JPS5211864A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5211864A
JPS5211864A JP50088754A JP8875475A JPS5211864A JP S5211864 A JPS5211864 A JP S5211864A JP 50088754 A JP50088754 A JP 50088754A JP 8875475 A JP8875475 A JP 8875475A JP S5211864 A JPS5211864 A JP S5211864A
Authority
JP
Japan
Prior art keywords
semiconductor device
conductor wiring
handling
damage
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50088754A
Other languages
Japanese (ja)
Inventor
Masaharu Noyori
Isamu Kitahiro
Hiroaki Fujimoto
Tsuyoshi Shiragasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP50088754A priority Critical patent/JPS5211864A/en
Publication of JPS5211864A publication Critical patent/JPS5211864A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

PURPOSE: By forming the conductor wiring which makes the face down bonding of a semiconductor element in the concave part of the insulating substrate of a heat-resistant resin, the damage of the surface of a conductor wiring shall be eliminated during the handling.
COPYRIGHT: (C)1977,JPO&Japio
JP50088754A 1975-07-18 1975-07-18 Semiconductor device Pending JPS5211864A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50088754A JPS5211864A (en) 1975-07-18 1975-07-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50088754A JPS5211864A (en) 1975-07-18 1975-07-18 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5211864A true JPS5211864A (en) 1977-01-29

Family

ID=13951675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50088754A Pending JPS5211864A (en) 1975-07-18 1975-07-18 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5211864A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287238A (en) * 1985-06-14 1986-12-17 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61287238A (en) * 1985-06-14 1986-12-17 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device

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