precision mounting is possible.

That is, since the same camera can recognize components and lands and the head which is the center of transfer can be recognized by the same camera, error components can be reduced and high-precision mounting becomes possible ( FIG. 4 shows a component mounting state).

Next, an inspection after mounting is performed. By the above-mentioned method, even if high-precision positioning is performed, the components may move or stand due to the state of the cream solder at the time of mounting, the cutoff of the air pressure of the transfer head, and the vibration at the time of mounting. . Therefore, inspection is performed after mounting.

FIG. 5A shows a state in which the component transfer head 1 is lifted upward after mounting. The composite image obtained at this time is shown in FIG. Since this image is stored in the frame memory, the transfer recognition unit can retrieve the next part.

Next, FIG. 6 shows an image of image extraction. That is, an image of the mounting land 9 before mounting FIG.
The image comparison process shown in FIG. 5B is performed to obtain a component image after mounting. From this image, the position of the component after mounting can be recognized with reference to the component transfer head 1. The position information and the position information of the component before mounting obtained from FIG.
By using the reference as a reference, the mounting state of the component after mounting can be recognized.

This makes it possible for the apparatus to determine whether or not the mounted components are normally mounted, to teach an operator of an abnormality, and to reduce positional displacement information to next mounting data. .

In this embodiment, as a mounting apparatus having a recognition function, this function is used not only for positioning but also as a function for checking the mounting state after mounting. In addition, since recognition is performed immediately after mounting, there is almost no time loss due to inspection, and an inspection device is not required in a post-process as in the related art. For this reason, teaching at a position necessary for the inspection machine is unnecessary, the number of steps before curing is reduced, and there is no danger of parts being inadvertently displaced.

That is, the size of the entire line can be reduced, the teaching time and the type switching time can be shortened, and the number of defective elements can be reduced.

In this manner, high-precision mounting is performed by recognizing parts and mounting lands with the same camera, and inspection is performed after mounting, so that it is not necessary to introduce a mounting inspection machine. The above ability can be exhibited.

Next, a series of flows from mounting to inspection will be described with reference to FIGS. 7 (a), 7 (b) and 7 (c). Referring to FIG. 5, in step 101, rough teaching of a mounting position and input of accompanying mounting data are performed, and then the process proceeds to a mounting data optimizing process. In this step, Step 10
In step 2, movement to the component supply position and removal of the component based on the component supply position data are performed, and step 103
To capture component image information and calculate component position information based on the transfer head.

In step 104, movement to the component mounting position based on the teaching data is performed. Step 105
Then, the board image information is captured, the mounting land is searched and extracted for the mounted component based on the extraction result of the component information, and the mounting land position information is calculated based on the transfer head.

In step 106, a mounting position that minimizes the difference in the positional relationship between the corresponding feature points of the component position and the mounting land position with respect to the transfer head is calculated. Step 107
Then, the mounting position data is updated, and in step 108, movement to the optimum mounting position and component mounting are performed.
Then, after optimizing all the mounting data, the process shifts to the actual operation process.

In step 109, it is determined whether or not the component requires mounting accuracy. If the determination is YES, the process proceeds to the actual operation step (FIG. 7B) in step 110. If the determination is NO, the speed of mounting tact is increased. Then, the process proceeds to the actual operation process (FIG. 7C) of step 119 in which the mounting position is corrected based on the component position information of the component taken out.

Thus, in step 110, movement to the component supply position and removal of the component based on the component supply position data are performed, and in step 111, component image information is captured and component position information based on the transfer head is set. Is calculated. The information on the component position calculated here is used for updating data in step 117,
The updated data is input to the step 110.

In step 112, the component is moved to the component mounting position based on the component mounting data. In step 113, the board image information is captured, and the search and extraction of the mounting land for the mounted component based on the result of extracting the component information are performed.
The mounting land position information is calculated based on the transfer head.

The mounting land position information calculated here is
It is used for updating data in step 118, and the updated data is input to step 112 described above. Subsequently, in step 114,
A mounting position that minimizes the difference in the positional relationship between the corresponding feature points of the component position and the mounting land position with respect to the transfer head is calculated. In step 115, movement to the optimum mounting position and component mounting are performed. The image information is taken to extract the positional information of the mounted component, the component mounting information is calculated based on the transfer head, and the quality of the mounting of the component based on the transfer head is determined.

Next, when mounting accuracy is not required, in step 119, the component supply position is moved and the component is taken out based on the component supply position data.
At 0, component image information is captured and component position information is calculated based on the transfer head. The component position information calculated here is used for updating data in step 126, and the updated data is used in step 1 described above.
19 is input.

