JP2012199352A - Component mounting device and component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device which can perform the component mounting work while cleaning a suction nozzle with an inexpensive configuration, and to provide a component mounting method.SOLUTION: The component mounting device comprises a nozzle cleaning tool 14 which is attached removably to the slot 12a of a feeder base 12 and has an adhesive tape 23 pasted to a part corresponding to the component supply port 13p of a tape feeder 13 attached to another slot 12a, while directing the adhesive surface 23a of the adhesive tape 23 upward. Foreign matters adhering to a suction nozzle 17 are removed by pressing the suction nozzle 17 against the adhesive tape 23.

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component supplied from a tape feeder by a suction nozzle and mounting the component on a substrate.

  The component mounting apparatus sucks a component supplied from a component supply unit by a suction nozzle and mounts the component on a substrate positioned by a substrate transport path. In such a component mounting apparatus, foreign matter (dust) adheres to the lower end of the suction nozzle while repeatedly performing the component mounting operation of sucking the component with the suction nozzle and mounting it on the board, thereby preventing normal suction of the component. For this reason, a nozzle cleaning tool is provided in which the suction nozzle is brought into contact with an adhesive tape with the adhesive surface facing upward to remove foreign matter adhering to the suction nozzle.

  As such a nozzle cleaning tool, for example, when the component supply unit includes a tape feeder that supplies a component to a component supply port by conveying a carrier tape containing the component, a feeder base on which the tape feeder is mounted A type that is mounted in the same manner as a tape feeder and that transports and feeds an adhesive tape to a position corresponding to a component supply port of the tape feeder in a manner of transporting a carrier tape is known (for example, Patent Document 1). In such a type of nozzle cleaning tool, the adhesive surface of the adhesive tape can be updated by the pitch feeding operation of the adhesive tape.

Japanese Patent No. 4475204

  However, the nozzle cleaning tool of the type that transports and supplies the adhesive tape to a position corresponding to the component supply port of the tape feeder requires a complicated mechanism and requires an expensive tape pitch feeding device, which increases the cost. was there.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of executing a component mounting operation while cleaning the suction nozzle with an inexpensive configuration.

  The component mounting apparatus according to claim 1, wherein the substrate mounting path for transporting and positioning the substrate, a feeder base having a plurality of feeder mounting portions, and a component that is detachably mounted on each feeder mounting portion of the feeder base. A plurality of tape feeders that supply parts to the supply port, a suction nozzle that picks up the parts supplied from each tape feeder and places them on the board positioned by the board conveyance path, and a feeder mounting part of the feeder base that can be attached and detached. A nozzle cleaning tool with an adhesive tape with the adhesive surface facing upward at a location corresponding to the component supply port of the tape feeder mounted on the other feeder mounting part, and parts supplied from the tape feeder Executes component mounting operation to attach to the substrate positioned by the substrate transport path by suction with the suction nozzle and perform component mounting operation After repeating several, and a suction nozzle control means for pressing the suction nozzle as foreign matter adhered to the suction nozzle is removed adhesive tape.

  A component mounting apparatus according to a second aspect is the component mounting apparatus according to the first aspect, wherein the adhesive tape is held by a tape holding member that is detachably attached to the nozzle cleaning tool.

  The component mounting apparatus according to claim 3 is the component mounting apparatus according to claim 1 or 2, wherein a plurality of nozzle pressing locations to which the suction nozzle is pressed are set on the adhesive tape, and the suction nozzle control means is Every time the suction nozzle is pressed against the adhesive tape, the nozzle pressing position is changed.

  The component mounting apparatus according to claim 4 is the component mounting apparatus according to claim 3, wherein the suction nozzle control means pushes the suction nozzle to all of the plurality of nozzle pressing locations set on the adhesive tape. After the contact, the operator notifies that the adhesive tape should be replaced via an alarm.

  According to a fifth aspect of the present invention, there is provided a component mounting method comprising: a substrate transport path for transporting and positioning a substrate; a feeder base having a plurality of feeder mounting portions; and a component that is detachably mounted on each feeder mounting portion of the feeder base. A plurality of tape feeders that supply parts to the supply port, a suction nozzle that picks up the parts supplied from each tape feeder and places them on the board positioned by the board conveyance path, and a feeder mounting part of the feeder base that can be attached and detached. Component mounting by a component mounting apparatus equipped with a nozzle cleaning tool attached with an adhesive tape with the adhesive surface facing upward at a location corresponding to the component supply port of the tape feeder mounted on another feeder mounting part A method in which a component supplied from a tape feeder is sucked by a suction nozzle and mounted on a substrate positioned by a substrate transport path And a step of executing the instrumentation operation, after the component mounting operation is repeated a predetermined number of times, and removing the foreign matter adhered to the suction nozzle by pressing a suction nozzle to the adhesive tape.

