KR950002211B1 - Parts mounting device - Google Patents

Abstract

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Description

Component mounting device

1 is an explanatory diagram of the recognition and mounting operation in the component mounting according to the present invention.

2 is an explanatory view of the operation of the recognition means in the component recognition point in the apparatus according to the present invention.

3 shows a composite image of one of the mounting parts obtained for the recognition means at the recognition point of FIG.

4 is an explanatory view of the operation of the recognition means at the substrate recognition point in the apparatus according to the present invention.

5 shows a composite image of a substrate recognized by the recognition point of FIG.

6 is an explanatory diagram of a component mounting operation in the apparatus according to the present invention.

7 is an explanatory view of the inspection operation after mounting the component in the device according to the present invention.

8 shows a composite image of the mounted state of the inspected part.

9 is a view showing a recognized state after mounting a part in the device according to the present invention.

10 is a flow chart showing the operation from component mounting to post-installation inspection in the device according to the invention.

11 is an explanatory diagram of a printed circuit board applied to the apparatus according to the present invention for mounting a component.

12 and 13 illustrate the self-alignment effect obtained in the device of the present invention.

14 is an explanatory view of a land arrangement for one of the parts with leads provided in four directions.

FIG. 15 is an explanatory diagram of land arrangement for one of the parts with leads provided in two directions. FIG.

16 and 17 are explanatory diagrams of field of view for recognizing the smaller of the mounting parts.

18 and 19 are explanatory diagrams of field of view arrangements for recognizing larger of mounting components.

20 is an explanatory diagram of the operation of the diagonal movable camera used in the apparatus according to the present invention.

21 is an explanatory view of the operation of the horizontally movable camera used in the apparatus according to the present invention.

Figure 22 is an illustration of the positioning operation by the camera in the device according to the present invention.

23 is an explanatory diagram of a jig recognition image by a camera in the apparatus according to the present invention.

24 is a view showing the positional relationship between the parts suction position and the suction head in the apparatus according to the present invention.

25 is an explanatory view of a state of recognizing a lead of one of the components sucked in the apparatus according to the present invention.

FIG. 26 is an explanatory view of a state of alignment between a land pattern on a substrate and one of the mounting parts in the apparatus according to the present invention. FIG.

27 and 28 are views showing a state in which a mounting part is recognized by a camera in the device according to the present invention.

29 is a control flow diagram in the pre-mounting phase of the component in the device according to the invention.

30 shows a state of cream type solder printed on land in the device according to the invention.

Figure 31 shows an extraction phase of land in the device according to the invention.

32 is a flow chart of the printing state of the cream-type solder.

33 is an explanatory view of the mounting operation in another embodiment of the component mounting apparatus of the present invention.

34 is a schematic diagram showing the relationship between the mounting position on the substrate and the reference position in the apparatus of the present invention.

35 is an explanatory view of the operation of the component recognition means in the apparatus of the present invention.

FIG. 36 shows a composite view of one mounting part obtained by the recognition means of FIG.

37 and 38 illustrate a positional deviation or misalignment between the center of the mounting part and the center of the part transfer head in the apparatus of the present invention.

39 is a flowchart of a high speed mounting method in the apparatus of the present invention from the pickup of the parts to be mounted to the completion of mounting on the substrate.

40 is an explanatory view of the mounting operation in another embodiment of the component mounting apparatus of the present invention.

Fig. 41 is a diagram showing the relationship on the substrate between the mounting position and the reference position of the mounting component with lead in the apparatus of the present invention.

42 and 43 are views showing positional shifts between the center of the mounting component with a lead and the center of the component transfer head of the apparatus of the present invention.

44 and 45 are views showing the positional shift between the center of the mounting land on the substrate and the center of the component transfer head of the apparatus of the present invention.

FIG. 46 is a flow chart of a high precision mounting method in the apparatus of the present invention from pickup for mounting one of the components to completion of mounting of the mounting component on the substrate.

Fig. 47 is a flowchart of a mounting method in the apparatus of the present invention, in which reduction of a required time is attempted.

48 is a flowchart of the relationship between the moving position of the printed circuit board and the component feeding position in the apparatus of the present invention.

Background of the Invention

The present invention relates to a component mounting apparatus, in particular, a component mounting apparatus capable of carrying out accurate positioning of a component using a recognition means and also determining whether the position is appropriate.

The component mounting apparatus of this kind mentioned above can be effectively used to accurately mount electrical and electronic components on a printed circuit board at a predetermined mounting position.

[Prior art]

In general, in mounting the part to the substrate automatically, the part is picked up from the part feeder by means of a part-transfer head and transferred to a predetermined mounting position on the substrate.

Especially when surface-mounted parts with a very large number of leads are used, even slight positional deviations lead to incorrect wiring because each lead is provided at an extremely small pitch. Therefore, it is required to detect each arrangement of the mounting parts and the position on the substrate on which each component is to be mounted. At this time, the arrangement of the mounting components is aligned with the positions on the substrate to be mounted on each component, so that the components are accurately mounted at predetermined positions on the substrate.

