JP6837292B2 - Anti-board work machine - Google Patents

Description

The present invention relates to a board-to-board working machine that performs work on a board such as a component mounting machine that mounts electronic components on a board.

In a board-to-board work machine such as a component mounting machine, a board is fixed by a board fixing device, and electronic components are mounted, an adhesive is applied, and inspection is performed on the fixed board. These board-to-board operations are performed based on the position of the board fixed by the board fixing device (hereinafter, may be referred to as "fixed position"), and the fixed position is the board in many board-to-board work machines. The reference mark provided in the above is imaged by an imaging device, and the reference mark is acquired based on the imaging result. That is, the work on the board is performed based on the recognized reference mark. On the other hand, as described in the patent application below, for some substrates, in addition to the overall reference mark that serves as the position reference for the entire substrate, a part of the substrate is used because it is necessary to improve the accuracy of the work on the substrate. A partial area reference mark that serves as a reference for a board area (hereinafter, may be referred to as a "partial area") is provided, and work on the board in that partial area is performed with reference to the partial area reference mark. ing.

Japanese Unexamined Patent Publication No. 2003-101300

Various objects such as printed wiring lands are provided or displayed on the surface of the board, and when the reference mark is recognized by imaging, it is confirmed that the imaging target is the reference mark, that is, it is recognized. Processing is performed to confirm that the reference mark to be recognized has been recognized. It is desired that the confirmation process be performed accurately. In particular, in a substrate in which an overall reference mark and a partial area reference mark are provided side by side, in addition to the large number of reference marks, the number of reference marks is large, and the number of reference marks is large. Satisfying the above requirements for reasons such as high precision required for work leads to improvement in practicality of the substrate working machine. The present invention has been made in view of such circumstances, and an object of the present invention is to provide a highly practical anti-board working machine.

In order to solve the above problems, the anti-board working machine of the present invention is used.
A board fixing device that fixes the board,
A board-to-board work device that works on a board fixed to the board fixing device,
An image pickup device that images the surface of the substrate fixed to the board fixing device,
When the amount of positional deviation of the imaging target imaged by the imaging device is within the set tolerance range, the imaging target is recognized as the reference mark, and the work based on the recognized reference mark is to be executed. A board-to-board work machine provided with a control device for controlling the board-to-board work device.
When the substrate fixed to the substrate fixing device is provided with an overall reference mark indicating a reference of the entire substrate and a partial region reference mark indicating a reference of a partial region as the reference mark, the portion The set tolerance for recognizing the area reference mark is made smaller than the set tolerance for recognizing the overall reference mark.

Incidentally, the above-mentioned "imaging target" in the present invention means an object specified as a reference mark in the captured image, and the "positional deviation amount of the imaging target" means that the imaging target is the reference mark. If so, it means the deviation of the position of the imaging target from the position where the reference mark should exist (“normal position”, “theoretical position”, etc. can also be called). The "work performed on the fixed substrate", that is, the "work on the board" is an inspection for inspecting the results of the component mounting work, the adhesive application work performed prior to the mounting work, and the mounting work. Various things such as work are included. Similarly, the "board-to-board work device" includes various things such as a component mounting device, an adhesive coating device, and an inspection device, and the "board-to-board work machine" is a part. Various types such as mounting machines, adhesive coating machines, inspection machines, etc. are included. Further, the "partial region" corresponds to, for example, one of the plurality of child boards in the case where one board is composed of a plurality of child boards having the same circuit pattern. Further, for example, regarding the mounting of a component that requires particularly high accuracy in the component mounting work, a reference mark may be provided in the vicinity of the component, and the component may be mounted based on the reference mark. The area in which is mounted and the area in the vicinity thereof also correspond to a partial area.

The above-mentioned anti-board working machine of the present invention is
A pair of overall reference marks in which the substrates fixed to the substrate fixing device are separated from each other as the overall reference mark are separated from each other as the partial region reference mark, and a pair of partial region reference marks are separated from each other as the partial region reference mark. If is provided,
The set tolerance for recognizing the overall reference mark includes the set tolerance for the separation distance of the pair of overall reference marks as the set tolerance of the relative positional deviation amount of the pair of overall reference marks, and the partial region reference. The set tolerance for mark recognition includes the set tolerance for the separation distance of the pair of partial area reference marks as the set tolerance of the relative positional deviation amount of the pair of partial area reference marks.
It is desirable that the set tolerance for the separation distance of the pair of partial region reference marks is smaller than the set tolerance for the separation distance of the pair of overall reference marks.

