JP2907246B2 - Component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus capable of accurately positioning a component at a predetermined position on a printed board and mounting the component at high speed.

[0002]

2. Description of the Related Art As a device for taking out a component from a feeder as a component supply device, transferring the component to a predetermined position on a printed circuit board, and automatically mounting the component, for example, Japanese Patent Application Laid-Open No. 60-1900, The technique described in Japanese Unexamined Patent Publication No. Sho 60-132399 is known. According to these prior arts, the position shift between the component transfer head and the component is calculated by the recognition means, and after the component transfer head is moved to a position programmed in advance, the component transfer head is shifted by the calculated position. It was moved (corrected) by an amount and the components were mounted on the board. Further, as another conventional example, there is one in which a feeder and a substrate are fixedly arranged in a fixed positional relationship and components are automatically mounted.

[0003]

However, in the prior art, since a series of operations or a part of the mounting is performed only by moving the component transfer head or the substrate, it is difficult to guarantee high accuracy over a long moving distance. Met. Also, as shown in FIG. 13, for example, the component transfer head 1a is
Since the distance L between b and the tip of the suction tool 1c is large, it is amplified when play occurs in the head support portion 1b, and further, there is a problem that the tip of the suction tool 1c cannot be corrected with high accuracy. Furthermore, in the conventional example, FIG.
As shown in (a) to (c), while the component 3 is being sucked and moved from the feeder 4, the component 3 is recognized by the recognition camera 2, and the component transfer head 1 a is moved to the programmed position and the head 1 a is moved. In this case, the correction was performed, and the circuit was mounted on the substrate 5, so that a time loss occurred.

In another conventional example, as shown in FIG. 15, since the positional relationship between the feeder 4 and the substrate 5 is fixed, the head moving distance becomes longer depending on the contents of the program, and the efficiency is low. There was a problem that the head was moved.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a component mounting apparatus capable of mounting components accurately and at high speed by moving a substrate. Is to provide.

[0006]

According to a first aspect of the present invention, a component is removed from a component supply device and transferred to a predetermined component mounting position on a positioned substrate. A component transfer head is provided with a recognizing means, and a means for moving the substrate is provided. The focus surface of the recognizing means is set to be flush with the land surface of the substrate, and the component transfer image picked up by the recognizing means is provided. The substrate is moved during the movement of the component transfer head using the displacement between the mounting head and the component as a movement amount, and the positional relationship between the component and the land pattern on the substrate based on the displacement is corrected. Further, as a second configuration, a component transfer head that takes out a component from the component supply device and transfers the component to a predetermined component mounting position on the substrate includes a recognition unit, and includes a unit that moves the substrate. The focus surface of the recognizing means is set to be flush with the land surface of the substrate, and the deviation of the component transfer head and the component imaged by the recognizing device and the deviation of the component transfer head and the land pattern on the substrate are determined. The method is characterized in that both are obtained, the substrate is moved by using a difference between the two deviations as a movement amount, and a positional relationship between the component and the land pattern on the substrate based on the two deviations is corrected. Further, as a third configuration, in the first or second configuration, the distance between the component take-out position and the component mounting position of the component supply device, that is, the moving distance of the component transfer head is minimized by moving the substrate. It is characterized by the following.

[0007]

According to the first configuration, a component transfer head for transferring a component from a component supply device to a predetermined component mounting position on a substrate, and an image recognizing means are provided. The deviation can be calculated as the movement amount,
In addition, since the device includes means for moving the substrate, it is possible to correct the positional relationship between the component transfer head and the land pattern of the substrate with high accuracy while the component transfer head is moving.

Further, according to the second configuration, a deviation amount between the component transfer head and the component is obtained at the component recognition point,
After the component transfer head has moved to the board recognition point, the amount of displacement between the component transfer head and the land pattern is determined, and the board is moved using the difference between the two displacements as the amount of movement to move the component transfer head and the board. Since the positional relationship with the land pattern is corrected, it is particularly suitable for mounting components requiring precision, and the pursuit of precision by moving the component transfer head is reduced. As a result, high-precision positioning is applied only to correction with a short stroke, and high-precision is not required for a component transfer head with a long stroke.

Further, by moving the substrate to the position of the component to be taken out of the component supply device by the third configuration, the moving distance of the component transfer head can be minimized, and higher-speed component mounting can be performed. Become.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings.