Such a method of mounting a component has been proposed by Kojo Suzuki et al. In Japanese Patent Publication No. 60-1900, where the center position and rotation angle of the components are determined from the top of the lead of each component. The angle of rotation is determined from the top of the substrate by two IC marks formed in the same way as the mounting pattern, and the part-carrying head carrying each mounting part moves according to the positional relationship between the mounting part and the mounting pattern obtained through this determination. And rotate, and the parts are mounted on a predetermined position on the substrate. However, if the mounting position of the part is to be corrected according to the discriminated positional relationship between the mounting pattern and the IC mark by such a conventional mounting method, the mounting pattern and the IC mark as well as the positional relationship of the imaging means with respect to the component and the substrate. If the positional relationship between the two is not accurately and precisely determined, it is actually difficult to position the part highly precisely on the mounting pattern. Moreover, two IC marks are required for each mounting component, which is difficult according to the conventional method and implements a high-density mounting pattern for a component composed of a fairly small chip component or a lead having a small pitch requiring a very precise mounting. It's hard after all.

On the other hand, although the positional relationship between the part and the mounting pattern is very precisely defined to allow the mounting parts to be correctly mounted on the mounting pattern, it is due to the coarse printing of the adhesive or cream type solder that is used to temporarily hold the parts on the mounting land. Therefore, there is still a risk of positional deviations immediately after mounting, so that any positional deviation can be detected so that the substrate containing such a lower mounting is not transferred to a reflow furnace, which is the next step.

T. In Japanese Patent Laid-Open No. 63-90707 as a method of determining the quality of the mounted state of parts. Proposed by Yochoya, for example, the characteristics are determined based on the positional relationship between land images before and after mounting. Meanwhile, in Japanese Patent Laid-Open No. 1-309190, M. Okayaki proposed a method of determining the mounting characteristics by overlapping land phases before and after mounting. However, since known methods for determining the mounting characteristics of these parts are realized by performing post-installation inspection, the criteria used in the comparison for the determination will be a teaching or reference substrate instead of the substrate on which the actual mounting will be performed. Thus, there is a need to provide a method or apparatus for implementing a means for allowing any dimensional or positional variation related to each substrate to be used for actual mounting.

Moreover, a method of mounting components on a substrate by means of a mounting apparatus has been introduced, and the determination of the characteristics of the mounted state of the components is carried out in the next step after the completion of the mounting of all the components for all of the substrates. It is performed by a visual inspection device. In the case of visual inspection, there is a risk that the patent inspection standard is different for each individual inspector and also the efficiency of work. Therefore, it is more difficult to expect sufficient accuracy of the test. As a result, it is common to use the inspection device in the final stage, but since the device must be provided with input data such as the mounting position of the parts, the inspection position of the mounted parts, etc., and an adjuster of such input data, the operator must The burden is that more labor and time is required to prepare input data and the like on the substrate. Therefore, it is more difficult or nearly impossible for the operator to perform the test when many mounting patterns are involved.

It has also been proposed to recognize mounting parts and substrates by cameras, i.e., in Japanese Patent Laid-Open No. 63-168097. Kaneda et al. Show switching the camera's field of view depending on the part to be mounted. In practice, however, the larger part is roughly recognized by the specific camera for the larger part and then precisely adjusted by the camera with the smaller field of view, so this recognition must be performed twice. The problem is that it consumes considerable time.

In Japanese Patent Laid-Open No. 62-287108, Kenji Suzuki et al. Also draw a specific pattern for a specific configuration of a lead array provided for each part, and also extract a pattern corresponding to the shape of the land arrangement on the substrate, and By measuring the relative position of each and every component with respect to the proposed method for the alignment of the components on the substrate and their mounting positions. However, the alignment between the component and the substrate according to this method requires a high degree of accuracy in the drawing of the array of leads of the component and the land array of the substrate, and the resulting alignment process and means. Moreover, in the process of melting or solidifying the cream-type solder printed on the land of the substrate, it is difficult to obtain a self-alignment effect on the parts having the lead due to the shape, weight or similar factors of the parts. it's difficult. And the burden on component mounting and environmental equipment tends to increase as the pitch of leads provided for components requiring higher precision grows.

In addition, a method of mounting components by a so-called cream type solder printing method has been proposed. However, when examining the printing characteristics of the cream-type solder, it is difficult to determine the position of the mounting land when the printing area of the cream-type solder is larger than the mounting land, and it is easy to determine the position of the cream-type solder on the mounting land. not. Moreover, if the printed area of the cream-type solder is the same as the area of the mounting land, the mounting land is completely covered by the cream-type solder, so it is difficult to recognize the mounting land, and the positional deviation or insufficient thickness of the printed cream-type solder, etc. Also makes recognition of the mounting land difficult. In this respect it may be possible to determine the properties of the printed state of the cream-type solder relative to the mounting land by the recognized position and area of the mounting land. However, in this way of component mounting, the positioning or alignment of the cream-type solder print on the mounting land is done correctly once the print area is slightly larger due to any deflection or sliding effect at the edge of the cream-type solder. it's difficult.

[Summary of invention]

Therefore, the main object of the present invention is to eliminate the problems associated with the above known technology, and to provide a highly accurate mounting of the components as well as real-time inspection of the mounted state in accordance with the provisions of the positional relationship between the component to be mounted on the substrate and its mounting land. It is to provide a component mounting apparatus that can be realized.

Still another object of the present invention is to provide a component mounting apparatus, in which a component recognition camera performs a very accurate recognition by a recognition performed only once and moves the position according to the component in order to recognize corners of all components.

On the other hand, another object of the present invention is to recognize the characteristics of the cream-type solder printed before the mounting of the parts by means of the recognition means provided in the part-carrying head included in the body of the component mounting device, as well as to implement the specification of the mounting position of the parts. It is to provide a component mounting device.

According to the present invention, the above objects are provided with a recognizing means having a component-carrying head for picking up each mounting component from a component supply stand and transferring the picked-up component to a predetermined position on a printed circuit board. In order to obtain the alignment between the mounting lands, the mutual correspondence of the mounting lands on each part and the substrate is defined according to each mounting position made based on the part-carrying head.