Subsequently, in step 121, the component mounting position data is corrected based on the component position information based on the transfer head, and the components are moved to the component mounting position corrected in steps 122 to 124, and the board image information is captured. Including
In step 125, board image information is taken to extract position information of the mounted components, calculate component mounting position information based on the transfer head, and perform information based on the transfer head. Is determined as to whether or not the component is mounted.

The board image information in step 123 and the component mounting position information calculated in step 125 are used for updating the data in step 127, and the updated data is input to the previous step 121. It has become.

8 to 12 show an embodiment of a circuit board for mounting components. 8, a depression 14 is formed in the center of the mounting land 9, and cream solder 15 is printed on the mounting land as shown in FIGS. 9 and 10, and components are mounted.

Then, the cream solder 15 is melted by a reflow furnace or the like. The cream solder that has become liquid during the melting of the cream solder flows into the cavity 14, and the component (19) rides on the flow, thereby promoting the self-alignment effect.

The self-alignment effect promoted is that the depression 14 is formed at the center of the mounting land 9,
In order to concentrate on the center of the cavity 14, the cream solder 1
The parts mounted on 5 are also positioned at the center of the land,
It becomes larger than the alignment amount d (FIG. 9B) obtained by the conventional self-alignment effect (FIG. 10B).
Along with d ′) of (b), the lead 19 of the component sinks into the recess 14, and the bonding property of the solder increases. In order to further promote the self-alignment effect, a vibration function or the like may be provided in the reflow furnace to vibrate the substrate 5 itself.

The depression 14 formed on the mounting land is
As shown in FIGS. 11 and 12, 4
Components with directional leads are provided in two directions and components with two-directional leads are provided in one direction, and the number of components to be installed may be determined based on the weight of the components, for example, for all or for a representative point.

The circuit board for component mounting promotes the self-alignment effect at the time of melting the cream solder, and realizes the accuracy of recognition of the component and the substrate, the mechanical accuracy related to the movement of the mechanical unit as the positioning means, and the printing of the cream solder. The burden on accuracy is reduced. In addition, the component is positioned at the center of the mounting land, and the bonding property between the component and the mounting land is enhanced, so that highly accurate and highly reliable component mounting can be realized.

Next, when recognizing small parts, FIG.
(A) With the camera view configuration shown in (b), the corners of the part 1 are imaged by two or four cameras. Also, large parts 2
Is recognized, the corner of the component 2 is imaged with the camera view configuration shown in FIG. Further, since the camera can move continuously, it is possible to image the corners of the components and the corresponding board patterns for the recognition targets from the minimum to the maximum.

FIGS. 15 and 16 show a mechanism for achieving the above functions. 15 of FIG. The base is attached to a Y table, and a component suction unit 17 is disposed at the center of the base. Further, the suction unit 17 has a vertical (Z) direction and a rotational (R) direction.
It is a mechanism that can move in the direction. Two and four cameras 2 are arranged with the suction unit 17 as a center.

The camera 2 is fixed to the base 16 at a fixed position. However, it is assumed that the camera 2 has a mechanism that can swing the head slightly in the direction of the field of view around its fixed portion, and can move the field of view. The method of FIG. 16 achieves the above-described effect by moving the camera 2 around the suction unit 17.

By the way, in FIG. 15 and FIG.
In order to recognize and correct components and boards based on the generated camera field of view and to mount them, the field of view must be accurate. For this purpose, the camera 2 checks the corner of the calibration jig 18 in FIG.

The camera 2 determines the difference between the position 21 to be moved and the actual position 22 by the recognized position of the corner of the jig 18.
You can ask. The vertices (X ₁ ,
Y ₁ ) is the vertex of the actual jig image, and the vertex of the broken line (X
₀ Y ₀ ) is the taught position. The difference between these two points, D
_{X = X 0 -X 1, DY} = Y 0 -Y 1 by adding to the recognition correction, it is possible to calibrate the position between the camera. Further, if this camera position confirmation operation is performed when the suction head is replaced, the influence on the machine cycle can be suppressed.

Next, an electronic component mounting method will be described. FIG.
0, the electronic component is sucked at the position of b and the recognition position a
The head rises up. 21A and 21B, the lead of the electronic component is recognized. After the recognition is completed, the suction head 17 is raised to a position c which does not hinder the visual field of the camera, and the head is moved to the teaching mounting position in a state where the electronic component is sucked, and the substrate is moved as shown in FIGS. The pattern is recognized, arithmetic processing is performed together with the component recognition, and the position of the component and the board pattern are aligned.

When recognizing the components and the board,
For example, in FIG. 19A, if the camera is simply arranged in the vertex direction with respect to the component, the lead may not be able to enter the field of view, so the camera is rotated and arranged as shown in FIG. 19B. ing.