[Embodiment 1] FIG. 1 shows the structure of a main part of a device according to the present invention. In this embodiment, a component 3 to be mounted has no lead. The component mounting apparatus includes a component transfer head 1a.
And two or four around the component transfer head 1a
A component transfer head unit 1 having one recognition camera 2, a substrate moving unit 6, and the like are provided, and operate according to a predetermined program to mount the component 3 at a predetermined position on the substrate 5.

As shown in the figure, the component transfer head 1a is capable of horizontal movement in the X and Y directions, vertical movement in the Z direction, and rotation in the R direction. It serves to transfer the component 3 to a predetermined position on the substrate 5. The recognition camera 2 has a field of view in the movable direction of the component transfer head 1a from an oblique direction. Furthermore,
The substrate moving unit 6 has an XY table that can move horizontally,
It serves to correct the deviation between the component transfer head 1a and the component 3 captured by the recognition camera 2 of the component transfer head unit 1 on the substrate 5 while the component transfer head 1a is moving.

Next, referring to FIGS. 1 to 4, FIG.
The operation of mounting components on a substrate will be described with reference to the flowchart of FIG. First, in step 90, mounting data for the board 5 and data such as the type, shape, and angle of the mounting component 3
In addition, supply position data of the mounted components 3 and the like are input in advance to the mounting machine main body including the component transfer head unit 1 by an operator. Also, as shown in FIG.
Is set on the board moving unit 6 of the mounting machine main body as shown in FIG.
0), the positional relationship is determined.

Subsequently, in step 100, the component transfer head 1a moves to the designated position of the feeder 4 (X, Y, R axes), and in step 102, the component transfer head 1a descends to remove the component 3. Adsorb. And step 1
At 04, the component transfer head 1a moves up to the component recognition point P corresponding to the focus surface of the camera 2 while the component 3 is being sucked (FIG. 1). That is, as shown in FIG. 3A, after the component 3 is taken out of the feeder 4 by the suction means, the lower surface thereof is lifted up to the same height as the focus surface of the camera 2, and the suction state is shown in FIG. Is imaged as a component image 3 ′.

In step 106, the posture of the component 3 is recognized, and the deviation between the component transfer head 1a and the component 3 is obtained. In step 108, the component transfer head 1
a rises to a height H at which the a moves to the substrate 5 side. Further, in step 110, the component transfer head 1a moves to a specified position Q (mounting data position input by an operator) on the substrate 5 (FIG. 1). At the same time, step 10
In FIG. 9, as shown in FIGS. 4A and 4B, the shift amount S between the component 3 and the component transfer head 1 a on the X and Y axes, that is, the head center a of the component transfer head 1 a and the component 3 The data of the difference between the center a ′ in the X and Y directions is sent to the substrate moving unit 6 as a movement amount, and the substrate 5 moves in the XY direction based on the data. If the head center a of the component transfer head 1a is the same as the component center a 'of the component 3, it is needless to say that the substrate 5 does not need to be corrected.

Subsequently, in step 112, during the movement of the component transfer head 1a, rotation is performed by an amount corresponding to the R axis shift amount.
In step 114, the movement of the component transfer head 1a is completed, the component transfer head 1a is lowered, and the component 3 is mounted. As a result, it is possible to correct the displacement of the components during the movement of the head, and it is possible to start the descending operation immediately after the movement of the component transfer head to the component mounting position (the predetermined position Q in FIG. 1). There is no time loss compared to the system.

[0016]

Embodiment 2 FIG. 6 shows a second embodiment of the present invention, in which members corresponding to those in FIG. 1 described above have the same reference numerals. In this embodiment, a component requiring accuracy, that is, a component having a lead as a mounted component is targeted. The recognition of the component 3 at the component recognition point P is performed by focusing on the bent lower surface of the lead 3a of the component 3.

The relationship between the reference position of the substrate 5 and the mounting position of the component 3 is as shown in FIG. 7, in which the substrate 5 provided with the land pattern 7 'is set on the substrate moving section 6 of the mounting machine body. The positional relationship is determined with one corner as a reference position (0, 0). Note that the positional displacement between the component transfer head 1a and the component 3 is as shown in FIGS. 8A and 8B.
The shift amount S of the X-axis and the Y-axis between the head center a of part a and the part center a ′ of the part 3 is calculated. Further, in this embodiment, as shown in FIG.
By means of -2, the land pattern 7 'of the substrate 5 on which the component 3 having the lead 3a is mounted is also imaged. In the drawings, A, B, and C indicate mounting lands to which the leads 3a of the respective components 3 are mounted and connected. Then, in addition to detecting the positional shift S between the component transfer head 1a of the first embodiment and the component 3, the head center a of the component transfer head 1a and the land of the substrate 5 as shown in FIG. Pattern 7 '
Of the land center a "is also detected, and these deviations are also corrected.
In FIGS. 9A and 9B, the land pattern 7 'of the mounting land of the board 5 is simply shown in a simple rectangular shape as shown in FIG. Has the lead 3a, and accordingly, the land pattern 7 'is originally as shown in FIG.

