JP4744365B2 - Electronic component mounting device - Google Patents

Description

  According to the present invention, the flux supplied from the flux supply unit to the flat plate is smoothed by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and the flux is supplied to the electronic component held by the suction nozzle. The present invention relates to an electronic component mounting apparatus that includes a plurality of flux transfer devices for transferring to a protruding electrode and mounts an electronic component on a printed board after the flux is transferred by a predetermined flux transfer device.

The flux transfer device is disclosed in, for example, Patent Document 1, but after transferring the flux to the protruding electrode of the electronic component, the rotating disk is rotated by a drive source so that the thickness is adjusted to a predetermined thickness by a squeegee. Yes. By doing so, a constant thickness of flux can be transferred at all times.
Japanese Patent No. 3583319

  However, even if the type of electronic component is different (even if the size of the protruding electrode is different), the thickness of the flux is always constant. It was too much.

  Therefore, an object of the present invention is to obtain an appropriate amount of flux transfer according to electronic components.

  Therefore, in the first aspect of the invention, the flux supplied from the flux supply unit to the flat plate is leveled by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and the flux is held by the suction nozzle. In the electronic component mounting apparatus that includes a plurality of flux transfer devices for transferring to the protruding electrodes of the electronic component and mounts the electronic component on the printed circuit board after the flux is transferred by a predetermined flux transfer device, A first memory storing data representing that the flux is transferred for each type and a film thickness data of the transferred flux, and a film thickness data of the flux transferred to the protruding electrode of the electronic component for each flux transfer device Is determined based on each of the stored data in the first memory and the second memory. Using a flux transfer device, characterized in that a control device for controlling so as to mount to the electronic components of the projection electrodes by transferring the flux on a printed substrate.

  According to a second aspect of the present invention, the flux supplied from the flux supply unit to the flat plate is smoothed by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and the flux is held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer devices for transferring to a protruding electrode of a component and mounts an electronic component on a printed circuit board after the flux is transferred by a predetermined flux transfer device, for each type of the electronic component The first memory for storing the data representing the transfer of the flux and the film thickness data of the transferred flux, and the film thickness data of the flux transferred to the protruding electrode of the electronic component for each flux transfer device And a predetermined frame based on the data stored in the first and second memories. A determining means for determining a transfer device and a control device for controlling the flux to be transferred to the protruding electrode of the electronic component and mounted on the printed circuit board using the flux transfer device determined by the determining means are provided. It is characterized by that.

  According to a third aspect of the present invention, the flux supplied from the flux supply unit to the flat plate is smoothed by the squeegee by moving the flat plate and the squeegee relative to each other by a driving source, and the flux is held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer devices for transferring to a protruding electrode of a component and mounts an electronic component on a printed circuit board after the flux is transferred by a predetermined flux transfer device, for each type of the electronic component A first memory that stores data representing that the flux is transferred, a type data of the transferred flux, and a film thickness data of the flux, and a flux transferred to the protruding electrode of the electronic component for each flux transfer device A second memory for storing type data and flux film thickness data, and the first and second And a control device for controlling the flux to be transferred to the protruding electrode of the electronic component and mounted on the printed circuit board using the flux transfer device determined based on each data stored in the memory. Features.

  According to a fourth aspect of the present invention, the flux supplied from the flux supply unit to the flat plate is smoothed by a squeegee by moving the flat plate and the squeegee relative to each other by a driving source, and the flux is held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer devices for transferring to a protruding electrode of a component and mounts an electronic component on a printed circuit board after the flux is transferred by a predetermined flux transfer device, for each type of the electronic component A first memory that stores data representing that the flux is transferred, a type data of the transferred flux, and a film thickness data of the flux, and a flux transferred to the protruding electrode of the electronic component for each flux transfer device A second memory for storing type data and flux film thickness data, and the first and second A determining means for determining a predetermined flux transfer device based on each data stored in the memory, and a printed circuit board by transferring the flux to the protruding electrode of the electronic component using the flux transfer device determined by the determining means And a control device that controls to be mounted on.

  According to a fifth invention, in the inventions according to the first to fourth electronic component mounting apparatuses, the flat plate is constituted by a disk-shaped rotary disk, and the flux supplied from the flux supply unit by rotating the rotary disk Is smoothed by the squeegee.

  Conventionally, even if the type of electronic component is different, the thickness of the flux is always constant, so depending on the type of electronic component, the flux is too much or too little, but according to the present invention, An appropriate transfer amount can be obtained depending on the electronic component.