That is, as shown in FIG. 19A, when the camera 2 is arranged in the vertex direction with respect to the electronic component 3, the lead portion which cannot be detected even if the four visual fields 20 are synthesized on the pixel array of the camera 2. 19 comes out. Therefore, FIG.
As shown in (b), each pixel (camera) is rotated so that the directions of the visual field 20 and the component 3 match so that the visual field can be used effectively, and the blind spot for the synthesis of the four visual fields is eliminated.

According to this embodiment, since the component and the board are recognized by the same camera, it is possible to recognize the component and the board without passing through the part for recognizing the component, thereby shortening the tact time. In addition, since the camera is arranged so as to capture an image of the component from diagonally above in the vertex direction, it is possible to detect lead floating with high accuracy.

By the way, in a pre-process of component mounting, cream solder is printed on a component mounting land of a surface mounting board by a cream solder printing machine for the purpose of temporary mounting of a mounted component and solder bonding. The printing condition of the cream solder greatly affects the reliability of the finished board itself together with the mounting accuracy of the components. In addition, it is difficult to correct cream solder printing failure on a narrow lead pitch QFP component in a subsequent process, and the influence is large.

Therefore, as shown in FIG. 23, in order to align the components and the mounting lands, the board surface information (the mounting lands and the cream solder printed thereon) picked up by the recognition means on the mounting board is used. By inspecting the printing state of the cream solder, only when the printing state of the cream solder is good, the mounting position calculation for alignment is performed, and the components are mounted based on the calculation. However, when the printing state of the cream solder is defective, the component is not mounted, and the component is mounted by the above-described method after discharging as a defective board or correcting the cream solder by some means.

In this embodiment, the mounting position of the component and the quality of the cream solder printing prior to the component mounting are determined by the recognition means provided on the component transfer head of the mounting machine body. It should be noted that the quality of cream solder printing may be determined for all mounting points prior to component mounting, or may be determined only for certain set component mounting points. This eliminates the need to provide a dedicated cream solder printing inspection machine between the cream solder printing machine and the mounting machine.

The image of the substrate surface state viewed from the recognition means is
As shown in FIG. 24, the substrate surface 5 is dark, the mounting land (preliminary solder plating surface) 9 is bright, and the printed surface of the cream solder 15 has a brightness intermediate between the substrate surface 5 and the mounting land 9. The brightness can be obtained from the image information. In addition, the printing of cream solder is performed on the mounting land,
The end surface of the mounting land 9 can be easily specified (since the mounting position is specified from the mounting land, the mounting land cannot be extracted if the mounting land is completely covered by the shadow of the cream solder). Do inside so that you can recognize.

As described above, if the cream solder is printed on the mounting land, no matter how the printing of the cream solder is displaced on the mounting land, the three corners of the mounting land can be recognized. Since the land is usually a quadrilateral, the position of the mounting land can be correctly defined from the three recognized corners.

That is, as shown in FIGS. 25A and 25B,
Assuming a quadrilateral defined by the extracted three corner points a, b, and c, the center of the quadrilateral is determined. The center obtained in this way is the center position of the mounting land, and the mounting land center position of the corresponding mounting land is similarly obtained, thereby defining the mounting position of the component from the center position of the paired mounting land.

Next, only the cream solder is extracted from the image information based on the brightness characteristics of the cream solder, and the area and the center of gravity (the cream solder center position) are obtained. The area obtained at this time is used for a state inspection such as insufficient cream solder printing or blurring, and the center of gravity is used for a cream solder print position deviation inspection by comparison with the previously obtained mounting land center position. Then, these are set to a predetermined allowable area value (or an area ratio with a mounting land),
Then, the quality of the cream solder printing is determined by comparing with the allowable positional deviation amount.

[0078]

According to the present invention, the following remarkable effects are obtained. (1) Since components and mounting lands are recognized by the same camera with reference to the component transfer head, high-accuracy alignment is possible without requiring the accuracy of the entire apparatus.

(2) The mounting state of the component can be inspected by comparing the positions of the image after mounting and the image obtained for mounting, so that an inspection machine is not required in the subsequent process.
Therefore, there are no factors such as teaching of the inspection machine, switching of types, occurrence of defects by the inspection machine, and the like. Therefore, there is no need to connect a defect determination line after the mounting apparatus.

(3) The mounting deviation data can be accumulated and reduced to subsequent mounting data, so that mounting with higher precision can be performed.

(4) Everything from small parts to large parts can be recognized with the accuracy corresponding to the minimum parts, and the jig with the dimensional accuracy is recognized by the camera and the position of the camera is confirmed. Thus, the positional relationship between the cameras can be accurately calibrated.

(5) By inspecting the printed state of the cream solder prior to mounting the component, it is possible to avoid mounting the component on a defective cream solder printed board, and to produce a defective product and yield of the used component. Efficient production such as improvement is possible. (6) By providing a cream solder printing inspection function to the mounting machine, it is not necessary to introduce a cream solder printing inspection machine into the mounting line, and the initial cost, running cost, and man-hours involved in the installation can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a recognition mounting operation.

