JP4744358B2 - Electronic component mounting device - Google Patents

Description

  According to the present invention, the flux supplied from the flux supply unit to the flat plate is smoothed by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and the flux is supplied to the electronic component held by the suction nozzle. The present invention relates to a flux transfer device for transferring to a protruding electrode. Specifically, the flux supplied from the flux supply unit to the disk-shaped rotating disk is smoothed by a squeegee by rotating the rotating disk by a driving source, and the protruding electrode of the electronic component held by the suction nozzle The present invention relates to a flux transfer device for transferring to a sheet. Furthermore, the present invention relates to an electronic component mounting device that includes the flux transfer device and mounts an electronic component after flux transfer on a printed board.

The flux transfer device is disclosed in, for example, Patent Document 1, but after transferring the flux to the protruding electrode of the electronic component, the rotating disk is rotated by a drive source so that the thickness is adjusted to a predetermined thickness by a squeegee. Yes. By doing so, a constant thickness of flux can be transferred at all times.
Japanese Patent No. 3583319

  However, even if the type of electronic component is different (even if the size of the protruding electrode is different), the thickness of the flux is always constant. It was too much.

  Therefore, an object of the present invention is to obtain an appropriate transfer amount for each type of electronic component.

Therefore, in the first aspect of the invention, the flux supplied from the flux supply unit to the flat plate is leveled by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and the flux is held by the suction nozzle. Whether or not to transfer the flux for each type of electronic component in the electronic component mounting apparatus that includes a flux transfer device for transferring to the protruding electrode of the electronic component and mounts the electronic component after flux transfer on the printed circuit board And a setting device for setting the film thickness of the flux transferred to the protruding electrode of the electronic component, and a storage device for storing transfer presence / absence data and film thickness data as to whether or not to transfer the flux set by the setting device If the electronic component transfers the flux based on the transfer presence / absence data stored in the storage device, the transfer is performed. Characterized in that a control device for controlling to adjust by changing the height position of the squeegee by moving device the distance between the squeegee and the flat plate on the basis of the film thickness data before.

  Conventionally, even if the type of electronic component is different, the thickness of the flux is always constant, so depending on the type of electronic component, the flux is too much or too little, but according to the present invention, An appropriate transfer amount can be obtained for each type of electronic component.

  Hereinafter, an example in which a flux transfer device according to an embodiment of the present invention is applied to an electronic component mounting device will be described with reference to the accompanying drawings. 1 is a plan view of an electronic component mounting apparatus, FIG. 2 is a plan view of a BGA (Ball Grid Array), and FIGS. 3 and 4 are side views of a flux transfer apparatus mounted on the electronic component mounting apparatus. It is a top view.

  In FIG. 1, a pair of rails 5 for guiding movement of the A beam 3 and the B beam 4 in the Y direction are arranged on a base 2 of the electronic component mounting apparatus 1. The A beam 3 and the B beam 4 are long in the X direction, and the mounting heads 7 and 8 are arranged so as to be movable by the X axis motors 13 and 15 along the longitudinal direction. Therefore, the mounting heads 7 and 8 are movable in the XY directions.

  A ball screw shaft 11 rotated by the Y-axis motor 10 on the A side is screwed into a nut (not shown) fixed to the A beam 3, and the A beam 3 is attached to the rail 5 by the rotation of the ball screw shaft 11. It can move along. The B beam 4 moves along the rail 5 when the ball screw shaft 12 having the same structure is rotated by the Y-axis motor 14 on the B side.

  Further, a component supply table 6 is formed at each of the upper and lower positions of the base 2 in FIG. 1, and a component supply device 16 for supplying various electronic components is detachably mounted on the component supply table 6. Yes. The component supply device 16 includes a so-called tape supply type component supply device, a stick supply type component supply device, a tray supply type component supply device, and the like.

  Reference numeral 30 denotes a flux transfer device that is detachably mounted on the component supply base 6. As will be described in detail later, an electronic component having protruding electrodes (solder bumps) supplied from a certain component supply device 16, for example, BGA 9 The flux is transferred to the protruding electrode 9A (see FIG. 2) of (Ball Grid Array).