Still other objects and advantages of the present invention will become apparent from the following description of the present invention in detail with reference to embodiments according to the present invention shown in the drawings.

Although the present invention is now described with respect to the embodiments shown in the accompanying drawings, it is to be understood that the invention is not limited by the embodiments and includes all possible modifications, corrections and equivalent arrangements within the scope of the appended claims.

Detailed Description of the Preferred Embodiments

In FIG. 1, the component transfer head 11 and the cameras 12 and 12a are mounted on a common base in the component mounting apparatus of the present invention, and these heads 11 and the cameras 12 and 12a move in the X and Y directions. Possibly provided. Furthermore, the component transfer head 11 is provided to be movable in the vertical direction and rotatably in the axial direction, and two or four of the cameras 12 and 12a move in the direction of movement of the transfer head 11 about the head 11. Are positioned to have a field of view in the diagonal direction. By combining each of the images obtained through a number of these cameras, the resolution of the camera field of view can be raised, and the side behind the head 11 relative to one of the cameras is recognized by the other camera on the opposite side of the head 11. The height information of the target object can be obtained easily, and the head 11 can be prevented from entering the field of view of one of the cameras 12 and 12a. The parts transfer head 11 and the recognition cameras 12 and 12a will also be referred to as recognition transfer units in the following description.

The recognition transfer unit is movable in the X and Y directions, but the cameras 12 and 12a are not movable in the vertical direction so that the cameras 12 and 12a are fixed surfaces as shown in FIG. 1 during the movement relative to the transfer unit. They can focus their images on (13). Therefore, the printed circuit board 14 and the mounting part 15 should be positioned on the focusing surface 13 to obtain accurate and proper recognition.

Since no image is provided to the cameras 12 and 12a unless an unwanted background obtained by the camera is present on the focusing surface 13, the influence of the background can be effectively eliminated.

Referring to the second diagram, the step of recognizing and mounting the part using the device used is that each mounting part 15 is connected to the part transfer head 11 from the feed table 16 to the focusing surface 13. The image of the mounted component 15, which is sucked in and transported, is obtained by the cameras 12 and 12a, and the information of the image, i.e., the composite image PCI of the component 15 as shown in FIG. Stored in memory (not shown).

Thereafter, the head 11 for conveying the mounting part 15 is raised to a movable height, and then moves laterally to the substrate recognition point BP shown in FIG. 1 on the printed circuit board 14. At the same time as the movement, the position recognition process is executed to obtain the position information on the conveyed part together with the conveying head 11 determined as a reference. At the substrate recognition point BP, the head 11 is still maintained at the elevation, while the cameras 12 and 12a focus the mounting land 17 on the substrate 14 at the same height as the focusing surface 13, The image of the mounting land 17 of each of the cameras 12 and 12a consists of a composite image (BCI) as shown in FIG. Since this composite image BCI is obtained through the same cameras 12 and 12a providing the composite image PCI of FIG. 3, the mounting land 17 on the substrate 14 relative to the component transfer head 11 is obtained. It is possible to recognize the location.

In this case, therefore, the positional information of the substrate 14 including the mounting land 17 and the positional information of the conveying part 15 obtained in FIG. The high precision of the whole is no longer necessary, but as a result high precision mounting is made possible by the conveying parts 15 aligning means with the mounting land 17. In other words, in this arrangement, the conveying part 15 and the mounting land 17 are recognized by the ordinary camera and the conveying head 11, and the center of the recognition conveying unit is also recognizable by the same camera, so that the error factor is reduced. The mounting of the conveying part 15 can be achieved with high precision as shown in FIG.

Next, post-installation irradiation steps will be mentioned. Even if high precision alignment has been achieved by the above method, the mounting of the parts is still in the printing state of the cream type solder, the suction air pressure fluctuations of the part transfer head 11, and any vibrational motion of the transfer part 15. Since it cannot be executed precisely because of positional deviation or state change, it is required to perform post-mount inspection.

Now in FIG. 7, only the component transfer head 11 is lifted up, and the component 15 remains in the mounting land 17. The composite image (MCI) of the mounted state is shown in FIG. It is obtained by (12 and 12a). This composite image (MCI) is stored in the frame memory (not shown), and the recognition transfer unit is positioned to prepare for the next transfer operation for mounting the next of the mounting parts.

On the other hand, the phase comparison process has a composite image (BCI) of FIG. 5 of the mounting land 17 before mounting, a composite image (BCI) such as 8 of the land after mounting, and a phase (MPI) of the component after synthesis of FIG. Is executed. This phase (MPI) makes it possible to recognize the position of the post-mounted component 15 as shown in FIG. 9 with respect to the component transfer head 11. The positional information (CPI) of the mounted component 15, which is a composite image (PCI) of the third degree based on the component transfer head 11, is compared with the positional information MPI, It is possible to recognize the status, and thus determine whether the mounting component is mounted properly, to warn of abnormal mounting operation and to re-memorize information on positional deviations in the next mounting data.

In the present invention, the recognition function provided in the component mounting apparatus as disclosed is used for position alignment and investigation of the component mounting state. In this regard, the recognition operation can be executed immediately after installation, so that there is no time loss due to irradiation, so that no next step operation for checking the installation state is performed, such as a mounting state inspector. For this reason, it is no longer necessary to collect the position information required for the mounting state inspector, so that the pre-setting stage of solder, etc. can be reduced, and the inadvertent positional deviation of the component can be easily prevented. As a result, it is possible to minimize the total length of the actual copper wire for mounting, shorten the required teacher time or grade or shape switching time, and reduce the defective rate. In this way, high precision mounting of the component can be carried out by the cameras 12 and 12a through the recognition of the component 15 and the mounting lands 17, taking into account all data that can be obtained using the inherent performance of the device shown. No special equipment such as a state detector for carrying out irradiation after mounting is necessary.