  Hereinafter, an example in which a flux transfer device according to an embodiment of the present invention is applied to an electronic component mounting device will be described with reference to the accompanying drawings. 1 is a plan view of an electronic component mounting apparatus, FIG. 2 is a plan view of a BGA (Ball Grid Array), and FIGS. 3 and 4 are side views of a flux transfer apparatus mounted on the electronic component mounting apparatus. It is a top view.

  In FIG. 1, a pair of rails 5 for guiding movement of the A beam 3 and the B beam 4 in the Y direction are arranged on a base 2 of the electronic component mounting apparatus 1. The A beam 3 and the B beam 4 are long in the X direction, and the mounting heads 7 and 8 are arranged so as to be movable by the X axis motors 13 and 15 along the longitudinal direction. Therefore, the mounting heads 7 and 8 are movable in the XY directions.

  A ball screw shaft 11 rotated by the Y-axis motor 10 on the A side is screwed into a nut (not shown) fixed to the A beam 3, and the A beam 3 is attached to the rail 5 by the rotation of the ball screw shaft 11. It can move along. The B beam 4 moves along the rail 5 when the ball screw shaft 12 having the same structure is rotated by the Y-axis motor 14 on the B side.

  Further, a component supply table 6 is formed at each of the upper and lower positions of the base 2 in FIG. 1, and a component supply device 16 for supplying various electronic components is detachably mounted on the component supply table 6. Yes. The component supply device 16 includes a so-called tape supply type component supply device, a stick supply type component supply device, a tray supply type component supply device, and the like.

  Reference numeral 30 denotes a plurality of flux transfer devices that are detachably mounted on the component supply table 6. As will be described in detail later, an electronic component having protruding electrodes (solder bumps) supplied from a component supply device 16. For example, the flux is transferred to the protruding electrode 9A (see FIG. 2) of the BGA 9 (Ball Grid Array), and each flux transfer device 30 has a different film thickness of the flux transferred to the protruding electrode 9A of the BGA 9 and the flux. The types are different and are selected and used so as to obtain an appropriate transfer amount according to the type of electronic component.

  The mounting heads 7 and 8 are for transporting and mounting electronic components taken out from each component supply device 16 by vacuum suction to desired positions on the printed circuit board 18. The printed circuit board 18 is transported by a transport conveyor 20 installed on the base 2 and positioned and fixed by a fixing mechanism (not shown) at a predetermined work stage position.

  Further, the electronic components taken out from the component supply device 16 by the suction nozzles 24 of the mounting heads 7 and 8 are picked up by the component recognition camera 21 with respect to the suction position deviation, the component dropping state, and the protruding electrode 9A missing state. The flux transfer status and the like are imaged and recognized by the recognition processor 19. Reference numeral 17 denotes a board recognition camera which images a positioning mark (not shown) attached to the printed board 18 and is subjected to recognition processing by the recognition processing device 19.

  A first open / close valve 22 communicates with the vacuum source (not shown) and the suction nozzle 24, and a second open / close valve 23 communicates with the air supply source (not shown) and the suction nozzle 24. Then, the first opening / closing valve 22 is opened to communicate with a vacuum source so that the suction nozzle 24 sucks and holds the electronic component. When the electronic component is mounted on the printed circuit board 18 by the suction nozzle 24, the first opening / closing valve 22 is opened. The second open / close valve 23 is closed and air from the air supply source is blown out to break the vacuum.

  Hereinafter, the flux transfer device 30 will be described. 3 and 4, a flux supply unit 32 and a flux storage unit 33 are roughly mounted on a base 31 of the flux transfer device 30.

  The flux supply unit 32 stores the flux F in a syringe 35 fixed to the base 31 via a support base 34. When the screw 36 is rotated a predetermined amount, a predetermined amount of the flux F is connected to the hose 37 and the hose 37. It is supplied to the flux reservoir 33 through a supply pipe 38 having a discharge port directed downward at the tip.

  The flux storage section 33 is rotatably provided on the base 31 and has an outer edge 41 for storing the flux F supplied from the flux supply section 32 so that the flux F is not discharged (outflowed) to the outside. The base disc body 46 of the rotary disc 40 has a rotation of the output shaft of the drive motor 42 transmitted through the pulley 43, the belt 44, and the pulley 45. It is rotated in a certain direction. The outer edge 41 is formed to be higher than the flat portion of the rotating disk 40, and is formed so that the flux F is not discharged (outflowed) outward when the rotating disk 40 is rotated to a squeegee 50 described later. Is done.