  The mounting heads 7 and 8 are for transporting and mounting electronic components taken out from each component supply device 16 by vacuum suction to desired positions on the printed circuit board 18. The printed circuit board 18 is transported by a transport conveyor 20 installed on the base 2 and positioned and fixed by a fixing mechanism (not shown) at a predetermined work stage position.

  Further, the electronic components taken out from the component supply device 16 by the suction nozzles 24 of the mounting heads 7 and 8 are picked up by the component recognition camera 21 with respect to the suction position deviation, the component dropping state, and the protruding electrode 9A missing state. The flux transfer status and the like are imaged and recognized by the recognition processor 19. Reference numeral 17 denotes a board recognition camera which images a positioning mark (not shown) attached to the printed board 18 and is subjected to recognition processing by the recognition processing device 19.

  A first open / close valve 22 communicates with the vacuum source (not shown) and the suction nozzle 24, and a second open / close valve 23 communicates with the air supply source (not shown) and the suction nozzle 24. Then, the first opening / closing valve 22 is opened to communicate with a vacuum source so that the suction nozzle 24 sucks and holds the electronic component. When the electronic component is mounted on the printed circuit board 18 by the suction nozzle 24, the first opening / closing valve 22 is opened. The second open / close valve 23 is closed and air from the air supply source is blown out to break the vacuum.

  Hereinafter, the flux transfer device 30 will be described. 3 and 4, a flux supply unit 32 and a flux storage unit 33 are roughly mounted on a base 31 of the flux transfer device 30.

  The flux supply unit 32 stores the flux F in a syringe 35 fixed to the base 31 via a support base 34. When the screw 36 is rotated a predetermined amount, a predetermined amount of the flux F is connected to the hose 37 and the hose 37. It is supplied to the flux reservoir 33 through a supply pipe 38 having a discharge port directed downward at the tip.

  The flux storage section 33 is rotatably provided on the base 31 and has an outer edge 41 for storing the flux F supplied from the flux supply section 32 so that the flux F is not discharged (outflowed) to the outside. The base disc body 46 of the rotary disc 40 has a rotation of the output shaft of the drive motor 42 transmitted through the pulley 43, the belt 44, and the pulley 45. It is rotated in a certain direction. The outer edge 41 is formed to be higher than the flat portion of the rotating disk 40, and is formed so that the flux F is not discharged (outflowed) outward when the rotating disk 40 is rotated to a squeegee 50 described later. Is done.

  Reference numeral 50 denotes a synthetic resin squeegee whose surface is coated with Teflon (registered trademark) for adjusting the flux F applied on the rotating disk 40 to a predetermined application thickness. And a pair of opposing horizontal pieces that connect the pair of vertical pieces, and a slider 52 fixed to a support 51 fixed to one vertical piece can be moved up and down along the guide rail 53.

  That is, when the drive motor 55 is driven to adjust the flux to a predetermined coating thickness (transfer thickness), the screw shaft 56 connected to the output shaft of the drive motor 55 rotates, and the slider 52 and The integrated nut body 57 moves up and down together with the slider 52, and the squeegee 50 moves up and down. If the electronic component transfers the flux based on the transfer presence / absence data stored in the RAM 62, which will be described later, the squeegee 50 and the flat plate based on the film thickness data before transfer. The distance from the rotating disk 40 is adjusted by a moving device, and this moving device includes a slider 52, a guide rail 53, a drive motor 55, a screw shaft 56 and a nut body 57.

  In order to allow the squeegee 50 to generate the flux F on the rotating disk 40, the portion of the squeegee 50 located above the rotating disk 40 is thick, and the portion located outside the rotating disk 40 has a step. It is formed and made thin.

  Next, description will be made based on the control block diagram of FIG. Reference numeral 60 denotes a CPU (Central Processing Unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 60 is connected to a RAM (Random Access Memory) 62 and a ROM (Read. Only memory) 63 is connected. Based on the data stored in the RAM 62, the CPU 60 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 63.