In that case, the anti-board working machine of the present invention
It is desirable that the set tolerance for the separation distance of the pair of overall reference marks and the set tolerance for the separation distance of the pair of partial region reference marks be set to a size corresponding to the separation distance.

Since most of the board fixing devices fix the board stopped by the conveyor device, the fixing position (“rotation position”) of the board fixed by the board fixing device is related to the stopping accuracy of the conveyor device. That is, it is a concept including "rotational phase" and "direction"), it is considered that the deviation is relatively large. In view of this, in order to allow a relatively large displacement of the overall reference mark, the setting tolerance for recognizing the overall reference mark is increased in the board-to-board working machine of the present invention. When the overall reference mark can be recognized, the position of the entire board is grasped by the overall reference mark, and the positions of various parts on the board, that is, the coordinates on the board (hereinafter, may be referred to as "reference coordinates"). ) Is determined, and the partial area reference mark is recognized based on the coordinates. Therefore, it is considered that the positional deviation of the partial area reference mark is relatively small. In view of this, in the board-to-board working machine of the present invention, the setting tolerance for recognizing the partial area reference mark is reduced. Further, since the partial region is a relatively narrow region, an object that may be mistaken for a partial region reference mark may be taken as an imaging target. In consideration of this, the setting tolerance for recognizing the partial area reference mark is reduced in order to avoid the misidentification. From the above, according to the substrate working machine of the present invention, the above-mentioned reference mark confirmation process, that is, the process for confirming that the reference mark to be recognized has been recognized is accurately performed. Become.

Further, in general, in the case of the overall reference mark, a pair of overall reference marks are often provided at diagonal positions of the outer edge of the substrate in order to acquire the rotation position of the substrate. , In order to acquire the rotation position of the partial region, a pair of partial region reference marks are often provided at diagonal positions of the outer edge portion of the partial region. In such a case, as the reference mark confirmation process, the deviation of the separation distance of the pair of reference marks, that is, the amount of deviation of the relative position of the pair of reference marks is a parameter for the reference mark confirmation process. It is effective as. More specifically, for example, in the case of a flexible substrate, that is, a flexible substrate, it is particularly effective to perform the reference mark confirmation process in consideration of the deflection of the substrate. In such a substrate, the amount of deviation of the separation distance between the pair of overall reference marks is relatively large, while the amount of deviation of the separation distance between the pair of partial area reference marks is relatively small in the region. Often, it can be considered relatively small. In consideration of such a situation, it is desirable that the set tolerance for the separation distance of the pair of partial region reference marks is smaller than the set tolerance for the separation distance of the pair of overall reference marks. By setting the separation distance between the pair of reference marks in this way, more accurate reference mark confirmation processing can be performed.

It is desirable that the amount of deviation of the allowable separation distance between the pair of reference marks corresponds to the separation distance. That is, it is desirable that the larger the separation distance is, the larger the distance is, and the smaller the distance is, the smaller the distance is. As described above, by setting the setting tolerance for the separation distance of the pair of reference marks to a size corresponding to the separation distance, more accurate reference mark confirmation processing can be performed.

It is a figure which shows the whole structure of the component mounting machine as one Example of the board-to-board working machine of this invention. It is a figure which shows typically the substrate which performs the component mounting work as the board-to-board work in the component mounting machine of an Example. It is a flowchart which shows the reference mark recognition process performed in the component mounting machine of an Example. It is a figure which shows typically an example of the image acquired by the camera when the reference mark was imaged.

Hereinafter, a typical embodiment of the present invention will be described in detail with reference to the drawings as an example of a component mounting machine for mounting electronic components on a circuit board. In addition to the following examples, the claimable invention can be implemented in various modes with various modifications and improvements based on the knowledge of those skilled in the art.

[A] Configuration of component mounting machine The component mounting machine of the embodiment is incorporated in the component mounting system shown in FIG. 1, and the system consists of a system base 10 and two systems arranged side by side on the system base 10. It is configured to include a component mounting machine 12. The two component mounting machines 12 have the same configuration as each other, and each of them is a component mounting machine as a board-to-board working machine of the embodiment.

