JPS5344179A - Soldering method of semiconductor pellets - Google Patents

Soldering method of semiconductor pellets

Info

Publication number
JPS5344179A
JPS5344179A JP11956376A JP11956376A JPS5344179A JP S5344179 A JPS5344179 A JP S5344179A JP 11956376 A JP11956376 A JP 11956376A JP 11956376 A JP11956376 A JP 11956376A JP S5344179 A JPS5344179 A JP S5344179A
Authority
JP
Japan
Prior art keywords
soldering method
pellet
semiconductor pellets
soldering
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11956376A
Other languages
Japanese (ja)
Inventor
Masaru Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP11956376A priority Critical patent/JPS5344179A/en
Publication of JPS5344179A publication Critical patent/JPS5344179A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Abstract

PURPOSE: Contactless pressurizing of a pellet and cooling of molten solder are simultaneously accomplished and the production of bubbles within the solder layer is considerably reduced by blowing an inert gas onto the top surface of the pellet at the time of soldering the semiconductor pellet to a base.
COPYRIGHT: (C)1978,JPO&Japio
JP11956376A 1976-10-05 1976-10-05 Soldering method of semiconductor pellets Pending JPS5344179A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11956376A JPS5344179A (en) 1976-10-05 1976-10-05 Soldering method of semiconductor pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11956376A JPS5344179A (en) 1976-10-05 1976-10-05 Soldering method of semiconductor pellets

Publications (1)

Publication Number Publication Date
JPS5344179A true JPS5344179A (en) 1978-04-20

Family

ID=14764416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11956376A Pending JPS5344179A (en) 1976-10-05 1976-10-05 Soldering method of semiconductor pellets

Country Status (1)

Country Link
JP (1) JPS5344179A (en)

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