  That is, the CPU 60 moves the mounting heads 7 and 8 in the X direction via the interface 64 and the drive circuit 65, and the Y axis motor 10 that moves the A beam 3 and the B beam 4 in the Y direction. 14, a vertical axis motor 66 for raising and lowering the suction nozzle 24, a θ-axis motor 67 for rotating the suction nozzle 24, a drive motor 42 for rotating the rotary disk 40, a drive motor 55 for adjusting the flux to a predetermined coating thickness, etc. The drive is controlled.

  The RAM 62 stores mounting data related to component mounting. For each mounting order (step number), the X-coordinate, Y-coordinate and angle information in the printed circuit board, and the arrangement of the component supply units 3 are stored. Number information and the like are stored. The RAM 62 stores component arrangement data relating to the type (component ID) of each electronic component corresponding to the arrangement number of each component supply device 16. Furthermore, component library data including a type, a size in the X direction, a size in the Y direction, a size in the thickness direction, and the like is also stored for each electronic component (component ID) (see FIG. 6).

  Reference numeral 19 denotes a recognition processing apparatus connected to the CPU 60 via an interface 64. The recognition processing apparatus 19 performs recognition processing of an image captured by the component recognition camera 21 and an image captured by the board recognition camera 17 and captured. The recognition process is performed. An image captured by the component recognition camera 21 or the board recognition camera 17 is displayed on a monitor 68 as a display device. The monitor 68 is provided with various touch panel switches 69, and an operator can perform various settings related to mounting of electronic components by operating the touch panel switch 69.

  Next, creation of the component library data shown in FIG. 6 will be described. First, in addition to the size in the X direction, the size in the Y direction, and the size in the thickness direction for each electronic component (component ID), the touch panel switch 69 is pressed to select the presence or absence of flux transfer shown in FIG. A screen is displayed on the monitor 68 to select whether or not to apply flux to the electronic component.

  In this case, when “Yes” for applying the flux is selected, the CPU 60 causes the monitor 68 to display a setting screen for film thickness data and indentation amount data as shown in FIG. Then, a numeric keypad switch (not shown) is pressed to set, for example, the film thickness of the flux transferred to the protruding electrode of the electronic component to 0.15 mm and the pressing amount to 0.10 mm, and press the decision switch 69A. When operated, the CPU 60 stores these data in the RAM 62. That is, when set in this way, component library data as shown in FIG. 6 is stored in the RAM 62.

  The amount of pressing down means that the CPU 60 drives the vertical axis motor 66 via the drive circuit 65 to transfer the flux F on the rotating disk 40 to the projecting electrode 9A of the BGA 9, and lowers the suction nozzle 24 that sucks and holds the BGA 9. In this case, the amount of lowering of the standard lowering amount against the spring (not shown) that lifts and urges the nozzle 24 itself.

  Next, the operation of the electronic component mounting apparatus 1 will be described. First, the printed circuit board 18 is transported to the work table position of the electronic component mounting apparatus 1 by the transport conveyor 20, and is positioned and fixed by the positioning mechanism. Subsequently, the CPU 60 controls the X-axis motors 13 and 15 and the Y-axis motors 10 and 14 to move the mounting heads 7 and 8 so that the board recognition camera 17 is positioned above the positioning mark of the printed board 18. Then, the positioning mark is imaged, and the recognition processing device 19 performs recognition processing to grasp the position of the printed circuit board 18.

  Next, when the CPU 60 controls the X-axis motors 13 and 15 and the Y-axis motors 10 and 14, the mounting heads 7 and 8 move XY to the desired electronic component take-out position of the component supply device 16, where they move up and down. By controlling the shaft motor 66, the suction nozzle 24 is lowered to suck and take out the BGA 9 supplied to the suction position.

