JP2015142007A - Part mounting device and part mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part mounting device and a part mounting method that can reduce the amount of transfer material to be supplied to a stage and suppress the cost of the transfer material.SOLUTION: When a film of flux 8 is formed on a stage 24, a squeegee 28a moves to a height position at which a coating film formation interval q is coincident with a thickness t2 smaller than a proper thickness t1 for transferring the flux 8 onto a part. Under this state, a stage 24 moves in the section S1 corresponding to a first non-transfer area C1. Then, the squeegee 28a ascends to a height position at which the coating film formation interval q is coincident with the thickness t1, and under this state, the stage 24 moves in the section S2 corresponding to a transfer area B. Then, the squeegee 28a descends to a height position at which the coating film formation interval q is coincident with the thickness t2, and under this state, the stage 24 moves in the section S3 corresponding to a second non-transfer area C2. Thereafter, a mount head transfers the flux 8 onto the part in the transfer area B, and mounts the part on a board.

Description

  The present invention relates to a component mounting apparatus and a component mounting method for transferring a transfer material onto a component and mounting the transfer material on a substrate.

  As a form of mounting a component such as a BGA on a substrate to manufacture a mounting substrate, a method is known in which a component mounting apparatus is used to mount the component on a substrate electrode by solder bonding via bumps provided on the component. In this method, for the purpose of removing the oxide film adhering to the surface of the bump or electrode, the bump is landed on the electrode of the substrate in a state where a transfer material having an oxide film removing action such as flux is transferred to the bump. ing.

  For this reason, a component mounting apparatus including a transfer device that supplies a transfer material in a film-formed state is known (see, for example, Patent Document 1). Patent Document 1 discloses a transfer device that forms a coating film by reciprocating a stage having a film formation region so that a transfer material is thinly extended in the film formation region by a squeegee disposed at a predetermined gap from the stage. Is illustrated. In such a component mounting apparatus, the transfer material is transferred to the bumps formed on the lower surface of the component by lowering the mounting head that holds the component in the transfer region set in the film formation region, and the transfer material is transferred. The mounted component is mounted on the board. Thereafter, while the mounting head moves to the component supply unit and takes out a new component, the transfer device performs a film forming operation for moving the stage back and forth to form a transfer material in the film forming region.

  In the conventional transfer apparatus, including the example shown in Patent Document 1, a sensor is provided for detecting the remaining amount of the transfer material scraped by the squeegee after the film forming operation. Whether or not the transfer material can be replenished is determined based on the remaining amount detection result by this sensor, and when it is determined that the remaining amount is equal to or less than a predetermined value, the transfer material is replenished to the stage using a syringe or the like.

JP2013-74005A

  However, the conventional transfer apparatus has a problem that the transfer material is wasted due to the film forming operation being performed under the same conditions in all film forming regions. That is, above the area where the stage reciprocates, the above-described members such as the squeegee, syringe and sensor are fixed in the transfer device. Therefore, in order to prevent interference between each member of the transfer device and the mounting head at the time of transfer, it is necessary to set the moving distance of the stage long and keep both of them apart.

  However, since the film formation area increases in proportion to the movement distance of the stage, the longer the movement distance of the stage, the more wasteful non-transfer areas that do not contribute to the transfer to the bumps are formed in the film formation area. . In the conventional transfer apparatus, the film forming operation is performed with the height of the squeegee with respect to the stage being the same as that of the transfer area even in the non-transfer area. It was necessary to supply more transfer material to the stage.

  In addition, the transfer material replenishment determination was made based on the amount of transfer material required to form a coating film having a thickness necessary for transfer in all film formation regions including the non-transfer region. The transfer material was replenished despite a sufficient amount of transfer material remaining to form a coating in the area. Therefore, even if it is not necessary to replenish the transfer material, the transfer material may be replenished and the number of replenishments may increase. For this reason, there is a problem in that the amount of transfer material discarded after the production of the mounting substrate is increased, waste is generated, and the cost for the transfer material is increased.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can reduce the amount of transfer material supplied to a stage and reduce the cost of the transfer material.

