JP2017224662A - Component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting method capable of suppressing occurrence of component mounting failure for a board, by preventing insufficient paste adhesion of the component, without up-sizing a paste supply section.SOLUTION: Prior to a paste contact step, a determination is made whether or not a component 3 comes in contact with a paste Pst without protruding from a transfer region TR, when the component 3 is brought into contact with the paste Pst by moving a nozzle 22a to a reference position KJ set for the transfer region TR. When the component 3 comes in contact with the paste Pst without protruding from the transfer region TR, the component 3 is brought into contact with the paste Pst by moving the nozzle 22a to the reference position KJ, and when the component 3 comes in contact with the paste Pst while protruding from the transfer region TR, the component 3 is brought into contact with the paste Pst by moving the nozzle 22a to the position of movement destination of the nozzle 22a capable of coming into contact with the paste Pst without protruding from the transfer region TR.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a component mounting method in which a component adsorbed by a nozzle is brought into contact with a paste and then mounted on a substrate.

  Some component mounting apparatuses that mount a component on a substrate to manufacture a mounting substrate attach a paste such as flux or adhesive to the lower surface of the component before mounting the component on the substrate. In such a component mounting method using the component mounting apparatus, the paste is supplied to a predetermined transfer region by the paste supply unit, the component adsorbed by the nozzle is brought into contact with the paste, and the paste is attached to the lower surface of the component. (For example, Patent Document 1).

  In the transfer position, a reference position is set as a target movement position of the nozzle when the component is brought into contact with the paste. When the component is brought into contact with the paste, the nozzle that sucks the component is moved to the reference position. If the reference position is set to a position where the part can be brought into contact with the paste without protruding from the transfer area if the nozzle that has attracted the center of the part is moved to that position, the entire area of the lower surface of the part Can be brought into contact with the paste in the transfer region, and sufficient paste can be attached to the component.

Japanese Patent Laying-Open No. 2015-142006

  However, in the above component mounting method, if the component is relatively large and the center of the component cannot be sucked by the nozzle, the component is transferred to the transfer area even if the nozzle that sucks the component is moved to the reference position. It is not always possible to make contact with the paste without protruding. When the component is in contact with the paste in a state where the component protrudes from the transfer region, insufficient paste adhesion occurs where the paste does not sufficiently adhere to a part of the component, and the mounting state of the component on the board tends to be poor. In order to prevent such an inconvenience, the paste supply unit may be enlarged to enlarge the transfer area, but the entire component mounting apparatus may be increased in size.

  Therefore, an object of the present invention is to provide a component mounting method that can prevent the component from being poorly attached to the substrate by preventing the component from being insufficiently attached to the paste without increasing the size of the paste supply unit.

  The component mounting method of the present invention includes a paste supply step for supplying a paste to a predetermined transfer region, a component suction step for sucking a component with a nozzle, and moving the nozzle that sucks the component in the component suction step. A component mounting method comprising: a paste contact step for bringing the component into contact with the paste; and a component mounting step for mounting the component brought into contact with the paste in the paste contact step onto a substrate, wherein the transfer region includes The reference position is set as the target movement position of the nozzle when the component is brought into contact with the paste, and the nozzle that has attracted the component is moved to the reference position before the paste contact step. If the part is brought into contact with the paste, it is determined whether or not the part comes into contact with the paste without protruding from the transfer area. A determination step is performed, and when it is determined in the determination step that the component comes into contact with the paste without protruding from the transfer region, the paste contact step is performed by moving the nozzle to the reference position. Run.

  According to the present invention, it is possible to prevent the component from being poorly attached to the substrate by preventing the component from being attached to the paste without increasing the size of the paste supply unit.