  Reference numeral 50 denotes a synthetic resin squeegee whose surface is coated with Teflon (registered trademark) for adjusting the flux F on the rotating disk 40 to a predetermined transfer thickness. A slider 52 fixed to a support 51 fixed to one vertical piece is movable up and down along the guide rail 53. The slider 52 is composed of a pair of opposed horizontal pieces connecting a pair of vertical pieces.

  That is, when the drive motor 55 is driven, the screw shaft 56 connected to the output shaft of the drive motor 55 rotates, and the nut body 57 integrated with the slider 52 moves up and down together with the slider 52, so that the squeegee 50 moves up and down, and the interval between the squeegee 50 and the rotary disk 40 as a flat plate is adjusted based on the film thickness data set for each flux transfer device 30. The moving device for adjusting the distance includes a slider 52, a guide rail 53, a drive motor 55, a screw shaft 56, and a nut body 57.

  In order to allow the squeegee 50 to generate the flux F on the rotating disk 40, the portion of the squeegee 50 located above the rotating disk 40 is thick, and the portion located outside the rotating disk 40 has a step. It is formed and made thin.

  Next, description will be made based on the control block diagram of FIG. Reference numeral 60 denotes a CPU (Central Processing Unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 60 is connected to a RAM (Random Access Memory) 62 and a ROM (Read. Only memory) 63 is connected. Based on the data stored in the RAM 62, the CPU 60 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 63.

  That is, the CPU 60 moves the mounting heads 7 and 8 in the X direction via the interface 64 and the drive circuit 65, and the Y axis motor 10 that moves the A beam 3 and the B beam 4 in the Y direction. 14, a vertical axis motor 66 for raising and lowering the suction nozzle 24, a θ-axis motor 67 for rotating the suction nozzle 24, a drive motor 42 for rotating the rotary disk 40, a drive motor 55 for adjusting the flux to a predetermined transfer thickness, etc. The drive is controlled.

  As shown in FIG. 6, the RAM 62 stores mounting data related to component mounting. For each mounting order (for each step number), the X-coordinate, Y-coordinate and angle information in the printed circuit board, The arrangement number information of the component supply device 16 and the like are stored. In addition, as shown in FIG. 7, the RAM 62 stores component arrangement data relating to each electronic component type (component ID) corresponding to the arrangement number of each component supply device 16. Furthermore, as shown in FIG. 8, the flux is transferred for each electronic component (component ID), the size in the X direction, the size in the Y direction, the size in the thickness direction (Z), and the type of electronic component. In the case of electronic components that transfer or not, whether or not to transfer the flux, component library data including the film thickness of the flux transferred to the protruding electrode and the type of flux is also stored. Furthermore, as shown in FIG. 9, transfer device library data including the film thickness and the type of flux is stored for each flux transfer device (transfer device ID) 30. For example, at least the film thickness is different for each flux transfer device, and the type may be different.

  The component library data and the transfer device library data as described above can be created by the operator pressing the touch panel switch 69 displayed on the monitor 68. When the component ID is AAAAAAA, the component is transferred with flux. Thus, the film thickness of the flux is 0.15 mm, and when the transfer device ID is FU1, the film thickness of the flux is 0.15 mm and the type of the flux is A (see FIGS. 8 and 9).

  Reference numeral 19 denotes a recognition processing apparatus connected to the CPU 60 via an interface 64. The recognition processing apparatus 19 performs recognition processing of an image captured by the component recognition camera 21 and an image captured by the board recognition camera 17 and captured. The recognition process is performed. An image captured by the component recognition camera 21 or the board recognition camera 17 is displayed on a monitor 68 as a display device.

  Next, the operation of the electronic component mounting apparatus 1 will be described with reference to FIG. First, the printed circuit board 18 is transported to the work table position of the electronic component mounting apparatus 1 by the transport conveyor 20, and is positioned and fixed by the positioning mechanism. Subsequently, when the CPU 60 controls the X-axis motor 13 and the Y-axis motor 10, the mounting head 7 is moved so that the board recognition camera 17 is positioned above the positioning mark of the printed board 18, and the positioning mark is moved. The image is picked up, and the recognition processing device 19 performs recognition processing to grasp the position of the printed circuit board 18.

  Next, when the CPU 60 controls the X-axis motor 13 and the Y-axis motor 10, the mounting head 7 detects the electronic component of step ID 0001 shown in FIG. 6 and picks up and removes the electronic component of AAAAAAA. The supply device 16 moves XY to the electronic component extraction position, and controls the vertical axis motor 66 to lower the adsorption nozzle 24 to adsorb and extract the BGA 9 supplied to the adsorption position.

