JPS522167A - Wire bonding method - Google Patents
Wire bonding methodInfo
- Publication number
- JPS522167A JPS522167A JP50076560A JP7656075A JPS522167A JP S522167 A JPS522167 A JP S522167A JP 50076560 A JP50076560 A JP 50076560A JP 7656075 A JP7656075 A JP 7656075A JP S522167 A JPS522167 A JP S522167A
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- bonding method
- wire
- improper
- shortcircuiting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To provide a wire bonding method which can prevent improper shortcircuiting by preventing explosion due to improper bonding of wire to solder electrode at wire bonding process.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50076560A JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50076560A JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS522167A true JPS522167A (en) | 1977-01-08 |
JPS5426469B2 JPS5426469B2 (en) | 1979-09-04 |
Family
ID=13608619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50076560A Granted JPS522167A (en) | 1975-06-24 | 1975-06-24 | Wire bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS522167A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62105207A (en) * | 1985-10-31 | 1987-05-15 | Sanyo Electric Co Ltd | Guiding device for mobile robot |
-
1975
- 1975-06-24 JP JP50076560A patent/JPS522167A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62105207A (en) * | 1985-10-31 | 1987-05-15 | Sanyo Electric Co Ltd | Guiding device for mobile robot |
JPH0578043B2 (en) * | 1985-10-31 | 1993-10-28 | Sanyo Electric Co |
Also Published As
Publication number | Publication date |
---|---|
JPS5426469B2 (en) | 1979-09-04 |
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