In FIG. 10 an embodiment of full operation from mounting to irradiation is shown. More particularly, in step 101 the input of the mounting position and the schematic data of the accompanying mounting data is carried out, in which operation is moved to the step for optimizing the mounting data. In step 102, the part supply position data is moved to the part supply position and picking up of a part is performed. In step 103, the part position information as well as the calculation of the part position information based on the part conveying head are performed. Is obtained. In the next step 104, the movement to the component mounting position is executed based on the teaching data. In step 105, the reference land, the extraction land and the transfer head of the pick-up component mounting land are obtained by obtaining the information on the board, and extracting the part information. The calculation of the mounting land position information on the basis of the reference is executed. In a next step 106, a calculation is performed to determine the mounting position so as to minimize the difference between the positional relationship of the component position with respect to the component transfer head and the rising characteristic of the mounting land position. In the next step 107, the mounting position data is updated, and in the next step 108, the movement of the head to the proper mounting position and the mounting of the transfer part are performed.

In step 109 of the next step, it is determined whether a particular mounting component requires mounting accuracy and consequently the drive converts to the actual work of step 110 in the case of "YES" or in the case of "NO". The drive converts to another actual task of step 119. That is, the case of "YES" is for a microchip, QFP and the like, and the case of "NO" is for a conventional chip component and the like.

In step 110, the movement of the head to the component supply position based on the component supply position data and the pickup of one of the components are performed. In the next step 111, not only the part position information is calculated on the basis of the part transfer head, but also the image information of the picked-up part is performed. The part position information obtained here is also used in step 117 to update the part supply position data, so that the updated data is input onto step 110. In the next step 112, the movement to the component mounting position based on the component mounting position data is executed, and in the next step 113, the photographing of the phase information on the printed circuit board or the board and the extraction of the component information are performed. The mention and extraction of the mounting land for the picked-up parts and the calculation of the mounting land position information on the basis of the transfer head are performed. In addition, the mounting land position information calculated here is used in step 118 to update the parts mounting position data, and thus the updated data is input into the step 112 above. In the next step 114 the mounting position is calculated such that the difference in the positional relationship between the component position with respect to the transfer head and the corresponding characteristic of the mounting land position is made to a minimum.

In the next step 115, the movement to the optimum mounting position and the mounting of the conveyed parts are carried out, and in the next step 116 the extraction of the positional information of the mounted parts as well as the extraction of the positional information of the mounted boards by comparison with the information on the board Determination of the quality of the mounted state of the part is performed by photographing the image information, calculating the component mounting position information based on the transfer head, and comparing the component position information before and after mounting based on the transfer head.

If the transferred part does not require mounting with high accuracy, step 119 not only picks up a particular one of the parts but also moves to the part supply position based on the part supply position data, and in step 120 The calculation of the part position information and the imaging of the part image information are performed on the basis of the transfer head.

The position information calculated here is also used for updating in step 126 for the parts supply position data, so that the updated data is input into step 119. In the next step 121, the part mounting position data is calibrated by the part position information on the basis of the transfer head. Furthermore, in steps 122 to 124, the head is moved to the corresponding part mounting position, Photographing and mounting of the conveyed parts to the position are performed. In the next step 125, the extraction of the positional information on the mounted parts as well as the extraction of the positional information on the mounted parts are performed by comparison with the information on the board before mounting. Determination of the quality of the mounting state of the parts is carried out by calculating the parts mounting position information on the basis of and the comparison between the parts position information before and after the mounting on the basis of the transfer head. On-board information in step 123 and component mounting position information in step 125 are applied in step 127 for updating the component mounting position data, so that the updated data is fed back into step 121. .

Referring now to FIGS. 11-15, an example of a printed circuit board or board is also shown for fixing a component applied in the present invention. More specifically, each land 17 on the board 14 is formed to hold a dent 21 in the center of the upper surface as shown in FIG. Located on the land 17 as shown in FIG. 12, the mounting part 15 is mounted thereon. The printed cream-type solder 22 is then melted by means such as, for example, a reflow furnace (not shown), and the melted and fluidized solder 22 flows into the groove 21, thereby causing the mounting component. 15 is transported to the fully aligned position into the groove 21 as shown in FIG. 13 so that the self-alignment effect can be effectively realized here. In particular, when the mounting part has a lead 23, each lead 23 enters the groove 21 in accordance with the movement of the printed solder 22, in order to achieve movement by the length component of l, The lead 23 may be located in the center of the groove 21 surrounded by the solder 22 flowing into the groove 21, thereby increasing the adhesion between the solder 22 and the lead 23 significantly. Can be.

Furthermore, a vibrator can be provided in the reflow furnace to vibrate the board 14 to enhance the self-aligning effect of the mounting parts to each land 17. If the mounting part 15 or its lead 23 should preferably be mounted at a predetermined position of the land 17 on the board 14 with high accuracy, it is thus necessary to provide the groove 21 at the predetermined position. The purpose will be met.