Next, referring to FIGS. 6 to 9, FIG.
The component mounting operation on the board will be described with reference to the flowchart of FIG. Steps 90 to 104 are the same as those in the flowchart of FIG. 5, but in step 106, the posture of the component is recognized (the component recognition point P in FIG. 6), and the deviation amount between the component transfer head 1 a and the component 3 is calculated. And the component transfer head 1a is raised to a predetermined height H (step 10).
8) Move to substrate recognition point Q (step 11)
0), by recognizing the land pattern 7 'of the board 5 at the board recognition point Q as shown in FIGS. 9A and 9B, the head center a of the component transfer head 1a and the land pattern 7' The difference is that a deviation amount S 'from the land center a "is obtained (step 112).

Further, in step 114, the difference between the displacement amount of the component 3 and the board 5 is calculated, and this difference is used as the amount of movement on the board 5 side.
a, the substrate 5 is rotated by the amount of the R axis shift, and the X, Y
The component is moved by the amount of axis deviation, and finally, in step 118, the component transfer head 1a is lowered to mount the component 3.

As described above, in this embodiment, the movement of the component transfer head and the board is shared, and the movement requiring high precision is performed on the board side, and the part that does not require much precision is performed on the component transfer head side. Let Thereby, high accuracy can be realized only for a short stroke movement (correction operation), and the structure is simplified and the cost is reduced.

[0021]

Embodiment 3 FIGS. 11 and 12 show a third embodiment of the present invention. This example is characterized in that the component 3 can be mounted on the substrate 5 while minimizing the distance between the substrate 5 and the feeder 4, and the mounting can be completed at a higher speed. This embodiment can be applied in combination with any of the first and second embodiments. Hereinafter, a specific operation from the removal of the component to the completion of the mounting on the board will be described with reference to the flowchart of FIG. Step 200
In FIG. 12, the component transfer head 1a moves to the component supply position as shown in FIG. At this time, step 2
02, the X data of the mounting point data on the board 5 side is the same as the X data of the component supply position,
The data is unique common data close to the feeder 4. As a result, the center of the feeder 4 is aligned with each land A,
It is possible to mount them in accordance with the centers of B and C. Then, in step 206, the substrate is moved based on the X and Y data, and the process proceeds to step 210.

On the other hand, in step 204, the component transfer head 1a descends to pick up a component from the feeder 4, and in step 208, moves the component transfer head 1a in the Y direction by a fixed amount. Then, in step 210, the component transfer head 1a is lowered to mount the component on the point A of the board.

Next, at step 212, FIG.
As shown in (b), the component transfer head 1a moves to the component supply position. At this time, in step 214, the X data of the mounting point data on the board side is the same as the X data of the component supply position, and the Y data is the feeder 4
And common data close to. And step 21
In step 8, the substrate is moved based on the X and Y data,
Proceed to 22.

On the other hand, in step 216, the component transfer head 1a descends to pick up components from the feeder 4, and in step 220, moves the component transfer head 1a in the Y direction by a fixed amount. Then, in step 222, the component transfer head 1a descends, and the component is mounted at the point B on the board. Hereinafter, similarly,
As shown in FIG. 12C, the components are mounted at the point C on the board. In this way, the component take-out position of the feeder 4 and the board mounting position can be minimized.

[0025]

According to the present invention, with the component transfer head for transferring from the component supply device to a predetermined component mounting position on a substrate positioned Remove the device comprises recognition means for moving the substrate comprising means to set the focal plane of said recognition means coplanar and the land surface of the substrate,
Said moving the substrate during component transfer head moves component transfer head and deviation of the part taken by the recognition means as the movement amount, and the component based on the deviation of the positional relationship between the land pattern on the substrate By performing the correction, component mounting can be performed at high speed and with high accuracy.