  A component mounting apparatus according to the present invention is a component mounting apparatus that takes out a component from a component supply unit by a mounting head, transfers a transfer material to the component, and mounts it on a substrate. The component mounting device is transferred to the component held by the mounting head. A transfer device that supplies the transfer material in a film-formed state, the transfer device having a film formation region on which the transfer material is formed, stage moving means for reciprocating the stage, and the stage And a squeegee for forming a transfer material in the film formation region by moving the stage with a predetermined gap between the stage and the stage. In the area, a transfer area for transferring the transfer material to the part is set, and when the transfer material is deposited on the stage, the scan with respect to the stage other than the transfer area is set. Di height, lower than the height of the squeegee relative to the stage in the transfer region.

  The component mounting method of the present invention uses a component mounting apparatus provided with a transfer device that supplies a transfer material to be transferred to a component held by the mounting head in the form of a film. Is a component mounting method in which a transfer material is transferred to a component and mounted on a substrate, wherein the transfer device reciprocally moves the stage having a film formation region on which the transfer material is formed and the stage. A squeegee that is disposed so as to be movable up and down with respect to the stage driving means and the stage, and forms a transfer material in the film forming region by moving the stage with a predetermined gap between the stage driving means and the stage. A film forming step of forming a transfer material in the film forming region by moving the stage with respect to the squeegee, and a transfer material formed on the stage A transfer step for transferring to a component, and in the film formation step, the height of the squeegee other than the transfer region for transferring the transfer material to the component set in the film formation region is set in the transfer region. Lower the squeegee height.

  According to the present invention, the cost of the transfer material can be suppressed by reducing the amount of the transfer material supplied to the stage.

The top view of the component mounting apparatus in one embodiment of this invention The perspective view of the transcription | transfer apparatus with which the component mounting apparatus in one embodiment of this invention was equipped (A), (b) Structure explanatory drawing of the transfer device provided in the component mounting apparatus in one embodiment of the present invention Explanatory drawing of the film-forming area | region set to the stage in one embodiment of this invention The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention Flowchart of component mounting operation in one embodiment of the present invention Explanatory drawing of the film-forming operation | movement in one embodiment of this invention (A) (b) (c) Explanatory drawing of the film-forming operation | movement in one embodiment of this invention (A) Explanatory diagram of flux transfer operation in one embodiment of the present invention (b) Explanatory diagram of flux detection operation in one embodiment of the present invention (c) Scavenging operation in one embodiment of the present invention Illustration of The figure which shows the other example of the film-forming area | region set to the stage in one embodiment of this invention (A) (b) Explanatory drawing of film-forming operation | movement in one embodiment of this invention

  First, a component mounting apparatus according to an embodiment of the present invention will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting components on the substrate 2. On the base 1a of the component mounting apparatus 1, a board transfer mechanism 3 is disposed in the X direction (board transfer direction). The substrate transport mechanism 3 transports the substrate 2 to be mounted in the X direction and positions it at a predetermined mounting work position.

  Component supply units 4A and 4B are disposed on both sides of the substrate transport mechanism 3. A tray feeder 5 for supplying components having a plurality of bumps such as BGA (Ball Grid Array) stored in a tray 5a and a transfer device 6 are mounted in parallel in the X direction on the one-side component supply unit 4A. Yes. A plurality of tape feeders 7 for supplying small components such as chip components held on a carrier tape are set in the other component supply section 4B. In FIG. 2, the transfer device 6 has a function of supplying a flux (transfer material) 8 transferred to a component P held by a mounting head 11A described later in the state of a coating film. The flux 8 is a viscous fluid having an action of removing an oxide film adhering to the surface of the bump Pa (FIG. 3A) and the surface of the electrode of the substrate 2 connected to the bump Pa when mounting the component.

  In FIG. 1, a Y-axis moving table 9 provided with a linear drive mechanism is disposed at one end of the base 1a in the X direction in the Y direction perpendicular to the X direction in the horizontal plane. Similarly, two X-axis movement tables 10A and 10B each having a linear drive mechanism are coupled to the Y-axis movement table 9 so as to be movable in the Y direction. On the X-axis movement tables 10A and 10B, mounting heads 11A and 11B are mounted so as to be movable in the X direction. By driving the Y-axis movement table 9 and the X-axis movement table 10A, the mounting head 11A moves horizontally in the XY directions. Similarly, by driving the Y-axis movement table 9 and the X-axis movement table 10B, the mounting head 11B moves horizontally in the XY direction.

