JP2011060987A - Method of packaging electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of packaging electronic components, capable of fitting electronic components to a substrate by making an appropriate amount of paste adhere only to a bump without making the paste adhere to a projection when the projection for prohibiting adhesion of the paste is provided on a bump formation surface of the electronic components in addition to the bump. <P>SOLUTION: A paste film Pm including a groove-like paste film non-deposition region R is formed on an upper surface 13s of a table 13. While the projection T for prohibiting adhesion of the paste Pst, which is provided on the bump formation surface cf of the electronic component Pt, is being positioned directly above the paste film non-deposition region R, and the bump bp is being located directly above the paste film Pm, the electronic components Pt are brought closer to the table 13 for making the paste Pst adhere to the bump bp. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method for mounting an electronic component with a bump on a substrate in a posture in which a bump forming surface faces downward.

  The electronic component mounting device moves the upper surface of the bumped electronic component supplied in a face-down orientation with the bump forming surface facing downward by the mounting head and moves it above the thin film (paste film) of paste such as flux. Then, the mounting head is lowered from there and the paste is attached to the bumps, and then the mounting head is moved above the substrate to mount the electronic component on the substrate. Here, the paste film forming apparatus for forming the paste film moves the squeegee installed above the table relative to the table to which the paste is supplied, so that the gap (gap) between the upper surface of the table and the squeegee is set. A paste film having a corresponding thickness is formed on the table.

  In such a paste film forming apparatus, the paste film is formed to have a uniform thickness smaller than the height of the bump, and the mounting head is lowered so that the bump contacts the upper surface of the table from above. Appropriate amount of paste can be attached to all the bumps, but there is warping deformation (usually deformation in a shape that protrudes downward with the peripheral part higher than the central part in the face-down state) The bumps in the central part of the electronic component and the bumps in the peripheral part of the electronic component have different relative height positions. Even if the bumps in the central part are brought into contact with the upper surface of the table, the bumps in the peripheral part are not Since it is in a state of floating from the upper surface, an appropriate amount of paste cannot be attached to all the bumps with a paste film having a uniform thickness. For this reason, conventionally, when the electronic component is warped and deformed, the size of the gap is changed in conjunction with the relative movement of the squeegee with respect to the table, and the shape of the upper surface of the paste film is curved according to the warp of the electronic component. By doing so, an appropriate amount of paste can be attached not only to the bumps in the central part but also to the bumps in the peripheral part (Patent Document 1).

JP 2008-66624 A

  However, if the bump formation surface of the electronic component is provided with bumps or protrusions that prohibit the adhesion of paste, the paste film formed to a uniform thickness and the shape of the top surface are curved. In the pasted film, it is extremely difficult to attach the electronic component to the substrate by attaching an appropriate amount of paste only to the bumps without attaching the paste to the protruding portion.

  Therefore, according to the present invention, when the bump forming surface of the electronic component is provided with a protrusion that prohibits the adhesion of paste in addition to the bump, an appropriate amount of paste is attached only to the bump without attaching the paste to the protrusion. An object of the present invention is to provide an electronic component mounting method capable of mounting an electronic component on a substrate.

The electronic component mounting method according to claim 1, wherein a bump-formed electronic component having a bump formed on the bump-formed surface and a plurality of bumps located between the bumps is formed on the bump-formed surface. Is an electronic component mounting method for mounting on a substrate with a posture facing downward, a step of forming a paste film having a groove-like paste film non-deposition region on the upper surface of the table, and an electron with the bump forming surface facing downward The process of sucking and holding the upper surface of the component by the mounting head, and moving the mounting head holding the upper surface of the electronic component by sucking and holding the bump forming surface downward, the protruding part of the electronic component does not form a paste film A step of positioning the mounting head relative to the table so that the bumps are positioned directly above the paste film and the mounting head positioned relative to the table Lowering the table against the table, placing the electronic component close to the table and attaching the paste to the bump, and raising the mounting head to the table so that the electronic component with the paste attached to the bump is pulled up above the table And moving the mounting head above the substrate, positioning the mounting head with respect to the substrate so that the bumps of the electronic components are positioned above the electrodes provided on the substrate, and positioning with respect to the substrate. Lowering the mounted head with respect to the substrate and bringing the bumps into contact with the electrodes.