The perspective view of the component mounting apparatus in one embodiment of this invention The perspective view of the paste supply part with which the component mounting apparatus in one embodiment of this invention is provided The side view of the paste supply part in one embodiment of this invention The top view of a part of paste supply part in one embodiment of the present invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention The flowchart which shows the execution procedure of the component mounting operation which the component mounting apparatus in one embodiment of this invention performs (A) (b) The figure which shows the state which has made the paste contact the components by the component mounting apparatus in one embodiment of this invention The figure which shows the state which has made the paste contact the components by the component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 mounts the component 3 on the substrate 2 and executes the component mounting method of the present invention. The component mounting apparatus 1 includes a base 11 including a board transport mechanism 12, a component supply unit 13, a component mounting mechanism 14, a component imaging unit 15, and a paste supply unit 16. Here, for convenience of explanation, the left-right direction of the component mounting apparatus 1 as viewed from the operator OP is the X-axis direction, and the front-rear direction is the Y-axis direction. Also, the vertical direction is the Z-axis direction.

  In FIG. 1, the substrate transport mechanism 12 transports the substrate 2 in the X-axis direction (arrow A shown in the figure) by a pair of front and rear conveyors 12 a and positions it at a work position near the center of the base 11. . The component supply unit 13 includes a plurality of tape feeders 13a. The plurality of tape feeders 13a are arranged side by side in the X-axis direction on the front side of the base 11 (the front side as viewed from the operator OP). Each tape feeder 13a continuously supplies the component 3 to the component supply port 13K located at the end on the rear side (the back side as viewed from the operator OP).

  In FIG. 1, the component mounting mechanism 14 includes a head moving mechanism 21 provided on the base 11 and a mounting head 22 moved by the head moving mechanism 21. The head moving mechanism 21 includes a fixed table 21a, a moving table 21b, and a moving plate 21c. The fixed table 21a is fixed to the base 11 and extends above the base 11 in the Y-axis direction. The moving table 21b extends in the X-axis direction, and one end (right end) is movable along the fixed table 21a. The moving plate 21c is movably provided along the moving table 21b. The mounting head 22 is attached to the moving plate 21c.

  In FIG. 1, the mounting head 22 includes a plurality of component suction nozzles 22a extending downward. Each nozzle 22a can freely move up and down and rotate around the Z axis with respect to the mounting head 22, and a component suction port for sucking the component 3 is formed at the lower end. The mounting head 22 includes a suction mechanism 22b, and the suction mechanism 22b is connected to a vacuum source (not shown). The suction mechanism unit 22b generates a vacuum suction force at the component suction port of each nozzle 22a by controlling the vacuum pressure supplied from the vacuum source.

  The head moving mechanism 21 moves the mounting head 22 in the horizontal plane (in the XY plane) by moving the moving table 21b in the Y-axis direction relative to the fixed table 21a and moving the moving plate 21c in the X-axis direction relative to the moving table 21b. Move in the direction. The component mounting mechanism 14 operates to mount the component 3 on the substrate 2 positioned at the work position by the substrate transport mechanism 12.

  In FIG. 1, the component imaging unit 15 is provided in an area between the substrate transport mechanism 12 and the component supply unit 13 of the base 11. The component imaging unit 15 includes a camera with an imaging field of view facing upward. The component imaging unit 15 images an object passing through above (specifically, the component 3 picked up by the mounting head 22) from below.

  In FIG. 1, the paste supply unit 16 is provided at a position adjacent to the tape feeder 13 a of the component supply unit 13. As shown in FIGS. 2 and 3, the paste supply unit 16 has a dish-like stage 31, a squeegee unit 32 provided above the stage 31 and provided with a squeegee 32 a extending in the X-axis direction. The stage drive unit 33 that moves the stage 31 in the front-rear direction is provided. A paste Pst is stored on the stage 31. When the stage 31 is moved in the Y-axis direction with respect to the squeegee unit 32 by the stage drive unit 33, the paste Pst on the stage 31 is relatively scraped by the squeegee 32a, and the film-like paste Pst is formed on the stage 31. Formed (FIG. 3).