  1 and 2, the mounting heads 11A and 11B include a plurality of unit transfer heads 11a. The unit transfer head 11a includes a suction nozzle 12 capable of sucking the component P at the lower end, and the suction nozzle 12 can be individually moved in the vertical direction (Z direction) by driving the nozzle lifting mechanism 13 (FIG. 5). It has become. The mounting head 11 </ b> A has a function of sucking the component P supplied from the tray feeder 5 by the suction nozzle 12 and mounting it on the substrate 2 positioned at the mounting work position. The mounting head 11B has a function of sucking the component P supplied from the tape feeder 7 by the suction nozzle 12 and mounting it on the substrate 2 positioned at the mounting work position.

  In FIG. 1, the mounting heads 11 </ b> A and 11 </ b> B are provided with a substrate recognition camera 14 whose imaging field of view is directed downward. The substrate recognition camera 14 moves integrally with the mounting heads 11A and 11B, and images the substrate 2 from above. A component recognition camera 15 is disposed between the component supply units 4A and 4B and the board transport mechanism 3 in the base 1a. The component recognition camera 15 images the component P held by the mounting heads 11A and 11B moving above from below.

  Next, the structure of the transfer device 6 will be described with reference to FIGS. The transfer device 6 is configured by providing each part described below on a long base 20. The base unit 20 is detachable from the side opposite to the access direction of the mounting head 11A indicated by the arrow a, with the longitudinal direction aligned with the feeder base 17 (FIG. 3A) provided in the component supply unit 4A in the Y direction. Installed. In this specification, the side on which the mounting head 11A accesses the transfer device 6 is defined as the front side, and the opposite direction is defined as the rear side.

  The transfer device 6 is provided with an engaging portion 20a that engages with the feeder base 17 and fixes the base portion 20, and a handle 21 projects from the rear of the engaging portion 20a. When the transfer device 6 is mounted on the feeder base 17, the lower surface side of the base portion 20 is aligned with the upper surface of the feeder base 17 and the handle 21 is gripped and pushed forward. Thereby, the engaging part 20a engages with the rear end part 17a of the feeder base 17, and the base part 20 is mounted at a predetermined position.

  3A and 3B, a guide rail 22 is disposed on the upper surface of the base portion 20 in the longitudinal direction, and the slider 23 slidably fitted to the guide rail 22 is fixed to the lower surface of the stage 24. Has been. A feed screw 26 is screwed into a nut 25 coupled to the lower surface of the stage 24, and the feed screw 26 is rotationally driven by a first motor 27 disposed on the rear end side of the base portion 20. Accordingly, by driving the first motor 27, the stage 24 reciprocates in the longitudinal direction (Y direction) on the upper surface of the base portion 20. In the above configuration, the guide rail 22, the slider 23, the nut 25, the feed screw 26, and the first motor 27 serve as stage moving means for reciprocating the stage 24.

  Next, the stage 24 will be described with reference to FIGS. The stage 24 has a structure in which a concave portion having a smooth bottom surface is formed on the upper surface side of the rectangular member. The bottom surface of the concave portion serves as a coating film forming surface 24a for forming a coating film (thin film) of the flux 8. . In FIG. 4, a film forming area A is set on the coating film forming surface 24a of the stage 24. By performing a film forming operation described later in this film forming area A, a flux is applied to the coating film forming surface 24a. 8 coatings are formed. As described above, the stage 24 has the film formation region A where the flux 8 is formed.

  As shown in FIG. 4, a transfer area B is set in the film formation area A. The transfer area B is an area for transferring the flux 8 to the component P held by the mounting head 11A. Further, a region that does not contribute to the transfer of the flux 8 to the component P, that is, a region other than the transfer region B in the film formation region A is defined as a non-transfer region C. In the present embodiment, the transfer region B is set at substantially the center of the film formation region A, and both sides sandwiching the transfer region B in the Y direction are the first non-transfer region C1 (front side) and the second non-transfer region. It becomes the transfer area C2 (rear side).

  In the transfer region B, a transfer position T, which is a position to transfer each component P sucked by the plurality of suction nozzles 12 included in the mounting head 11A, is set in advance. The transfer area B is set based on the transfer position T and the size of the component P to be mounted. More specifically, in the transfer area B, the flux 8 can be transferred to all the bumps Pa formed on the component P when the suction nozzle 12 that has sucked the component P performs one lifting operation. It is set to be a large area.