  Subsequently, the mounting heads 7 and 8 again move XY above the component recognition camera 21, and the component recognition camera 21 images the BGA 9 sucked and held by the suction nozzle 24, and the picked-up image is recognized. The device 19 performs recognition processing to recognize the suction position deviation state of the BGA 9 with respect to the suction nozzles 24 of the mounting heads 7 and 8 and the component dropping state.

  When there is no recognition abnormality, the mounting heads 7 and 8 move XY from above the component recognition camera 21 to the flux transfer position TN of the flux transfer device 30, where the flux is sucked and held by the suction nozzle 24. The projecting electrode 9A of the BGA 9 is lowered until it is immersed. At this time, the flux F supplied onto the rotating disk 40 of the flux transfer device 30 is already prepared in a state suitable for transfer. That is, the flux in the syringe 35 of the flux supply unit 32 is supplied on the rotating disk 40 through the hose 37 and the supply pipe 38 in advance, and the driving motor 42 is driven to rotate the rotating disk 40 to obtain a predetermined coating thickness. It is leveled with the squeegee 50.

  In this case, since the CPU 60 already knows which electronic component should be taken out and mounted in accordance with the mounting data and the arrangement data stored in the RAM 62, it transfers the flux from the flux transfer presence / absence data in the component library data of the electronic component. If it is determined that the BGA 9 is to be transferred, the film thickness data as the component library data is read, the drive motor 55 is controlled via the drive circuit 65, and the film thickness data is followed. The drive motor 42 is driven after setting the height of the squeegee 50 to rotate the rotating disk 40, and the flux on the rotating disk 40 is smoothed by the squeegee 50.

  Note that the CPU 60 corrects the suction position deviation based on the recognition processing result of the BGA 9 with respect to the suction nozzle 24 so that the flux is transferred in the same posture at the same flux transfer position TN. , 15, Y-axis motors 10, 14 and θ-axis motor 67 are corrected and controlled. Thus, since the flux is always transferred in the same posture at the flux transfer position TN, the transfer amount of the flux is constant and the quality is constant. Further, in the configuration in which the mounting heads 7 and 8 are provided with a plurality of suction nozzles 24 and the BGA 9 is sucked and held by the suction nozzles 24 and mounted on the printed circuit board 18, the suction heads 24 are sucked by the suction nozzles 24. The transfer amount of the flux is also constant by transferring the flux to each held BGA 9 and driving the drive motor 42 to rotate the rotating disk 40 so that the squeegee 50 has a predetermined coating thickness. The quality is constant.

  Subsequently, after the suction nozzle 24 is lowered to the transfer position TN and the flux F is transferred to the protruding electrode 9A of the BGA 9, the suction nozzle 24 is raised, and the mounting heads 7 and 8 are again moved XY above the component recognition camera 21. Then, the component recognition camera 21 captures an image of the BGA 9 sucked and held by the suction nozzle 24. During this transfer, the CPU 60 passes through the drive circuit 65 according to the pushing amount of the BGA 9 stored in the RAM 62. Then, the vertical axis motor 66 is driven to lower the suction nozzle 24.

  Then, the recognition processor 19 recognizes the image picked up by the component recognition camera 21, and the suction position deviation state of the BGA 9 with respect to the suction nozzle 24 of the mounting heads 7 and 8, the component drop state, and the protruding electrode 9A missing state. And recognize the flux transfer status.

  If there is no recognition abnormality, the mounting heads 7 and 8 are moved XY, lowered to the mounting position, and the protruding electrode 9A of the BGA 9 is mounted on the printed circuit board 18. In this case, the CPU 60 corrects and controls the X-axis drive motors 13 and 15, the Y-axis motors 10 and 14, and the θ-axis motor 67 in order to correct the positional deviation of the BGA 9 after transferring the flux. When the BGA 9 is mounted on the printed circuit board 18, the first on-off valve 22 communicating with a vacuum source (not shown) is closed and the second on-off valve 23 communicating with an air supply source (not shown) is opened. The air is blown out from the air supply source to break the vacuum.

  Thereafter, similarly, necessary electronic components are mounted on the printed circuit board 18, and each electronic component is fixed on the printed circuit board 18 by reflowing the solder.