The component mounting machine 12 includes a main body composed of a base 14 and a frame 16 arranged on the base 14. A conveyor device 18 is arranged at the center of the base 14 in the front-rear direction, and a plurality of component feeders 20 each functioning as a component supply device are arranged side by side in the left-right direction at the front. Further, the frame 16 supports a component mounting device 22 as a board-to-board work device. The component mounting device 22 includes a mounting head 24 having a suction nozzle that is a component holding device, and a head moving device 26 that moves the mounting head 24 back and forth, left and right, and up and down.

The conveyor device 18 is a device that conveys the substrate to the left and right in two front and rear lanes, and is erected so as to face each other in the front and rear, and each supports a conveyor belt (not shown) so as to orbit. A pair of support plates 28 and a lift 30 arranged between the pair of support plates 28 for lifting the substrate from below are provided. The substrate S is conveyed in the left-right direction by the conveyor belt, and the substrate S that has been conveyed to the set position during the component mounting work is lifted by the lifting table 30 to each of the pair of support plates 28. It is fixed in a state of being locked to the upper end of the. That is, the conveyor device 18 functions as a board fixing device for fixing the board S during the component mounting work.

The component mounting operation is performed while the head moving device 26 moves the mounting head 24 between the component feeder 20 and the substrate S fixed by the conveyor device 18. More specifically, the mounting head 24 holds the parts supplied from the part feeder 20 in the suction nozzle, and the held parts are placed on the substrate S fixed by the conveyor device 18. The control of the conveyor device 18, the component feeder 20, the component mounting device 22, and the like in the component mounting work is performed by the control device 32 in which the operation panel is integrated.

As will be described in detail later, a component camera 34 is provided between the conveyor device 18 and the component feeder 20, and the component held by the mounting head 24 is imaged by the component camera 34 with respect to the image obtained by the imaging. By the process, the amount of deviation of the holding position of the component is acquired, and the component is placed on the substrate S while considering the amount of deviation. On the other hand, a substrate camera 36 that images the surface of the substrate S is attached to the mounting head 24, and is integrally moved with the mounting head 24 by the head moving device 26. The substrate camera 36 as an image pickup apparatus captures a reference mark provided on the substrate S at the time of component mounting work, and by processing the obtained image, the amount of deviation of the position of the fixed substrate S, that is, the fixed position. The deviation amount of the above is acquired, and the component is placed on the substrate S while considering the deviation amount. The image processing and the acquisition of the deviation amount are also performed by the control device 32.

[B] The board on which the component mounting work is performed on the board and the reference mark component mounting machine 12 provided on the board is as shown in FIGS. 2 (a) and 2 (b), for example. The substrate S shown in FIG. 2 is a so-called multi-board, and is like a collection of a plurality of child substrates. In other words, the substrate S is provided with a plurality of partial regions having the same circuit pattern as each other. Specifically, the substrate S shown in FIG. 2 (a) is provided with four partial regions A in a matrix of vertical 2 × horizontal 2, and the substrate S shown in FIG. 2 (b) is vertically provided. Forty-eight partial regions A are provided in a 6 × horizontal 8 matrix.

As described above, the components are placed on the substrate S fixed by the conveyor device 18 by the component mounting device 22, but the position of the substrate S fixed by the conveyor device 18, that is, the fixed position. Will vary depending on the stopping accuracy during transportation by the conveyor device 18, the clearance in the front-rear direction, and the like. Specifically, a deviation occurs in both the front-rear direction position and the left-right direction position, and also a deviation occurs in the rotation direction position (rotation phase, direction). Since it is necessary to perform the component mounting work in consideration of the deviation, the substrate S is provided with the reference mark.

Specifically, each of the substrates S in FIGS. 2A and 2B is provided with a pair of reference marks FM1 in the upper right corner and the lower left corner of the substrate S, and each partial region A is provided with a pair of reference marks FM1. A pair of reference marks FM2 are provided in the upper left corner and the lower right corner of the partial region A. The reference mark FM1 is for grasping the entire position of the substrate S, and can be called an overall reference mark. On the other hand, the reference mark FM2 is a mark that serves as a reference for the parts placed in the partial region A, and can be called a partial region reference mark. The partial area reference mark FM2 is provided to improve the accuracy of the mounting position of the component in the partial area A.

[C] Recognition of reference mark The process for recognizing the reference mark is performed after the substrate is fixed by the conveyor device 18 and before the component is placed on the substrate. More specifically, the control device 32 executes the reference mark recognition program shown in the flowchart shown in FIG.