  In the transfer area B, the length dimension L1 in the moving direction (Y direction) of the stage 24 is equal to the length dimension of the landing target areas Ba and Bb calculated from the transfer position T and the size of the component P to be mounted. The length dimension is set by adding an extension allowance Δy from both ends of the target areas Ba and Bb. The extension allowance Δy is determined in consideration of the positional deviation of the mounting head 11A above the transfer region B, the positional deviation of the component P sucked by the suction nozzle 12, and the like.

  In FIG. 3, when the stage 24 is moved to the front side, the film formation squeegee unit 28 and the scraping unit are positioned at a position behind the transfer region B and above the stage 24 where no interference with the mounting head 11 occurs. A unit 29 is arranged. Further, between the film forming squeegee unit 28 and the scraping unit 29, a needle 30a of a flux supply syringe 30 for supplying the flux 8 is inserted and disposed. The film forming squeegee unit 28 is held by a bracket 31 erected on the base portion 20, and the horizontal position is fixed with respect to the base portion 20.

  Details of the film formation squeegee unit 28 will be described with reference to FIGS. FIG. 3B shows a cross section A in FIG. The film forming squeegee unit 28 includes a squeegee 28a that extends downward and has a lower end portion disposed with a coating film forming gap g (FIG. 7A) between the coating film forming surface 24a. The squeegee 28 a is coupled to the connecting member 32, and the connecting member 32 is attached to the bracket 31 via the slide unit 33. Therefore, the squeegee 28 a is movable up and down with respect to the bracket 31.

  The squeegee 28a forms the flux 8 on the coating film forming surface 24a by horizontally moving the stage 24 in the Y direction (front side) by the stage moving means in a state where the flux 8 is supplied to the coating film forming surface 24a. As a result, a coating film of flux 8 having a thickness corresponding to the coating film formation gap g is formed in the film formation region A. That is, the film formation region A is formed in a section where the stage 24 and the squeegee 28a move relative to each other. Then, by moving the stage 24 to the front side, as shown in FIG. 4A, the transfer region B on which the flux 8 is formed can be positioned at the transfer position T by the mounting head 11. As described above, the transfer device 6 supplies the transfer material transferred to the component P held by the mounting head 11 in a film-formed state.

  In FIG. 3A, the scraping unit 29 includes a scraper 29a extending downward. The scraper 29a is biased downward and is always in contact with the coating film forming surface 24a regardless of the height position of the stage 24. By moving the stage 24 in the Y direction (rear side) by the stage moving means, the scraper 29a scrapes the flux 8 deposited on the deposition region A.

  As shown in FIGS. 2 and 3, above the stage 24, between the squeegee 28a and the scraper 29a, a reflective optical sensor (transfer material detector) 38 indicates the direction of detection by the detection optical axis 38a. It arrange | positions toward the formation surface 24a. The optical sensor 38 irradiates the coating film forming surface 24a with detection light and receives the reflected light. The received light signal is output to a detection processing unit 45 (FIG. 5) described later.

  3 (a) and 3 (b), the connecting member 32 is coupled with an elevating member 34 disposed in the vertical direction. A cam follower 35 is coupled to the lower end portion of the elevating member 34 that penetrates into the base portion 20. A second motor 36 is disposed in a horizontal posture inside the base portion 20, and a disc cam 37 coupled to the rotation shaft of the second motor 36 is in contact with the cam follower 35. By rotating the second motor 36 in this state, the elevating member 34 moves up and down according to the cam characteristics of the disc cam 37. As a result, the squeegee 28a moves up and down with respect to the stage 24.

  That is, the elevating member 34, the cam follower 35, the disc cam 37, and the second motor 36 are squeegee position adjusting means for adjusting the vertical position of the squeegee 28a. The squeegee 28a is disposed so as to be movable up and down with respect to the stage 24, and the transfer material is deposited on the deposition region A by moving the stage 24 with a predetermined gap between the squeegee 28a. Before the film forming operation described later is started, the squeegee position adjusting means adjusts the vertical position of the squeegee 28a to change the coating film forming gap g between the lower end of the squeegee 28a and the coating film forming surface 24a. To do. Thereby, the thickness of the coating film of the flux 8 formed in the film formation region A becomes variable. In the present embodiment, a cam mechanism is employed as the squeegee position adjusting means. However, a drive system other than the cam mechanism is used as long as it is a linear motion mechanism capable of arbitrarily raising and lowering the elevating member 34. May be.