Further, both the displacement of the component transfer head and the component, and the displacement of the component transfer head and the land pattern on the substrate, which are imaged by the recognition means are obtained, and the difference between the two displacements is determined as the amount of movement. By moving the substrate and correcting the positional relationship between the component and the land pattern on the substrate based on both of the deviations, it is particularly suitable for mounting components that require precision, and corrects the deviation between the component and the substrate. Since the operation is performed only on the substrate side, mounting with higher precision is possible as compared with the case where correction is performed by the component transfer head.

Further, by moving the substrate, the distance between the component take-out position and the component mounting position of the component supply device, that is, the moving distance of the component transfer head, is minimized, so that higher-speed component mounting can be performed. Can be.

[Brief description of the drawings]

FIG. 1 is a diagram showing an embodiment from the removal of components to the mounting operation on a substrate.

FIG. 2 is a diagram illustrating a relationship between a reference position of a board and a mounting position of a component.

FIG. 3A is a diagram showing a state at the time of component recognition;
(B) is a figure which shows the composite image of a component.

FIGS. 4A and 4B are diagrams showing positional deviation between a head center of a component transfer head and a component center of a component.

FIG. 5 is a diagram showing a flowchart from the removal of components to the completion of mounting on a board by a mounting process corresponding to high speed.

FIG. 6 is a diagram showing another embodiment from the removal of components to the mounting operation on a board.

FIG. 7 is a diagram showing a relationship between a reference position of a substrate and a mounting position of a component with leads.

FIGS. 8A and 8B are diagrams showing a positional relationship between a head center of a component transfer head and a component center of a component.

9A is a diagram showing a board recognition state, and FIG.
FIG. 5 is a diagram showing a positional relationship between a head center of a component transfer head and a land center of a land pattern.

FIG. 10 is a diagram showing a flowchart from the removal of components to the completion of mounting on a board by a mounting process corresponding to high precision.

FIG. 11 is a diagram showing a flowchart of an implementation process for shortening the mounting time.

FIG. 12 is a diagram illustrating a relationship between a component supply position and a board movement position.

FIG. 13 is a diagram illustrating a positional relationship between a head support unit and a suction tool in a conventional component mounting apparatus.

14 (a) to 14 (c) are views showing steps from removal of a component to completion of mounting on a substrate according to a conventional example.

FIG. 15 is a diagram showing a relationship between a component supply position and a board moving position according to a conventional example.

[Description of Signs] 1... Component transfer head unit 1 a... Component transfer head 2-1, 2-2,..., Camera 3 ... component 3 a, lead 4, feeder 5. · Board 6 ··· Board moving section 7, 7 '· · Land pattern P · · · Component recognition point Q · · · Predetermined position Q' · · · Board recognition point a · · · Head center a '· · · Component center a Land center S: The amount of deviation between the head center and the parts center S ': The amount of deviation between the head center and the land center

Continuation of front page (56) References JP-A-2-82700 (JP, A) JP-A-3-30499 (JP, A) JP-A-63-168098 (JP, A) JP-A-2-244800 (JP) JP-A-57-96740 (JP, A) JP-A-62-42597 (JP, A) JP-A-3-6900 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB Name) H05K 13 / 04,13 / 08 B23P 19/00

Claims (3)

(57) [Claims] 1. A component transfer head for taking out a component from a component supply device and transferring the component to a predetermined component mounting position on a positioned substrate, further comprising: a recognition unit; and a unit that moves the substrate. The focus surface of the recognition unit is set to be flush with the land surface of the substrate, and the substrate is moved during the movement of the component transfer head using the displacement of the component transfer head and the component imaged by the recognition unit as a movement amount. A component mounting apparatus for correcting a positional relationship between the component and a land pattern on the substrate based on the displacement. 2. A component transfer head for taking out a component from a component supply device and transferring the component to a predetermined component mounting position on a substrate, comprising: a recognition unit; and a unit for moving the substrate. The focus surface is set to the same plane as the land surface of the substrate, and both the displacement of the component transfer head and the component imaged by the recognition means and the displacement of the component transfer head and the land pattern on the substrate are obtained. A component mounting apparatus that moves the substrate by using a difference between the two deviations as a movement amount, and corrects a positional relationship between the component and a land pattern on the substrate based on the two deviations. 3. The component mounting apparatus according to claim 1, wherein the distance between the component pick-up position and the component mounting position of the component supply device, that is, the moving distance of the component transfer head is minimized by moving the substrate. A component mounting apparatus characterized in that: