JPS5585037A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS5585037A
JPS5585037A JP15748278A JP15748278A JPS5585037A JP S5585037 A JPS5585037 A JP S5585037A JP 15748278 A JP15748278 A JP 15748278A JP 15748278 A JP15748278 A JP 15748278A JP S5585037 A JPS5585037 A JP S5585037A
Authority
JP
Japan
Prior art keywords
bonding
heated gas
leads
temperature
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15748278A
Other languages
Japanese (ja)
Inventor
Koji Nose
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15748278A priority Critical patent/JPS5585037A/en
Publication of JPS5585037A publication Critical patent/JPS5585037A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

PURPOSE: To prevent an electric circuit element from damaging due to load concentration or the like by bonding the conductive leads of a tape carrier to the element by spraying heated gas thereto to thereby equalize the pressing strength on the leads over the entire leads.
CONSTITUTION: A semiconductor device 2 provided with a bump and completely diced in wafer type is set on a table. After a carrier tape or thin lead frame 4 is disposed to position the device on the table, heated gas 5 at necessary temperature for bonding is sprayed through a jig 20 under pressure necessary for the bonding toward the lead 4 and the surface of the device 2. When the bonding is completed, room temperature gas is mixed in the heated gas 5 to thereby lower the temperature at the connecting portion to thus complete the bonding method. This method is particularly advantageous for the thin lead frame such as carrier tape, flat package, or the like.
COPYRIGHT: (C)1980,JPO&Japio
JP15748278A 1978-12-22 1978-12-22 Bonding method Pending JPS5585037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15748278A JPS5585037A (en) 1978-12-22 1978-12-22 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15748278A JPS5585037A (en) 1978-12-22 1978-12-22 Bonding method

Publications (1)

Publication Number Publication Date
JPS5585037A true JPS5585037A (en) 1980-06-26

Family

ID=15650637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15748278A Pending JPS5585037A (en) 1978-12-22 1978-12-22 Bonding method

Country Status (1)

Country Link
JP (1) JPS5585037A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0290638A (en) * 1988-09-28 1990-03-30 Toshiba Corp Inner lead bonding device
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937006A (en) * 1988-07-29 1990-06-26 International Business Machines Corporation Method and apparatus for fluxless solder bonding
JPH0290638A (en) * 1988-09-28 1990-03-30 Toshiba Corp Inner lead bonding device
US5057969A (en) * 1990-09-07 1991-10-15 International Business Machines Corporation Thin film electronic device

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