  Next, the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 40 provided in the component mounting apparatus 1 includes a storage unit 41, a mounting control unit 42, a transfer region setting unit 43, a film forming operation control unit 44, a detection processing unit 45, and a recognition processing unit 46. . The controller 40 includes a substrate transport mechanism 3, a tape feeder 7, a tray feeder 5, a Y-axis movement table 9, X-axis movement tables 10A and 10B, a nozzle lifting mechanism 13, a substrate recognition camera 14, a component recognition camera 15, a first A first motor 27, a second motor 36, and an optical sensor 38 are connected.

  The storage unit 41 stores component data 41a, mounting data 41b, and film formation data 41c. The component data 41a is data including information such as the type and size of the component P to be mounted. The mounting data 41b is data for mounting the component P after flux transfer on the substrate 2. The film formation data 41 c is data for forming the flux 8 by the transfer device 6. The film formation data 41c includes various areas necessary for forming the flux 8, such as the transfer region B set according to the type of the component P, the control parameter of the second motor 36 that moves the squeegee 28a up and down, and the like. Contains information.

  The mounting control unit 42 controls the substrate transport mechanism 3, the tray feeder 5, the tape feeder 7, the Y-axis moving table 9, the X-axis moving tables 10A and 10B, and the nozzle lifting mechanism 13 based on the mounting data 41b. Thus, the mounting head 11A takes out the component P supplied from the tray feeder 5, transfers the flux 8 supplied by the transfer device 6 to the component P, and then mounts the component P on the substrate 2 positioned at the mounting work position. Is installed. The mounting head 11B takes out the component P supplied from the tape feeder 7 and mounts the component P on the substrate 2 positioned at the mounting work position.

  The transfer area setting unit 43 refers to the component data 41a before starting the film forming operation, and sets the transfer area B according to the size of the component P to be mounted. The position of the transfer region B is included in the film formation data 41 c and is stored in the storage unit 41.

  The film forming operation control unit 44 executes an operation for forming the flux 8 on the coating film forming surface 24a of the stage 24 based on the film forming data 41c. More specifically, the film formation operation control unit 44 adjusts the height position of the squeegee 28a by controlling the second motor 36, and controls the first motor 27 to set the stage 24 to a predetermined level. Move horizontally at a speed of. The film forming operation control unit 44 also functions as a squeegee movement control unit that controls the second motor 36 constituting the squeegee position adjusting unit to move the squeegee 28a in the vertical direction.

  The detection processing unit 45 detects the remaining amount of the flux 8 on the coating film forming surface 24a by detecting the light reception signal output from the optical sensor 38. Then, it is determined whether or not the flux 8 needs to be replenished based on the detection result. As described above, the detection processing unit 45 determines the necessity of replenishment by detecting the remaining amount of the transfer material supplied to the stage 24 by the transfer material detection unit disposed between the squeegee 28a and the scraper 29a. This is a supply necessity determination unit.

  The recognition processing unit 46 detects the position of the substrate 2 by recognizing imaging data acquired by the substrate recognition camera 14. Further, the position of the component P sucked by the suction nozzle 12 is detected by recognizing the imaging data acquired by the component recognition camera 15. In the mounting operation of the component P by the mounting head 11A or the mounting head 11B, the mounting position is corrected in consideration of the position detection results of the substrate 2 and the component P.

  The component mounting apparatus 1 in the present embodiment is configured as described above. Next, referring to the flowchart of FIG. 6 and the operation explanatory diagrams of FIGS. 7 to 10, the component P supplied by the tray feeder 5 is replaced with the substrate 2. The component mounting operation for mounting on will be described. The component mounting operation includes both a component mounting operation mainly performed by the mounting head 11 </ b> A and a film formation and scraping operation mainly performed by the transfer device 6. First, the component P is extracted by the mounting head 11A (ST1A: component extraction step). That is, the mounting head 11 </ b> A moves to the supply position of the component P by the tray feeder 5 and sucks the desired component P by the suction nozzle 12.