  A component mounting method according to a sixth aspect is the component mounting method according to the fifth aspect, wherein the adhesive tape is held by a tape holding member that is detachably attached to the nozzle cleaning tool.

  The component mounting method according to claim 7 is the component mounting method according to claim 5 or 6, wherein a plurality of nozzle pressing locations for pressing the suction nozzle are set on the adhesive tape, and the suction nozzle is provided on the adhesive tape. The nozzle pressing position is changed each time it is pressed.

  The component mounting method according to claim 8 is the component mounting method according to claim 7, wherein after the suction nozzle is pressed against all of the plurality of nozzle pressing locations set on the adhesive tape, the alarm is set. The operator is notified that the adhesive tape should be replaced.

  In the present invention, the pressure-sensitive adhesive tape that presses the suction nozzle to remove the foreign matter adhering to the suction nozzle is attached to the nozzle cleaning tool that is detachably mounted on the feeder mounting portion of the feeder base. When it is necessary to renew the adhesive tape by repeatedly pressing the nozzle, the nozzle cleaning tool is removed from the feeder base and the adhesive tape itself is replaced. The component mounting operation can be executed while cleaning.

The block diagram of the component mounting apparatus in one embodiment of this invention (A) (b) The perspective view of the component supply part with which the component mounting apparatus in one embodiment of this invention is provided. (A) (b) The perspective view of the nozzle cleaning tool with which the component mounting apparatus in one embodiment of this invention is provided The partial expansion perspective view of the nozzle cleaning tool with which the component mounting apparatus in one embodiment of this invention is provided The flowchart which shows the execution procedure of the component mounting method which the component mounting apparatus in one embodiment of this invention performs

  Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, a component mounting apparatus 1 is configured to carry in and position a substrate 2 sent from an upstream process device (not shown) (for example, a solder printer or another component mounting device), and place the substrate 2 on the positioned electrode 3 on the electrode 3. A device that repeatedly executes a series of operations including mounting of a component (electronic component) 4 and transporting the substrate 2 on which the component 4 is mounted to a downstream process side device (for example, another component mounting device, an inspection machine, a reflow furnace, etc.) It is.

  1, the component mounting apparatus 1 is provided on a base, which is provided on a base (not shown) and transports the board 2 and positions it at a predetermined work position (position shown in FIG. 1). A plurality of tape feeders 13 as component supply units mounted on the feeder base 12, a nozzle cleaning tool 14 also mounted on the feeder base 12, an orthogonal coordinate type head moving robot 15 provided on the base, a head moving A mounting head 16 that is moved in a horizontal plane by the robot 15, a suction nozzle 17 that can be moved up and down on each mounting head 16 and that can rotate about a vertical axis, a substrate camera 18 that is provided on the mounting head 16, and a base. A component camera 19 is provided.

  In FIG. 1, the substrate transport path 11 is composed of a pair of belt conveyors extending in the horizontal direction, and transports the substrate 2 while supporting both ends of the substrate 2 from below.

  1A, 1B, and 2B, the feeder base 12 has a plurality of slots 12a (feeder) provided in parallel with each other in a horizontal plane direction orthogonal to the direction of transport of the substrate 2 by the substrate transport path 11. (Mounting portion) is provided, the nozzle cleaning tool 14 is mounted in one of the slots 12a, and the tape feeder 13 is mounted in the other slot 12a.

  As shown in FIG. 2B, each tape feeder 13 is mounted by inserting a slot insertion portion 13a provided at the lower portion into the slot 12a, and is provided at an end portion on the substrate transport path 11 side. The parts 4 are continuously supplied to 13p.

  As shown in FIGS. 2B, 3A, and 3B, the nozzle cleaning tool 14 includes a base 20 that is mounted by inserting a slot insertion portion 20a provided in the lower portion into the slot 12a, and a base A tape holding member support portion 22 supported by a plurality of support columns 21 provided on 20 and a tape holding member attachment region 22a (FIG. 3B) on the upper surface of the tape holding member support portion 22 are attached to an adhesive surface 23a. The plate-like tape holding member 24 holding the adhesive tape 23 facing upward (with the adhesive tape 23 attached) and the tape holding member 24 attached to the tape holding member attachment region 22a are connected to the tape holding member attachment region. It consists of a fixed slider 25 fixed in 22a.

