JPS57191045U - - Google Patents

Info

Publication number
JPS57191045U
JPS57191045U JP1981078209U JP7820981U JPS57191045U JP S57191045 U JPS57191045 U JP S57191045U JP 1981078209 U JP1981078209 U JP 1981078209U JP 7820981 U JP7820981 U JP 7820981U JP S57191045 U JPS57191045 U JP S57191045U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981078209U
Other languages
Japanese (ja)
Other versions
JPS6334269Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1981078209U priority Critical patent/JPS6334269Y2/ja
Publication of JPS57191045U publication Critical patent/JPS57191045U/ja
Application granted granted Critical
Publication of JPS6334269Y2 publication Critical patent/JPS6334269Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1981078209U 1981-05-28 1981-05-28 Expired JPS6334269Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981078209U JPS6334269Y2 (en) 1981-05-28 1981-05-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981078209U JPS6334269Y2 (en) 1981-05-28 1981-05-28

Publications (2)

Publication Number Publication Date
JPS57191045U true JPS57191045U (en) 1982-12-03
JPS6334269Y2 JPS6334269Y2 (en) 1988-09-12

Family

ID=29873850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981078209U Expired JPS6334269Y2 (en) 1981-05-28 1981-05-28

Country Status (1)

Country Link
JP (1) JPS6334269Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106124A (en) * 1982-12-11 1984-06-19 Toshiba Corp Method and apparatus for manufacturing semiconductor device
JP2014014868A (en) * 2012-07-05 2014-01-30 Vesi Switzerland Ag Method and apparatus for supplying flux free solder to substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123759A (en) * 1974-08-22 1976-02-25 Asahi Glass Co Ltd Ekishohyojisoshino fushihoho
JPS5582445A (en) * 1978-12-18 1980-06-21 Matsushita Electronics Corp Method of bonding semiconductor substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123759A (en) * 1974-08-22 1976-02-25 Asahi Glass Co Ltd Ekishohyojisoshino fushihoho
JPS5582445A (en) * 1978-12-18 1980-06-21 Matsushita Electronics Corp Method of bonding semiconductor substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59106124A (en) * 1982-12-11 1984-06-19 Toshiba Corp Method and apparatus for manufacturing semiconductor device
JP2014014868A (en) * 2012-07-05 2014-01-30 Vesi Switzerland Ag Method and apparatus for supplying flux free solder to substrate

Also Published As

Publication number Publication date
JPS6334269Y2 (en) 1988-09-12

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