  Subsequently, the mounting head 7 again moves XY above the component recognition camera 21, where the component recognition camera 21 images the BGA 9 sucked and held by the suction nozzle 24, and the captured image is recognized by the recognition processing device 19. The recognition process recognizes the suction position deviation state of the BGA 9 relative to the suction nozzle 24 of the mounting head 7 and the component dropping state.

  If there is no recognition abnormality, the CPU 60 determines whether or not to transfer the flux from the component library data of the BGA 9, but since it is an electronic component that transfers the flux, the CPU 60 next transfers the flux. The target flux transfer device 30 is searched.

  In this case, first, the CPU 60 searches for the flux transfer device 30 having the same flux type in the component library data of the BGA 9 and the transfer device library data, and if there is the same flux transfer device 30, the flux film thickness is the same. If a match is found, the flux transfer device 30 to be transferred is determined. That is, the flux transfer device 30 in which the type of flux is “A” and the transfer device ID with the flux film thickness of 0.15 mm is FU1 is applicable.

  Therefore, as shown in FIG. 7, the determined flux transfer device 30 has the arrangement number “103”, and the mounting head 7 is positioned above the component recognition camera 21 to determine the determined flux transfer position TN of the flux transfer device 30. The XY moves until the projection electrode 9A of the BGA 9 attracted and held by the suction nozzle 24 is immersed in the flux.

  When the CPU 60 searches for the target flux transfer device 30 to which the flux is to be transferred and the target flux transfer device 30 is not found, an abnormal display is displayed on the monitor 68, that is, the corresponding flux transfer device 30 is not found. Is displayed to notify the operator, and the CPU 60 controls to stop the electronic component mounting apparatus 1.

  When transferring the flux, the flux F supplied onto the rotating disk 40 of the flux transfer device 30 is already prepared in a state suitable for transfer. That is, the flux in the syringe 35 of the flux supply unit 32 is supplied in advance to the rotating disk 40 through the hose 37 and the supply pipe 38, and the driving motor 42 is driven to rotate the rotating disk 40 to obtain a predetermined transfer thickness. It is leveled with the squeegee 50.

  Subsequently, after the suction nozzle 24 is lowered to the transfer position TN and the flux F is transferred to the protruding electrode 9A of the BGA 9, the suction nozzle 24 is raised, and the mounting head 7 is again moved XY above the component recognition camera 21. The component recognition camera 21 images the BGA 9 sucked and held by the suction nozzle 24.

  Then, the recognition processing device 19 recognizes the image captured by the component recognition camera 21, and the suction position deviation state of the BGA 9 with respect to the suction nozzle 24 of the mounting head 7, the component fall state, the missing state of the protruding electrode 9A, and the flux Recognize transcription status.

  If there is no recognition abnormality, the mounting head 7 is moved XY, lowered to the mounting position, and the protruding electrode 9A of the BGA 9 is mounted on the printed circuit board 18. In this case, the CPU 60 corrects and controls the X-axis drive motor 13, the Y-axis motor 10, and the θ-axis motor 67 in order to correct the positional deviation of the BGA 9 after transferring the flux. When the BGA 9 is mounted on the printed circuit board 18, the first on-off valve 22 communicating with a vacuum source (not shown) is closed and the second on-off valve 23 communicating with an air supply source (not shown) is opened. The air is blown out from the air supply source to break the vacuum.

  Thereafter, when the mounting of the electronic component of the last step number of the mounting data shown in FIG. 6 is completed, each electronic component is fixed on the printed circuit board 18 by reflowing the solder.

  If the CPU 60 determines that the next electronic component to be taken out from the component supply device 16 and mounted on the printed circuit board 18 will transfer the flux based on the transfer presence / absence data indicating whether or not to transfer the flux, After completing the transfer of the flux to the protruding electrode 9A of the BGA 9, the CPU 60 drives the drive motor 42 of the corresponding flux transfer device 30 to rotate the rotating disk 40 and causes the squeegee 50 to smooth the flux on the rotating disk 40. If it is determined that the next electronic component taken out from the component supply device 16 does not transfer the flux, the electronic component to which the flux is transferred after that and the electronic component determined by the CPU 60 are transferred from the component supply device 16. At the time of sucking and taking out, simultaneously with this sucking operation, the CPU 60 drives the drive motor 42 of the corresponding flux transfer device 30 to rotate the rotating disk 40 and causes the squeegee 50 to smooth the flux on the rotating disk 40.