  2 and 4, the transfer region TR is predetermined on the stage 31. The paste supply unit 16 supplies the paste Pst to the region including the transfer region TR defined on the stage 31. The transfer region TR is defined as a region where the thickness T (FIG. 3) of the formed film-like paste Pst is stably constant among the regions on the stage 31.

  The shape of the transfer region TR is arbitrary, but in this embodiment, as shown in FIG. 4, it is a rectangular region having four sides parallel to the X-axis direction and the Y-axis direction, respectively. In the present embodiment, the transfer region TR has a lateral dimension (dimension in the X-axis direction) Lx as viewed from the operator OP and a vertical dimension (dimension in the Y-axis direction) Ly as viewed from the operator OP. It has become. Further, the maximum dimension Sy in the Y-axis direction of the component 3 handled by the component mounting apparatus 1 in the present embodiment is smaller than the vertical dimension Ly of the transfer region TR (Ly> Sy), and the component 3 is in the transfer region TR in plan view. It is a size that can fit inside.

  In FIG. 5, each operation control of the substrate transport mechanism 12, each tape feeder 13 a, the head moving mechanism 21, and the suction mechanism unit 22 b and the control of the imaging operation of the component imaging unit 15 are controlled by the control device 40 included in the component mounting apparatus 1. Performed by the unit 40a. The operation control unit 40a of the control device 40 also performs operation control of the stage drive unit 33 provided in the paste supply unit 16. Image data obtained by the imaging of the component imaging unit 15 is sent to the control device 40, and the image recognition unit 40b of the control device 40 recognizes the image.

  In FIG. 5, a touch panel 41 is connected to the control device 40. The touch panel 41 functions as an input device for the worker OP to make a necessary input to the control device 40, and the control device 40 displays the state of the component mounting apparatus 1 on the worker OP or gives a work instruction to the worker OP. Function as an output device.

  Next, a component mounting method by the component mounting apparatus 1 in the present embodiment will be described in accordance with an execution procedure of a component mounting operation for mounting the component 3 on the substrate 2 by the component mounting apparatus 1. The component mounting work by the component mounting apparatus 1 is started when the operator OP performs a work start operation from the touch panel 41.

  When the operator OP performs a work start operation, first, the substrate transport mechanism 12 is operated under the control of the control device 40, and receives and carries the substrate 2 supplied from the outside and positions it at the work position (FIG. 6). Step ST1 of substrate loading step). When the substrate transport mechanism 12 positions the substrate 2 at the work position, the paste supply unit 16 moves the stage 31 with respect to the squeegee 32a and supplies the paste Pst to the transfer region TR (paste supply process of step ST2).

  When the paste supply unit 16 supplies the paste Pst to the transfer region TR, the mounting head 22 is driven by the head moving mechanism 21 and moves above the component supply unit 13. And the component 3 which each tape feeder 13a supplies to the component supply port 13K is adsorb | sucked by the nozzle 22a (component adsorption process of step ST3).

  In the transfer region TR, a reference position KJ is set as a target movement position of the nozzle 22a when the component 3 is brought into contact with the paste Pst (FIG. 4). The reference position KJ is determined such that if the nozzle 22a that sucks the central portion 3C of the part 3 is moved to that position and the part 3 is brought into contact with the paste Pst, the part 3 does not protrude from the transfer region TR. The position is set to In the present embodiment, specifically, the reference position KJ is set to a position on a line parallel to the X axis through the midpoint of the vertical side of the transfer region TR (FIG. 4).

  When the nozzle 22a sucks the component 3, the determination unit 40c of the control device 40 moves the nozzle 22a that sucks the component 3 to the reference position KJ (FIG. 4) and brings the component 3 into contact with the paste Pst. 3 determines whether or not to contact the paste Pst without protruding from the transfer region TR (determination step of step ST4). The determination unit 40c makes the above determination based on the transfer area TR size data given in advance, the size data of the component 3, the suction position data of the nozzle 22a with respect to the component 3, and the like.