  In parallel with the above-described operation of taking out the component P, the transfer device 6 forms the flux 8 (ST1B: film formation step). That is, the flux 8 is deposited in the deposition region A by moving the stage 24 relative to the squeegee 28a. The film forming operation in this step will be described in detail. FIG. 7 shows that the stage 24 is in the retracted position, and the lower end portion of the squeegee 28a is positioned at the end portion (right side in this example) of the coating film forming surface 24a before the film forming operation is started. The state where the flux 8 is supplied between the squeegee 28a and the scraper 29a is shown. The edge part in the coating film formation surface 24a here refers to the foremost edge part in the film-forming area A, that is, the start edge C1a of the first non-transfer area C1. Before the film forming operation is started, the squeegee 28a has a thickness t2 in which the coating film forming gap g between the lower end portion and the coating film forming surface 24a is smaller than an appropriate thickness t1 for transferring the flux 8 to the component P. Move to the matching height position (arrow b1). 7 indicate sections corresponding to the first non-transfer area C1, the transfer area B, and the second non-transfer area C2, respectively.

  Next, as shown in FIG. 8A, the stage 24 moves in the section S1 corresponding to the first non-transfer area C1 (arrow c1). That is, the stage 24 maintains the coating film formation gap g at the thickness t2 until the lower end portion of the squeegee 28a reaches the end C1b (start end Bc of the transfer region B) from the start end C1a of the first non-transfer region C1. Move while standing. The stage 24 stops moving at the position where the lower end of the squeegee 28a reaches the end C1b. Thereby, the coating film of the flux 8 having a thickness t2 smaller than the appropriate thickness t1 is formed in the first non-transfer area C1.

  Next, as shown in FIG. 8B, the squeegee 28a rises to a height position at which the coating film formation gap g matches the thickness t1 (arrow b2). Next, the stage 24 moves in the section S2 corresponding to the transfer region B (arrow c2). That is, the stage 24 maintains the coating film formation gap g at the thickness t1 until the lower end of the squeegee 28a reaches the end Bd from the start end Bc of the transfer region B (start end C2a of the second non-transfer region C2). Move while standing. The stage 24 stops moving at the position where the lower end of the squeegee 28a reaches the end Bd. As a result, a coating film of the flux 8 having an appropriate thickness t1 is formed in the transfer region B.

  Next, as shown in FIG. 8C, the squeegee 28a descends again to a height position at which the coating film formation gap g matches the thickness t2 (arrow b3). Next, the stage 24 moves in the section S3 corresponding to the second non-transfer area C2 (arrow c3). That is, the stage 24 moves while keeping the coating film formation gap g at the thickness t2 until the lower end of the squeegee 28a reaches the end C2b from the start end C2a of the second non-transfer area. The stage 24 stops moving at the position where the lower end of the squeegee 28a reaches the end C2b. Thereby, the coating film of the flux 8 having a thickness t2 smaller than the appropriate thickness t1 is formed in the second non-transfer area C2. The reason why the flux 8 is formed in the second non-transfer area C2 is that each member (film formation squeegee unit 28) disposed above the stage 24 when the mounting head 11A moves to above the transfer area B. Etc.) in order to prevent the situation from interfering.

  As described above, in the present embodiment, when the transfer material is formed on the stage 24, the height of the squeegee 28a with respect to the stage 24 in the area other than the transfer area B is set higher than the height of the squeegee 28a with respect to the stage 24 in the transfer area B. I try to keep it low. As a result, the amount of transfer material supplied to the stage 24 can be reduced, and the amount of transfer material discarded after the production of the substrate 2 can be reduced, thereby reducing the cost of the transfer material. Further, in the vicinity of both ends (start end Bc, end Bd) of the section S2 corresponding to the transfer region B, the film thickness of the flux 8 may become non-uniform as the height position of the squeegee 28a is switched. is there. However, by covering both ends of the section S2 with the extension allowance Δy of the transfer region B, it is possible to ensure an appropriate thickness t1 of the coating film in the landing target regions Ba and Bb that actually contribute to the transfer of the flux 8. it can.