  Therefore, conventionally, even if the type of electronic component is different, the thickness of the flux is always constant. Therefore, depending on the type of this electronic component, the flux is too much or too small. According to the above, even when the types of electronic parts are different and the thickness of the flux suitable for transfer is different, it is possible to search for a suitable flux transfer device, and as a result, transfer the appropriate flux according to the electronic parts. A quantity is obtained.

  The present invention is not limited to the flux transfer device provided with the rotating disk and the squeegee, and the plate (plane plate) having a flat surface to which the flux is supplied and the squeegee move relatively, for example, in parallel. Even if there is no protruding electrode in the electronic component sucked and held by the suction nozzle after the transfer operation, the same effect can be obtained by not performing the relative movement.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of the electronic component mounting apparatus with which this invention flux transfer apparatus is applied. It is a top view of BGA. It is a side view of the flux transfer device in a state where the squeegee is raised. It is a top view of the flux transcription | transfer apparatus of the state which the squeegee raised. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows component arrangement | positioning data. It is a figure which shows parts library data. It is a figure which shows transcription | transfer apparatus library data. It is a figure which shows a flowchart.

Explanation of symbols

1 Electronic component mounting device 9 BGA
9A Protruding electrode 18 Printed circuit board 19 Recognition processing device 21 Component recognition camera 24 Adsorption nozzle 30 Flux transfer device 40 Rotating disk 42 Drive motor 50 Squeegee 60 CPU
62 RAM
68 Monitor 69 Touch panel switch

Claims (5)

  The flux supplied to the flat plate from the flux supply unit is moved by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and this flux is transferred to the protruding electrode of the electronic component held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer apparatuses for mounting electronic components on a printed circuit board after the flux is transferred by a predetermined flux transfer apparatus, the flux is transferred for each type of electronic component And a second memory for storing flux film thickness data transferred to the protruding electrode of the electronic component for each of the flux transfer devices. The flux transfer apparatus determined based on the data stored in the first and second memories An electronic component mounting apparatus characterized by comprising a control device for controlling so as to mount to the electronic components of the projection electrodes by transferring the flux on a printed circuit board using.   The flux supplied to the flat plate from the flux supply unit is moved by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and this flux is transferred to the protruding electrode of the electronic component held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer apparatuses for mounting electronic components on a printed circuit board after the flux is transferred by a predetermined flux transfer apparatus, the flux is transferred for each type of electronic component And a second memory for storing flux film thickness data transferred to the protruding electrode of the electronic component for each of the flux transfer devices. A predetermined flux transfer device is determined based on the data stored in the first and second memories. And a control device that controls to transfer the flux to the bump electrode of the electronic component and mount it on the printed circuit board using the flux transfer device determined by the determination device. Electronic component mounting device.   The flux supplied to the flat plate from the flux supply unit is moved by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and this flux is transferred to the protruding electrode of the electronic component held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer apparatuses for mounting electronic components on a printed circuit board after the flux is transferred by a predetermined flux transfer apparatus, the flux is transferred for each type of electronic component A first memory for storing data indicating the type of flux, data on the type of flux to be transferred, and film thickness data of the flux, type data on the flux transferred to the protruding electrode of the electronic component for each flux transfer device, and film of the flux A second memory for storing the thickness data, and the storage of these first and second memories And a control device that controls to transfer the flux to the bump electrode of the electronic component using the flux transfer device determined based on each data and to mount it on the printed circuit board. Component mounting device.   The flux supplied to the flat plate from the flux supply unit is moved by the squeegee by relatively moving the flat plate and the squeegee by a driving source, and this flux is transferred to the protruding electrode of the electronic component held by the suction nozzle. In an electronic component mounting apparatus that includes a plurality of flux transfer apparatuses for mounting electronic components on a printed circuit board after the flux is transferred by a predetermined flux transfer apparatus, the flux is transferred for each type of electronic component A first memory for storing data indicating the type of flux, data on the type of flux to be transferred, and film thickness data of the flux, type data on the flux transferred to the protruding electrode of the electronic component for each flux transfer device, and film of the flux A second memory for storing the thickness data, and the storage of these first and second memories And determining means for determining a predetermined flux transfer device based on each data, and using the flux transfer device determined by the determining means, transferring the flux to the protruding electrode of the electronic component and mounting it on the printed circuit board. An electronic component mounting apparatus comprising a control device for controlling the electronic component. 5. The flat plate is constituted by a disk-shaped rotary disk, and the flux supplied from the flux supply unit is rotated by the squeegee by rotating the rotary disk. The electronic component mounting apparatus described.

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