In the process according to the above program, first, in step 1 (hereinafter, abbreviated as “S1”; the same applies to the other steps), one of the pair of overall reference marks FM1 is imaged. Specifically, the image of the reference mark is performed by moving the substrate camera 36 above the reference mark by the head moving device 26. The moving position of the substrate camera 36 is a position where the theoretical position where the reference mark should exist (hereinafter, may be referred to as “mark normal position”) is located at the center of the field of view of the substrate camera 36. In the case of the overall reference mark FM1, that is, when it is assumed that the substrate is fixed at a regular position (theoretical position), the position where the overall reference mark FM1 should exist becomes the mark regular position, and in that case, the substrate. The image captured by the camera 36 is, for example, as shown in FIG.

Next, in S2, the overall reference mark FM1 is specified based on the data of the image captured in S1, and the overall reference mark FM1 may be referred to as the left-right direction (hereinafter, referred to as "X direction") from the mark normal position of the overall reference mark FM1. ) And the positions X and Y in the front-back direction (hereinafter, may be referred to as “Y direction”), and the positions deviation ΔX and ΔY are acquired. Incidentally, to explain the case shown in FIG. 4, the positions X and Y are positions based on the reference position set for the component mounting machine 12, and the positions deviation amounts ΔX and ΔY are It will be as shown in the figure. The reference mark is specified by finding an image pickup target having a shape and size corresponding to the reference mark from the image based on the shape and size of the reference mark registered in advance. ..

As can be seen from FIG. 4, not only the reference mark but also the wiring pattern P (which can also be called a “land”) is provided on the substrate, and objects other than the reference mark can be imaged as an imaging target. In the figure, the terminal T of the wiring pattern P is similar in shape and size to the overall reference mark FM1, and the terminal T may be erroneously recognized as the overall reference mark FM1. In consideration of this, the tolerances TΔXΔX1 and TΔY1 are set for the above position deviation amounts ΔX and ΔY, and in the subsequent S3, the position deviation amounts ΔX and ΔY are within the range of Y1 of the set tolerances TΔX1 and TΔY1. It is judged whether or not it is in. As a result of the determination, if either of the positional deviation amounts ΔX and ΔY is not within the range of the set tolerances TΔX1 and TΔY1, it is notified in S4 that the reference mark is erroneously recognized, and the component mounting machine 12 operates. Can be stopped.

When both the positional deviation amounts ΔX and ΔY of the overall reference mark FM1 are within the range of the set tolerances TΔX1 and TΔY1, the other of the pair of overall reference marks FM1 is subjected to the processing of S5, and S1 to S3. Processing is done. When it is determined that the positional deviation amounts ΔX and ΔY are within the range of the set tolerances TΔX1 and TΔY1 for both of the pair of overall reference marks FM1, the processing of S6 is performed.

In S6, the separation distance L (see FIG. 2) of the pair of overall reference marks FM1 is acquired based on the respective positions X and Y acquired in S2, and together with that separation distance L and the regular separation distance. The separation distance difference ΔL, which is the difference from the above, is acquired as the amount of deviation (relative position deviation amount) with respect to the relative position of the pair of overall reference marks FM1. A tolerance TΔL1 is also set for the separation distance difference ΔL here, and in the subsequent S7, it is determined whether or not the separation distance difference ΔL is within the range of the set tolerance TΔL1. As a result of the determination, when the separation distance difference ΔL is not within the range of the set tolerance TΔL1, it is notified in S4 that the reference mark is erroneously recognized, and the operation of the component mounting machine 12 is stopped. When it is determined that the separation distance difference ΔL is within the range of the set tolerance TΔL1, the processing of S8 is performed.

In S8, the reference coordinates with respect to the substrate are set based on the positions X and Y of the pair of overall reference marks FM1 acquired in S2. The reference coordinates are coordinates set in consideration of the deviation of the fixed position of the substrate, and the processing of S9 or less is executed based on the reference coordinates. Specifically, for example, the mark normal position of the partial area reference mark FM2 is also a position according to the reference coordinates.

The processing of S10 or less is the processing for the partial area reference mark FM2, and in S9, one area for performing the processing of S10 or less among the plurality of partial areas A is still processing of S10 or less according to the set order. Is identified from the area where is not performed. Then, the processes of S10 to S15 are performed on the specified partial region A. The processing of S10 to S15 is the same processing as the processing of S1 to S7 described above. Simply put, the position X of the partial area reference mark FM2 according to the reference coordinates of one partial area A, Y, position deviation amount ΔX, ΔY, separation distance difference ΔL are acquired, and whether or not these position deviation amounts ΔX, ΔY are within the range of the set tolerances TΔX2, TΔY2, and the separation distance difference ΔL is within the range of the set tolerance TΔL2. If it is not within the range, it is notified that the reference mark has been erroneously recognized.