FIG. 2A is a diagram showing a state at the time of component recognition;
(B) is a figure which shows the composite image of a component.

FIG. 3 is a diagram illustrating a state at the time of recognition at a board recognition point, and FIG. 3B is a diagram illustrating a composite image of the board.

FIG. 4 is a diagram showing a component mounting state.

5A is a diagram illustrating an inspection state after component mounting, and FIG. 5B is a diagram illustrating a composite image of the component mounting state.

FIG. 6 is a diagram illustrating an image of image extraction of a component after mounting.

FIGS. 7A, 7B, and 7C are flowcharts from mounting to inspection.

FIG. 8 is a diagram showing a configuration of a component mounting circuit board.

FIGS. 9A and 9B are diagrams showing a conventional self-alignment effect.

FIGS. 10A and 10B are views showing a self-alignment effect of the present invention.

FIG. 11 is a diagram showing a land configuration when a component with four-way leads is mounted.

FIG. 12 is a diagram showing a land configuration when a component with two-way leads is mounted.

FIGS. 13A and 13B are views showing a visual field configuration for small component recognition.

FIGS. 14A and 14B are views showing a visual field configuration for large component recognition.

FIG. 15 is a diagram showing a configuration of an obliquely moving camera.

FIG. 16 is a diagram showing a configuration of a horizontally moving camera.

FIG. 17 is a diagram showing a position confirmation operation by a camera.

FIG. 18 is a diagram showing a jig recognition image by a camera.

FIGS. 19A and 19B are diagrams showing a state of component recognition by a camera.

FIG. 20 is a diagram showing a positional relationship between a component suction position and a suction head.

FIGS. 21A and 21B are diagrams showing a state of recognizing a lead of a sucked component.

FIGS. 22A and 22B are diagrams showing a state in which a component and a board pattern are aligned.

FIG. 23 is a diagram illustrating a control flowchart in a pre-process of component mounting.

FIG. 24 is a diagram illustrating a printed state of cream solder on a mounting land.

FIGS. 25A and 25B are diagrams showing an extracted image of a mounting land.

FIG. 26 is a diagram showing an inspection flowchart of cream solder printing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component transfer head 2, 2-1 and 2-2 Camera 3 Component 5 Substrate 9 Land 14 Depression 15 Cream solder 17 Suction unit

 ────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor: Yutaka Yajima 1048, Kazuma, Kadoma, Osaka Prefecture Inside Matsushita Electric Works, Ltd. (56) References JP-A-60-1900 (JP, A) JP-A-61-63099 (JP, A) JP-A-3-6900 (JP, A) JP-A-62-287108 (JP, A) JP-A-63-168097 (JP, A) JP-A-63-90707 (JP, A)

Claims (6)

(57) [Claims] A component transfer head for picking up a component from a component supply device and transferring the component to a predetermined component mounting position on a board; and a recognition unit movable integrally with the component transfer head. The recognition unit recognizes the mounted component at a component recognition point on the focus surface of the recognition unit, recognizes a mounting land on a board to be mounted on the focus surface of the recognition unit, and corresponds to the mounted component and the corresponding feature of the mounting land. A component mounting apparatus characterized in that mounting points and mounting lands are aligned by calculating points in a positional relationship based on a component transfer head. 2. A component transfer head for picking up a component from a component supply device and transferring the component to a predetermined component mounting position on a substrate, and a recognizing means movable integrally with the component transfer head, The recognition means recognizes a mounted component at a component recognition point on a focus surface of the recognition means, recognizes a mounting land on a board to be mounted on a focus surface of the recognition means, and mounts a component transfer head before mounting on the board. A component mounting apparatus characterized in that a component mounting state is determined by comparing a suction state of a component with respect to a component and a mounting state of the component after mounting on the basis of a component transfer head. 3. The component mounting apparatus according to claim 1, wherein the component mounting position is calculated by the recognition unit and the quality of the component mounting is determined. 4. The component mounting apparatus according to claim 1, wherein at least two cameras are movably arranged in a field of view symmetrically with respect to the suction head, and a position recognition jig is provided. A component mounting apparatus for mounting the mounted component by imaging the camera and defining the positional relationship between the cameras. 5. The component mounting apparatus according to claim 1, wherein
A component mounting apparatus for inspecting a printing state of cream solder printed on a mounting land prior to component mounting by aligning a mounting component and a mounting land based on a component transfer head. 6. The component mounting apparatus according to claim 5, wherein
A component mounting apparatus characterized in that the quality of cream solder printing is determined based on the mounting land and the position and area of the cream solder printed thereon.