  The electronic component mounting method according to claim 2 is the electronic component mounting method according to claim 1, wherein the upper surface of the electronic component with the bump forming surface facing downward is sucked and held by the mounting head, and then the electronic component is mounted. The mounting head with respect to the table is executed based on the detected position deviation of the electronic component with respect to the mounting head. And positioning of the mounting head with respect to the substrate.

  In the present invention, a paste film having a groove-like paste film non-deposition region is formed on the upper surface of the table, and the protrusion provided on the bump formation surface of the electronic component is prohibited from being pasted. The paste is attached to the bump by placing the electronic component close to the table with the bump positioned directly above the area and the bump is positioned directly above the paste film. Since paste does not adhere because it is located in the non-deposited area of the paste film, even if the bump formation surface of the electronic component is provided with a protrusion that prohibits the attachment of paste in addition to the bump, the paste is applied to the protrusion. Without adhering, an appropriate amount of paste can be attached only to the bumps and the electronic component can be mounted on the substrate.

The block diagram of the electronic component mounting apparatus in one embodiment of this invention The perspective view of the paste film forming apparatus with which the electronic component mounting apparatus in one embodiment of this invention is provided The side view of the paste film forming apparatus with which the electronic component mounting apparatus in one embodiment of this invention is provided (A) (b) (c) (d) Operation | movement explanatory drawing of the paste film forming apparatus with which the electronic component mounting apparatus in one embodiment of this invention is provided (A) (b) (c) (d) Operation | movement explanatory drawing of the paste film forming apparatus with which the electronic component mounting apparatus in one embodiment of this invention is provided (A) (b) Explanatory drawing of the paste film non-film-forming area | region formed on the table of the paste film formation apparatus in one embodiment of this invention The flowchart which shows the execution procedure of the mounting process of the electronic component performed with the electronic component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing of the electronic component mounting apparatus in one embodiment of this invention (A) (b) (c) Operation | movement explanatory drawing of the electronic component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, an electronic component mounting apparatus 1 according to an embodiment of the present invention includes a plurality of bumps bp arranged in two rows on a bump formation surface cf (see an enlarged view of FIG. 1), and two rows of bumps. A component supply unit 2 for supplying an electronic component Pt having a protruding portion T protruding in the same direction as the bump bp at an intermediate portion between bp in a face-down posture with the bump forming surface cf facing downward, and an electrode on the upper surface A substrate holding unit 3 for holding a substrate Pb provided with DT, a mounting head 6 provided movably by a three-axis orthogonal robot 4 and having a suction nozzle 5 detachable at the lower end, and a thin film of paste Pst such as flux A paste film forming apparatus 7 for forming a film (hereinafter referred to as a paste film Pm), a substrate camera 8 provided on the mounting head 6 with the imaging field of view facing downward, and a component camera 9 with the imaging field of view facing upward. It is configured Te.

  As shown in FIGS. 2 and 3, the paste film forming apparatus 7 includes a base portion 11 provided on a base Bs (FIG. 3) provided in the electronic component mounting apparatus 1, and the base portion 11 on a horizontal plane. A pair of slide guides 12 provided extending in one direction (X-axis direction), a table 13 provided movably in the X-axis direction along the slide guide 12 above the base portion 11, and a table The ball screw 14 extending through (screwing) the inside of the block portion 13a provided in the lower part of the block 13a in the X-axis direction is rotationally driven around the X-axis to drive the table 13 along the slide guide 12 in the X-axis direction. A table drive motor 15 for reciprocating the table 13 and a squeegee unit 16 installed above the table 13.

  2 and 3, the squeegee unit 16 includes a squeegee base 21 fixed to the base Bs, and a direction below the squeegee base 21 in a horizontal plane perpendicular to the X-axis direction (Y-axis direction). And a squeegee 22 provided so as to be movable up and down in the vertical direction (Z-axis direction) with respect to the squeegee base 21, and the squeegee 22 on the squeegee base 21. A squeegee lifting motor 23 that moves up and down, and a “spar” -like member that extends below the squeegee base 21 in the Y-axis direction and faces the squeegee 22 in the X-axis direction, and extends downward from the squeegee base 21. The scraper 26 is supported by the scraper guide 24 so as to be movable up and down, and is urged downward by an urging spring 25. When the squeegee 22 is moved up and down by the squeegee lifting motor 23, the size of the gap Gp (see the enlarged view in FIG. 3) that is the distance between the upper surface 13s of the table 13 and the lower edge 22s of the squeegee 22 is changed.