  In the sections S1 and S3 corresponding to the first non-transfer area C1 and the second non-transfer area C2, the lower end portion of the squeegee 28a is brought into contact with the coating film forming surface 24a so that the value of the coating film forming gap g is zero. It may be. However, when the height position of the squeegee 28a is set in this way, the coating film forming surface 24a may be damaged by friction of the squeegee 28a when the stage 24 is moved horizontally. Therefore, it is desirable to move the stage 24 after slightly providing the coating film formation gap g in the sections S1 and S3. In addition, it is not necessary to match the thickness of the coating film between the first non-transfer area C1 and the second non-transfer area C2, but at least in any area than the thickness t1 of the coating film in the transfer area B. Make it smaller. Desirably, the thickness of the coating film of the flux 8 formed in both the first non-transfer area C1 and the second non-transfer area is smaller than t1.

  The switching of the height position of the squeegee 28a may be performed without stopping the movement of the stage 24. That is, the squeegee 28a may be raised while moving the stage 24, and the squeegee 28a may be switched from a height position corresponding to the thickness t2 to a height position corresponding to the thickness t1. The reverse is also true.

  After depositing the flux 8, the flux 8 is transferred by the mounting head 11A (ST2A: transfer step). That is, as shown in FIG. 9A, the mounting head 11A holding the component P moves onto the stage 24, where the suction nozzle 12 is moved up and down (arrow d). Thereby, the flux 8 is transferred to the bumps Pa of the component P. As described above, in the transfer process, the transfer material deposited on the stage 24 is transferred to the component P. Thereafter, the mounting head 11A moves to above the substrate 2 and mounts the component P at a predetermined mounting position on the substrate 2 (ST3A). The steps (ST1A), (ST2A), and (ST3A) described above are performed mainly with the mounting head 11A.

  Further, after forming the flux 8, the detection processing unit 45 determines whether or not the flux 8 needs to be replenished (ST2B: replenishment necessity determining step). That is, as shown in FIG. 9B, in the state where the squeegee 28a is raised to a predetermined height position (arrow b4), the detection processing unit 45 is an optical sensor disposed between the scraper 29a and the squeegee 28a. 38 (transfer material detection unit) detects the remaining amount of the flux 8 supplied to the stage 24 and determines whether replenishment is necessary. When it is determined that the flux 8 needs to be replenished, the flux 8 is replenished by the flux supply syringe 30 (ST3B: flux replenishing step). Each process for supplying the flux 8 is performed in parallel with the transfer operation and the like performed on the mounting head 11A side.

  When it is determined that the replenishment of the flux 8 is not necessary, or when the replenishment of the flux 8 is completed, the film forming operation control unit 44 determines whether the transfer of the flux 8 (ST2A) is completed (ST4B: transfer completion determination). Process). When it is determined that the transfer of the flux 8 has been completed, the flux 8 is scraped (ST5B: scraping step). That is, as shown in FIG. 9C, when the stage 24 moves backward (arrow e), the flux 8 on the coating film forming surface 24a is scraped to one side by the scraper 29a. Each of the steps (ST1B), (ST2B), (ST3B), (ST4B), and (ST5B) described above is performed with the transfer device 6 as a main body.

  The transfer area B is appropriately set depending on the size of the component P to be mounted. More specifically, the transfer region setting unit 43 refers to the film formation data 41c before the start of the film formation operation, and sets the transfer region according to the size of the component P to be mounted. When the stage 24 moves horizontally, the squeegee 28a is positioned at a height where the coating film formation gap g matches the thickness t1 in the section S2 corresponding to the set transfer region B.

  As described above, the component mounting apparatus 1 according to the present embodiment takes out the component P from the component supply unit 4A by the mounting head 11A, transfers the transfer material to the component P, and mounts it on the substrate 2. According to the component mounting apparatus 1, when the transfer material is deposited on the stage 24, the height of the squeegee 28a with respect to the stage 24 in the area other than the transfer area B is set higher than the height of the squeegee 28a with respect to the stage 24 in the transfer area B. Therefore, the cost of the transfer material can be reduced by reducing the amount of the transfer material supplied to the stage 24.

  Next, an application example of the film formation region will be described with reference to FIG. In FIG. 10, the transfer area B1 (transfer position T) is set not on the approximate center of the film formation area A1, but on the access side (upper side of the paper) of the mounting head 11A. In the film formation region A1, the transfer region B1 is set over a predetermined range from the end on the access side (upper side of the paper) of the mounting head 11A, and the other region is a non-transfer region C3. That is, the non-transfer area C3 is not divided into the first non-transfer area C1 (front side) and the second non-transfer area C2 as described above.