In fact, the groove 21 formed in the mounting land 17 is provided according to the shape or external contour of the mounting part, so that when the mounting part has a lead extending in four directions, the groove 21 is shown in FIG. It will be made to lie in two transverse directions as shown, and the groove 21 will be provided in a single direction as shown in FIG. 15 when the mounting part has a lead extending in the opposite direction. The number of grooves actually provided will be determined in consideration of the weight of the mounting part 15 and optionally determines whether the grooves are provided in all or only some of the lands 17. In the arrangements shown in FIGS. 14 and 15, it will be appreciated that the self-alignment effect can be enhanced in the direction of the arrow SA towards the center of each groove.

In then recognizing the small sized mounting part 15S, the arrangement is made as shown in FIG. 16 so that the device is equipped with four cameras to define four areas of view CE1 to CE4, resulting in mounting parts. The divided image of 15S is taken for four corners of the component 15S that are rectangular in plan view so that each corner edge is disposed in the center of each divided image, or manufactured as shown in FIG. 17 instead. At least two cameras provide limited to two areas of the positive eye (CE1 and CE2) to take two divided images at two corners of the part 15S so that a corner edge is placed at the center of each divided image. On the other hand, in recognizing the large-size mounting part 15L, as shown in FIG. 18, four areas of the field of view CE1-CE4 are taken by four cameras to take a quadrant image of four corners of the part 15S. Two areas of view CE1 and CE2 as provided or as shown in FIG. 19 are provided by two cameras to take a two-divided image at two corners of part 15L.

In this example, the cameras 12 and 12a are continuously movable, and images of each corner of the mounting parts varying from the minimum to the maximum in size as well as the correspondence of land or circuit patterns on the board can be flexibly taken.

For an arrangement capable of completing this function, a mechanism as shown in FIGS. 20 and 21 may be applicable.

In the mechanism as shown in FIG. 20, the base 25 of the conveying device is mounted with an XY table, and the part-carrying head 11 is used in the vertical direction of the arrow Z and in the rotational direction of the arrow R. It is mounted in the center of the base 25 to enable.

In addition to the central head 11, 4 or 2 (only 2 in the figure) of the cameras 12 and 12a are mounted on the base 25 and mounted around the head 11.

While these cameras are positioned at a fixed height relative to the base 25, they allow some rotation to properly move the field of view.

In another mechanism as shown in FIG. 21, the camera is provided for interlocking movement with vertical and rotational movements in the direction of the arrows Z and R of the part-carrying head 11.

For the purpose of correcting the recognition of the mounting part and the mounting board using the area of the field of view of each camera used as a reference in the mechanism of FIG. 20 or 21 degrees, for example, to accurately maintain the positional relationship between each area of the field of view. It is necessary. A calibration jig as shown in FIG. 22 is used to handle the task of recognizing the camera position.

More specifically, any difference between the position DP where the movement is desired and the actual position AP can be obtained by the camera together with the calibration jig 30 used to provide the recognition position using the corners of the jig.

That is, referring to FIG. 23, the upper points X1 and Y1 of the solid line are the upper points of the image of the actual jig 30, while the upper points X0 and Y0 of the crush line are initial recognition positions.

Here, the difference between these upper points DX = X1-X0 and DY = Y1-Y0 is added for recognition correction, and the positional relationship between the cameras can be corrected.

When this camera positioning action is executed during the exchange action of the part transfer head 11, any influence of the driving cycle of the mechanism may be prevented.

Referring to the following processing for the mounting component such as the electrical component, the component transfer head 11 is lowered to the mounting component 15 up to the level b where the component 15 is located, as shown in FIG. 15 is pulled up by the head 11 to the recognition level a, and the rib 23 of the component 15 is recognized as shown in Figs. 25A and 25B.

Upon completion of this recognition operation, the head 11, together with the retained part 15, is raised to a level c where the head and the part are out of view of the respective cameras 12 and 12a, and the retained part 15 is held. The head 11 is moved to the mounting position as shown in Figs. 26a and 26b, and the board pattern at this position is recognized by the cameras 12 and 12a, and the optimum operation processing is performed for the parts and the board pattern. This is done by comparing the recognition, and the alignment of the board pattern and the mounting part 15 is performed.

In performing the task of recognizing the mounting component 15 and the board 14, simply arranging the cameras for each corner edge of the mounting component as shown in FIG. Even when four areas of the field of view CE of the camera are combined, one part 23I of the lid 23 of the mounting part 15 may cause a risk that it will not fall within the area of the camera field of view, that is, it will not be detected.

Thus, as shown by the arrows in FIG. 27, each of the cameras rotates around their axis to align each corner of the mounting part 15 with the outer corner of the field of view CE area of the cameras 12 and 12a. Any blind spots can also be removed from the composite image of the four regions of view as shown in FIG.

Since the recognition of both the mounting part 15 and the board 14 can be performed with a commercial camera, the recognition of the lead can be performed without going through the recognition point for the individual cameras, unlike a system in which the cameras are provided separately. Therefore, the required countermeasure time can be shortened, and the camera arrangement taking the diagonally aligned images of the mounting parts in the diagonal direction allows the holding state of the leads of the mounting parts to be detected with high accuracy.

Generally in the conventional stages of component mounting, the printing of cream-type solders uses cream-type solder presses on lands on printed circuit boards for solder-adhesion and temporary mounting of components on land. , The mounting accuracy and the reliability of the board on which the component is mounted are greatly influenced by the finish quality of the printed cream type solder.

In particular, defects in printed cream-type solders in the adhesion and retention of mounting components such as QFPs, which require very narrow pitches of leads, are difficult to correct even in the post-installation stage.

Thus, a component mounting operation is used which includes a step for inspecting the condition of the printed cream type solder as shown in the flowchart of FIG.