  The table 13 is driven in one direction along the front-rear direction of the base Bs (this direction is defined as the direction of the base Bs) when the table drive motor 15 is rotationally driven in one direction (positive direction) around the axis of the ball screw 14. In the state where the table 13 is located at the forefront (the state shown in FIG. 3), the rear end of the table 13 is located immediately after the scraper 26. Further, the table 13 is moved to the rear of the base Bs by rotation driving in a direction opposite to the one direction around the axis of the ball screw 14 by the table driving motor 15 (reverse direction), and the table 13 is moved to the last. In the state of being located, the front end of the table 13 is located immediately before the squeegee 22.

  In FIG. 1, the control device 30 included in the electronic component mounting apparatus 1 controls the operation of a robot drive unit 31 that drives the three-axis orthogonal robot 4 to move the mounting head 6 in a horizontal plane. Further, the control device 30 controls the operation of the suction mechanism 32 connected to the suction nozzle 5 provided in the mounting head 6 so that the suction nozzle 5 sucks and holds the electronic component Pt, or cancels the suction and hold to remove the suction nozzle 5 from the suction nozzle 5. The electronic component Pt is removed.

  In FIG. 1, the control device 30 controls the imaging operation of the board camera 8 and the component camera 9, and image data obtained by the imaging operation of the board camera 8 and the component camera 9 is captured and stored in the storage unit 33.

  In FIG. 1, the control device 30 controls the operation of the table drive motor 15 and the squeegee lifting motor 23 from the paste film formation controller 30 a to form (deposit) a paste film Pm on the upper surface 13 s of the table 13. Specifically, the control device 30 operates the squeegee lifting motor 23 to adjust the size of the gap Gp and then operates the table drive motor 15 to move the table 13 relative to the squeegee 22 in the horizontal direction. (Arrow A shown in FIG. 1), a paste film Pm having a thickness t (FIG. 3) corresponding to the size of the gap Gp is formed on the table 13. Normally, the thickness t of the paste film Pm is about 60% of the size of the gap Gp.

  When the paste film Pm is formed by the paste film forming device 7, the control device 30 first performs the scraping of the paste Pst by the scraper 26. In the scraping of the paste Pst by the scraper 26, the control device 30 operates the squeegee lifting motor 23 to raise the squeegee 22 so that the lower edge 22 s of the squeegee 22 does not contact the paste Pst on the table 13. The table drive motor 15 is rotationally driven in the reverse direction described above, and the table 13 is moved rearward (FIG. 4A) (see arrow B1 shown in the figure). As a result, the paste Pst on the table 13 is scraped forward of the table 13 by the scraper 26 pressed against the upper surface 13s of the table 13 by the biasing spring 25 (FIG. 4B).

  After scraping the paste Pst by the scraper 26, the control device 30 operates the squeegee lifting motor 23 to lower the squeegee 22 and adjusts the size of the gap Gp (FIG. 4C). The table drive motor 15 is rotationally driven in the above-described positive direction to move the table 13 forward (see arrow B2 shown in FIG. 4D). As a result, the paste Pst on the table 13 is scraped by the squeegee 22 behind the table 13 leaving a paste Pst having a thickness corresponding to the size of the gap Gp (FIG. 4C). A paste film Pm having a thickness t corresponding to the size of the gap Gp is formed in the region in front of the squeegee 22 (FIG. 4D).

  When the squeegee 22 reaches almost the center of the table 13, the control device 30 once stops the moving operation of the table 13, operates the squeegee lifting motor 23 to lower the squeegee 22, and lowers the lower edge of the squeegee 22. 22s is brought into contact with the upper surface 13s of the table 13, and the size of the gap Gp is made zero (FIG. 5A) (see arrow C2 shown in the figure). Then, the movement of the table 13 is resumed (arrow B3 shown in FIG. 5B), and when the table 13 moves relative to the squeegee 22 by a predetermined distance, the movement operation of the table 13 is stopped again (FIG. 5 ( b)). Then, the squeegee raising / lowering motor 23 is operated to raise the squeegee 22 (see arrow C3 shown in FIG. 5 (c)), and the size of the gap Gp is returned to the original value (FIG. 5 (c)), and then the table. 13 starts to move (arrow B4 shown in FIG. 5D).

