JPS5232264A - Formation method for solder electrode - Google Patents

Formation method for solder electrode

Info

Publication number
JPS5232264A
JPS5232264A JP50106982A JP10698275A JPS5232264A JP S5232264 A JPS5232264 A JP S5232264A JP 50106982 A JP50106982 A JP 50106982A JP 10698275 A JP10698275 A JP 10698275A JP S5232264 A JPS5232264 A JP S5232264A
Authority
JP
Japan
Prior art keywords
solder electrode
formation method
solder
electrode
face down
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50106982A
Other languages
Japanese (ja)
Inventor
Tadao Kachi
Yoshio Honma
Akihiro Kenmochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50106982A priority Critical patent/JPS5232264A/en
Publication of JPS5232264A publication Critical patent/JPS5232264A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To reduce pellet size by forming pattern for solder electrode for face down bonding small.
COPYRIGHT: (C)1977,JPO&Japio
JP50106982A 1975-09-05 1975-09-05 Formation method for solder electrode Pending JPS5232264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50106982A JPS5232264A (en) 1975-09-05 1975-09-05 Formation method for solder electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50106982A JPS5232264A (en) 1975-09-05 1975-09-05 Formation method for solder electrode

Publications (1)

Publication Number Publication Date
JPS5232264A true JPS5232264A (en) 1977-03-11

Family

ID=14447461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50106982A Pending JPS5232264A (en) 1975-09-05 1975-09-05 Formation method for solder electrode

Country Status (1)

Country Link
JP (1) JPS5232264A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0282625A (en) * 1988-08-22 1990-03-23 Internatl Business Mach Corp <Ibm> Metallic layer lift-off treatment method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0282625A (en) * 1988-08-22 1990-03-23 Internatl Business Mach Corp <Ibm> Metallic layer lift-off treatment method

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