In S16, it is determined whether or not the processing for all the partial regions A has been performed, and the processing of S10 to 15 is repeated for all the partial regions A. When all the reference marks are recognized well, the component mounting work for each partial area A is executed based on the positions X and Y of the acquired partial area reference marks FM2 in each partial area A. ..

In the above-described processing for recognizing the reference mark, the setting tolerances TΔX1, TΔY1, TΔX2, TΔY2 are set based on the positional deviation amount ΔX, ΔY of the reference mark and the separation distance difference ΔL which is the relative positional deviation amount. Using the tolerances TΔL1 and TLΔ2, a process for confirming that the reference mark to be recognized has been recognized is performed. Specifically, S3, S7, S12, and S15 are reference mark confirmation processes, and the setting tolerances TΔX1, TΔY1, TΔX2, TΔY2 used in these confirmation processes are referred to as the setting tolerances TΔL1, TΔL2. In the mounting machine 12, the set tolerances TΔX2, TΔY2, and TΔL2 for confirming the partial region reference mark FM2 are smaller than the set tolerances TΔX1, TΔY1, TΔL1 for confirming the overall reference mark FM1. As a result, in the component mounting machine 12, the above-mentioned confirmation process is accurately performed as described above.

As can be seen from FIG. 2, the separation distance L of the pair of partial region reference marks FM2 differs depending on the substrate due to the number of partial regions A and the like. In the component mounting machine 12, for the reason described above, the set tolerance TΔL increases as the separation distance L increases and the separation distance L decreases according to the separation distance L of the pair of partial region reference marks FM2. It is set so small. This contributes to making the confirmation process of the reference mark more accurate.

12: Parts mounting machine [to board work machine] 18: Conveyor device [board fixing device] 22: Parts mounting device [to board work device] 32: Control device 36: Board camera [imaging device] S: Board A: Partial area FM1: Overall reference mark FM2: Partial area reference mark ΔX, ΔY: Positional deviation amount TΔX1, TΔY1, TΔX2, TΔY2: Setting tolerance ΔL: Separation distance difference [Relative position deviation amount] TΔL1, TΔL2: Setting tolerance

Claims (2)

A board fixing device that fixes the board,
A board-to-board work device that works on a board fixed to the board fixing device,
An image pickup device that images the surface of the substrate fixed to the board fixing device,
When the amount of positional deviation of the imaging target imaged by the imaging device is within the set tolerance range, the imaging target is recognized as the reference mark, and the work based on the recognized reference mark is to be executed. A board-to-board work machine provided with a control device for controlling the board-to-board work device.
The control device recognizes that the image pickup target is not a reference mark when the amount of positional deviation of the image pickup target imaged by the image pickup device is not within the set tolerance range, and stops the operation of the substrate working machine.
When the substrate fixed to the substrate fixing device is provided with an overall reference mark indicating a reference of the entire substrate and a partial region reference mark indicating a reference of a partial region as the reference mark, the portion The set tolerance for recognizing the area reference mark is made smaller than the set tolerance for recognizing the overall reference mark .
A pair of overall reference marks in which the substrates fixed to the substrate fixing device are separated from each other as the overall reference mark are separated from each other as the partial region reference mark, and a pair of partial region reference marks are separated from each other as the partial region reference mark. If is provided,
The set tolerance for recognizing the overall reference mark includes the set tolerance for the separation distance of the pair of overall reference marks as the set tolerance of the relative positional deviation amount of the pair of overall reference marks, and the partial region reference. The set tolerance for mark recognition includes the set tolerance for the separation distance of the pair of partial area reference marks as the set tolerance of the relative positional deviation amount of the pair of partial area reference marks.
A substrate working machine , wherein the set tolerance for the separation distance of the pair of partial region reference marks is smaller than the set tolerance for the separation distance of the pair of overall reference marks. The first aspect of claim 1, wherein the set tolerance for the separation distance of the pair of overall reference marks and the set tolerance for the separation distance of the pair of partial area reference marks are set to a size corresponding to the separation distance. Anti-board work machine.

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