  As a result, a paste film Pm having a thickness t having a groove-like paste film non-deposition region R (region where the paste film Pm is not formed) is formed on the table 13 (FIG. 2). If the distance that the table 13 is moved relative to the squeegee 22 with the gap Gp set to zero is Δ, the width of the groove-like paste film non-deposition region R (dimension in the X-axis direction). ) Becomes Δ (FIG. 5 (c) and FIG. 5 (d)).

Here, the width Δ of the paste film non-deposition region R is, as shown in FIG. 6A, between the two rows of bumps bp located on the bump formation surface cf of the electronic component Pt with the protrusion T interposed therebetween. The size is smaller than the shortest distance D and larger than the width d of the protruding portion T located in the middle portion between the two rows of bumps bp, and the protruding portion T is in the groove-like paste film non-deposition region R. When the electronic component Pt is positioned and lowered with respect to the table 13 so as to be accommodated, as shown in FIG. 6B, the two rows of bumps bp sandwiching the protruding portion T are not formed into a paste film, respectively. The paste film Pm on both sides of the region R can be contacted.

  In the electronic component mounting apparatus 1 provided with such a paste film forming apparatus 7, when the control device 30 executes the mounting process of the electronic component Pt for mounting the electronic component Pt on the substrate Pb, the control device 30 is first configured as described above. According to the procedure, a paste film Pm having a thickness t having a groove-like paste film non-film-forming region R having a width Δ is formed on the table 13 provided in the paste film forming apparatus 7 (step ST1 shown in FIG. 7).

  When the control device 30 forms the paste film Pm having the thickness t having the groove-like paste film non-film formation region R having the width Δ on the table 13 of the paste film forming device 7, the bump forming surface is supplied from the component supply unit 2. After the upper surface of the electronic component Pt supplied with cf downward is sucked and held by the mounting head 6 (step ST2 shown in FIG. 7), the mounting head 6 is moved to a position immediately above the component camera 9, and then the component is moved. The camera 9 is operated and the electronic component Pt is imaged from below (step ST3 shown in FIG. 7). Then, the control device 30 performs image recognition processing based on the image data of the electronic component Pt obtained by imaging in the image recognition unit 30b (FIG. 1), and the positional deviation of the electronic component Pt with respect to the mounting head 6 (suction nozzle 5). Is detected (step ST4 shown in FIG. 7).

  When the control device 30 detects the positional deviation of the electronic component Pt with respect to the mounting head 6, the control device 30 moves the mounting head 6 holding the upper surface of the electronic component Pt with the bump forming surface cf downward to the upper side of the table 13, and step Based on the positional displacement of the electronic component Pt with respect to the mounting head 6 detected in ST4, the protruding portion T of the electronic component Pt is positioned immediately above the paste film non-film formation region R, and the bump bp is positioned directly above the paste film Pm. Thus, the mounting head 6 is positioned with respect to the table 13 (step ST5 shown in FIG. 7; FIG. 6A).

  After positioning the mounting head 6 with respect to the table 13, the control device 30 lowers the mounting head 6 with respect to the table 13 (FIG. 8A, see arrow D <b> 1 shown in the figure), and moves the electronic component Pt. The paste Pst is adhered to the bump bp in proximity to the table 13 (step ST6 shown in FIG. 7; FIGS. 6B and 8B). At this time, since the protruding portion T descends above the paste film non-deposition region R, the paste Pst does not adhere to the protruding portion T. At this time, the bump bp is brought into contact with the upper surface 13s of the table 13 so that the bump bp is immersed in the paste Pst corresponding to the thickness t of the paste film Pm (see FIG. 6B). As a result, even if the bump forming surface cf of the electronic component Pt is provided with a protrusion T that prohibits the adhesion of the paste Pst in addition to the bump bp, the paste Pst is not attached to the protrusion T. An appropriate amount of paste Pst can be attached only to the bumps bp.