  By setting the position of the transfer region B1 as described above, the transfer position T of the flux 8 can be made closer to the access side of the mounting head 11A. Accordingly, the moving distance when the mounting head 11A that has taken out the component P accesses the transfer device 6 or the mounting head 11A that holds the component P after the flux transfer moves above the substrate 2 via the component recognition camera 15. It is possible to shorten the moving distance when performing and improve the productivity.

  Next, with reference to FIG. 11, the film forming operation when the film forming region A1 is set will be briefly described. First, as shown in FIG. 11A, in a state where the squeegee 28a has moved to a height position at which the coating film formation gap g coincides with the thickness t1 (arrow b5), the stage 24 has a section S4 corresponding to the transfer region B1. (Arrow c4). Next, as shown in FIG. 11B, in a state where the squeegee 28a is lowered to a height position where the coating film formation gap g coincides with the thickness t2 (arrow b6), the stage 24 is in the section S5 corresponding to the non-transfer area C3. (Arrow c5). As a result, a coating film of flux 8 having an appropriate thickness t1 is formed in the transfer area B1, and a coating film of flux 8 having a thickness t2 smaller than the thickness t1 is formed in the non-transfer area C3. In this application example, since the number of times of switching the height position of the squeegee 28a is only one, the film forming operation time can be shortened.

  According to the present invention, it is possible to improve the productivity by suppressing the occurrence of a film formation waiting time of the transfer material, which is particularly useful in the field of electronic component mounting.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4A, 4B Component supply part 6 Transfer apparatus 8 Flux 11 (11A, 11B) Mounting head 22 Guide rail 23 Slider 24 Stage 25 Nut 26 Feed screw 27 First motor 28a Squeegee 29a Scraper 38 Optical sensor 43 Transfer area setting section 44 Film formation operation control section 45 Detection processing section A, A1 Film formation area B, B1 Transfer area P Parts

Claims (6)

A component mounting apparatus that removes a component from a component supply unit with a mounting head, transfers a transfer material to the component, and mounts the component on a substrate
A transfer device for supplying a transfer material to be transferred to a component held by the mounting head in a filmed state;
The transfer device includes:
A stage having a film formation region on which the transfer material is formed;
Stage moving means for reciprocating the stage;
A squeegee that is disposed so as to be movable up and down with respect to the stage, and forms a transfer material in the film formation region by moving the stage with a predetermined gap between the stage and the stage;
In the film formation region, a transfer region for transferring the transfer material to the part is set,
The component mounting apparatus, wherein when the transfer material is deposited on the stage, a height of the squeegee with respect to the stage in a region other than the transfer region is set lower than a height of the squeegee with respect to the stage in the transfer region.   A transfer material supplied to the stage by a scraper that moves the stage to scrape the transfer material formed in the film formation region, and a transfer material detector disposed between the squeegee and the scraper. The component mounting apparatus according to claim 1, further comprising a replenishment necessity determination unit that detects a remaining amount of the toner and determines whether or not replenishment is necessary.   The component mounting apparatus according to claim 1, further comprising a transfer region setting unit that sets the transfer region according to a size of the component. Using a component mounting apparatus having a transfer device that supplies a transfer material to be transferred to a component held by the mounting head in a film state, the component is taken out from the component supply unit by the mounting head, and the transfer material is transferred to the component. Is a component mounting method for transferring and mounting on a board,
The transfer device includes:
A stage having a film formation region on which the transfer material is formed;
Stage driving means for reciprocating the stage;
A squeegee that is disposed so as to be movable up and down with respect to the stage, and forms a transfer material in the film formation region by moving the stage with a predetermined gap between the stage and the stage;
A film forming step of forming a transfer material in the film forming region by moving the stage relative to the squeegee;
A transfer step of transferring the transfer material deposited on the stage to a component,
In the film forming step,
A component mounting method, wherein the height of the squeegee in a region other than the transfer region for transferring the transfer material to the component set in the film formation region is made lower than the height of the squeegee in the transfer region.   The remaining amount of the transfer material supplied to the stage by the transfer material detector disposed between the scraper and the squeegee that moves the stage to scrape the transfer material deposited in the film formation region. The component mounting method according to claim 4, further comprising a replenishment necessity determination step for detecting whether or not replenishment is necessary.   6. The component mounting method according to claim 4, wherein the transfer region is set according to a size of the component.

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