  Here, the tape holding member attachment region 22 a is formed at a location that becomes the component supply port 13 p of the tape feeder 13 when attached to the feeder base 12 when the nozzle cleaning tool 14 is the tape feeder 13. Yes. In other words, the nozzle cleaning tool 14 is detachably mounted in the slot 12a of the feeder base 12, and has an adhesive surface 23a facing upward at a location corresponding to the component supply port 13p of the tape feeder 13 mounted in the other slot 12a. The tape 23 is affixed.

  In FIG. 1, the suction nozzle 17 provided in the mounting head 16 picks up the component 4 supplied by each tape feeder 13 by vacuum suction and picks up the component 4 on the electrode 3 of the substrate 2 positioned by the substrate transport path 11. The component 4 is mounted on the substrate 2 by releasing the vacuum suction and releasing the component 4 from the suction nozzle 17.

  In FIG. 1, the substrate camera 18 has an imaging field of view directed downward, and when the substrate 2 is positioned at the work position by the substrate transport path 11, a substrate mark 2 m for detecting the position of the substrate 2 provided on the substrate 2. Is imaged from above.

  In FIG. 1, each component camera 19 has an imaging field of view facing upward, and is picked up by the suction nozzle 17 and picks up the component 4 positioned in the imaging field of view by moving the mounting head 16 from below.

  The operation of positioning the substrate 2 by the substrate transport path 11 and positioning to the work position is controlled by the control device 30 (FIG. 1) provided in the component mounting apparatus 1 of the substrate transport path drive mechanism 31 (FIG. 1) including an actuator (not shown). Made by doing.

  The supply of the component 4 to the component supply port 13p by each tape feeder 13 is performed when the control device 30 controls the operation of a tape feeder drive mechanism 32 (FIG. 1) including an actuator (not shown).

  The movement operation of the mounting head 16 in the horizontal plane direction is performed by the operation control of the robot drive mechanism 33 (FIG. 1) in which the control device 30 operates the head moving robot 15.

  The raising and lowering of the suction nozzle 17 with respect to the mounting head 16 and the rotation operation about the vertical axis are performed by the operation control of the nozzle drive mechanism 34 (FIG. 1) including an actuator or the like (not shown) by the control device 30. In the suction (pickup) and suction release (mounting to the substrate 2) operations of the component 4, the control device 30 controls the operation of a suction mechanism 35 (FIG. 1) including an actuator (not shown), and the vacuum pressure is applied to the suction nozzle 17. And by releasing the supply of the vacuum pressure.

  The image pickup operation control of the board camera 18 and the image pickup operation control of the component camera 19 are performed by the control device 30 (FIG. 1). The image data obtained by the imaging operation of the board camera 18 and the image data obtained by the imaging operation of the component camera 19 are respectively sent to the control device 30, and image recognition processing is performed in the image recognition unit 30a (FIG. 1) of the control device 30. Is done.

  The control device 30 performs the component mounting operation (mounting turn) for sucking the component 4 by the suction nozzle 17 and mounting the component 4 on the substrate 2 after a predetermined number of times (for example, 50 times). The suction nozzle 17 that removes foreign matters (dust) attached to the lower end of the suction nozzle 17 is cleaned by pressing against the adhesive surface 23a of the adhesive tape 23 held (attached) to the holding member 24.

  In FIG. 3A, one end plate 22b and two side plates 22c are provided at one end of the nozzle cleaning tool 14 on the side close to the substrate transport path 11 of the tape holding member support 22. A region surrounded on three sides by the end plate 22b and the side plate 22c is a tape holding member attachment region 22a.

  In FIG. 3A, the fixed slider 25 has a long hole 25m provided in the center portion supported by a plurality of screws 25s provided on the upper surface of the tape holding member support portion 22, and a tape holding member attachment region 22a. The tape holding member 24 attached to the end plate 22b is pressed against the end plate 22b to fix the tape holding member 24 (FIG. 3A), and the pressing of the tape holding member 24 to the end plate 22b is released. The tape holding member 24 can be detached from the tape holding member attachment region 22a and can be slid between the fixing release position (FIG. 3B) that enables the tape holding member 24 to be attached to the tape holding member attachment region 22a. It has become.