  If the CPU 60 determines that the next electronic component to be taken out from the component supply device 16 and mounted on the printed circuit board 18 will transfer the flux based on the transfer presence / absence data indicating whether or not to transfer the flux, After completing the transfer of the flux to the protruding electrode 9A of the BGA 9, the CPU 60 reads the film thickness data of the next electronic component stored in the RAM 62 and controls the drive motor 55 via the drive circuit 65 to obtain the film thickness data. After the height of the squeegee 50 is set, the drive motor 42 is driven to rotate the rotating disk 40, and the flux on the rotating disk 40 is smoothed by the squeegee 50. If it is determined that the next electronic component taken out from the component supply device 16 does not transfer the flux, the electronic component to which the flux is transferred after that and the electronic component determined by the CPU 60 are transferred from the component supply device 16. When picking up and taking out, simultaneously with the picking operation, the CPU 60 reads the film thickness data of the electronic component, controls the drive motor 55 via the drive circuit 65, and the height of the squeegee 50 according to the film thickness data. After the position is reached, the drive motor 42 is driven to rotate the rotary disk 40 and the squeegee 50 smoothes the flux on the rotary disk 40.

  Therefore, conventionally, even if the type of electronic component is different, the thickness of the flux is always constant. Therefore, depending on the type of this electronic component, the flux is too much or too small. Accordingly, an appropriate transfer amount can be obtained for each type of electronic component.

  Of course, this film thickness adjustment is performed only when the current film thickness data and the next film thickness data are different. In the same case, adjustment is not performed, and the rotating disk 40 is rotated and the flux on the rotating disk 40 is smoothed by the squeegee 50. It is.

  Until the rotation of the rotary disk 40 is completed, the suction nozzle 24 is controlled by the CPU 60 so as not to be lowered for the transfer of the flux.

  The transfer presence / absence data on whether or not to transfer the set flux, the film thickness data, and the indentation amount data are stored in the RAM 62 as a part of the part library data. Or the data alone may be stored in the storage device.

  The present invention is not limited to the flux transfer device provided with the rotating disk and the squeegee, and the plate (plane plate) having a flat surface to which the flux is supplied and the squeegee move relatively, for example, in parallel. Even if there is no protruding electrode in the electronic component sucked and held by the suction nozzle after the transfer operation, the same effect can be obtained by not performing the relative movement.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of the electronic component mounting apparatus with which this invention flux transfer apparatus is applied. It is a top view of BGA. It is a side view of the flux transfer device in a state where the squeegee is raised. It is a top view of the flux transcription | transfer apparatus of the state which the squeegee raised. It is a control block diagram. It is a figure which shows parts library data. It is a figure which shows the creation screen of flux transfer presence / absence data. It is a figure which shows the screen for setting film thickness data and pushing amount.

Explanation of symbols

1 Electronic component mounting device 9 BGA
9A Protruding electrode 18 Printed circuit board 19 Recognition processing device 21 Component recognition camera 24 Adsorption nozzle 30 Flux transfer device 40 Rotating disk 42 Drive motor 50 Squeegee 55 Drive motor 60 CPU
62 RAM
68 Monitor 69 Touch panel switch

Claims (1)

The flux supplied to the flat plate from the flux supply unit is moved by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and this flux is transferred to the protruding electrode of the electronic component held by the suction nozzle. In an electronic component mounting apparatus for mounting an electronic component after flux transfer on a printed circuit board, whether or not to transfer the flux for each type of electronic component and a protruding electrode of the electronic component Setting device for setting film thickness of flux to be transferred, storage device for storing transfer presence / absence data on whether or not to transfer flux set by this setting device, and film thickness data, and stored in this storage device the film thickness data before the electronic component is to be transferred the apparatus having to transfer the flux on the basis of the transfer presence data Zui and electronic component mounting apparatus characterized by comprising a control device for controlling to adjust by changing the height position of the squeegee by moving device the distance between the squeegee and the flat plate.

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