The movement of the component transfer head to the component supply position and the picking up of one of the components are performed in step 201, and the picked-up component is recognized in step 202, as well as photographing the surface state of the mounting substrate. Movement to the mounting substrate or position on the board is performed in step 203, so that inspection of the state of the printed cream-type solder on the substrate is then performed in step 204.

In the next step 205 the detection of a "good" condition as a result of the inspection leads the step to step 206 to perform the recognition of the mounting position (mounting lands or lands) on the mounting substrate, and then the mounting parts and mountings. Operation for repositioning between lands is performed in step 208, and thus mounting of the component is then performed in step 209. When no good condition is detected in step 205, the action proceeds to step 207 where the substrate is ejected.

The above-described steps can be executed, for example, by means of recognition provided in the part-carrying head. The quality of the printed cream-type solder can be checked at all mounting points on the mounting substrate prior to mounting or only at limited mounting points for any selected component.

The image of the surface state of the substrate seen from the recognition means shows the surface of the substrate 14 in dark tones, as shown in FIG. 30, whereas the pre-soldered surface of the mounting land 17 appears in light tones and printed. The surface of the cream-type solder thus obtained is given as the midtone of the tone of the substrate 14 and the mounting land 17, and the brightness can be obtained from the phase information in consideration of these characteristics.

Further, while the printing of the cream type solder is being carried out on the mounting land 17, since the determination of the mounting land is carried out from the position of the mounting land, extraction of the mounting land is impossible when the mounting land is positioned below the cream type solder, Printing of the cream-type solder is preferably performed inward from the end surface of the mounting land 17, whereby at least three of the three edges of the rod 17 can be printed even if the cream-type solder has a positional deviation, Since the mounting land is generally quadrilateral, the position of the mounting land can be accurately determined from the three edges already recognized.

In practice, as shown in FIGS. 31A and 31B, the mounting position for each part is imagined as a quadrangle, which can be determined from three extracted corner points a, b and c of one of the lands 17, The center of the rectangle is obtained as the center position of the mounting lands, another center position of another mounting land is similarly obtained, and the two center positions are compared with each other to determine the mounting positions in consideration of the relative positions of the two lands being compared. . As mentioned, the brightness of the cream-type solder is such that information about the cream-type solder is extracted from the phase information, the area and center position of the printed cream-type solder is obtained, and the mounting land is checked to check the positional deviation of the printed solder. Compared to the center position, as shown in FIG. 31A, which exceeds a predetermined area ratio to the land, the printed clean solder is determined to be defective when the land is excessively covered.

It will be appreciated from this that the quality of the printed cream type solder can be determined with high precision.

In practice, as shown in Figs. 31A and 31B, a quadrangle that can be determined by three properly selected three edge points a, b and c of quadrilaterals is imagined, and the center of this imaginary quadrangle is obtained. This center shall be the center position of the mounting land. Similarly, the central position of a number of opposing mounting lands is obtained, and the mounting position of the part can be determined from the position relative to the mounting land.

Next, the printed cream-type solder is extracted from the phase information based on the brightness characteristics of the cream-type solder, the surface area and the center position of the cream-type solder thus extracted are obtained, and the area ratio temporarily set for the land is exceeded. To the extent the land is overly covered with cream-type solder, any misalignment in the printed cream-type solder is checked against the center position of the mounting land to determine that the printed cream-type solder is defective.

It will be appreciated that the good or bad condition of the cream type solder printed in this way can be determined with high precision.

In particular, each step for determining the state of the printed cream type solder based on the mounting land and the position and area of the printed cream type solder is made according to the flow chart as in FIG.

That is, in step 301, imaging on the printed circuit board (PCB) or the substrate is performed, and in step 302 only information on the mounting land is extracted from the captured image to determine the position of the mounting land.

Next, in step 303, only information about the printed cream type solder is extracted, the center position of the cream type solder is set, and the printed area of the solder is obtained. In step 304, it is determined whether the deviation between the mounting land position and the printed cream type solder position is smaller than the allowable amount of deviation. If the result is "yes", the cream type solder area printed in the next step 306 is allowed. It is further determined whether it is smaller than the area value. In this case, if the discrepancy between the mounting land position and the printed cream-type solder position is larger than the allowable amount of misalignment as a result of the discrimination in step 304, the printed cream-type solder is determined to be accompanied by the misalignment, while the allowable The determination of the printed solder area smaller than the area value to be determined determines that the printed cream-type solder is in good condition, but the determination of the printed cream-type solder larger than the acceptable area value will be determined to be in bad condition.

Referring to FIG. 33, another embodiment of a component mounting apparatus according to the present invention is shown, wherein the component transfer head 41 and the cameras 42 and 42a are provided to be movable in the X and Y directions and the head 41 ) Can be moved in the vertical Z direction, and the PCB or substrate 44 is placed on a substrate carrier 44a which can be moved in the horizontal X and Y directions.

In the apparatus shown in FIG. 33, all other arrangements are similar to those of the device shown in FIG. 1, and the components of the device of FIG. 33, such as those in the apparatus of FIG. It is indicated by the absent part number.

From now on, the component mounting operation of the apparatus of FIG. 33 with respect to the substrate 44 will be described according to the flowchart of FIG. 39 in conjunction with FIGS. 34 to 38. FIG.

In step 401 shown in FIG. 39, first of all, the driver of the apparatus has a component supply position of data or mounting component 45 for mounting the component on the substrate 44 on the mounting apparatus side having the component transfer head 41. The data of the mounting parts such as the type, shape, angle, etc., are input as well.