  In FIG. 4, pressing locations AR of the plurality of suction nozzles 17 are set on the adhesive surface 23 a of the adhesive tape 23, and the adhesive tape 23 is placed in the pressing location storage unit 30 b (FIG. 1) of the control device 30. The position coordinates of each pressing point AR in a state where the tape holding member 24 provided on the upper surface is attached to the tape holding member attachment region 22a of the tape holding member support portion 22 is stored. In addition, arrangement | positioning of the pressing location AR of the suction nozzle 17 shown in FIG. 4 is only an example, and arrangement | positioning of the pressing location AR is not specifically limited, It is arbitrary.

  When the suction nozzle 17 is pressed against the adhesive tape 23 of the nozzle cleaning tool 14 to clean the suction nozzle 17, the control device 30 selects from a plurality of pressing locations AR stored in the pressing location storage unit 30b. When one pressing location AR is read out, the suction nozzle 17 is pressed against the pressing location AR, and then the suction nozzle 17 is pressed against the adhesive tape 23, a pressing location AR different from the previous one is selected and read out. To.

  As a result, the suction nozzle 17 is always pressed against a new area of the adhesive surface 23a of the adhesive tape 23, and the suction nozzle 17 is pressed and adhered to the adhesive tape 23 (removed from the suction nozzle 17). Can be prevented from adhering to the suction nozzle 17 again.

  After the suction nozzle 17 is pressed against all the pressing locations AR stored in the pressing location storage unit 30b, the control device 30 controls the operation of the alarm 36 connected to the control device 30, and the component mounting device 1 operator (not shown) is notified that the adhesive tape 23 should be replaced (encourage the replacement of the adhesive tape 23). Specifically, if the notification device 36 is of a type that emits sound, the notification device 36 outputs a voice message, and if the notification device 36 is of a type that displays an image, the notification device 36. The above notification is performed by outputting a text message. As a result, the operator can replace the adhesive tape 23 at an appropriate time.

  As described above, the control device 30 performs the component mounting operation for causing the component 4 supplied from the tape feeder 13 to be sucked by the suction nozzle 17 and mounting the component 4 on the substrate positioned by the substrate transport path 11, and also performs the component mounting operation. After repeating the operation a number of times, it functions as a suction nozzle control unit that presses the suction nozzle 17 against the adhesive tape 23 so that the foreign matter adhering to the suction nozzle 17 is removed. In addition, the control device 30 indicates that the operator should replace the adhesive tape 23 via the alarm 36 after the suction nozzle 17 has pressed all of the plurality of nozzle pressing locations AR set on the adhesive tape 23. It has the function to notify to.

  When the operator replaces the adhesive tape 23, first, the nozzle cleaning tool 14 is pulled out from the slot 12a of the feeder base 12, and then the fixed slider 25 is slid toward the fixed release position (in FIG. 3B). The tape holding member 24 is removed from the tape holding member attachment region 22a on the tape holding member support portion 22 (arrow B shown in FIG. 3B). Then, the adhesive tape 23 attached to the tape holding member 24 is peeled off, and a new adhesive tape 23 is attached to the tape holding member 24. When the operator attaches a new adhesive tape 23 to the tape holding member 24, the operator attaches the tape holding member 24 to the tape holding member mounting region 22a on the tape holding member support portion 22 and moves the fixed slider 25 from the fixed release position to the fixed position. Slide to. Thereby, the replacement of the adhesive tape 23 is completed.

  Next, the execution procedure of the component mounting method by the component mounting apparatus 1 in this Embodiment is shown using the flowchart of FIG. To this end, the control device 30 first operates the substrate transport path 11 to receive and carry in the substrate 2 sent from the upstream process side device and position it at a predetermined work position (step ST1 shown in FIG. 5). ).

  After positioning the substrate 2 at the working position by the substrate transport path 11, the control device 30 moves the substrate camera 18 (the mounting head 16) above the substrate 2, and the substrate mark provided on the substrate 2 by the substrate camera 18. Image recognition is performed by imaging 2 m, and the positional deviation from the normal position of the substrate 2 on the substrate transport path 11 is calculated (step ST2 shown in FIG. 5).