  When the electronic component Pt is brought close to the paste film Pm and the bump bp is attached to the paste Pst, the control device 30 is mounted so that the electronic component Pt having the paste Pst attached to the bump bp is pulled up above the table 13. The head 6 is raised with respect to the table 13 (step ST7 shown in FIG. 7; see arrow D2 shown in FIG. 8C). Each bump bp of the electronic component Pt pulled up above the table 13 is in a state in which the outer peripheral surface is covered with the paste Pst corresponding to the height t of the paste film Pm (in FIG. 8C). See enlarged view).

When the mounting head 6 is raised with respect to the table 13, the control device 30 moves the mounting head 6 above the substrate Pb (step ST8 shown in FIG. 7), and the electronic component Pt for the mounting head 6 detected in step ST4. The mounting head 6 is positioned with respect to the substrate Pb so that the bumps bp of the electronic component Pt are positioned above the electrodes DT provided on the substrate Pb (step ST9 shown in FIG. 7). (A)). Then, the mounting head 6 positioned with respect to the substrate Pb is lowered with respect to the substrate Pb (arrow E1 shown in FIG. 9A), and the bump bp is brought into contact with the electrode DT on the substrate Pb (FIG. 9). 9 (b)), the suction of the electronic component Pt by the mounting head 6 is released, and the mounting head 6 is raised with respect to the substrate Pb (FIG. 9C. Arrow E2 shown in the figure), and the electronic component Pt is moved. It is mounted on the substrate Pb (step ST10 shown in FIG. 7).

  When the electronic component Pt is mounted on the substrate Pb, the control device 30 determines whether or not all the electronic components Pt to be mounted on the substrate Pb have been mounted (step ST11 shown in FIG. 7). As a result, when the mounting of all the electronic components Pt to be mounted on the substrate Pb has not been completed, the control device 30 returns to step ST2 and mounts the electronic components Pt that are not yet mounted. In addition, when the bumps bp of the electronic component Pt are brought into contact with the paste film Pm in the execution process of the mounting process of the electronic component Pt that is repeatedly performed, a place where the bump pb of the other electronic component Pt has been previously contacted is avoided. The bump bp is brought into contact with the portion formed at the target thickness t. On the other hand, if it is determined in step ST11 that all the electronic components Pt to be mounted on the substrate Pb have been mounted, the mounting process of the electronic components Pt on the substrate Pb is ended.

  As described above, in the electronic component mounting method according to the present embodiment, the protruding portion T where the adhesion of the paste Pst is prohibited is formed on the bump forming surface cf, and the plurality of bumps bp located between the protruding portions T are formed. In this method, the electronic component Pt with the bump bp is mounted on the substrate Pb with the bump forming surface cf facing downward, and the groove-like paste film non-film forming region is formed on the upper surface 13s of the table 13 provided in the paste film forming apparatus 7. A step of forming a paste film Pm having R (step ST1), a step of attracting and holding the upper surface of the electronic component Pt with the bump formation surface cf facing downward by the mounting head 6 (step ST2), and a bump formation surface cf The mounting head 6 that sucks and holds the upper surface of the electronic component Pt facing downward is moved above the table 13, and the protruding portion T of the electronic component Pt is a paste film non-deposition region. The step of positioning the mounting head 6 with respect to the table 13 so that the bumps bp are positioned immediately above the paste film Pm (step ST5), and the mounting head 6 positioned with respect to the table 13 is mounted on the table 13 , The step of bringing the electronic component Pt close to the table 13 and attaching the paste Pst to the bump bp (step ST6), and the electronic component Pt having the paste Pst attached to the bump bp is pulled up above the table 13 After the mounting head 6 is raised with respect to the table 13 (step ST7), the step of moving the mounting head 6 above the substrate Pb (step ST8) and the upper side of the electrode DT provided on the substrate Pb The mounting head 6 is positioned with respect to the substrate Pb so that the bumps bp of the electronic component Pt are positioned on the substrate Pb. And step (step ST9) for performing, the mounting head 6 performing the positioning with respect to the substrate Pb is lowered relative to the substrate Pb, which is intended to include the step of contacting the bump bp to electrode DT (Step ST10).