At this time, the substrate 44 provided with the land 47 as shown in FIG. 34 is placed on the substrate carrier 44a so that the corners of the substrate indicate the reference position (0,0) for determining the positional relationship. In the next step 402, the component transfer head 41 is appropriately moved in the X and Y directions toward the designated position of the component feeder 46. As shown in FIG.

In step 403, the head 41 is lowered and the mounting part 45 at the designated place is sucked up and picked up. In step 404, the head 41 carrying the mounting component 45 is raised so that the bottom surface coincides with the level of the component recognition point PP, which level corresponds to the plane on which the images of the cameras 42 and 42a form. do.

That is, as shown in FIG. 35, the mounting part 45 picked up from the supply base 46 to the head 41 by the suction means coupled with the head 41 has a lower surface of the mounting part 45 as the camera ( Raised to a height equal to the focal planes of 42 and 42a and the aspired state of the component 45 is taken by the camera as the pickup component image PCI as shown in FIG.

In a next step 405, attitude recognition with respect to the mounting part 45 on the head 41 is performed and a misalignment between the center point of the head 41 and the mounting part 45 is obtained, and then in step 406. The head 41 carrying the mounting part 45 is further raised to the level of the height H at which the part transfer head 41 carrying the part 45 moves toward the substrate 44.

Then, in step 407, the head 41 with the mounting part 45 is moved to the designated position BP on the substrate 44, that is, the mounting data position by the driver's input.

At the same time, in step 408, the displacement amount between the head 41 and the mounting part 45, or the distance in the X and Y directions, as shown in FIGS. 37 and 38, i.e., the center of the part transfer head 41 ( Data of the difference in the X and Y directions between C1) and the center C2 of the mounting part 45 being conveyed by the head is sent to the substrate carrier 44a as the movement amount of the carrier 44a and the substrate 44. Is appropriately moved in the X and Y directions by the difference data. At this time, the misalignment member, that is, the coincidence with the center C2 of the mounting part 45 of the center C1 of the head 41 does not require position correction on the substrate 44 side.

Next, in step 409, the head 41 carrying the mounting component 45 is axially rotated by a degree corresponding to the shift in the rotational R direction of the head upon the movement toward the component mounting position. Thereafter, in step 401, the movement of the head 41 carrying the part 45 is completed, the head 41 is lowered, and the part 45 is mounted.

In this way, the required correction for misalignment of the mounting part 45 can be carried out upon the movement of the part transfer head 41, so that the lowering operation of the head 41 and the mounting part 45 is performed by the part 45. It can be started immediately after the movement of the head is completed to the mounting position of the mounting position, that is, the designated position BP with respect to the mounting part 45 as shown in FIG.

As a result, there is no time loss compared to any existing device.

Next, referring to FIG. 40, there is shown another embodiment of the component mounting apparatus according to the present invention, in which the component mounting operation of the mounting component 85 having the lead 85a that requires very high mounting precision is performed. An apparatus for doing this is provided. In this case, the recognition of the mounting part 85 at the part recognition point PP is realized by making image condensation of the cameras 82 and 82a take place at the bent portion of each lead 85a of the mounting part 85.

The other arrangements in the arrangement shown in FIG. 40 are the same as in the arrangement of the embodiment in FIG. 1, and the same elements as those in the arrangement in FIG. 1 are shown in FIG. 40 by the member number in FIG. 40 plus 70.

In this embodiment, the positional relationship between the reference position of the substrate 84 and the mounting position with respect to the mounting part 85 is such that the substrate 84 provided with the mounting land 87 as shown in FIG. ) And the reference position (0, 0) by one of the edges of the substrate 84 is determined.

Here, the position shift between the component transfer head 81 and the mounting component 85 is the centers C1 and C2 of the component transfer head 81 and the mounting component 85 as shown in FIGS. 42 and 43. Is obtained by calculating the degree of deviation in the X and Y directions between

In this embodiment, the cameras 82 and 82a also take an image of the land 87 on the substrate 84 to which the mounting component 85 having the lid 85a is mounted, as shown in FIG.

Here, reference numerals 87A, 87B and 87C denote mounting lands to which the leads 85a of the respective mounting parts 85 are to be mounted and connected.

Similar to the embodiment of FIG. 33 and in addition to the detection of misalignment between the component transfer head 81 and the mounting component 85, the center C1 ′ of the head 81 and the land 87 on the substrate 84. The shift amount BLC 'between the centers C2' of is also detected, and each shift amount is effectively corrected. In this case, the lands 87 on the substrate 84 are shown in a rectangular shape only for convenience of illustration and description, but the lands are not limited to the number and the number of leads 85a of the mounting component 85 as shown in FIG. It will be appreciated that it is provided as an array of land portions that are consistently smaller.

The component mounting operation on the substrate 84 is now described with reference to the flowchart of FIG. 46, wherein steps 501 to 504 are the same as the steps 401 to 404 previously described.

In step 505, the attitude recognition of the mounting component 85 is received at the component recognition point PP shown in FIG. 40, and the position between the component transfer head 81 and the mounting component 85 carried by the head. A shift amount is obtained.

In a next step 508, as previously mentioned in part, the land 87 on the substrate 84 is recognized at the substrate recognition point as shown in FIGS. 44 and 45, and the part transfer head 81 and A shift amount BLC 'between both centers of the lands 87 is obtained.

Next, in step 509, the amount of deviation between the substrate 84 and the mounting component 85 is calculated, and the amount of displacement is used as the movement amount with respect to the substrate 84.