  After calculating the positional deviation of the substrate 2 in step ST <b> 2, the control device 30 controls the operation of the robot drive mechanism 33 to operate the head moving robot 15 and moves the mounting head 16 above the tape feeder 13. The operation of the nozzle drive mechanism 34 is controlled so that the suction nozzle 17 is brought into contact with the component 4 supplied to the component supply port 13p of the tape feeder 13 and the operation of the suction mechanism 35 is controlled to the suction nozzle 17. The vacuum pressure is supplied, and the suction nozzle 17 sucks (picks up) the component 4 (step ST3 shown in FIG. 5).

  When the control device 30 causes the suction nozzle 17 to pick up the component 4, the control device 30 moves the mounting head 16 so that the component 4 passes above the component camera 19, and causes the component camera 19 to image the component 4. Recognition is executed (step ST4 shown in FIG. 5). Then, based on the result of the image recognition, the part 4 is inspected for abnormalities (deformation, defect, etc.) and the position of the part 4 with respect to the suction nozzle 17 is grasped. (Shift) is calculated (step ST5 shown in FIG. 5).

  After calculating the suction displacement of the component 4, the control device 30 controls the operation of the head moving robot 15 and moves the mounting head 16 so that the component 4 sucked by the suction nozzle 17 is positioned above the substrate 2. . Then, by controlling the operation of the nozzle drive mechanism 34, the adsorbed component 4 is soldered by the electrode 3 on the substrate 2 (on this electrode 3, the solder printing machine disposed on the upstream process side of the component mounting apparatus 1). The vacuum pressure supply to the suction nozzle 17 is canceled by controlling the operation of the suction mechanism 35, and the component 4 is mounted on the substrate 2 (step ST6 shown in FIG. 5).

  Here, when mounting the component 4 on the substrate 2 in step ST6, the control device 30 corrects the positional deviation of the substrate 2 obtained in step ST2 and the adsorption deviation of the component 4 obtained in step ST5. 2, the position of the suction nozzle 17 is corrected (including rotation correction).

  When the component 4 is mounted on the substrate 2 in step ST6, the control device 30 determines whether all the components 4 to be mounted on the substrate 2 have been mounted on the substrate 2 (step ST7 shown in FIG. 5). As a result, if it is determined that not all the components 4 to be mounted on the substrate 2 have been mounted on the substrate 2, then the components 4 are continuously mounted on the substrate 2 a predetermined number of times without cleaning the suction nozzle 17. It is determined whether or not it is mounted (step ST8 shown in FIG. 5). As a result, when the component 4 is mounted on the substrate 2 continuously for a predetermined number of times without cleaning the suction nozzle 17, the control device 30 moves the suction nozzle 17 (with the mounting head 16) of the nozzle cleaning tool 14. The suction nozzle 17 is moved upward and pressed against the adhesive tape 23 of the nozzle cleaning tool 14 from above to clean the suction nozzle 17 (step ST9 shown in FIG. 5). At this time, as described above, the control device 30 presses the suction nozzle 17 to one selected from the pressing locations AR of the plurality of suction nozzles 17 set on the adhesive tape 23.

  After cleaning the suction nozzle 17 in step ST9, the control device 30 has pressed the suction nozzle 17 for all of the pressing locations AR of the plurality of suction nozzles 17 set on the adhesive tape 23 (all It is determined whether or not the pressing portion AR has been used (step ST10 shown in FIG. 5). As a result, when the suction nozzle 17 is pressed against all the pressing points AR, the control device 30 controls the operation of the alarm 36 and notifies the operator that the adhesive tape 23 should be replaced. (Step ST11 shown in FIG. 5). The operator promptly replaces the adhesive tape 23 in the manner described above when the alarm 36 informs that the adhesive tape 23 should be replaced.

  If the control device 30 has notified that the adhesive tape 23 should be replaced in step ST11, or if the suction nozzle 17 has not been pressed against all the pressing locations AR in step ST10, or If the component 4 is not mounted on the substrate 2 continuously for a predetermined number of times without cleaning the suction nozzle 17 in step ST8, the process returns to step ST3, and the component mounting operation in steps ST3 to ST6 is executed. If the control device 30 determines in step ST7 that all the components 4 to be mounted on the substrate 2 have been mounted on the substrate 2, the substrate transport path 11 carries the substrate 2 to the downstream process side device. (Step ST12 shown in FIG. 5).