  In the present embodiment, as described above, the reference position KJ is moved out of the transfer region TR when the central portion 3C of the component 3 is moved to that position and the component 3 is brought into contact with the paste Pst. Since the nozzle 22a sucks the central portion 3C of the component 3 in the component suction step, the nozzle 22a is moved to the reference position KJ and the component 3 is pasted. If it is brought into contact with Pst, the component 3 comes into contact with the paste Pst without protruding from the transfer region TR (FIG. 4). For this reason, the determination part 40c may perform the said determination process only when the nozzle 22a adsorb | sucks parts other than the center part 3C of the components 3 at the component adsorption | suction process.

  When the controller 40 determines that the component 3 protrudes from the transfer region TR and contacts the paste Pst in the determination step, as shown in FIG. 7A, the controller 3 does not protrude the component 3 from the transfer region TR. The position of the movement destination of the nozzle 22a that can be brought into contact with the paste Pst is calculated, and the calculated position is set as the nozzle movement destination position NS (FIG. 7B) (nozzle movement destination position setting step in step ST5). . As the nozzle movement destination position NS, for example, a position where the nozzle 22a that sucks the part 3 is located when the center part 3C of the part 3 is positioned at the reference position KJ is set.

  In step ST4, the control device 40 determines that the component 3 protrudes from the transfer region TR and comes into contact with the paste Pst. When the nozzle movement destination position NS is set in step ST5, the control device 40 sets the nozzle movement destination position NS to the set nozzle movement destination position NS. The nozzle 22a is moved (step ST6), and the component 3 is brought into contact with the paste Pst (FIG. 7 (b). Paste contacting step of step ST7). On the other hand, if it is determined in step ST4 that the component 3 comes into contact with the paste Pst without protruding from the transfer region TR, the control device 40 moves the nozzle 22a that has sucked the component 3 in the component suction step to the reference position KJ. (Step ST8), and the component 3 is brought into contact with the paste Pst (FIG. 4. Paste contacting step of step ST7).

  The mounting head 22 pulls up the nozzle 22a when the component 3 is brought into contact with the paste Pst and the paste Pst is attached to the component 3 in the paste contact process. Then, the component 3 that has moved above the substrate 2 and is brought into contact with the paste Pst in the paste contact step is mounted at a predetermined position (component mounting position) on the substrate 2 (component mounting step in step ST9).

  In the component mounting step, the mounting head 22 mounts the component 3 on the component mounting portion on the substrate 2 after causing the component imaging unit 15 to image the component 3 to which the paste Pst is attached. The control device 40 performs image recognition based on the image of the component 3 captured by the component imaging unit 15 and controls the operation of the mounting head 22 so that the component 3 is mounted on the substrate 2 in a correct posture.

  Here, in the case where the nozzle 22a could not attract the central portion 3C of the component 3, as shown in FIG. 7B, the set nozzle movement destination position NS is farther from the substrate 2 than the reference position KJ. If it is located on the side close to the operator OP, the center 3C of the part 3 is positioned at the reference position KJ with the nozzle 22a rotated 180 degrees, and the part 3 is pasted into the paste Pst. The nozzle movement destination position NS may be positioned closer to the substrate 2 than the reference position KJ (FIG. 8). That is, in the nozzle movement destination position setting step, the movement destination of the nozzle 22a may be positioned closer to the substrate 2 than the reference position KJ. As in the present embodiment, when the paste supply unit 16 is set at a position relatively far from the substrate 2 positioned at the work position, the paste transfer to the component 3 is performed by the head moving mechanism 21 on the mounting head 22. In many cases, it is performed at the limit of the movable range, and when the set nozzle movement destination position NS is located farther from the substrate 2 than the reference position KJ, the component 3 cannot be brought into contact with the paste Pst. This is because a case can occur.