In step 510, the head 81 is rotated by a degree corresponding to the amount of deviation in the R direction and the substrate 84 is also moved with respect to the amount of deviation in the X and Y directions.

Thereafter, in step 511, the head 81 is lowered and mounting of the component 85 is performed.

As is apparent from the above description, according to the embodiment shown in FIGS. 40 to 46, the movement is shared by the part transfer head 81 and the substrate 84, and the movement requiring higher precision is performed on the substrate side. Movements that are carried out and do not require higher precision are performed on the part transfer head side, so that the required calibration movements can be performed with relatively short strokes at high precision.

According to the remarkable feature of the component mounting apparatus of the present invention, it may also be possible to mount the component on the PCB and the substrate with a minimum distance between the substrate and the component supply supply base, and the mounting can be performed smoothly at high speed.

Referring to the flow chart of FIG. 47 in conjunction with the continuous diagrams of FIG. 48 and describing the component mounting operation on the substrate, the component transfer head is the first mounting component of the supply base 86A as shown in FIG. 84A in step 601. To the parts supply position

In step 602, the X-direction data of the mounting point data on the substrate 84 side is matched with the X-direction data of the supply position for the first mounting part, and the Y-direction data of the mounting point data is specified near the supply base 86A. To be common data, the center of the supply base 86A is located with respect to the center of each of the lands 87A, 87B and 87C on the substrate 84A.

In step 604, the movement of the substrate 84A is performed according to the X and Y direction data, and the operation proceeds to the next step 606.

On the other hand, in step 603, the component transfer head is lowered to allow the first mounting component to be sucked up and picked up from the feeder 86A.

In a next step 605, the head with the first mounting component thus conveyed is moved in the Y direction by a fixed amount. Then, in step 606, the head carrying the first mounting component is lowered again, and the first mounting component is mounted to the land 87A on the substrate 84A. The operation in step 606 is similarly performed after completion of step 604 above. Next, in step 607, the empty head without mounting parts is moved to the next supply position of the second of the mounting parts as shown in FIG. 48 (b). In the next step 608, the X-direction data of the mounting point data on the side of the substrate is made consistent with the X-direction data of the second mounting component, while the Y-direction data of the mounting point data is made of specific common data close to the feeder 86A. .

In step 610, the substrate 84A is moved according to the X and Y direction data, and the operation proceeds to the final step 612.

On the other hand, when step 607 is completed, the empty head is lowered in step 609 so that the second mounting part is sucked up and raised from the supply stand 86A, and the head carrying the second mounting part in the next step 611. Is moved in the Y direction by a fixed range.

Then, in the final step 612, the head is lowered to mount the second mounting component on another land 87B on the substrate 84A.

This step 612 is also executed after the previous step 610.

In a manner similar to the above, as shown in FIG. 48C, the mounting operation is repeated to mount the third mounting component on another land 87C on the substrate 84A.

It will be readily appreciated that the apparatus described with reference to FIGS. 47 and 48 is applicable to any of the above embodiments.

Claims (12)

Movable base; A component transfer head mounted on the movable base and picking up the mounting component from the mounting component supply means and transferring the mounting component to a predetermined mounting position on a substrate having a mounting land on which the mounting component is to be mounted; Recognition means mounted on the movable base and recognizing the mounting land and the mounting part located in the focal plane with the component transfer head as a standard reference position for recognition in the focal plane; And means for determining a positional relationship between the mounting part and the mounting land and aligning the position of the mounting part with respect to the mounting land. The component mounting apparatus according to claim 1, further comprising means for comparing a state in which the mounting component is picked up with a state in which the mounting component is mounted, and means for determining proper positional alignment of the mounted state. . 3. The component mounting apparatus according to claim 2, wherein said means for discriminating proper positioning of the mounting state of said mounting component is included in said recognition means. The component mounting apparatus according to claim 1, wherein the recognition means includes a plurality of cameras focusing on a focal plane including a surface of the substrate on which the mounting component is mounted. The component mounting apparatus according to claim 1, wherein the recognition means includes two or more cameras mounted on the substrate symmetrically with respect to the component transfer head. 6. The component as claimed in claim 5, wherein the recognition means further comprises a jig, wherein an image of the jig is photographed by the two cameras in which the mutual positional relationship of the cameras is positioned to effect the mounting of the mounting component. Mounting device. 3. The component mounting apparatus according to claim 2, further comprising means for inspecting a state in which a cream-type solder is printed on the land prior to the alignment of the mounting component with respect to the corresponding mounting land. 8. A component mounting apparatus according to claim 7, wherein said inspection means and said means having said proper position matching of said mounting state are included in said recognition means. 8. The component mounting apparatus according to claim 7, wherein the inspection means is arranged to determine proper positioning of the cream type solder based on the position and area relationship between the cream type solder and the land. 2. The apparatus of claim 1, further comprising: means for moving the substrate such that a substrate is moved during the transfer of the component transfer head using a deviation between the component transfer head and the mounting component to determine one movement amount; And a means for correcting the positional relationship between the land and the component transfer head. 11. The mounting land and the component transfer head according to claim 10, wherein the recognition means moves the substrate by a movement amount such as a deviation between the component transfer head and the mounting land and a difference between the component transfer head and the deviation of the mounting component. Component mounting apparatus, characterized in that to obtain a deviation between. 12. The method of claim 11, wherein the transfer distance of the component transfer head from the position at which the mounting component is picked up from the mounting component supplying means to the position at which the mounting component is mounted on the substrate is taken into account in consideration of the movement of the substrate. Component mounting apparatus further comprises a means.