  As described above, in the component mounting apparatus 1 and the component mounting method using the component mounting apparatus 1 according to the present embodiment, the adhesive tape 23 that presses the suction nozzle 17 to remove the foreign matter attached to the suction nozzle 17 is provided on the feeder base 12. It is affixed to the nozzle cleaning tool 14 that is detachably mounted in the slot 12a (feeder mounting portion), and the suction nozzle 17 is repeatedly pressed against the adhesive tape 23 to update the adhesive tape 23 (the adhesive surface of the adhesive tape 23). 23a), the nozzle cleaning tool 14 is removed from the feeder base 12 and the adhesive tape 23 itself is replaced. Therefore, the suction nozzle 17 is cleaned with an inexpensive configuration. However, the component mounting work can be executed.

  Moreover, in the present embodiment, the adhesive tape 23 is affixed to the tape holding member 24 that is detachably attached to the nozzle cleaning tool 14, and the adhesive tape 23 is affixed in advance when the adhesive tape 23 is replaced. Since the replacement operation of the tape holding member 24 can be replaced, the adhesive tape 23 can be replaced quickly.

  Provided are a component mounting apparatus and a component mounting method capable of executing a component mounting operation while cleaning a suction nozzle with an inexpensive configuration.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4 Components 11 Board | substrate conveyance path 12 Feeder base 12a Slot (feeder mounting part)
DESCRIPTION OF SYMBOLS 13 Tape feeder 13p Component supply port 14 Nozzle cleaning tool 17 Adsorption nozzle 23 Adhesive tape 23a Adhesive surface 24 Tape holding member 30 Control apparatus (adsorption nozzle control means)
36 Alarm AR Nozzle pressing point

Claims (8)

A substrate transport path for transporting and positioning the substrate;
A feeder base having a plurality of feeder mounting portions;
A plurality of tape feeders that are detachably mounted on each feeder mounting portion of the feeder base and supply components to the component supply port;
A suction nozzle that picks up the components supplied from each tape feeder and attaches them to the substrate positioned by the substrate transport path;
Nozzle cleaning tool that is detachably attached to the feeder mounting part of the feeder base, and has an adhesive tape with the adhesive surface facing upward at the location corresponding to the part supply port of the tape feeder attached to the other feeder mounting part When,
A component mounting operation is performed in which the component supplied from the tape feeder is attracted to the suction nozzle and mounted on the substrate positioned by the substrate transport path, and after the component mounting operation is repeated a predetermined number of times, foreign matter attached to the suction nozzle is removed. A component mounting apparatus comprising: suction nozzle control means for pressing the suction nozzle against the adhesive tape so as to be removed.   The component mounting apparatus according to claim 1, wherein the adhesive tape is held by a tape holding member that is detachably attached to the nozzle cleaning tool.   2. A plurality of nozzle pressing locations where the suction nozzle is pressed are set on the adhesive tape, and the suction nozzle control means changes the nozzle pressing location each time the suction nozzle is pressed against the adhesive tape. Or the component mounting apparatus of 2.   The suction nozzle control means notifies the operator that the adhesive tape should be replaced via an alarm device after pressing the suction nozzle to all of the plurality of nozzle pressing locations set on the adhesive tape. The component mounting apparatus according to claim 3. A substrate transport path for transporting and positioning a substrate, a feeder base having a plurality of feeder mounting portions, and a plurality of tape feeders that are detachably mounted on each feeder mounting portion of the feeder base and supply components to a component supply port And a suction nozzle that picks up the components supplied from each tape feeder and attaches them to the substrate positioned by the substrate transport path, and is detachably attached to the feeder attachment portion of the feeder base, and is attached to other feeder attachment portions. A component mounting method by a component mounting apparatus comprising a nozzle cleaning tool having an adhesive tape with an adhesive surface facing upward at a location corresponding to a component supply port of the tape feeder,
A step of performing a component mounting operation of sucking a component supplied from the tape feeder by a suction nozzle and mounting the component on a substrate positioned by the substrate transport path;
And a step of pressing the suction nozzle against the adhesive tape and removing foreign matter adhering to the suction nozzle after repeating the component mounting operation a predetermined number of times.   6. The component mounting method according to claim 5, wherein the adhesive tape is held by a tape holding member that is detachably attached to the nozzle cleaning tool.   The component mounting according to claim 5 or 6, wherein a plurality of nozzle pressing locations for pressing the suction nozzle are set on the adhesive tape, and the nozzle pressing location is changed each time the suction nozzle is pressed against the adhesive tape. Method.   The operator is informed that the adhesive tape should be replaced via an alarm device after the suction nozzle is pressed against all of the plurality of nozzle pressing locations set on the adhesive tape. Component mounting method.

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