  When the component 3 is mounted on the substrate 2 as described above, the control device 40 determines whether there is an unmounted component 3 that is not yet mounted on the substrate 2 (determination step of step ST10). If it is determined that there is an unmounted component 3, the process returns to the paste supply process in step ST2, and if it is determined that there is no unmounted component 3, the substrate transport mechanism 12 transports the substrate 2 to mount the component. It is carried out of the apparatus 1 (substrate carrying-out process in step ST11). As a result, the component mounting operation for one board 2 by the component mounting apparatus 1 is completed.

  As described above, in the component mounting method by the component mounting apparatus 1 according to the present embodiment, the component 22 is pasted by moving the nozzle 22a to the reference position KJ set with respect to the transfer region TR before the paste contact step. If the part 3 is brought into contact with the Pst, it is determined whether or not the part 3 comes into contact with the paste Pst without protruding from the transfer region TR. For this reason, when it is determined that the component 3 comes into contact with the paste Pst without protruding from the transfer region TR, the component 3 can be brought into contact with the paste Pst by moving the nozzle 22a to the reference position KJ. When it is determined that the component 3 protrudes from the transfer region TR and comes into contact with the paste Pst, the position of the movement destination of the nozzle 22a that allows the component 3 to contact the paste Pst without protruding from the transfer region TR ( The nozzle movement destination position NS) is set, and the component 22 can be brought into contact with the paste Pst by moving the nozzle 22a to the set nozzle movement destination position NS.

  For this reason, according to the component mounting method in the present embodiment, the component 3 can be reliably brought into contact with the paste Pst in the transfer region TR regardless of the size of the component 3 or the suction position of the nozzle 22a with respect to the component 3. Therefore, it is possible to prevent the component 3 from being attached to the board 2 and prevent the component 3 from being poorly attached without increasing the size of the paste supply unit 16.

  Provided is a component mounting method capable of preventing a component from being poorly attached to a substrate by preventing a component from being insufficiently attached to a substrate without increasing the size of a paste supply unit.

2 Substrate 3 Component 3C Center 22a Nozzle TR Transfer area Pst Paste KJ Reference position NS Nozzle movement destination position

Claims (5)

A paste supplying step for supplying a paste to a predetermined transfer region;
A component adsorption process for adsorbing components with a nozzle;
A paste contact step of moving the nozzle that has adsorbed the component in the component adsorption step to bring the component into contact with the paste;
A component mounting method including a component mounting step of mounting the component brought into contact with the paste in the paste contact step on a substrate,
In the transfer area, a reference position is set as a target movement position of the nozzle when the component is brought into contact with the paste.
Before the paste contact step, if the nozzle that has sucked the part is moved to the reference position and the part is brought into contact with the paste, does the part come into contact with the paste without protruding from the transfer area? Execute a judgment process to judge whether or not,
In the determination step, when it is determined that the component comes into contact with the paste without protruding from the transfer region, the paste contact step is performed by moving the nozzle to the reference position. Component mounting method.   In the determination step, when it is determined that the component protrudes from the transfer region and comes into contact with the paste, the nozzle of the nozzle that can contact the paste without protruding the component from the transfer region. The nozzle movement destination position setting step for setting a movement destination position is executed, and the paste contact step is executed by moving the nozzle to the set movement destination position of the nozzle. The component mounting method described.   In the determination step, when it is determined that the component protrudes from the transfer region and comes into contact with the paste, the center portion of the component is moved to the reference position in the nozzle movement destination position setting step. 2. The component mounting method according to claim 1, wherein a position at which the nozzle that adsorbs the component is located is set as a movement destination position of the nozzle.   The component mounting method according to claim 1, wherein the determination step is executed when the nozzle sucks a portion other than a central portion of the component in the component suction step.   5. The component mounting method according to claim 4, wherein, in the nozzle movement destination position setting step, the movement destination of the nozzle is positioned closer to the substrate than the reference position.

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