  As described above, in the electronic component mounting method according to the present embodiment, the paste film Pm having the groove-like paste film non-deposition region R is formed on the upper surface 13s of the table 13, and is provided on the bump formation surface cf of the electronic component Pt. The electronic component Pt is brought close to the table 13 in a state where the protruding portion T where the adhesion of the paste Pst is prohibited is located immediately above the paste film non-film formation region R and the bump bp is located directly above the paste film Pm. The paste Pst is attached to the bump bp, and when the paste Pst is attached to the bump bp, the protruding portion T is located in the paste film non-film formation region R and the paste Pst is not attached. Even if the bump formation surface cf is provided with a protrusion T that prohibits the adhesion of the paste Pst in addition to the bump bp, the paste Pst is applied to the protrusion T. Without attaching an electronic component Pt can be attached to the substrate Pb and only adhere a suitable amount of the paste Pst bump bp.

In the present embodiment, after the upper surface of the electronic component Pt with the bump formation surface cf facing downward is sucked and held by the mounting head 6 (step ST2), the electronic component Pt is imaged from below (step ST3). Based on the obtained image of the electronic component Pt, a step (step ST4) of detecting the positional deviation of the electronic component Pt with respect to the mounting head 6 is executed, and the table is determined based on the detected positional deviation of the electronic component Pt with respect to the mounting head 6. Positioning of the mounting head 6 with respect to 13 (step ST5) and positioning of the mounting head 6 with respect to the substrate Pb (step ST9) are performed. Therefore, the mounting head 6 is positioned with respect to the table 13 for adhering an appropriate amount of paste Pst only to the bump bp without adhering the paste Pst to the protrusion T provided on the bump formation surface cf of the electronic component Pt. Can be performed with high accuracy.

  Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, the procedure for forming the paste film Pm having the groove-like paste film non-deposition region R on the table 13 is not limited to that described above, and may be another procedure. Further, in the above-described embodiment, the paste film Pm is formed on the table 13 by moving the table 13 supplied with the paste Pm relative to the squeegee 22 in the horizontal direction. The paste film Pm may be formed on the table 13 by relatively moving the squeegee 22 in the horizontal direction with respect to the table 13 to which is supplied. Further, in the above-described embodiment, the bumps bp located on the bump formation surface cf of the electronic component Pt with the protruding portion T interposed therebetween are two rows, but are not necessarily two rows.

  If the bump formation surface of the electronic component is provided with a protrusion that prohibits the attachment of paste in addition to the bump, attach an appropriate amount of paste only to the bump without attaching the paste to the protrusion. An electronic component mounting method that can be mounted on a substrate is provided.

6 Mounting head 13 Table 13s Upper surface Pst Paste Pm Paste film R Paste film non-deposition region Pt Electronic component cf Bump formation surface bp Bump T Protrusion Pb Substrate DT Electrode

Claims (2)

An electronic component for mounting a bumped electronic component with a bump formed on the bump forming surface and a bump formed on the substrate, with the bump formed surface facing downward. An implementation method,
Forming a paste film having a groove-like paste film non-deposition region on the upper surface of the table;
A process of sucking and holding the upper surface of the electronic component with the bump forming surface facing downward by the mounting head;
The mounting head holding the upper surface of the electronic component with the bump forming surface facing downward is moved above the table, the protruding part of the electronic component is located immediately above the non-paste film forming region, and the bump is the paste film Positioning the mounting head with respect to the table so that it is positioned directly above;
A step of lowering the mounting head that has been positioned with respect to the table, bringing the electronic component close to the table, and attaching paste to the bumps;
A step of moving the mounting head above the substrate after raising the mounting head with respect to the table so that the electronic component having the paste attached to the bump is pulled up above the table;
Positioning the mounting head with respect to the substrate so that the bumps of the electronic component are located above the electrodes provided on the substrate;
And a step of lowering a mounting head positioned with respect to the substrate with respect to the substrate and bringing the bumps into contact with the electrodes.   After the upper surface of the electronic component with the bump forming surface facing downward is sucked and held by the mounting head, the electronic component is imaged from below, and the position of the electronic component relative to the mounting head is detected based on the obtained image of the electronic component 2. The electronic component mounting method according to claim 1, further comprising: positioning the mounting head with respect to the table and positioning the mounting head with respect to the substrate based on the detected displacement of the electronic component with respect to the mounting head. .

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